Liquid-cooled piezoelectric pump for chip heat dissipation

By integrating multiple vibration components and series working chambers into a liquid-cooled piezoelectric pump, a compact structure with high pressure output and low energy consumption is achieved, solving the problems of large size, high energy consumption and short life of traditional liquid-cooled pumps, and making it suitable for heat dissipation of high power density chips.

CN224550317UActive Publication Date: 2026-07-24CHANGZHOU YIFEI TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHANGZHOU YIFEI TECHNOLOGY CO LTD
Filing Date
2025-09-04
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Traditional mechanical liquid-cooled pumps are large in size, complex in structure, high in energy consumption, and short in life, making it difficult to meet the requirements of highly reliable and low-power electronic devices. Furthermore, in high-pressure scenarios, multiple pump bodies need to be connected in series, which increases the size of the device.

Method used

Design a liquid-cooled piezoelectric pump that integrates multiple vibration components into a single pump body. The fluid is pressurized in stages through multiple series working chambers. The pump chambers are connected in series, and the fluid flows through the flow channel holes of the housing component, reducing the impact on the piezoelectric ceramic vibration components.

Benefits of technology

It achieves a compact structure, low flow rate and high pressure output, high fluid output stability, fast drive response and low energy consumption, and is suitable for high pressure scenarios, solving the problems of high energy consumption and short life of traditional liquid-cooled pumps.

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Abstract

The utility model provides a kind of liquid cooling piezoelectric pump for chip heat dissipation, it by integrating multiple vibration components in a pump body, to be applicable to high pressure use scene, compared with using multiple pump bodies are connected, this kind of structure smaller volume, simultaneously compared with traditional liquid cooling pump, the fluid output stability of present scheme is high, driving response is fast, and driving energy consumption is low, solve the energy consumption of traditional liquid cooling pump, short service life, reliability low and other problems.Its structure includes shell assembly, piezoelectric ceramic vibration assembly, piezoelectric ceramic vibration assembly is installed in shell assembly, piezoelectric ceramic vibration assembly and shell assembly form working cavity, working cavity is used for the inflow / outflow of fluid, piezoelectric ceramic vibration assembly can change the pressure in working cavity by deformation, characterized by: working cavity has multiple and is connected in series with each other, multiple working cavities are communicated by flow channel hole on shell assembly.
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