Heat dissipation device and lamp

Abstract

The utility model provides a kind of heat dissipation device and lamps and lanterns, wherein, heat dissipation device includes multiple heat dissipation fins sequentially spaced along the first direction X, heat dissipation fin is used to be connected with heating element;Multiple first heat pipe groups extending along the first direction X, first heat pipe group is set through multiple heat dissipation fins;Multiple second heat pipe groups extending along the first direction X, second heat pipe group is set through multiple heat dissipation fins;Wherein, first heat pipe group and second heat pipe group are alternately set along the second direction Y perpendicular to the first direction X.It greatly improves the heat dissipation efficiency by the combination of heat dissipation fin and heat pipe group, and the alternative arrangement of heat pipe group;The heat dissipation network formed by the alternative arrangement of first heat pipe group and second heat pipe group avoids damage to heating element due to local overheating, improves the stability and reliability of the whole system;The layout of heat pipe group and heat dissipation fin is reasonable, increases the heat dissipation area and heat transfer path.

Description

Technical Field

[0001] This utility model relates to the technical field of lighting fixtures, and more specifically, to a heat dissipation device and a lighting fixture. Background Technology

[0002] In the lighting industry, tower radiators are common heat dissipation devices. Currently, traditional tower radiators have significant technical shortcomings when dealing with high-power cooling demands: their traditional arrangement cannot fully accommodate heat pipes in high-power scenarios, and it's difficult to ensure uniform distribution of heat pipes within the fins, resulting in uneven heat transfer. This problem increases the thermal resistance and temperature of the cooling system, not only reducing heat transfer performance but also preventing the fins from maximizing heat exchange efficiency, severely impacting the cooling effect and stability of high-power equipment. Therefore, there is an urgent need for a new type of tower radiator that can optimize heat pipe arrangement and improve cooling efficiency to solve the key problem of unreasonable heat pipe arrangement in existing high-power radiators. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation device and a lamp to solve the technical problem of uneven heat transfer in existing lamps, which reduces heat dissipation efficiency.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] In a first aspect, a heat dissipation device is provided, comprising:

[0006] Multiple heat sinks are arranged at intervals along a first direction X, and the heat sinks are used to connect to a heat-generating element;

[0007] Multiple first heat pipe groups extending along the first direction X, the first heat pipe groups passing through multiple heat sinks;

[0008] Multiple second heat pipe groups extending along the first direction X are provided, and the second heat pipe groups are disposed through the multiple heat sinks;

[0009] The first heat pipe group and the second heat pipe group are alternately arranged along a second direction Y that is perpendicular to the first direction X.

[0010] By adopting the above technical solution, it has the advantages of efficient heat dissipation, good temperature uniformity and high space utilization.

[0011] In one embodiment, the first heat pipe group includes a plurality of first heat pipes, which are spaced apart along a third direction Z that is perpendicular to both the first direction X and the second direction Y, and the first heat pipes are sequentially connected to the plurality of heat sinks.

[0012] The second heat pipe assembly includes a plurality of second heat pipes, which are spaced apart along the third direction Z, and the second heat pipes are sequentially connected to the plurality of heat sinks.

[0013] In one embodiment, in the third direction Z, the distance between two adjacent first heat pipes in the first heat pipe group is equal to the distance between two adjacent second heat pipes in the second heat pipe group.

[0014] In one embodiment, in the third direction Z, the distance between two adjacent first heat pipes in the first heat pipe group is greater than the distance between two adjacent second heat pipes in the second heat pipe group.

[0015] In one embodiment, in the third direction Z, the first heat pipe and the second heat pipe extend away from each other.

[0016] In one embodiment, the first heat pipe includes a first tube body and a second tube body that is perpendicularly connected to the first tube body, the first tube body extending along the first direction X, and the second tube body extending along the third direction Z; the second heat pipe includes a third tube body and a fourth tube body that is perpendicularly connected to the third tube body, the third tube body extending along the first direction X, and the fourth tube body extending away from the second tube body along the third direction Z.

[0017] In one embodiment, the heat sink has multiple through holes, and the first heat pipe and the second heat pipe pass through the corresponding through holes.

[0018] In one embodiment, the heat dissipation device further includes a cooling element located on the side of the heat sink away from the heat-generating element in the third direction Z.

