Test fixture and test system for testing multi-specification semiconductor devices

Abstract

The utility model belongs to the technical field of semiconductor device test, especially, relate to a test fixture and test system of test multi-specification semiconductor device, include: base mechanism, be provided with a pair of support block on the test department in it, the support block is in echelon, and each echelon of two support blocks is symmetrically arranged to form the corresponding specification semiconductor device placement station, the side wall of test department is connected with the binding post to be electrically connected with support block, the binding post is configured as the external test device to form the test loop through the binding post connection test device after semiconductor device is located corresponding placement station, and semiconductor device is detected, and then realizes the detection of multi-specification semiconductor device with the same test fixture, reduces the time of test personnel's replacement fixture, improves the detection efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor device testing technology, and in particular relates to a test fixture and test system for testing multi-specification semiconductor devices. Background Technology

[0002] Surface mount semiconductor devices come in a wide variety of specifications, and testing typically involves using specialized fixtures and test clamps for each model. The former method (testing multiple batches of the same model) is suitable for testing, but becomes cumbersome if there are many models. The latter method (testing by different people) is susceptible to human error, leading to significant differences in results.

[0003] Therefore, due to the large variety of surface mount semiconductor device specifications, but the technical problem that test fixtures can only be adapted to a single model of semiconductor device, it is necessary to design a test fixture and test system for testing semiconductor devices of multiple specifications.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one test fixture and test system for testing multi-specification semiconductor devices.

[0006] In a first aspect, embodiments of this disclosure provide a test fixture, including: The base mechanism has a pair of support blocks on the test section inside. The support blocks are stepped, and the steps of the two support blocks are symmetrically arranged to form a placement station for semiconductor devices of corresponding specifications. The side wall of the test section is connected to a terminal block for electrical connection with the support block. The terminal block is configured to connect to an external test device to form a test circuit after the semiconductor device is placed in the corresponding placement position, so as to test the semiconductor device.

[0007] In one optional embodiment, the test section includes: two test conductive bases; The support block is disposed between the two test conductive bases and is connected to the corresponding test conductive bases to form the test circuit.

[0008] In one alternative embodiment, the base mechanism further includes: an insulating base; The test conductive base is connected to the top surface of the insulating base, and a groove is formed between the two test conductive bases and the insulating base.

[0009] In one alternative embodiment, the base mechanism further includes: an insulating plate; The insulating plate is connected to the top surface of the insulating base in the base mechanism; The test conductive base is connected to the insulating plate, and the insulating plate extends above the top surface of the test conductive base.

[0010] In one optional embodiment, a clamping mechanism is provided on the insulating plate, the clamping mechanism being located between two test conductive seats and above the support block; The clamping mechanism is configured to clamp the semiconductor device supported on the support block.

[0011] In one alternative embodiment, the clamping mechanism includes a spring and an insulating slider; The top end of the spring is connected to the portion of the insulating plate located above the test conductive base, and the spring is set vertically; An insulating slider is connected to the bottom end of the spring; The insulating slider contacts the semiconductor device supported on the support block to press the semiconductor device firmly.

[0012] Secondly, embodiments of this disclosure also provide a test fixture, comprising: Two test conductive bases; The support block is disposed between the two test conductive bases and is connected to the corresponding test conductive bases to form the test circuit.

[0013] The support block is stepped, and the steps of the two support blocks are symmetrically arranged to form a semiconductor device placement station of corresponding specifications. An insulating slider is provided above the support block. The insulating slider is kept in contact with the semiconductor device supported on the support block by a spring, so as to press the semiconductor device.

[0014] In one optional embodiment, the test conductive base is connected to the top surface of the insulating base, and the top surface of the insulating base is also connected to an insulating plate. The test conductive base is connected to the insulating plate, and a portion of the insulating plate extends above the top surface of the test conductive base. The top end of the spring is connected to the portion of the insulating plate located above the test conductive base, and the spring is set vertically; The bottom end of the spring is connected to the insulating slider.

[0015] In one optional embodiment, a terminal block is provided on the side wall of the test conductive base. The terminal block is configured to connect to a test device to test the semiconductor device after it has been placed in the placement station.

[0016] Thirdly, embodiments of this disclosure also provide a testing system employing the above-described test fixture, comprising: A testing device electrically connected to terminals for testing semiconductor devices.

