Automatic transfer mechanism for semiconductor wafer workpieces

Abstract

The utility model discloses the automation of semiconductor manufacturing equipment technical field's pan semiconductor board class workpiece's automatic transfer mechanism, including base, the surface both sides of fixed plate are respectively limit rotary mounting and have first gear and second gear, it is meshed connection between first gear and second gear, the bottom one side fixed mounting of fixed plate has first motor, the output of first motor and the bottom of second gear are fixed connection, the surface fixed mounting of first gear has support frame, the both ends bottom of support frame is respectively symmetrical fixed mounting and has second fixed link, through setting multiple groups of the clamping lever that moves to the center of carousel can be to the semiconductor class workpiece above feeding station fast clamping, through the operation support frame of first motor rotates, thereby can rotate and transfer the semiconductor class workpiece of clamping to the above of the feeding station, thereby improved the efficiency of work.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to an automated transfer mechanism for semiconductor board-type workpieces. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the unique electrical properties of semiconductor materials to perform specific functions, such as generating, controlling, receiving, converting, and amplifying signals, and performing energy conversion. The semiconductor materials used in semiconductor devices are silicon, germanium, or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment. To distinguish them from integrated circuits, they are sometimes called discrete devices. The basic structure of most two-terminal devices (i.e., crystal diodes) is a PN junction. Automated transfer mechanisms for semiconductor plate-type workpieces mainly include automated material handling systems and automated transfer equipment, primarily used for the efficient transfer of wafers and other workpieces on production lines.

[0003] Existing semiconductor board workpiece transfer mechanisms typically employ translational drive mechanisms, which only support the lateral movement of the gripping mechanism. This makes them unsuitable for application scenarios with various requirements for material placement angles, and inconvenient to use. Therefore, we propose an automated transfer mechanism for general semiconductor board workpieces. Utility Model Content

[0004] The purpose of this invention is to provide an automated transfer mechanism for semiconductor board-type workpieces to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automated transfer mechanism for semiconductor board-type workpieces, comprising a base, a first gear and a second gear respectively mounted on the two sides of the surface of the fixed plate for limited rotation, the first gear and the second gear being meshed; a first motor fixedly mounted on one side of the bottom of the fixed plate, the output end of the first motor being fixedly connected to the bottom of the second gear; a support frame fixedly mounted on the surface of the first gear; second fixed rods symmetrically fixedly mounted on the bottom of both ends of the support frame; a second support plate fixedly mounted on the bottom end of the second fixed rod; a second motor fixedly mounted on the surface of the second support plate; a turntable rotatably mounted on the middle of the bottom surface of the second support plate, the top end of the turntable being fixedly connected to the bottom output end of the second motor; guide holes evenly distributed around the surface of the turntable; multiple sets of track plates fixedly mounted on the bottom surface of the second support plate; slide blocks slidably mounted on the surface of the track plates; clamping rods fixedly mounted on the bottom of the slide blocks; sliding rods fixedly inserted into the surface of the clamping rods; and the bottom end of the sliding rods being slidably connected to the inside of the guide holes.

[0006] Preferably, a first fixing rod is fixedly installed on one side of the bottom of the fixing plate, a first support plate is fixedly installed at the bottom end of the first fixing rod, and the bottom end of the first motor is fixedly installed on the surface of the first support plate.

[0007] Preferably, a fixing block is fixedly installed in the middle of the surface of the support frame, and a crossbar is fixedly connected above the fixing block. Preferably, a protective pad is fixedly installed on one side surface of the clamping rod.

[0008] Preferably, a base is fixedly installed at the bottom of the fixing plate.

[0009] Preferably, the bottom of the support frame is symmetrically provided with a feeding station and a discharging station on both sides.

[0010] Compared with the prior art, the beneficial effects of this utility model are: By setting up multiple sets of clamping rods that move towards the center of the turntable, semiconductor workpieces above the feeding station can be quickly clamped. The first motor's running support frame rotates, thereby rotating and transferring the clamped semiconductor workpieces to the top of the unloading station, thus improving work efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a side view of the present invention. Figure 3 This is a schematic diagram of the clamping rod structure of this utility model.

