Thin forced air-cooling piezoelectric pump for chip heat dissipation

Abstract

The utility model provides a thin type forced air cooling piezoelectric pump for chip heat dissipation, and the air inlet and outlet flow channels are separated from each other, the heat dissipation effect is good, the noise is smaller, the volume is small, and the piezoelectric pump can be integrated into various space-limited chip fan heat scenes flexibly. The structure comprises a shell assembly and a piezoelectric ceramic assembly, the piezoelectric pump working cavity is arranged in the shell assembly, the deformation of the piezoelectric ceramic assembly can change the pressure in the piezoelectric pump working cavity, the piezoelectric pump working cavity is communicated with the air inlet and the air outlet through the air inlet flow channel and the air outlet flow channel, the air inlet and the air outlet are not located at the same end of the shell assembly, the air inlet fin assembly is installed at the connecting part of the air inlet flow channel and the piezoelectric pump working cavity, and the air outlet fin assembly is installed at the connecting part of the air outlet flow channel and the piezoelectric pump working cavity.

Description

Technical Field

[0001] This utility model relates to the technical field of air-cooled heat dissipation devices, specifically a thin forced air-cooled piezoelectric pump for chip heat dissipation. Background Technology

[0002] With the development of chip manufacturing technology, the integration and power consumption of chips are constantly increasing, resulting in a significant increase in heat generated during operation. Efficient heat dissipation solutions have become crucial for ensuring stable equipment operation and extending its lifespan.

[0003] Traditional methods for cooling electronic devices include natural convection, forced air cooling, and liquid cooling. While these methods can meet cooling requirements to some extent, they each have limitations. For example, forced air cooling, although it increases airflow speed through devices such as fans, is bulky, noisy, and inefficient, and is difficult to apply flexibly in high-density electronic devices.

[0004] To overcome the shortcomings of traditional heat dissipation methods for electronic devices, air-cooled piezoelectric pumps are now used for heat dissipation. For example, the piezoelectric ceramic air pump and piezoelectric ceramic heat dissipation device disclosed in CN219472306U. The piezoelectric pump energizes the piezoelectric ceramic, causing the vibrating plate connected to the ceramic to bend and deform vertically, thereby increasing or decreasing the volume of the working chamber and driving gas into or out of the working chamber. However, the existing piezoelectric pumps have mixed inlet and outlet airflow channels, causing some outlet air to flow back into the inlet airflow channel, resulting in insufficient outlet airflow and ineffective heat dissipation. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides a thin forced-air-cooled piezoelectric pump for chip heat dissipation, which has separate inlet and outlet airflow channels for good heat dissipation.

[0006] The technical solution is as follows: a thin forced-air-cooled piezoelectric pump for chip heat dissipation, comprising a housing assembly and a piezoelectric ceramic assembly. The housing assembly contains a piezoelectric pump working chamber. Deformation of the piezoelectric ceramic assembly changes the pressure within the piezoelectric pump working chamber. The piezoelectric pump working chamber is connected to an air inlet and an air outlet via an air inlet channel and an air outlet channel, respectively. The air inlet and the air outlet are not located at the same end of the housing assembly. The key feature is that an air inlet plate assembly is installed at the connection between the air inlet channel and the piezoelectric pump working chamber. The air inlet plate assembly allows airflow from the air inlet channel into the piezoelectric pump working chamber and prevents airflow from the piezoelectric pump working chamber into the air inlet channel. Similarly, an air outlet plate assembly is installed at the connection between the air outlet channel and the piezoelectric pump working chamber. The air outlet plate assembly allows airflow from the piezoelectric pump working chamber into the air outlet channel and prevents airflow from the air outlet channel into the piezoelectric pump working chamber.

[0007] Furthermore, the piezoelectric ceramic assembly includes a piezoelectric ceramic, a flexible electrode plate, an insulating pad, and a metal substrate. One electrode surface of the piezoelectric ceramic is connected to the flexible electrode plate, and the other electrode surface is connected to the metal substrate. The insulating pad is disposed between the flexible electrode plate and the metal substrate.