[0017] The beneficial effects of this utility model are as follows: This test fixture includes a base mechanism, in which a pair of support blocks are provided on the test section. The support blocks are stepped, and the steps of the two support blocks are symmetrically arranged to form a placement station for semiconductor devices of corresponding specifications. A terminal block is connected to the side wall of the test section for electrical connection with the support block. The terminal block is configured to connect to an external test device. After the semiconductor device is placed in the corresponding placement station, the terminal block is connected to the test device to form a test circuit for testing the semiconductor device. This enables the testing of multiple specifications of semiconductor devices using the same test fixture, reduces the time for testers to change fixtures, and improves testing efficiency.

[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a test fixture for testing multi-specification semiconductor devices provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of the internal structure of a test fixture for testing multi-specification semiconductor devices provided in an embodiment of this disclosure.

[0022] In the picture: 1. Base mechanism, 11. Test section, 111. Test conductive seat, 112. Groove, 12. Support block, 13. Insulating base, 14. Insulating plate, 141. Slide groove, 15. Terminal block; 2. Clamping mechanism; 21. Spring; 22. Insulating slider; 3. Semiconductor devices. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0025] There are many specifications of surface mount semiconductor devices. When testing surface mount semiconductor devices, related technologies use special-type fixtures. These special-type fixtures can only be used for one type of surface mount semiconductor device. When the specifications of the surface mount semiconductor device to be tested change, the corresponding fixture needs to be changed. The inventors found that when there are many specifications of surface mount semiconductor devices to be tested, the need to frequently change fixtures leads to low testing efficiency. If test clamps are used for testing, human testing errors will occur, and the test results of different people will vary greatly, resulting in inaccurate testing.

[0026] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0028] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0029] like Figure 1As shown, at least one disclosed embodiment provides a test fixture, including: a base mechanism 1, wherein a test section 11 is provided with a pair of support blocks 12, the support blocks 12 being stepped, and each step of the two support blocks 12 being symmetrically arranged to form a placement station for semiconductor devices of corresponding specifications; a terminal block 15 is connected to the side wall of the test section 11 for electrical connection with the support block 12, the terminal block 15 being configured as an external test device, so that after the semiconductor device 3 is located in the corresponding placement station, the test device is connected through the terminal block 15 to form a test circuit for testing the semiconductor device 3, thereby realizing the testing of multiple specifications of semiconductor devices 3 using the same test fixture, reducing the time for testers to change fixtures, and improving testing efficiency.

[0030] In this embodiment, the top surface of the same step of the two support blocks 12 supports the same semiconductor device 3; each step of the support block 12 is configured to support a semiconductor device 3 of a corresponding specification; a terminal block 15 is connected to the side wall of the test section 11, and the terminal block 15 is configured to connect to a test device so that after the semiconductor device 3 is placed in the placement station, the test device is connected through the terminal block 15 to test the semiconductor device 3, thereby realizing the use of the same test fixture to test multiple specifications of semiconductor devices 3, reducing the time for testers to change fixtures and improving the testing efficiency.

[0031] In this embodiment, the different layers of steps on the support block 12 can support semiconductor devices 3 (surface mount semiconductor devices) of different specifications. When the specifications of the semiconductor device 3 change, it is only necessary to place the semiconductor device 3 on the corresponding step to achieve support for the semiconductor device 3, without the need to change the fixture.

[0032] In this embodiment, the steps on the support block 12 can be at least two layers, so as to support semiconductor devices 3 of different specifications.

[0033] In this embodiment, the steps on the support block 12 can be arranged from bottom to top, and the distance between the uppermost steps of the two support blocks 12 is larger, so that the uppermost steps can support larger semiconductor devices 3.

[0034] like Figure 2 As shown, in an optional embodiment, the test unit 11 includes: a pair of test conductive seats 111; the two test conductive seats 111 are spaced apart; a support block 12 is disposed between the two test conductive seats 111, and the support block 12 is connected to the corresponding test conductive seat 111; the material of the support block 12 is the same as the material of the test conductive seat 111; and the terminal 15 is connected to the test conductive seat 111.

[0035] In this embodiment, the two support blocks 12 do not contact each other.

[0036] In this embodiment, the test conductive base 111 and the corresponding support block 12 can be integrally formed using the same material.

[0037] In one optional embodiment, the base mechanism 1 further includes: an insulating base 13; the test conductive seat 111 is connected to the top surface of the insulating base 13, and a groove 112 is formed between the two test conductive seats 111 and the insulating base 13.

[0038] In an optional embodiment, the base mechanism 1 further includes: an insulating plate 14; the insulating plate 14 is connected to the top surface of the insulating base 13 in the base mechanism 1; the test conductive seat 111 is connected to the insulating plate 14, and the insulating plate 14 extends above the top surface of the test conductive seat 111.