[0012] In the diagram: 1. Base; 2. Fixing plate; 3. First gear; 4. Support frame; 5. Second gear; 6. First fixing rod; 7. First support plate; 8. First motor; 9. Second fixing rod; 10. Second support plate; 11. Second motor; 12. Track plate; 13. Slide block; 14. Clamping rod; 15. Protective pad; 16. Slide rod; 17. Turntable; 18. Guide hole; 19. Fixing block; 20. Crossbar; 21. Feeding station; 22. Unloading station. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Please see Figure 1-3This utility model provides a technical solution: an automated transfer mechanism for semiconductor board-type workpieces, including a base 1, a fixed plate 2 with a first gear 3 and a second gear 5 respectively mounted on both sides of its surface for limiting rotation, the first gear 3 and the second gear 5 being meshed together, a first motor 8 fixedly mounted on one side of the bottom of the fixed plate 2, the output end of the first motor 8 being fixedly connected to the bottom of the second gear 5, a support frame 4 fixedly mounted on the surface of the first gear 3, second fixing rods 9 symmetrically fixedly mounted on the bottom of both ends of the support frame 4, and a second support plate 10 fixedly mounted on the bottom end of the second fixing rods 9. A second motor 11 is fixedly installed on the surface of the support plate 10. A turntable 17 is rotatably installed in the middle of the bottom surface of the second support plate 10. The top of the turntable 17 is fixedly connected to the bottom output end of the second motor 11. Guide holes 18 are evenly opened in a circle on the surface of the turntable 17. Multiple sets of track plates 12 are fixedly installed on the bottom surface of the second support plate 10. A slide block 13 is slidably installed on the surface of the track plate 12. A clamping rod 14 is fixedly installed at the bottom of the slide block 13. A slide rod 16 is fixedly inserted on the surface of the clamping rod 14. The bottom end of the slide rod 16 is slidably connected to the inside of the guide hole 18.

[0015] Specifically, a first fixing rod 6 is fixedly installed on one side of the bottom of the fixing plate 2, a first support plate 7 is fixedly installed at the bottom end of the first fixing rod 6, and the bottom end of the first motor 8 is fixedly installed on the surface of the first support plate 7.

[0016] Specifically, a fixing block 19 is fixedly installed in the middle of the surface of the support frame 4, and a crossbar 20 is fixedly connected above the fixing block 19. Specifically, a protective pad 15 is fixedly installed on one side surface of the clamping rod 14.

[0017] Specifically, a base 1 is fixedly installed on the bottom of the fixing plate 2.

[0018] Specifically, the bottom of the support frame 4 is symmetrically provided with a feeding station 21 and a discharging station 22 on both sides.

[0019] In this embodiment, the operation of the second motor 11 drives the turntable 17 to rotate. The rotation of the turntable 17 drives the clamping rods 14 to move on the surface of the track plate 12 through the guide holes 18 on its surface, so that multiple sets of clamping rods 14 move towards the center of the turntable 17, thereby clamping the semiconductor workpiece above the feeding station 21. The operation of the first motor 8 drives the second gear 5 to rotate, the rotation of the second gear 5 drives the first gear 3 to rotate, and the rotation of the first gear 3 drives the upper support frame 4 to rotate. The rotation of the support frame 4 can rotate and transfer the clamped semiconductor workpiece to the upper part of the unloading station 22, thereby improving the efficiency of the work. The protective pad 15 increases the protection of the surface of the semiconductor workpiece, and the crossbar 20 increases the overall structural strength of the support frame 4.

[0020] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated transfer mechanism for semiconductor board-type workpieces, comprising a base (1), characterized in that: It also includes a fixing plate (2), the bottom of which is fixedly installed on the base (1). A first gear (3) and a second gear (5) are respectively installed on both sides of the surface of the fixing plate (2) for limiting rotation. The first gear (3) and the second gear (5) are meshed together. A first motor (8) is fixedly installed on one side of the bottom of the fixing plate (2). The output end of the first motor (8) is fixedly connected to the bottom of the second gear (5). A support frame (4) is fixedly installed on the surface of the first gear (3). A second fixing rod (9) is symmetrically fixedly installed at the bottom of both ends of the support frame (4). A second support plate (10) is fixedly installed at the bottom end of the second fixing rod (9). A second motor (11) is fixedly installed on the surface of the second support plate (10). A turntable (17) is fixedly installed in the middle of the bottom side surface of the second support plate (10). The top of the turntable (17) is fixedly connected to the bottom output end of the second motor (11). The surface of the turntable (17) is evenly provided with guide holes (18) in a circle. Multiple sets of track plates (12) are fixedly installed on the bottom surface of the second support plate (10). A slide block (13) is fixedly installed on the surface of the track plate (12). A clamping rod (14) is fixedly installed at the bottom of the slide block (13). A slide rod (16) is fixedly inserted on the surface of the clamping rod (14). The bottom end of the slide rod (16) is fixedly slidably connected to the inside of the guide hole (18).

2. The automated transfer mechanism for semiconductor board-type workpieces according to claim 1, characterized in that: A first fixing rod (6) is fixedly installed on one side of the bottom of the fixing plate (2), and a first support plate (7) is fixedly installed at the bottom end of the first fixing rod (6). The bottom end of the first motor (8) is fixedly installed on the surface of the first support plate (7).

3. The automated transfer mechanism for semiconductor board-type workpieces according to claim 1, characterized in that: A fixing block (19) is fixedly installed in the middle of the surface of the support frame (4), and a crossbar (20) is fixedly connected above the fixing block (19).

4. The automated transfer mechanism for semiconductor board-type workpieces according to claim 1, characterized in that: A protective pad (15) is fixedly installed on one side surface of the clamp (14).

5. The automated transfer mechanism for semiconductor board-type workpieces according to claim 1, characterized in that: The bottom of the support frame (4) is symmetrically provided with a feeding station (21) and a discharging station (22) on both sides.

Images