[0008] Furthermore, the air intake assembly includes an air intake plate and an air intake channel main plate. The air intake channel main plate has a cavity in the middle to form the air intake channel. The side of the air intake channel main plate facing the piezoelectric pump working chamber has an air intake hole, which connects the piezoelectric pump working chamber and the air intake channel. The air intake plate is located on the side of the air intake channel main plate with the air intake hole, and a sealing spring is provided at the position of each air intake hole. When the pressure in the piezoelectric pump working chamber is greater than the pressure in the air intake channel, the sealing spring moves close to the air intake channel main plate and blocks the air intake hole. When the pressure in the piezoelectric pump working chamber is less than the pressure in the air intake channel, the sealing spring moves away from the air intake channel main plate, and the air enters the piezoelectric pump working chamber through the gap on the air intake plate.

[0009] Furthermore, the air outlet assembly includes an air outlet channel plate, an air outlet plate, and a heat absorption plate. The heat absorption plate is uniformly provided with heat-conducting grooves to form the air outlet channel. The air outlet channel plate is provided with air outlet holes for connecting the working chamber of the piezoelectric pump and the air outlet channel. The air outlet plate is located on one side of the air outlet channel plate, and a sealing spring is provided at the position of each air outlet hole. When the pressure in the working chamber of the piezoelectric pump is less than the pressure in the air outlet channel, the sealing spring moves close to the air outlet channel plate and blocks the air outlet hole. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure in the air outlet channel, the sealing spring moves away from the air outlet channel plate, and the air enters the air outlet channel through the gap on the air outlet plate.

[0010] Furthermore, the heat-absorbing plate is used to connect to the location where heat dissipation is required, the heat-absorbing plate is made of a thermally conductive material, and the air outlet extends to the end face of the air-cooled piezoelectric pump and forms the air outlet.

[0011] Furthermore, the sum of the cross-sectional areas of the air inlets is greater than the sum of the cross-sectional areas of the air outlets.

[0012] Furthermore, both the air inlet assembly and the air outlet assembly are located below the piezoelectric ceramic assembly, with the air outlet assembly located below the air inlet assembly. The air inlet assembly is provided with a connecting channel for connecting the air outlet assembly and the working chamber of the piezoelectric pump.

[0013] Furthermore, the housing assembly includes an air inlet housing and an air duct plate. The air inlet housing has an air inlet located at the top. There is a certain gap between the air inlet housing and the air duct plate, forming an air duct cavity. The air inlet communicates with the air duct cavity. An air duct groove is provided on the side of the air inlet housing. One end of the air duct groove communicates with the air duct cavity, and the other end passes over the piezoelectric ceramic assembly and communicates with the air inlet channel.

[0014] Furthermore, the working chamber of the piezoelectric pump is located below the piezoelectric ceramic assembly, and a back pressure chamber is provided above the piezoelectric ceramic assembly. The back pressure chamber is connected to the air vent through a pressure relief port.

[0015] Furthermore, seals are provided between the housing assembly and the piezoelectric ceramic assembly, between the piezoelectric ceramic assembly and the air inlet assembly, and between the air inlet assembly and the air outlet assembly.

[0016] Beneficial effects: By designing the inlet and outlet air fin assemblies, airflow flows from the inlet channel into the piezoelectric pump's working chamber and then into the outlet channel, preventing reverse flow and turbulence, and ensuring sufficient air output. Other beneficial effects include: multiple outlet channels evenly distributed on the heat absorber plate, utilizing airflow to remove heat from the plate and cool it down, achieving efficient heat dissipation; the air-cooled piezoelectric pump has multiple inlets and outlets, with the sum of the cross-sectional areas of all inlets exceeding the sum of the cross-sectional areas of all outlets, forming a unidirectional gas flow channel with gradually decreasing cross-sectional area, increasing gas pressure and thus improving heat dissipation. Furthermore, the piezoelectric pump is quieter and more compact, allowing for flexible integration into various space-constrained chip cooling scenarios, such as ultra-thin laptops, iPads, wearable devices, and aerospace equipment, providing these devices with efficient and reliable heat dissipation solutions. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 for Figure 1 An explosion diagram;

[0019] Figure 3 This is a schematic diagram of the rear structure of the air intake housing;

[0020] Figure 4 This is a schematic diagram of a piezoelectric ceramic component.

