Refrigeration system with high performance thermoelectric regenerator in the field of semiconductors

Abstract

The application provides a refrigeration system with high-performance thermoelectric regenerator in the field of semiconductors, comprising that the output ends of a compressor are connected with the input ends of a condenser and an evaporator respectively; the output end of the condenser is connected with the input end of the evaporator through a first electronic expansion valve; the output end of the evaporator is connected with the input end of the compressor through a second electronic expansion valve; two sides of a semiconductor refrigeration sheet are respectively provided with a supercooling heat exchanger and a superheating heat exchanger; the supercooling heat exchanger is installed in series between the condenser and the first electronic expansion valve; and the superheating heat exchanger is installed in series between the output end of the evaporator and the input end of the compressor. Through connecting the output ends of the compressor with the condenser and the evaporator respectively and cooperating with the control of the first electronic expansion valve and the second electronic expansion valve, conventional refrigeration can be carried out, and the temperature of the refrigerant can be controlled before entering the evaporator, so that the refrigeration precision is effectively improved.

Description

Technical Field

[0001] This application relates to the field of industrial refrigeration technology, specifically to a refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field. Background Technology

[0002] Semiconductor manufacturing is an extremely complex process with very demanding environmental requirements. As chip integration continues to increase and feature sizes shrink, the temperature stability requirements for semiconductor manufacturing processes have reached unprecedented levels. Any minute temperature change can trigger alterations in the physical properties of materials, leading to chip performance deviations, reduced yields, and even damage to production equipment. In the early stages of semiconductor manufacturing, due to the relatively simple chip manufacturing process, the precision requirements for temperature control could be met through basic heat dissipation methods. However, with technological advancements, especially the emergence of high-precision processes such as photolithography, etching, and epitaxial growth, traditional heat dissipation methods are no longer sufficient to meet the ever-increasing heat dissipation demands. Photolithography, as a core component of chip manufacturing, generates a significant amount of heat during operation from key components such as optical lenses and laser sources. If this heat cannot be dissipated promptly and accurately, the minute deformations caused by the thermal expansion and contraction of the lenses will directly lead to deviations in the photolithographic pattern, severely impacting chip manufacturing precision.

[0003] Chiller technology emerged to address this need. It utilizes a circulating, low-temperature coolant to efficiently absorb the heat generated during equipment operation, enabling precise temperature control. Early chiller technology was relatively simple, with limited cooling capacity and temperature control accuracy only around ±2℃, suitable only for some less temperature-critical semiconductor manufacturing processes. However, with the rapid development of the semiconductor industry, the performance requirements for chillers have continuously increased, prompting continuous iteration of this technology. Today, chiller technology has made significant progress in the semiconductor field globally. The development and application of key components such as new refrigeration compressors and high-efficiency heat exchangers have greatly improved the cooling efficiency of chillers and reduced energy consumption. The combination of advanced temperature sensors and intelligent control systems enables modern chillers to maintain temperature control accuracy at ±0.1℃ or even higher, fully meeting the stringent temperature requirements of semiconductor manufacturing processes. Furthermore, to meet the demands of 24 / 7 uninterrupted operation on semiconductor production lines, chillers have achieved a qualitative leap in stability and reliability. Multiple safety protection mechanisms ensure stable operation under various complex conditions, reducing production interruptions caused by equipment failures.

[0004] While chillers are widely used in the semiconductor industry, they still have shortcomings. Some traditional chillers have low cooling efficiency, resulting in high energy consumption and increased operating costs. In addition, some chillers lack temperature control stability under extreme operating conditions, making it difficult to consistently maintain the stringent temperature standards required for semiconductor processes, thus affecting product yield and equipment lifespan. Summary of the Invention In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field.

[0005] This application provides a refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field, including... The compressor, the output of which is connected to the input of the condenser and the evaporator respectively; The output end of the condenser is connected to the input end of the evaporator through a first electronic expansion valve; The output end of the evaporator is connected to the input end of the compressor via a second electronic expansion valve; A semiconductor refrigeration chip, wherein a subcooling heat exchanger and a superheating heat exchanger are respectively provided on both sides of the semiconductor refrigeration chip; The subcooling heat exchanger is installed in series between the condenser and the first electronic expansion valve; The superheated heat exchanger is installed in series between the output end of the evaporator and the input end of the compressor.

[0006] Furthermore, The input terminals of the condenser and evaporator are connected to the compressor via a tee. The compressor is also equipped with an oil separator at its output end to separate the refrigerant and oil. The output end of the oil separator is connected to the three-way valve and the input end of the compressor, respectively.

