Optical coupling device and silicon light module

Abstract

The utility model belongs to optical module coupling technical field discloses an optical coupling device and silicon light module. Optical coupling device is used for the coupling operation of the chip of silicon light module, including fixed establishment, chip adjusting mechanism and microstructure, chip adjusting mechanism includes two six -axis adjusting components, two six -axis adjusting components interval arrangement, and the fixed end of two six -axis adjusting components is fixedly connected on the fixed establishment, and the output of two six -axis adjusting components all is provided with chip clamping assembly, and two chip clamping assemblies are used for clamping chip, and the microstructure fixed position is adjustably connected on the fixed establishment, and the microstructure can observe the chip on two chip clamping assemblies. The utility model provides optical coupling device and silicon light module, avoid the vibration when two chips coupling of the activity of other structures, improve the coupling effect of light module chip, guarantee the quality of light module.

Description

Technical Field

[0001] This utility model relates to the field of optical module coupling technology, and in particular to an optical coupling device and a silicon photonic module. Background Technology

[0002] Silicon photonics (SPP) modules utilize silicon photonics technology. The core concept behind SPP modules is "light replacing electricity," meaning using laser beams to replace electronic signals for data transmission. SPP module chips are fabricated on silicon substrates using silicon wafer technology, employing etching and epitaxial growth processes to create key components such as modulators. This achieves a high degree of integration between modulators and passive optical devices. Coupling between active and passive chips, and between fiber array components and passive chips, has always been a crucial step in the research and development of SPP modules. The coupling efficiency directly determines the performance of the SPP module. Currently, grating coupling is a widely used coupling method. However, due to the small size of the optical module, the internal chip spacing is too tight during coupling, making it easy for ordinary tooling to interfere with the optical module when adjusting lenses, resulting in poor coupling and even quality problems for the optical module.

[0003] The prior art discloses a coupling system for an optical module, including a lens structure, a prism structure, a prism adjustment structure, a microstructure, and an optical chip. The lens structure does not adjust the lens height, and the prism adjustment device does not adjust the prism displacement. The positioning point on the optical lens is used as a fixed reference point. The optical chip is displaced by the chip structure so that the positioning point of the optical chip coincides with the positioning point of the optical lens. The microstructure observes that the images of the two positioning points are completely overlapped. Keeping the positions of the lens structure and the chip structure still, the prism assembly is translated by the prism adjustment device. The positioning point of the optical chip and the positioning point of the optical lens are still aligned. Finally, the lens structure is lowered to adjust the lens, thus enabling the lens to couple with the optical chip. However, using the prism assembly as the structure of the imaging optical path between the reflective lens and the optical chip makes it susceptible to external influences. At the same time, when moving the prism assembly, the movement of the prism adjustment device will cause slight vibrations to the lens or the optical chip, affecting the coupling effect of the optical module. Utility Model Content

[0004] The purpose of this invention is to provide an optical coupling device and a silicon photonics module, which can reduce the structural complexity of the device, avoid vibration caused by the activity of other structures during the coupling of the two chips, improve the coupling effect of the optical module chips, and ensure the quality of the optical module.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An optical coupling device for coupling operations on a silicon photonics module chip, characterized in that it comprises:

[0007] Fixed mechanism;

[0008] A chip adjustment mechanism includes two six-axis adjustment components, which are arranged at intervals and whose fixed ends are fixedly connected to the fixing mechanism. Each of the two six-axis adjustment components has a chip clamping component at its output end, and the two chip clamping components are used to clamp the chip.

[0009] A microscopic mechanism is fixedly and adjustablely connected to the fixing mechanism, and the microscopic mechanism is capable of observing the chips on the two chip clamping assemblies.

[0010] Preferably, the two six-axis adjustment components are arranged in parallel at intervals, and the two chip clamping components are arranged opposite to each other.

[0011] Preferably, the six-axis adjustment assembly is a six-axis displacement stage.

[0012] Preferably, each of the chip clamping components includes:

[0013] A connector, one end of which is fixedly connected to the output end of the six-axis adjustment assembly;

[0014] A driving component, wherein the fixed end of the driving component is fixedly connected to the other end of the connecting component;

[0015] At least two clamping members are tractively connected to the output end of the drive member, and the drive member is capable of driving the at least two clamping members to move closer or further apart relative to each other in order to clamp and release the chip.

[0016] Preferably, multiple microscopic mechanisms are provided, and the multiple microscopic mechanisms are spaced apart.