[0019] In one embodiment, the heat dissipation device further includes a heat spreader, which is located on the side of the heat sink closer to the heat-generating element in the first direction X, and is connected to the first heat pipe and the second heat pipe.

[0020] Secondly, a lamp is provided, including a light source module and the aforementioned heat dissipation device, wherein the light source module includes a heating element and the heating element is connected to the heat dissipation device.

[0021] By adopting the above technical solution, the lamp in this embodiment has the advantage of high heat dissipation efficiency, in addition to the advantages of the heat dissipation device in the above embodiments. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device provided in an embodiment of the present utility model.

[0024] Figure 2 This is an exploded view of the heat dissipation device provided in an embodiment of this utility model.

[0025] Figure 3 This is a three-dimensional structural diagram of the first heat pipe and the second heat pipe provided in the embodiment of this utility model.

[0026] Figure 4 yes Figure 2 Enlarged view of section "A" in the image.

[0027] The labels in the attached figures are as follows: X, first direction; Y, second direction; Z, third direction;

[0028] 1. Heat sink; 2. Heating element; 3. First heat pipe assembly; 4. Second heat pipe assembly; 5. Cooling component; 6. Heat spreader; 7. Fixing assembly;

[0029] 11. Through hole; 31. First heat pipe; 41. Second heat pipe; 71. Fixing plate; 72. Fixing component;

[0030] 311. The first pipe body; 312. The second pipe body; 411. The third pipe body; 412. The fourth pipe body. Detailed Implementation

[0031] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0032] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be located directly on or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component.

[0033] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or the number of technical features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. The specific implementation of this utility model is described in more detail below with reference to specific embodiments:

[0035] like Figures 1 to 3 As shown, an embodiment of the present invention provides a heat dissipation device, comprising:

[0036] Multiple heat sinks 1 are arranged at intervals along the first direction X, and the heat sinks 1 are used to connect to the heat-generating element 2;

[0037] Multiple heat pipe groups 3 extending along the first direction X are provided, and the heat pipe groups 3 penetrate multiple heat sinks 1.

[0038] Multiple second heat pipe groups 4 extending along the first direction X are provided, and the second heat pipe groups 4 are disposed through multiple heat sinks 1;

[0039] The first heat pipe group 3 and the second heat pipe group 4 are alternately arranged along the second direction Y, which is perpendicular to the first direction X.

[0040] Specifically, multiple heat sinks 1 are arranged at intervals along the first direction X, for connection with the heating element 2, and directly receive the heat generated by the heating element 2. The intervals between the heat sinks 1 form air circulation channels, which help airflow to remove heat.

[0041] The first heat pipe assembly 3 extends along the first direction X and passes through multiple heat sinks 1. A heat pipe is a highly efficient heat transfer element, usually filled with a thermally conductive medium, which can quickly transfer heat from one end to the other. The first heat pipe assembly 3 can quickly conduct heat away from the heat sinks 1, reducing heat accumulation on the heat sinks 1.

[0042] The second heat pipe group 4 also extends along the first direction X and passes through multiple heat sinks 1. Unlike the first heat pipe group 3, it and the first heat pipe group 3 are alternately arranged along the second direction Y, which is perpendicular to the first direction X. This alternating arrangement makes the heat pipe group form a denser heat dissipation network on the two-dimensional plane, further improving the heat dissipation efficiency.

[0043] The working principle of the heat dissipation device provided in this embodiment is as follows:

[0044] The heat generated by the heating element 2 is first transferred to the heat sink 1 connected to it, causing the temperature of the heat sink 1 to rise. Since the first heat pipe group 3 and the second heat pipe group 4 pass through the heat sink 1, the heat is quickly conducted to the first heat pipe group 3 and the second heat pipe group 4. The heat-conducting medium in the first heat pipe group 3 and the second heat pipe group 4 absorbs heat at the high-temperature end and evaporates into a gaseous state. Under the action of the pressure difference in the first heat pipe group 3 and the second heat pipe group 4, the gaseous heat-conducting medium flows rapidly to the low-temperature end. After releasing heat at the low-temperature end, it condenses into a liquid state. The liquid then returns to the high-temperature end in the first heat pipe group 3 and the second heat pipe group 4 through capillary action, etc., and so on, transferring heat from the heat sink 1 to the first heat pipe group 3 and the second heat pipe group 4.