[0007] Furthermore, The compressor is also equipped with a first temperature sensor at its output end; The first temperature sensor is located between the compressor and the oil separator and is used to detect the output temperature of the compressor.

[0008] Furthermore, A liquid storage tank, a first pressure sensor, and a drying filter are also sequentially provided between the condenser and the superheat heat exchanger. The liquid storage tank is configured to store refrigerant to prevent the system pressure from becoming too high; The first pressure sensor is configured to detect the condensing pressure of the condenser; The dryer filter is configured to separate moisture and impurities from the refrigerant.

[0009] Furthermore, The output end of the dryer filter is also connected to the input end of the compressor via a third expansion valve for cooling the compressor.

[0010] Furthermore, The condenser is also connected to a circulating cooling device for refrigerant heat exchange and cooling. The input end of the circulating cooling device is equipped with a second temperature sensor and a second pressure sensor; the output end is equipped with a third temperature sensor and a third pressure sensor.

[0011] Furthermore, The evaporator is also connected to a temperature control system for controlling the temperature of the external environment; The input end of the temperature control system is connected to the evaporator, and the output end is connected to the water tank. The input end of the water tank is connected to the evaporator and is used to store coolant.

[0012] Furthermore, A fourth temperature sensor, a fourth pressure sensor, and a flow meter are respectively installed between the input end of the temperature control system and the evaporator.

[0013] Furthermore, A water pump, a drain valve, an electric heater, a fifth temperature sensor, and a fifth pressure sensor are respectively installed between the output end of the temperature control system and the water tank. The input end of the water pump is connected to the output end of the water tank to provide circulation power; The electric heater is connected to the output end of the water pump and is used to control the output temperature of the coolant; The drain valve is located between the electric heater and the water pump; The fifth temperature sensor and the fifth pressure sensor are respectively located at the end of the electric heater away from the water pump.

[0014] Furthermore, The water tank is equipped with a level gauge, a filling port, and a level switch. The filling port is located at the top of the water tank and is used to add coolant into the water tank; The level gauge is configured to detect the liquid level height in the water tank; The liquid level switch is linked to the liquid level gauge and the liquid filling port respectively, and is used to control the automatic addition of coolant.

[0015] The advantages and positive effects of this application are: This technical solution connects the compressor output to the condenser and evaporator respectively, and with the control of the first and second electronic expansion valves, it can perform conventional refrigeration and also control the temperature of the refrigerant before it enters the evaporator, thereby effectively improving the refrigeration accuracy. At the same time, a subcooling heat exchanger is installed between the condenser and the evaporator, which can effectively cool the refrigerant before it enters the evaporator, thereby effectively improving the refrigeration capacity. Furthermore, the refrigerant will also pass through a superheating heat exchanger before entering the compressor, thereby effectively raising its temperature and reducing compression energy consumption. Attached Figure Description

[0016] Figure 1 A schematic diagram of a refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field, provided as an embodiment of this application.

[0017] The text labels in the diagram represent: 100-Compressor; 110-Oil separator; 120-First temperature sensor; 200-Condenser; 210-First electronic expansion valve; 220-Liquid receiver; 230-First pressure sensor; 240-Drier filter; 250-Third expansion valve; 260-Second temperature sensor; 261-Second pressure sensor; 270-Third temperature sensor; 271-Third pressure sensor; 300-Evaporator; 310-Second electronic expansion valve; 320-Water tank; 321-Level gauge; 322-Inlet port; 323-Level switch; 330-Fourth temperature sensor; 331-Fourth pressure sensor; 332-Flow meter; 340-Water pump; 341-Drain valve; 342-Electric heater; 343-Fifth temperature sensor; 344-Fifth pressure sensor; 400-Semiconductor cooling chip; 410-Subcooling heat exchanger; 420-Superheating heat exchanger. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solution of this application, the application will be described in detail below with reference to the accompanying drawings. The description in this section is only exemplary and explanatory, and should not be used to limit the scope of protection of this application.

[0019] Please refer to Figure 1 This embodiment provides a refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field, including... A compressor 100 is provided, the output of which is connected to the input of a condenser 200 and an evaporator 300 respectively; the output of the condenser 200 is connected to the input of the evaporator 300 through a first electronic expansion valve 210; the output of the evaporator 300 is connected to the input of the compressor 100 through a second electronic expansion valve 310; a thermoelectric cooler 400 is provided on both sides of which a subcooling heat exchanger 410 and a superheating heat exchanger 420 are respectively provided; the subcooling heat exchanger 410 is connected in series between the condenser 200 and the first electronic expansion valve 210; the superheating heat exchanger 420 is connected in series between the output of the evaporator 300 and the input of the compressor 100.