[0039] In this embodiment, the top surface of the groove 112 formed by the test conductive base 111 and the insulating base 13 is open, and a pair of side walls are also open. The insulating plate 14 is disposed outside the test conductive base 111 and blocks one side wall of the open groove 112. A portion of the insulating plate 14 extends above the top surface of the groove 112, blocking part of the top surface of the groove 112, so that the groove 112 has only one side open and the top surface is open. These open positions facilitate the placement of the semiconductor device 3 to be tested on the steps of the support block 12.

[0040] In this embodiment, the side wall portion of the test conductive base 111 exposes the insulating plate 14 so that the terminal block 15 can be exposed.

[0041] In one alternative embodiment, the insulating plate 14 is provided with a clamping mechanism 2, which is located between two test conductive seats 111 and above the support block 12; the clamping mechanism 2 is configured to clamp the semiconductor device 3 supported on the support block 12.

[0042] In one optional embodiment, the clamping mechanism 2 includes: a spring 21 and an insulating slider 22; the top end of the spring 21 is connected to the portion of the insulating plate 14 located above the test conductive base 111, and the spring 21 is vertically arranged; the bottom end of the spring 21 is connected to the insulating slider 22; the insulating slider 22 contacts the semiconductor device 3 supported on the support block 12 to clamp the semiconductor device 3.

[0043] In this embodiment, the insulating plate 14 with the open sidewall of the shielding groove 112 can be vertically provided with a groove 141 on the side facing the inside of the groove 112. The spring 21 is located in the groove 141, and the insulating slider 22 is located in the groove 141. Other parts of the insulating slider 22 extend out of the groove 141 and are located in the groove 112 to facilitate pressing and clamping the semiconductor device 3. The groove 141 can limit the extension and retraction direction of the spring 21 and limit the movement direction of the insulating slider 22.

[0044] In this embodiment, when no semiconductor device 3 is placed on the step, the bottom surface of the insulating slider 22 is lower than the top surface of the bottom step, ensuring that when a semiconductor device 3 is placed on the top surface of the bottom step, the spring 21 is in a compressed state when the insulating slider 22 contacts the semiconductor device 3, thus ensuring the compression of the semiconductor device 3.

[0045] In this embodiment, when it is necessary to test the semiconductor device 3, the insulating slider 22 can be manually moved upward, and then the semiconductor device 3 can be placed on the corresponding step. The insulating slider 22 is released and pressed onto the semiconductor device 3 by the spring 21. At this time, the external testing device is connected through the terminal 15 to complete the test of the semiconductor device 3.

[0046] In this embodiment, the testing device can be an existing device for testing semiconductor device 3, and semiconductor device 3 can be a surface-mount diode, etc.

[0047] In this embodiment, each of the two test conductive bases 111 is provided with a terminal 15, and the test device is connected to both terminals 15 to test the semiconductor device 3.

[0048] In this embodiment, the test fixture can more conveniently test the semiconductor device 3 and can be adapted to more specifications of semiconductor devices 3. It has a simple structure, is easy to maintain, and is applicable to high-current products.

[0049] At least one other disclosed embodiment also provides a test fixture, comprising: a pair of test conductive seats 111, the two test conductive seats 111 being spaced apart; a pair of support blocks 12 being disposed between the two test conductive seats 111, the support blocks 12 being connected to the corresponding test conductive seats 111; the support blocks 12 being stepped, forming a placement station for supporting a semiconductor device 3 between the two support blocks 12, and the top surface of the same step of the two support blocks 12 supporting the same semiconductor device 3; an insulating slider 22 being disposed above the support block 12, the insulating slider 22 being kept in contact with the semiconductor device 3 supported on the support block 12 by a spring 21, so as to press the semiconductor device 3.

[0050] In one optional embodiment, the test conductive base 111 is connected to the top surface of the insulating base 13, and the top surface of the insulating base 13 is also connected to an insulating plate 14. The test conductive base 111 is connected to the insulating plate 14, and a portion of the insulating plate 14 extends above the top surface of the test conductive base 111. The top end of the spring 21 is connected to the portion of the insulating plate 14 located above the test conductive base 111, and the spring 21 is vertically arranged. The bottom end of the spring 21 is connected to the insulating slider 22.

[0051] In one optional embodiment, a terminal block 15 is provided on the side wall of the test conductive base 111. The terminal block 15 is configured to connect to a test device so that the semiconductor device 3 can be tested by connecting to the test device through the terminal block 15 after the semiconductor device 3 is placed in the placement station.

[0052] At least one other disclosed embodiment also provides a test system employing the above-described test fixture, comprising: a test device connected to a terminal 15 in the test fixture for testing a semiconductor device 3.