[0045] The spacing between the heat sinks 1 and the arrangement of the first heat pipe group 3 and the second heat pipe group 4 provide channels for airflow. When external airflow (such as airflow generated by a fan or natural convection airflow) passes through, the air exchanges heat with the surfaces of the heat sinks 1 and the first heat pipe group 3 and the second heat pipe group 4, carrying away heat and thus reducing the temperature of the heat sinks 1 and the first heat pipe group 3 and the second heat pipe group 4, further enhancing the heat dissipation effect. The alternating arrangement of the first heat pipe group 3 and the second heat pipe group 4 allows the air to make more full contact with the heat pipes and heat sinks 1 during the flow process, improving the convective heat dissipation efficiency.

[0046] By adopting the above technical solution:

[0047] By combining heat sink 1 with heat pipe arrays, and through the alternating arrangement of heat pipe arrays, heat dissipation efficiency is greatly improved. The high-efficiency heat transfer characteristics of heat pipes combined with the large-area heat dissipation characteristics of heat sink 1 can quickly dissipate the heat of heating element 2, effectively reducing the temperature of heating element 2, ensuring its normal operating performance, and extending its service life.

[0048] The heat dissipation network formed by the alternating arrangement of the first heat pipe group 3 and the second heat pipe group 4 can make the temperature distribution on the surface of the heat dissipation device more uniform, reduce the generation of local hot spots, avoid damage to the heating element 2 due to local overheating, and improve the stability and reliability of the entire system.

[0049] This structural design achieves efficient heat dissipation within a limited space. The layout of the heat pipe assembly and heat sink 1 is reasonable. In particular, the alternating arrangement of the heat pipe assembly increases the heat dissipation area and heat transfer path without increasing the volume too much.

[0050] In one embodiment, the first heat pipe group 3 includes a plurality of first heat pipes 31, which are spaced apart along a third direction Z that is perpendicular to both the first direction X and the second direction Y. The first heat pipes 31 are connected to a plurality of heat sinks 1 in sequence.

[0051] The second heat pipe group 4 includes multiple second heat pipes 41, which are spaced apart along the third direction Z, and the second heat pipes 41 are connected to multiple heat sinks 1 in sequence.

[0052] Specifically, the first heat pipe group 3 is composed of multiple first heat pipes 31 spaced apart along the third direction Z, and the second heat pipe group 4 is also composed of multiple second heat pipes 41 spaced apart along the third direction Z. They all pass through multiple heat sinks 1 arranged in sequence along the first direction X and are connected to them in sequence to form a three-dimensional interlaced structure.

[0053] When the heating element 2 generates heat, it transfers the heat to the heat sink 1. The heat is then transferred to the first heat pipe 31 and the second heat pipe 41 connected to it through thermal conduction. The heat-conducting medium inside the heat pipe absorbs heat at the high-temperature end and evaporates into a gaseous state. Under the action of the pressure difference inside the heat pipe, the gaseous heat-conducting medium flows to the low-temperature end, releases heat at the low-temperature end, and condenses into a liquid state. The liquid heat-conducting medium returns to the high-temperature end through capillary action, and so on, thus circulating the heat transfer. At the same time, since the first heat pipe group 3 and the second heat pipe group 4 are arranged in a three-dimensional Z-axis layer and alternate along the second Y-axis, the heat is conducted and diffused in three-dimensional space. Combined with the air circulation channels between the heat sinks 1, the heat is further removed by air convection.

[0054] By adopting the above technical solution, the heat dissipation efficiency is greatly improved by connecting the heat pipes and heat sink 1 in a three-dimensional manner, which can quickly dissipate the heat of the heat-generating element 2 and reduce its temperature; the layered and alternating heat pipe group layout makes the surface temperature distribution of the heat dissipation device more uniform and reduces local hot spots; and a high-efficiency heat dissipation network is constructed in a limited space to improve space utilization.

[0055] In one embodiment, in the third direction Z, the distance between two adjacent first heat pipes 31 in the first heat pipe group 3 is equal to the distance between two adjacent second heat pipes 41 in the second heat pipe group 4.

[0056] Specifically, this embodiment further clarifies the spatial distribution relationship of the first heat pipe group 3 and the second heat pipe group 4 in the third direction Z, that is, the spacing between adjacent heat pipes in the two heat pipe groups is kept consistent, forming a regular three-dimensional spatial array layout, which makes the arrangement of heat pipes in the direction perpendicular to the plane of heat sink 1 more regular and symmetrical.