[0020] In this embodiment, the output end of the compressor 100 is connected to the condenser 200 and the evaporator 300 respectively. This allows for both refrigeration through the conventional circuit of the compressor 100, condenser 200 and evaporator 300, and direct connection of the high-temperature and high-pressure refrigerant output by the compressor 100 to the evaporator 300, thereby controlling the temperature rise of the refrigerant output by the condenser 200 and effectively improving the refrigeration accuracy.

[0021] In this embodiment, when a low-voltage DC power supply is applied to the thermoelectric cooler 400, heat will be transferred from one side of the thermoelectric cooler 400 to the other side; the thermoelectric cooler 400 transfers the generated cooling energy to the subcooling heat exchanger 410, and the refrigerant flows through the subcooling heat exchanger 410 to cool down, thereby increasing the subcooling degree after condensation and effectively improving the cooling capacity of the system; conversely, the superheating heat exchanger 420 can heat up the refrigerant entering the compressor, thereby effectively reducing energy consumption.

[0022] In a preferred embodiment, the input ends of the condenser 200 and the evaporator 300 are connected to the compressor 100 via a tee; the output end of the compressor 100 is also provided with an oil separator 110 for separating the refrigerant and oil; the output end of the oil separator 110 is connected to the tee and the input end of the compressor 100 respectively.

[0023] In this embodiment, the oil separator 110 can separate the oil and gas of the high-temperature and high-pressure refrigerant output by the compressor 100 and transport the separated oil back to the compressor 100, thereby preventing the compressor 100 from lacking oil and friction, and preventing the accumulation of oil film in the pipeline from affecting heat exchange; depending on the compressor 100, the separated oil can be transported back through a separate oil inlet or air inlet.

[0024] In a preferred embodiment, the output end of the compressor 100 is further provided with a first temperature sensor 120; the first temperature sensor 120 is located between the compressor 100 and the oil separator 110, and is used to detect the output temperature of the compressor 100.

[0025] In this embodiment, the first temperature sensor 120 is located between the compressor 100 and the oil separator 110, and is used to detect the temperature of the output refrigerant. When the temperature exceeds the set value, an alarm can be triggered.

[0026] In a preferred embodiment, a liquid storage tank 220, a first pressure sensor 230, and a dryer filter 240 are sequentially provided between the condenser 200 and the superheated heat exchanger 420; the liquid storage tank 220 is configured to store refrigerant to prevent the system pressure from being too high; the first pressure sensor 230 is configured to detect the condensing pressure of the condenser; and the dryer filter 240 is configured to separate moisture and impurities in the refrigerant.

[0027] In a preferred embodiment, the output end of the drying filter 240 is also connected to the input end of the compressor 100 via a third expansion valve 250 for cooling the compressor 100.

[0028] In this embodiment, the third expansion valve 250 is connected to the subcooling heat exchanger 410 and the dryer filter 240 via a first tee. When the third expansion valve 250 is closed, the dryer filter 240 is only connected to the subcooling heat exchanger 410. When the input temperature of the compressor 100 is too high, the third expansion valve 250 opens, and some low-temperature liquid refrigerant directly enters the input of the compressor 100, absorbing a large amount of heat, thereby cooling the compressor 100.

[0029] In a preferred embodiment, the condenser 200 is also connected to a circulating cooling device for refrigerant heat exchange and cooling; the input end of the circulating cooling device is provided with a second temperature sensor 260 and a second pressure sensor 261; the output end is provided with a third temperature sensor 270 and a third pressure sensor 271.

[0030] In this embodiment, the condenser 200 is also connected to a circulating cooling device, so that the refrigerant can be effectively cooled by circulating cooling water; conversely, the cooled water can be heated and used to transfer heat to the outside.

[0031] In a preferred embodiment, the evaporator 300 is also connected to a temperature control system for controlling the temperature of the external environment; the input end of the temperature control system is connected to the evaporator 300, and the output end is connected to the water tank 320; the input end of the water tank 320 is connected to the evaporator 300 for storing coolant.

[0032] In a preferred embodiment, a fourth temperature sensor 330, a fourth pressure sensor 331, and a flow meter 332 are respectively provided between the input terminal of the temperature control system and the evaporator 300.

[0033] In a preferred embodiment, a water pump 340, a drain valve 341, an electric heater 342, a fifth temperature sensor 343, and a fifth pressure sensor 344 are respectively provided between the output end of the temperature control system and the water tank 320; the input end of the water pump 340 is connected to the output end of the water tank 320 to provide circulation power; the electric heater 342 is connected to the output end of the water pump 340 to control the output temperature of the coolant; the drain valve 341 is located between the electric heater 342 and the water pump 340; the fifth temperature sensor 343 and the fifth pressure sensor 344 are respectively located at the end of the electric heater 342 away from the water pump 340.