[0021] Figure 5 This is a schematic diagram of the intake plate assembly structure;

[0022] Figure 6 This is a schematic diagram of the back structure of the air intake duct plate;

[0023] Figure 7 This is an enlarged structural diagram of the sealing spring piece 1;

[0024] Figure 8 This is a schematic diagram of the air outlet assembly structure;

[0025] Figure 9 This is an enlarged structural diagram of the sealing spring shrapnel 2.

[0026] In the diagram, 1-Inlet housing; 100-Inlet port; 101-Air duct groove; 2-Air duct plate; 3-First sealing gasket; 301-Pressure relief port; 4-Flexible electrode plate; 5-Piezoelectric ceramic; 6-Insulating gasket; 7-Metal substrate; 8-Second sealing gasket; 9-Inlet plate; 901-Sealing spring one; 902-Connecting channel; 10-Inlet air duct plate; 1000-Inlet air duct; 1001-Inlet hole; 11-Inlet air duct cover plate; 12-Third sealing gasket; 13-Outlet air duct plate; 1300-Outlet hole; 14-Outlet plate; 1400-Sealing spring two; 15-Heat absorber plate; 1500-Outlet port; 1501-Heat conduction groove; 16-Dust plug. Detailed Implementation

[0027] like Figure 1 , Figure 2 The thin forced-air-cooled piezoelectric pump shown includes a housing assembly, such as... Figure 4 The piezoelectric ceramic component shown has a piezoelectric pump working chamber formed within the housing assembly by the piezoelectric ceramic component. Deformation of the piezoelectric ceramic component can change the pressure within the piezoelectric pump working chamber. The piezoelectric pump working chamber is connected to the inlet 100 and outlet 1500 via an inlet air passage and an outlet air passage, respectively. The inlet 100 and outlet 1500 are not located at the same end of the housing assembly; preferably, they are located at the upper and lower parts of the inlet housing 1, respectively, thus ensuring a large temperature difference between the inlet and outlet air. A device such as... is installed at the connection between the inlet air passage 1000 and the piezoelectric pump working chamber. Figure 5 The air intake assembly shown is used to allow airflow to enter the piezoelectric pump working chamber from the air intake channel 1000 and to prevent airflow from entering the air intake channel 1000 from the piezoelectric pump working chamber. A device such as... is installed at the connection between the air outlet channel and the piezoelectric pump working chamber. Figure 8 The air outlet assembly shown is used to allow airflow to enter the outlet air passage from the working chamber of the piezoelectric pump and prevent airflow from entering the working chamber of the piezoelectric pump from the outlet air passage. This results in avoiding reverse airflow and airflow turbulence, and ensuring sufficient air output.

[0028] Specifically, such as Figure 4As shown, the piezoelectric ceramic assembly includes a piezoelectric ceramic 5, a flexible electrode plate 4, an insulating pad 6, and a metal substrate 7. One electrode surface of multiple piezoelectric ceramics 5 is welded or bonded to the flexible electrode plate 4, and the other electrode surface is bonded to the metal substrate 7 with conductive adhesive. The flexible electrode plate 4 and the metal substrate 7 extend through the housing assembly to the outside and are connected to the power supply. The housing assembly is provided with a dust plug 16 to prevent dust from entering the piezoelectric pump from the electrode extension area. The insulating pad 6 is located between the flexible electrode plate 4 and the metal substrate 7 and is bonded along the edge of the flexible electrode plate 4. By applying an alternating electrical signal to the upper and lower electrode surfaces of the piezoelectric ceramic 5, the piezoelectric ceramic 5 will vibrate, thereby driving the metal substrate 7 to vibrate, causing the working chamber volume of the piezoelectric pump to change back and forth: when the chamber volume increases and generates a sufficiently large negative pressure, air will enter the chamber from the air inlet 100 through the air intake channel 1000, which is the pumping state; when the chamber volume decreases and generates a sufficiently large positive pressure, air will flow out from the outlet channel, which is the pumping state.