[0057] When the heat from the heating element 2 is conducted to the heat sink 1 and then to the heat pipe, the heat conduction path and heat flux density distribution in the third direction Z are relatively balanced because the adjacent heat pipes in the first heat pipe group 3 and the second heat pipe group 4 are spaced at the same distance. This avoids excessive local thermal resistance or heat flux concentration due to differences in spacing. At the same time, the uniform spacing is conducive to the formation of a stable and uniform convection channel between the heat pipe groups, improving the efficiency of convection heat dissipation and ensuring that heat can be evenly diffused in three-dimensional space.

[0058] By adopting the above technical solutions, the equidistant arrangement can effectively improve the stability and consistency of the overall heat dissipation performance of the heat dissipation device, make the surface temperature distribution of the heat dissipation device more uniform, reduce the generation of local hot spots, and ensure that the heating element 2 works in a stable temperature environment. The regular heat pipe arrangement also facilitates standardized assembly in the manufacturing process, reduces processing difficulty and cost, and optimizes the internal space utilization of the heat dissipation device, providing a more regular spatial basis for the layout of other components.

[0059] In one embodiment, in the third direction Z, the distance between two adjacent first heat pipes 31 in the first heat pipe group 3 is greater than the distance between two adjacent second heat pipes 41 in the second heat pipe group 4.

[0060] Specifically, the first heat pipe group 3 and the second heat pipe group 4 have different spacing settings in the third direction Z. The spacing between adjacent first heat pipes 31 in the first heat pipe group 3 is greater than the spacing between adjacent second heat pipes 41 in the second heat pipe group 4, forming a three-dimensional heat pipe distribution architecture with alternating density.

[0061] When the heat from the heating element 2 is conducted to the heat sink 1 and transferred to the heat pipes, the heat conduction takes a different path due to the difference in the spacing between the first heat pipe group 3 and the second heat pipe group 4: the first heat pipe group 3, due to its larger spacing, covers a wider area of ​​the heat sink 1 with a single heat pipe, and undertakes a relatively concentrated heat conduction task, quickly transferring heat to the far end through its own efficient phase change heat transfer; the second heat pipe group 4, with its smaller spacing, can absorb the heat from the heat sink 1 more carefully with its densely distributed heat pipes, forming a multi-point distributed heat transfer.

[0062] By adopting the above technical solution, targeted heat treatment for different areas is achieved, which is suitable for heating elements 2 with localized high-heat areas. The first heat pipe group 3 with a large spacing can quickly dissipate heat from high-heat areas, while the second heat pipe group 4 with a small spacing ensures that heat is evenly distributed in other areas, effectively reducing the overall temperature difference. The overall heat dissipation performance of the heat dissipation device is optimized. The differentiated spacing not only takes into account the need for concentrated and rapid heat conduction, but also improves the precision of heat dissipation through the dense heat pipe group, thereby improving the overall heat dissipation efficiency. This design provides the possibility for flexible application of the heat dissipation device. The spacing ratio of the two sets of heat pipes can be flexibly adjusted according to the actual heat distribution characteristics of the heating element 2 to meet the heat dissipation needs in different scenarios. At the same time, it balances the heat dissipation performance with the device size and cost to a certain extent, avoiding the problem of increased cost and excessive space occupation caused by the dense heat pipe layout throughout the entire area.

[0063] In one embodiment, in the third direction Z, the first heat pipe 31 and the second heat pipe 41 extend away from each other.

[0064] Specifically, the first heat pipe 31 and the second heat pipe 41 are arranged in a spatial layout that extends backward in the third direction Z, forming a three-dimensional structural relationship of divergence.

[0065] When the heat from the heating element 2 is conducted to the heat sink 1 and then to the heat pipe, the heat is forced to diffuse to both sides during the conduction process because the first heat pipe 31 and the second heat pipe 41 extend away from each other, forming a bidirectional heat flow path and preventing heat from accumulating in local areas.

[0066] By adopting the above technical solution, the heat dissipation coverage is effectively expanded, and the heat can be more evenly distributed to the edge area of ​​the heat dissipation device, significantly reducing the temperature gradient around the heat-generating element 2 and reducing the generation of local hot spots.