[0034] In this embodiment, the water pump 340 serves as the power source for the temperature control system, enabling the coolant to circulate effectively and thus achieve a stable effect.

[0035] In this embodiment, the electric heater 342 can rapidly heat the coolant, thereby effectively improving the accuracy of temperature control.

[0036] In a preferred embodiment, the water tank 320 is provided with a level gauge 321, a filling port 322, and a level switch 323; the filling port 322 is located at the top of the water tank 320 and is used to add coolant into the water tank 320; the level gauge 321 is configured to detect the liquid level in the water tank 320; the level switch 323 is linked to the level gauge 321 and the filling port 322 respectively, and is used to control the automatic addition of coolant.

[0037] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field, characterized in that, include, A compressor (100) is provided, the output of which is connected to the input of a condenser (200) and an evaporator (300), respectively. The output end of the condenser (200) is connected to the input end of the evaporator (300) through a first electronic expansion valve (210); The output end of the evaporator (300) is connected to the input end of the compressor (100) through a second electronic expansion valve (310); A semiconductor refrigeration chip (400) is provided with a subcooling heat exchanger (410) and a superheating heat exchanger (420) on both sides of the semiconductor refrigeration chip (400). The subcooling heat exchanger (410) is installed in series between the condenser (200) and the first electronic expansion valve (210); The superheated heat exchanger (420) is installed in series between the output end of the evaporator (300) and the input end of the compressor (100).

2. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 1, characterized in that, The input terminals of the condenser (200) and evaporator (300) are connected to the compressor (100) via a tee. The compressor (100) is also provided with an oil separator (110) at its output end for separating the refrigerant and oil; The output end of the oil separator (110) is connected to the three-way valve and the input end of the compressor (100), respectively.

3. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 2, characterized in that, The compressor (100) is also equipped with a first temperature sensor (120) at its output end. The first temperature sensor (120) is located between the compressor (100) and the oil separator (110) and is used to detect the output temperature of the compressor (100).

4. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 1, characterized in that, A liquid storage tank (220), a first pressure sensor (230), and a dryer filter (240) are also sequentially provided between the condenser (200) and the superheat heat exchanger (420). The liquid storage tank (220) is configured to store refrigerant to prevent the system pressure from becoming too high; The first pressure sensor (230) is configured to detect the condensing pressure of the condenser; The dryer filter (240) is configured to separate moisture and impurities from the refrigerant.

5. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 4, characterized in that, The output end of the dryer filter (240) is also connected to the input end of the compressor (100) via a third expansion valve (250) for cooling the compressor (100).

6. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 1, characterized in that, The condenser (200) is also connected to a circulating cooling device for refrigerant heat exchange and cooling; The input end of the circulating cooling device is equipped with a second temperature sensor (260) and a second pressure sensor (261); the output end is equipped with a third temperature sensor (270) and a third pressure sensor (271).

7. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 1, characterized in that, The evaporator (300) is also connected to a temperature control system for controlling the temperature of the external environment; The input end of the temperature control system is connected to the evaporator (300), and the output end is connected to the water tank (320); The input end of the water tank (320) is connected to the evaporator (300) for storing coolant.

8. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 7, characterized in that, A fourth temperature sensor (330), a fourth pressure sensor (331), and a flow meter (332) are respectively provided between the input end of the temperature control system and the evaporator (300).

9. The refrigeration system with a high-efficiency thermoelectric regenerator in the semiconductor field according to claim 7, characterized in that, A water pump (340), a drain valve (341), an electric heater (342), a fifth temperature sensor (343), and a fifth pressure sensor (344) are respectively provided between the output end of the temperature control system and the water tank (320). The input end of the water pump (340) is connected to the output end of the water tank (320) to provide circulation power; The electric heater (342) is connected to the output end of the water pump (340) to control the output temperature of the coolant; The drain valve (341) is located between the electric heater (342) and the water pump (340); The fifth temperature sensor (343) and the fifth pressure sensor (344) are located at the end of the electric heater (342) away from the water pump (340).

10. The refrigeration system in the semiconductor field with a high-efficiency thermoelectric regenerator according to claim 7, characterized in that, The water tank (320) is equipped with a level gauge (321), a liquid inlet (322), and a level switch (323). The filling port (322) is located at the top of the water tank (320) and is used to add coolant into the water tank (320); The level gauge (321) is configured to detect the liquid level height in the water tank (320); The liquid level switch (323) is linked to the liquid level gauge (321) and the liquid filling port (322) respectively, and is used to control the automatic addition of coolant.

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