Wafer test table cooling device

Abstract

The utility model discloses a wafer test board cooling device relates to wafer cooling technical field, the utility model discloses a bottom platform, bottom platform one side is provided with tracheal joint no.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cooling technology, specifically relating to a wafer testing stage cooling device. Background Technology

[0002] A wafer test stage, also known as a Chuck stage or wafer carrier, is used for fixing, supporting, positioning, and testing wafers. During wafer aging tests, the wafer needs to be heated to the target temperature. After testing, to prevent the wafer from remaining at a high temperature for an extended period and causing oxidation, it needs to be cooled rapidly. Cooling the test stage to room temperature also facilitates the cycle of aging tests on the next wafer. Therefore, the test stage needs to be cooled as quickly as possible after testing to protect the wafer and improve testing efficiency.

[0003] The existing cooling method for test benches is to use an air pump to blow compressed air onto the test bench to achieve a cooling effect. The shortcomings of this technical solution are that the test bench needs to test wafers of different sizes. Cooling the entire test bench by blowing compressed air onto it means that the air must be blown on the largest area of ​​the test bench, resulting in a slower cooling rate for the specific area on the wafer and the cooling location cannot be matched with the location on the wafer.

[0004] There are currently no effective solutions to the problems in the relevant technologies. Utility Model Content

[0005] The purpose of this utility model is to provide a wafer testing stage cooling device, and the technical problem to be solved is as follows: the existing testing stage has the problem that the cooling speed is slow and the cooling position does not match the position of the wafer.

[0006] The objective of this utility model can be achieved through the following technical solutions: A wafer testing stage cooling device includes a base platform. A first air pipe connector and a second air pipe connector are installed on one side of the base platform. An external venting chamber is provided on the outer side of the top of the base platform, and an internal venting chamber is provided on the inner side of the top. An air-blocking component is provided between the external and internal venting chambers. A support platform is fixedly connected to the top of the base platform. At least one outer venting ring is provided above the external venting chamber on the bottom surface of the support platform, and at least two inner venting rings are provided above the inner venting chambers. Multiple air passage holes are provided at the top of the support platform, and these holes communicate with both the outer and inner venting rings. An external air passage groove is provided on one side of the outer venting ring, and this groove communicates with the first air pipe connector. An internal air passage groove is provided between each of the inner venting rings, and this groove communicates with the second air pipe connector.

[0007] As a further embodiment of this utility model: the air-blocking component includes a compartment ring fixedly connected to the middle of the top of the base platform, a plurality of sealing ears are provided on the outer side of the compartment ring, and an air-blocking block is fixedly connected between the compartment ring and the outer side of the base platform.

[0008] As a further embodiment of this utility model: each of the inner and outer ventilation rings radiates outward from the center of the support platform.

[0009] As a further embodiment of this utility model: the air pipe connector is connected to the external air chamber, and the external air passage is located above the external air chamber.

[0010] As a further embodiment of this utility model: the second air pipe connector is connected to the top of the air-blocking block, the top of the air-blocking block is connected to the inner air passage groove, and the inner end of the inner air passage groove is located above the inner air chamber.

[0011] As a further embodiment of this utility model: the air passages penetrate the support platform, and the air passages are evenly arranged along the circumferential direction of the outer and inner ventilation rings.

[0012] The beneficial effects of this utility model are: By dividing the integrated test stage into a base stage and a support stage, and setting an air-isolating component in the middle of the base stage, when a smaller wafer is placed on the support stage, only the input of cooling gas to the second air pipe connector is needed to cool the wafer placed at the top center of the support stage. At this time, the cooling airflow enters the inner ventilation chamber along the airflow channels of the second air pipe structure, the air-isolating block, the inner air passage groove, and the inner ventilation ring, and is blown to the wafer through the air passage hole. When the wafer to be cooled is larger, in addition to pushing the inner cooling gas through the second air pipe connector, the cooling gas is also pushed to the outer ventilation chamber through the airflow channels of the outer air passage groove and the inner ventilation ring via the first air pipe connector. This forms a cooling airflow channel for larger wafers. The technical advantage of setting different cooling area ranges is that it forms a dual adaptation with the placement position and test size of the wafer to be cooled on the test stage, and with more concentrated and fixed-point blowing of cooling gas from the inside to the outside, the wafer cooling efficiency is improved. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the exploded view of this utility model; Figure 3 This is a utility model Figure 2 Enlarged detail view of point A in the middle; Figure 4This is a bottom view of the exploded view of this utility model; Figure 5 This is a utility model Figure 4 A magnified view of the details at point B in the middle.