[0067] In one embodiment, the first heat pipe 31 includes a first pipe body 311 and a second pipe body 312 that is perpendicularly connected to the first pipe body 311. The first pipe body 311 extends along a first direction X, and the second pipe body 312 extends along a third direction Z. The second heat pipe 41 includes a third pipe body 411 and a fourth pipe body 412 that is perpendicularly connected to the third pipe body 411. The third pipe body 411 extends along the first direction X, and the fourth pipe body 412 extends away from the second pipe body 312 along a third direction Z.

[0068] Specifically, the first heat pipe 31 is composed of a first tube body 311 and a second tube body 312 that are perpendicular to each other. The first tube body 311 extends along the first direction X, and the second tube body 312 extends along the third direction Z. The second heat pipe 41 is vertically connected by a third tube body 411 and a fourth tube body 412. The third tube body 411 also extends along the first direction X, and the fourth tube body 412 extends away from the second tube body 312 in the third direction Z, forming a three-dimensional staggered structure similar to an "L" shape and facing away from each other, which is connected to a plurality of heat sinks 1 that are spaced apart along the first direction X.

[0069] When the heating element 2 generates heat and conducts it to the heat sink 1, the heat is first transferred to the first tube 311 and the third tube 411 extending along the first direction X, and then diffused and conducted to both sides in the third direction Z through the second tube 312 and the fourth tube 412 respectively; after the heat-conducting medium inside the heat pipe absorbs heat and evaporates in the first tube 311 and the third tube 411, it flows along the extension direction of the second tube 312 and the fourth tube 412 to the far end to release heat and condense back. This back-extending design allows the heat flow to be dispersed in three-dimensional space.

[0070] By adopting the above technical solution, heat is efficiently dispersed in three-dimensional space, avoiding heat accumulation in local areas, effectively reducing the temperature gradient around the heating element 2, and reducing local hot spots; the heat dissipation efficiency of the heat dissipation device is significantly improved, the heat pipe structure extending backward expands the heat dissipation coverage, and with the enhanced convective heat transfer due to air turbulence, heat can be quickly dissipated, ensuring the stable operation of the heating element 2.

[0071] Please refer to the following: Figure 4 In one embodiment, the heat sink 1 has a plurality of through holes 11, and the first heat pipe 31 and the second heat pipe 41 pass through the corresponding through holes 11.

[0072] Specifically, the heat sink 1 serves as a basic component, with multiple through holes 11 on its surface forming a regular array of openings. The first heat pipe 31 and the second heat pipe 41 pass through these through holes 11 and penetrate multiple heat sinks 1, constructing a three-dimensional structure in which the heat pipes and heat sinks 1 are intertwined, so that the heat pipes and heat sinks 1 are tightly connected as an integral heat dissipation component.

[0073] When the heating element 2 generates heat, it is conducted to the heat sink 1. The heat is transferred to the first heat pipe 31 and the second heat pipe 41 through the contact interface between the through hole 11 and the heat pipe. The heat-conducting medium inside the heat pipe absorbs heat and evaporates. The gaseous heat-conducting medium flows to the low-temperature end of the heat pipe under the action of pressure difference, releases heat, condenses into liquid and flows back. This cycle achieves efficient heat transfer.

[0074] By adopting the above technical solution, the through hole 11 design enables the heat pipe and the heat sink 1 to fit tightly together, which greatly reduces the contact thermal resistance between the two and improves the heat conduction efficiency. In addition, by connecting multiple heat sinks 1 through the heat pipe, the discrete heat sinks 1 are connected in series to form an overall heat conduction network, which effectively enhances the overall heat conduction performance of the heat dissipation device and enables heat to be distributed and conducted more evenly.

[0075] In one embodiment, the heat dissipation device further includes a cooling element 5, which is located on the side of the heat sink 1 away from the heat-generating element 2 in the third direction Z.

[0076] Specifically, the heat dissipation device adds a cooling component 5 to the original heat sink 1 and heat pipe assembly. In the third direction Z, the cooling component 5 is located on the side of the heat sink 1 away from the heat-generating element 2, forming a hierarchical three-dimensional structure with the heat sink 1. The cooling component 5 can be selected from different types of components such as fans, water-cooled plates, and heat dissipation fin arrays according to actual needs.