[0053] In summary, the test fixture for testing multiple specifications of semiconductor devices 3 includes: a base mechanism 1, on which a pair of support blocks 12 are provided. The support blocks 12 are stepped, and a placement station for supporting semiconductor devices 3 is formed between the two support blocks 12. The top surface of the same step of the two support blocks 12 supports the same semiconductor device 3. Each step of the support blocks 12 is configured to support semiconductor devices 3 of the corresponding specifications. A terminal block 15 is connected to the side wall of the test section 11. The terminal block 15 is configured to connect to a test device so that after the semiconductor device 3 is placed in the placement station, the test device is connected through the terminal block 15 to test the semiconductor device 3. This enables the testing of multiple specifications of semiconductor devices 3 using the same test fixture, reduces the time required for testers to change fixtures, and improves testing efficiency.

[0054] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0055] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0056] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “under” other elements or features would be oriented as “above” other elements or features.

[0057] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A test fixture, characterized in that, include: The base mechanism (1) has a pair of support blocks (12) on the test section (11) inside. The support blocks (12) are stepped, and the steps of the two support blocks (12) are symmetrically arranged to form a semiconductor device placement station of corresponding specifications. The side wall of the test section (11) is connected to a terminal block (15) for electrical connection with the support block (12). The terminal block (15) is configured as an external test device to form a test circuit by connecting the test device through the terminal block (15) after the semiconductor device (3) is located in the corresponding placement position, and to test the semiconductor device (3).

2. The test fixture as described in claim 1, characterized in that, The test section (11) includes: two test conductive bases (111); The support block (12) is disposed between the two test conductive seats (111), and the support block (12) is connected to the corresponding test conductive seat (111) to form the test circuit.

3. The test fixture as described in claim 2, characterized in that, The base mechanism (1) further includes: an insulating base (13); The test conductive base (111) is connected to the top surface of the insulating base (13), and a groove (112) is formed between the two test conductive bases (111) and the insulating base (13).

4. The test fixture as described in claim 2, characterized in that, The base mechanism (1) further includes: an insulating plate (14); The insulating plate (14) is connected to the top surface of the insulating base (13) in the base mechanism (1); The test conductive base (111) is connected to the insulating plate (14), and the insulating plate (14) extends above the top surface of the test conductive base (111).

5. The test fixture as described in claim 4, characterized in that, A clamping mechanism (2) is provided on the insulating plate (14). The clamping mechanism (2) is located between two test conductive seats (111) and above the support block (12). The clamping mechanism (2) is configured to clamp the semiconductor device (3) supported on the support block (12).

6. The test fixture as described in claim 5, characterized in that, The clamping mechanism (2) includes: a spring (21) and an insulating slider (22); The top end of the spring (21) is connected to the portion of the insulating plate (14) above the test conductive base (111), and the spring (21) is set vertically; An insulating slider (22) is connected to the bottom end of the spring (21). The insulating slider (22) contacts the semiconductor device (3) supported on the support block (12) to press the semiconductor device (3) firmly.

7. A test fixture, characterized in that, include: Two test conductive bases (111); A support block (12) is disposed between two test conductive seats (111), and the support block (12) is connected to the corresponding test conductive seat (111) to form a test circuit; The support block (12) is stepped, and the steps of the two support blocks (12) are symmetrically arranged to form a semiconductor device placement station of corresponding specifications; An insulating slider (22) is provided above the support block (12). The insulating slider (22) is kept in contact with the semiconductor device (3) supported on the support block (12) by a spring (21) to press the semiconductor device (3) tightly.

8. The test fixture as described in claim 7, characterized in that, The test conductive base (111) is connected to the top surface of the insulating base (13), and the top surface of the insulating base (13) is also connected to an insulating plate (14). The test conductive base (111) is connected to the insulating plate (14), and a portion of the insulating plate (14) extends above the top surface of the test conductive base (111). The top end of the spring (21) is connected to the portion of the insulating plate (14) above the test conductive base (111), and the spring (21) is set vertically; The bottom end of the spring (21) is connected to the insulating slider (22).

9. The test fixture as described in claim 7, characterized in that, The test conductive base (111) has a terminal block (15) on its side wall. The terminal block (15) is configured to connect to a test device so that the semiconductor device (3) can be tested by connecting to the test device through the terminal block (15) after the semiconductor device (3) is placed in the placement station.

10. A testing system employing the test fixture as described in any one of claims 1-9, characterized in that, include: The testing device is electrically connected to the terminal block (15) to test the semiconductor device (3).

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