Carbon fiber grid embedded type foamed thermal insulation composite board
By using the multi-layer structure design of the carbon fiber mesh embedded foam insulation composite board, the problem of easy loosening at the joints of traditional composite boards is solved, achieving stable connection and efficient insulation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN BOLUNYA POLYURETHANE TECH CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional thermal insulation composite panels are prone to loosening at the joints, causing heat to transfer through the gaps and resulting in poor thermal insulation performance.
The carbon fiber mesh embedded foam insulation composite board adopts a multi-layer structure to enhance connection stability and thermal insulation performance through the trapezoidal interlocking structure of fixing strips and limiting grooves, the snap-fit of trapezoidal blocks and grooves, and the multiple limiting fixation of C-shaped fixing blocks, combined with the design of rigid foam material and carbon fiber layer.
It effectively resists loosening caused by external forces, reduces heat transfer gaps at the joints, improves tensile and deformation resistance, and maintains overall thermal insulation performance and structural strength.
Smart Images
Figure CN224549391U_ABST