[0029] like Figure 5 , Figure 6 , Figure 7 As shown, the air intake assembly includes an air intake slab 9 and an air intake duct main body plate. The air intake duct main body plate is formed by connecting an air intake duct plate 10 and an air intake duct cover plate 11. A cavity is provided in the middle of the air intake duct main body plate to form an air intake duct 1000. An air intake hole 1001 is provided on the side of the air intake duct main body plate facing the piezoelectric pump working chamber. The air intake hole 1001 connects the piezoelectric pump working chamber and the air intake duct 1000. The air intake slab 9 is located on the side of the air intake duct main body plate with the air intake hole 1001, and corresponds to each air intake... A sealing spring 901 is provided at the position of the hole 1001. The sealing spring 901 has elasticity and can be pressed away from the air inlet plate 9. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure in the air inlet channel 1000, the sealing spring 901 is pressed close to the main plate of the air inlet channel and blocks the air inlet hole 1001. When the pressure in the working chamber of the piezoelectric pump is less than the pressure in the air inlet channel 1000, the sealing spring 901 is pressed away from the main plate of the air inlet channel, and the air enters the working chamber of the piezoelectric pump through the gap on the air inlet plate 9.

[0030] like Figure 8 , Figure 9As shown, the air outlet assembly includes an air outlet channel plate 13, an air outlet plate 14, and a heat absorption plate 15. Because the piezoelectric pump is small and suitable for chip heat dissipation, the heat absorption plate 15 is used to connect to the location where the chip needs heat dissipation. It can also be used for other components or equipment requiring heat dissipation. The heat absorption plate 15 is made of a thermally conductive material such as copper. The air outlet channel extends to the end face of the air-cooled piezoelectric pump and forms an air outlet 1500. Heat-conducting grooves 1501 are evenly distributed on the heat absorption plate 15 to form the air outlet channel. The air outlet channel plate 13 has an air outlet hole 1300, which connects the working chamber of the piezoelectric pump to the outlet... The airflow channel has an outlet plate 14 located on one side of the outlet airflow channel plate 13, and a sealing spring 1400 is provided at the position of each outlet hole 1300. The sealing spring 1400 is elastic and can be pressed away from the outlet plate 14. When the pressure in the working chamber of the piezoelectric pump is less than the pressure in the outlet airflow channel, the sealing spring 1400 is pressed close to the outlet airflow channel plate 13 and blocks the outlet hole 1300. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure in the outlet airflow channel, the sealing spring 1400 moves away from the outlet airflow channel plate 13, and the air enters the heat conduction groove 1501 through the gap on the outlet plate 14.

[0031] Since the air inlet 100 and air outlet 1500 are not located at the same end of the housing assembly in this design, and are preferably located at the upper and lower parts of the air inlet housing 1 respectively, in order to accommodate this structure and to make the components of the device compact and save space, both the air inlet plate assembly and the air outlet plate assembly are located below the piezoelectric ceramic assembly, and the air outlet plate assembly is located below the air inlet plate assembly. The air inlet plate assembly is provided with a connecting channel 902 (connected to...). Figure 5 , Figure 6 The connecting channel 902 is used to connect the air outlet plate assembly and the working chamber of the piezoelectric pump.