[0077] The heat generated by the heating element 2 is first transferred to the heat sink 1 connected to it. After the heat sink 1 dissipates the heat initially, the heat is further conducted away from the heating element 2. At this time, the cooling component 5 located on the other side of the heat sink 1 begins to play its role. If the cooling component 5 is a fan, the forced airflow generated by its rotation will accelerate across the surface of the heat sink 1, enhance air convection heat transfer, and quickly remove the heat. If it is a water-cooled plate, the coolant circulating inside the water-cooled plate will absorb the heat transferred by the heat sink 1 through heat conduction, and efficiently transfer the heat by utilizing the high specific heat capacity of the coolant. Regardless of the type of cooling component 5, it will quickly dissipate the heat on the heat sink 1 by enhancing the heat exchange efficiency.

[0078] By adopting the above technical solution, the heat dissipation efficiency is significantly improved. The addition of cooling component 5 makes up for the shortcomings of relying solely on the heat sink 1 and heat pipe for natural heat dissipation, enabling the heat dissipation device to meet the heat dissipation requirements of higher power heating element 2. In addition, the temperature of heating element 2 is effectively reduced. Through the active heat dissipation effect of cooling component 5, the temperature of heating element 2 can be maintained at a lower level, ensuring its stable operation and extending its service life.

[0079] In one embodiment, the heat dissipation device further includes a heat spreader 6, which is located on the side of the heat sink 1 near the heat-generating element 2 in the first direction X, and is connected to the first heat pipe 31 and the second heat pipe 41.

[0080] Specifically, the heat dissipation device adds a heat spreader 6 to the existing heat sink 1, first heat pipe 31, and second heat pipe 41. In the first direction X, the heat spreader 6 is located on the side of the heat sink 1 closest to the heating element 2, forming a stacked structure. The heat spreader 6 is directly connected to the first heat pipe 31 and the second heat pipe 41, forming a tight heat conduction network. The heat spreader 6 is usually made of a material with high thermal conductivity (such as copper or graphite), and its shape can be adapted to the layout of the heating element 2 and the heat pipes, such as a flat plate or a boss shape.

[0081] The heat generated by the heating element 2 is first transferred to the heat spreader 6, which is in close contact with it. Due to its high thermal conductivity, the heat spreader 6 quickly and evenly diffuses the heat on its surface, avoiding the formation of local hot spots. Then, the heat is conducted to the heat pipes through the connection between the heat spreader 6 and the first heat pipe 31 and the second heat pipe 41. The heat-conducting medium in the heat pipe absorbs heat and evaporates. Under the action of pressure difference, it flows to the low-temperature end, releases heat, condenses and flows back, achieving efficient heat transfer. Finally, the heat is dissipated to the surrounding environment by the heat sink 1 through thermal convection and thermal radiation.

[0082] By adopting the above technical solution, the uniformity of heat distribution is significantly improved. The heat spreader 6 can quickly spread the heat generated by the heating element 2, reduce its surface temperature gradient, and enable the heating element 2 to work in a more stable temperature environment. In addition, the overall heat dissipation efficiency of the heat dissipation device is enhanced. The connection between the heat spreader 6 and the heat pipe optimizes the heat conduction path, reduces thermal resistance, accelerates the transfer of heat from the heating element 2 to the heat pipe and heat sink 1, and improves the heat dissipation rate.

[0083] In one embodiment, the heat dissipation device further includes a fixing component 7, which includes fixing plates 71 disposed on both sides of a plurality of heat sinks 1 in a first direction X. One of the fixing plates 71 is located between the heat sinks 1 and the heat spreader 6. The fixing plate 71 is also provided with a fixing member 72 extending along the second direction Y. The fixing member 72 is connected to the second tube 312 and the fourth tube 412 in sequence.

[0084] Specifically, the fixing component 7 of the heat dissipation device consists of a fixing plate 71 and a fixing member 72: a plurality of heat dissipation fins 1 are provided with fixing plates 71 on both sides of the first direction X, wherein the fixing plate 71 on one side is located between the heat dissipation fins 1 and the heat spreader 6 to form a sandwich structure, and the fixing member 72 extends from the fixing plate 71 and is arranged along the second direction Y. The fixing member 72 is mechanically connected to the second tube body 312 and the fourth tube body 412 in a sequential connection manner to form a fixed structure across the tube body.