[0015] In the diagram: 1. Base platform; 2. Air pipe connector one; 3. Air pipe connector two; 4. External vent chamber; 5. Internal vent chamber; 6. Air barrier; 61. Air barrier ring; 62. Sealing ear; 63. Air barrier block; 7. Support platform; 8. External vent ring; 9. Internal vent ring; 10. Air passage hole; 11. External air passage groove; 12. Internal air passage groove; 13. Wafer block. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0017] like Figures 1 to 5 As shown, a wafer testing stage cooling device includes a base platform 1. A first air pipe connector 2 and a second air pipe connector 3 are installed on one side of the base platform 1. An external ventilation chamber 4 is provided on the outer side of the top of the base platform 1, and an internal ventilation chamber 5 is provided on the inner side of the top. An air-blocking component 6 is provided between the external ventilation chamber 4 and the internal ventilation chamber 5. A support platform 7 is fixedly connected to the top of the base platform 1. An outer ventilation ring 8 is provided above the outer ventilation chamber 4 on the bottom surface of the support platform 7, and three inner ventilation rings 9 are provided above the inner ventilation chambers 5. A plurality of air passage holes 10 are provided at the top of the support platform 7, which are respectively connected to the outer ventilation ring 8 and the inner ventilation rings 9. An external air passage groove 11 is provided on one side of the outer ventilation ring 8, which is connected to the first air pipe connector 2. An inner air passage groove 12 is provided between each inner ventilation ring 9, and the inner air passage groove 12 is connected to the second air pipe connector 3. It should be noted that this wafer testing stage is used for fixing and testing six-inch and eight-inch wafers. The gas barrier 6 includes a compartment ring 61 fixedly connected to the middle of the top of the base 1. Six sealing ears 62 are provided on the outside of the compartment ring 61. A gas barrier block 63 is fixedly connected between the compartment ring 61 and the outside of the base 1. The top of the base 1 is in contact with the bottom surface of the support platform 7 and is locked by bolts through the six sealing ears 62 and the middle sealing block. That is, the base 1 and the support platform 7 are an integral structure. In the integral state, the outer vent 4 and the inner vent 5 of the test stage are separated from each other by the compartment ring 61. A wafer block 13 is placed on the top of the support platform 7. Regardless of its size, the wafer block 13 is placed at the center of the top of the support platform 7.