[0032] At the same time, based on the above, combined with Figure 2 , Figure 3 The housing assembly specifically includes an air intake housing 1 and an air duct plate 2. An air intake port 100 is provided on the air intake housing at the top. The air intake housing 1 and the air duct plate 2 are separated to form a certain gap and a horizontally arranged air duct chamber. The air intake port 100 is connected to the air duct chamber. A vertical air duct groove 101 is provided on the side of the air intake housing 1. One end of the air duct groove 101 is connected to the air duct chamber, and the other end passes over the piezoelectric ceramic assembly and is connected to the air intake channel 1000.

[0033] Because of the air vent 101, gas on the back of the piezoelectric ceramic assembly can be discharged. Specifically, the working chamber of the piezoelectric pump is located below the piezoelectric ceramic assembly, and a back pressure chamber is provided above the piezoelectric ceramic assembly. The back pressure chamber is connected to the air vent 101 through a pressure relief port 301. Thus, by providing the pressure relief port 301 (see...), Figure 4This reduces the pressure in the back pressure chamber, allowing the metal substrate 7 to vibrate more significantly, thereby improving gas flow and enhancing the working capacity of the piezoelectric pump.

[0034] In addition, to ensure that the components do not come into direct contact with each other and to guarantee their airtightness, seals are provided between the housing assembly and the piezoelectric ceramic assembly, between the piezoelectric ceramic assembly and the air inlet assembly, and between the air inlet assembly and the air outlet assembly. Specifically: Figure 4 In the middle, the first sealing gasket 3 between the air-expelling plate 2 and the flexible electrode plate 4, Figure 5 In the middle, the second sealing gasket 8 between the metal substrate 7 and the air intake fin 9, Figure 8 In the middle, the third sealing gasket 12 between the inlet air passage cover plate 11 and the outlet air passage plate 13, the plates of the piezoelectric pump can be connected to each other by means of bonding or other methods.

[0035] By adopting the above structure, in the chip heat dissipation system, the air-cooled piezoelectric pump pressurizes cold air and blows it from multiple air outlets 1300 onto the heat absorption plate 15, carrying away the heat generated by the chip and achieving a highly efficient cooling effect. Compared with traditional fan cooling systems, the air-cooled piezoelectric pump has multiple air inlets 100 and air outlets 1500. The sum of the cross-sectional areas of all air inlets 100 is greater than the sum of the cross-sectional areas of all air outlets 1500, forming a unidirectional gas flow channel with gradually decreasing cross-sectional area and increasing gas pressure, thus achieving better heat dissipation. At the same time, the piezoelectric pump is quieter and smaller in size, allowing for flexible integration into various space-constrained chip heat dissipation scenarios, such as ultra-thin laptops, iPads, wearable devices, and aerospace equipment, providing these devices with efficient and reliable heat dissipation solutions. Compared with traditional cooling fans, it significantly improves heat dissipation efficiency. Furthermore, compared with traditional liquid cooling methods, the micro piezoelectric pump has a simpler structure, smaller size, and lower maintenance costs.

[0036] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A thin, forced-air-cooled piezoelectric pump for chip heat dissipation, comprising a housing assembly and a piezoelectric ceramic assembly, wherein the housing assembly contains a piezoelectric pump working chamber, and deformation of the piezoelectric ceramic assembly can change the pressure within the piezoelectric pump working chamber, the piezoelectric pump working chamber being connected to an air inlet and an air outlet via an air inlet channel and an air outlet channel respectively, wherein the air inlet and the air outlet are not located at the same end of the housing assembly, characterized in that: An air intake plate assembly is installed at the connection between the air intake channel and the working chamber of the piezoelectric pump. The air intake plate assembly is used to allow airflow to enter the working chamber of the piezoelectric pump from the air intake channel and to prevent airflow from entering the air intake channel from the working chamber of the piezoelectric pump. An air outlet plate assembly is installed at the connection between the air outlet channel and the working chamber of the piezoelectric pump. The air outlet plate assembly is used to allow airflow to enter the air outlet channel from the working chamber of the piezoelectric pump and to prevent airflow from entering the working chamber of the piezoelectric pump from the air outlet channel.

2. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 1, characterized in that: The piezoelectric ceramic assembly includes a piezoelectric ceramic, a flexible electrode plate, an insulating pad, and a metal substrate. One electrode surface of the piezoelectric ceramic is connected to the flexible electrode plate, and the other electrode surface is connected to the metal substrate. The insulating pad is disposed between the flexible electrode plate and the metal substrate.

3. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 1 or 2, characterized in that: The air intake assembly includes an air intake plate and an air intake channel main plate. The air intake channel main plate has a cavity in the middle to form the air intake channel. The side of the air intake channel main plate facing the piezoelectric pump working chamber has an air intake hole, which connects the piezoelectric pump working chamber and the air intake channel. The air intake plate is located on the side of the air intake channel main plate with the air intake hole, and a sealing spring is provided at the position of each air intake hole. When the pressure in the piezoelectric pump working chamber is greater than the pressure in the air intake channel, the sealing spring moves close to the air intake channel main plate and blocks the air intake hole. When the pressure in the piezoelectric pump working chamber is less than the pressure in the air intake channel, the sealing spring moves away from the air intake channel main plate, and the air enters the piezoelectric pump working chamber through the gap on the air intake plate.

4. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 3, characterized in that: The air outlet plate assembly includes an air outlet channel plate, an air outlet plate, and a heat absorption plate. The heat absorption plate is uniformly provided with heat-conducting grooves to form the air outlet channel. The air outlet channel plate is provided with air outlet holes for connecting the working chamber of the piezoelectric pump and the air outlet channel. The air outlet plate is located on one side of the air outlet channel plate, and a sealing spring is provided at the position of each air outlet hole. When the pressure in the working chamber of the piezoelectric pump is less than the pressure in the air outlet channel, the sealing spring moves close to the air outlet channel plate and blocks the air outlet hole. When the pressure in the working chamber of the piezoelectric pump is greater than the pressure in the air outlet channel, the sealing spring moves away from the air outlet channel plate, and the air enters the air outlet channel through the gaps on the air outlet plate.

5. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 4, characterized in that: The heat-absorbing plate is used to connect to the location where heat dissipation is required. The heat-absorbing plate is made of a thermally conductive material. The air outlet extends to the end face of the air-cooled piezoelectric pump and forms the air outlet.

6. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 1 or 5, characterized in that: The sum of the cross-sectional areas of the air inlets is greater than the sum of the cross-sectional areas of the air outlets.

7. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 4, characterized in that: Both the air inlet assembly and the air outlet assembly are located below the piezoelectric ceramic assembly, with the air outlet assembly located below the air inlet assembly. The air inlet assembly is provided with a connecting channel for connecting the air outlet assembly and the working chamber of the piezoelectric pump.

8. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 7, characterized in that: The housing assembly includes an air inlet housing and an air duct plate. The air inlet housing has an air inlet located at the top. There is a certain gap between the air inlet housing and the air duct plate to form an air duct cavity. The air inlet is connected to the air duct cavity. An air duct groove is provided on the side of the air inlet housing. One end of the air duct groove is connected to the air duct cavity, and the other end passes over the piezoelectric ceramic assembly and is connected to the air inlet channel.

9. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to claim 8, characterized in that: The working chamber of the piezoelectric pump is located below the piezoelectric ceramic assembly, and a back pressure chamber is provided above the piezoelectric ceramic assembly. The back pressure chamber is connected to the air vent through a pressure relief port.

10. The thin forced-air-cooled piezoelectric pump for chip heat dissipation according to any one of claims 1, 2, and 4, characterized in that: Sealing elements are provided between the housing assembly and the piezoelectric ceramic assembly, between the piezoelectric ceramic assembly and the air inlet assembly, and between the air inlet assembly and the air outlet assembly.

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