[0085] The fixing plates 71 on both sides clamp the heat sink 1, limiting the heat sink array in the first direction X, ensuring that the heat sink 1 and the heat spreader 6 are in close contact to optimize the heat conduction path; the fixing plate 71 located between the heat sink 1 and the heat spreader 6 not only plays a positioning role, but may also assist the heat spreader 6 in uniformly transferring heat to the heat sink 1. The fixing member 72 extending along the second direction Y connects the second tube 312 and the fourth tube 412, constructing a support structure in the direction perpendicular to the arrangement of the heat sinks. On the one hand, it fixes the relative position of the tubes to prevent displacement of the tubes due to vibration or thermal expansion and contraction, and on the other hand, it ensures the relative position of the tubes with the heat sink 1 and the heat spreader 6 is stable, maintaining the flow path of the heat dissipation medium (such as coolant or air) in the tube without interference. In a second aspect, a lamp is provided, including a light source module and the above-mentioned heat dissipation device, wherein the light source module includes a heating element 2, and the heating element 2 is connected to the heat dissipation device.

[0086] By adopting the above technical solution, the lamp in this embodiment has the advantage of high heat dissipation efficiency, in addition to the advantages of the heat dissipation device in the above embodiments.

[0087] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation device, characterized in that, include: Multiple heat sinks (1) are arranged at intervals along the first direction X, and the heat sinks (1) are used to connect to the heat-generating element (2) of the light source module; Multiple first heat pipe groups (3) extending along the first direction X, the first heat pipe groups (3) passing through multiple heat sinks (1); Multiple second heat pipe groups (4) extending along the first direction X, the second heat pipe groups (4) being disposed through multiple heat sinks (1); The first heat pipe group (3) and the second heat pipe group (4) are alternately arranged along the second direction Y, which is perpendicular to the first direction X.

2. The heat dissipation device as described in claim 1, characterized in that, The first heat pipe group (3) includes a plurality of first heat pipes (31), which are spaced apart along a third direction Z that is perpendicular to both the first direction X and the second direction Y. The first heat pipes (31) are connected to the plurality of heat sinks (1) in sequence. The second heat pipe group (4) includes a plurality of second heat pipes (41), which are arranged at intervals along the third direction Z, and the second heat pipes (41) are sequentially connected to a plurality of heat sinks (1).

3. The heat dissipation device as described in claim 2, characterized in that, In the third direction Z, the distance between two adjacent first heat pipes (31) in the first heat pipe group (3) is equal to the distance between two adjacent second heat pipes (41) in the second heat pipe group (4).

4. The heat dissipation device as described in claim 2, characterized in that, In the third direction Z, the distance between two adjacent first heat pipes (31) in the first heat pipe group (3) is greater than the distance between two adjacent second heat pipes (41) in the second heat pipe group (4).

5. The heat dissipation device as described in claim 2, characterized in that, On the third direction Z, the first heat pipe (31) and the second heat pipe (41) extend away from each other.

6. The heat dissipation device as described in claim 5, characterized in that, The first heat pipe (31) includes a first tube body (311) and a second tube body (312) that is perpendicularly connected to the first tube body (311). The first tube body (311) extends along the first direction X, and the second tube body (312) extends along the third direction Z. The second heat pipe (41) includes a third tube body (411) and a fourth tube body (412) that is perpendicularly connected to the third tube body (411). The third tube body (411) extends along the first direction X, and the fourth tube body (412) extends away from the second tube body (312) along the third direction Z.

7. The heat dissipation device according to any one of claims 2 to 6, characterized in that, The heat sink (1) has multiple through holes (11), and the first heat pipe (31) and the second heat pipe (41) pass through the corresponding through holes (11).

8. The heat dissipation device according to any one of claims 2 to 6, characterized in that, The heat dissipation device also includes a cooling element (5), which is located on the side of the heat sink (1) away from the heat-generating element (2) in the third direction Z.

9. The heat dissipation device according to any one of claims 2 to 6, characterized in that, The heat dissipation device further includes a heat spreader (6), which is located on the side of the heat sink (1) near the heat-generating element (2) in the first direction X, and is connected to the first heat pipe (31) and the second heat pipe (41).

10. A lamp, characterized in that, The device includes a light source module and a heat dissipation device as described in any one of claims 1 to 9, wherein the light source module includes a heating element (2) and the heating element (2) is connected to the heat dissipation device.

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