[0018] like Figures 2 to 5As shown, each inner ventilation ring 9 and outer ventilation ring 8 radiates outward from the center of the support platform 7, and each air passage 10 penetrates the support platform 7 along the circumferential direction of the inner ventilation ring 9 and outer ventilation ring 8; the first air pipe connector 2 is connected to the outer ventilation chamber 4, and the outer air passage groove 11 is located above the outer ventilation chamber 4; the second air pipe connector 3 is connected to the top of the air-blocking block 63, and the top of the air-blocking block 63 is connected to the inner air passage groove 12, and the inner side of the inner air passage groove 12 is located above the inner ventilation chamber 5; It should be noted that the vent 10 used for heating and cooling gases is connected to the inner vent ring 9 and outer vent ring 8 with increasing diameters, and is evenly arranged in a circumferential direction in each ring, so as to maintain communication with the interior of the base 1 and maintain the uniformity of airflow. This ensures that the temperature can be kept uniform when the wafer is tested and that the force is kept consistent when it is adsorbed. The first air pipe connector 2 is connected to the external ventilation chamber 4. The top of the external ventilation chamber 4 is an external air passage groove 11, which is connected to the outer ventilation ring 8. The outer ventilation ring 8 is evenly provided with air passage holes 10 along the circumferential direction. The second air pipe connector 3 is kept in a blocked state with the external ventilation chamber 4 through the air isolation block 63, and is connected to the inner air passage groove 12 through the air inlet of the second air pipe connector 3 via the air isolation block 63. The inner end of the inner air passage groove 12 is connected to each inner ventilation ring 9. The inner ventilation ring 9 is located directly above the inner ventilation chamber 5, and the inner ventilation ring 9 is also evenly provided with air passage holes 10 along the circumferential direction. Therefore, when cooling the wafer, if the wafer is a small size of six inches, cooling gas is introduced into the second air pipe connector 3. The cooling gas enters the inner ventilation chamber 5 through the air isolation block 63, the inner air passage groove 12, and the inner ventilation ring 9, and finally exits through each air passage hole 10. The cooling gas is transferred to the top of the support platform 7, thereby achieving point cooling of the six-inch wafer placed in the middle of the top of the support platform 7. If the wafer is a larger size, such as eight inches, cooling gas is simultaneously introduced into the air pipe connector 1 2 and the air pipe connector 2 3. In addition to entering the inner ventilation chamber 5, the cooling gas also enters the outer ventilation chamber 4 through the outer ventilation groove 11 and the outer ventilation ring 8, and is blown onto the support platform 7 through the air holes 10 on the outer ventilation ring 8. This creates a blowing effect on a larger area at the top of the support platform 7, achieving point cooling of the eight-inch wafer. The purpose is to achieve point cooling of wafers of different sizes by blowing air into a specific area inside the test platform, thereby reducing the time required to cool the wafer and improving cooling efficiency by reducing the required cooling range of the point cooling method.

[0019] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A wafer testing stage cooling device, comprising a base (1), characterized in that, The base (1) is equipped with a first air pipe connector (2) and a second air pipe connector (3) on one side. An external air chamber (4) is provided on the outer side of the top of the base (1), and an internal air chamber (5) is provided on the inner side of the top. An air-tight component (6) is provided between the external air chamber (4) and the internal air chamber (5). A support platform (7) is fixedly connected to the top of the base (1). At least one air-venting outer ring (8) is provided on the bottom surface of the support platform (7) above the external air chamber (4) and above the internal air chamber (5). At least two ventilation inner rings (9) are provided above, and multiple air passage holes (10) are provided at the top of the support platform (7). The air passage holes (10) are connected to both the ventilation outer ring (8) and the ventilation inner ring (9). An outer air passage groove (11) is provided on one side of the ventilation outer ring (8). The outer air passage groove (11) is connected to the first air pipe connector (2). An inner air passage groove (12) is provided between each of the ventilation inner rings (9). The inner air passage groove (12) is connected to the second air pipe connector (3).

2. The wafer testing stage cooling device according to claim 1, characterized in that, The air-blocking component (6) includes a compartment ring (61) fixedly connected to the middle of the top of the base (1), and a plurality of sealing ears (62) are provided on the outer side of the compartment ring (61). An air-blocking block (63) is fixedly connected between the compartment ring (61) and the outer side of the base (1).

3. The wafer testing stage cooling device according to claim 1, characterized in that, Each of the inner ventilation ring (9) and the outer ventilation ring (8) radiates outward from the center of the support platform (7).

4. The wafer testing stage cooling device according to claim 1, characterized in that, The air pipe connector (2) is connected to the external air chamber (4), and the external air passage (11) is located above the external air chamber (4).

5. The wafer testing stage cooling device according to claim 2, characterized in that, The second air pipe connector (3) is connected to the top of the air-blocking block (63), the top of the air-blocking block (63) is connected to the inner air passage groove (12), and the inner end of the inner air passage groove (12) is located above the inner air chamber (5).

6. The wafer testing stage cooling device according to claim 1, characterized in that, The air passage (10) penetrates the support platform (7), and the air passage (10) is evenly arranged along the circumferential direction of the outer ventilation ring (8) and the inner ventilation ring (9).

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