[0017] Preferably, each of the microstructures comprises:

[0018] A base, which is fixedly and adjustablely connected to the fixing mechanism;

[0019] An adjustment component, one end of which is fixedly connected to the base;

[0020] A microscope assembly is fixedly connected to the other end of the adjustment assembly. The adjustment assembly can adjust the position of the microscope assembly relative to the chip clamping assembly. The microscope assembly can observe the chips on the two chip clamping assemblies.

[0021] Preferably, the optical coupling device further includes:

[0022] A power mechanism is fixedly mounted on the fixing mechanism and is connected to the chip clamping assembly for transmission. The power mechanism can drive the chip clamping assembly to clamp or release the chip.

[0023] Preferably, the optical coupling device further includes:

[0024] A carrying mechanism, one end of which is fixedly connected to the fixing mechanism, and the other end of which is used to hold the chip.

[0025] Preferably, the loading mechanism includes:

[0026] A carrier assembly capable of holding the chip;

[0027] A lifting assembly, wherein the fixed end of the lifting assembly is fixedly connected to the fixed mechanism, and the output end of the lifting assembly is connected to the load assembly via a transmission connection.

[0028] A silicon photonics module, which is formed by coupling using an optical coupling device as described above.

[0029] The beneficial effects of this utility model are:

[0030] This invention provides an optical coupling device and a silicon photonics module for coupling chips, including a fixing mechanism, a chip adjustment mechanism, and a microscopic mechanism. The chip adjustment mechanism includes two six-axis adjustment components arranged at intervals, with the fixed ends of the two six-axis adjustment components fixedly connected to the fixing mechanism. Each of the output ends of the two six-axis adjustment components is provided with a chip clamping component for clamping the chip. The microscopic mechanism is fixedly and adjustablely connected to the fixing mechanism, and the microscopic mechanism can observe the chip on the two chip clamping components.

[0031] During chip coupling, the chips to be coupled are placed on two chip clamping assemblies to secure them. Then, two six-axis adjustment components allow for initial position and orientation adjustments in six degrees of freedom for each clamped chip, ensuring they are in the appropriate positions to meet the basic requirements of optical coupling. During this adjustment process, the coupling state of the chips on the two clamping assemblies can be clearly observed using a microscopic mechanism. Simultaneously, precise adjustments using the six-axis adjustment components bring the two chips to their optimal coupling state. Once the two chips reach their optimal coupling state, direct adhesive bonding can be performed without the need for additional structures, reducing the structural complexity of the device, avoiding vibrations caused by the movement of other structures during chip coupling, improving the chip coupling effect of the optical module, and ensuring the quality of the silicon optical module. Attached Figure Description

[0032] Figure 1 This is a first isometric view of the optical coupling device provided in this embodiment of the present invention;

[0033] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0034] Figure 3 This is a second isometric view of the optical coupling device provided in this embodiment of the present invention;

[0035] Figure 4 This is a top view of the optical coupling device provided in an embodiment of the present invention.

[0036] In the picture:

[0037] 1. Fixing mechanism; 11. Through hole;

[0038] 2. Chip adjustment mechanism; 21. Six-axis adjustment assembly; 22. Chip clamping assembly; 221. Connector; 222. Drive unit; 223. Clamping unit;

[0039] 3. Microscopic mechanism; 31. Base; 32. Adjustment components; 33. Microscopic components;

[0040] 4. Carrying mechanism; 41. Carrying component; 411. Carrying body; 412. Guide component; 413. Limiting component; 42. Lifting component. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0042] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0045] This embodiment provides an optical coupling device for coupling operations on the chip of a silicon photonics module, such as... Figures 1-4 As shown, the device includes a fixing mechanism 1, a chip adjustment mechanism 2, and a microscopic mechanism 3. The chip adjustment mechanism 2 includes two six-axis adjustment components 21, which are arranged at intervals. The fixed ends of the two six-axis adjustment components 21 are fixedly connected to the fixing mechanism 1. The output ends of the two six-axis adjustment components 21 are provided with chip clamping components 22, which are used to clamp the chip. The microscopic mechanism 3 is fixedly and adjustablely connected to the fixing mechanism 1, and the microscopic mechanism 3 can observe the chip on the two chip clamping components 22.

[0046] During chip coupling, the chips to be coupled are placed on two chip clamping components 22, which hold the chips in place. Then, two six-axis adjustment components 21 are used to initially adjust the position and orientation of each chip in six degrees of freedom, ensuring the chips are in the appropriate positions to meet the basic requirements of optical coupling. During this adjustment process, the coupling state of the chips on the two chip clamping components 22 can be clearly observed through the microscopic mechanism 3. Simultaneously, the precise adjustment of the chips using the six-axis adjustment components 21 ensures the two chips achieve the optimal coupling state. When the two chips reach the optimal coupling state, direct adhesive bonding can be performed without adding other structures, reducing the structural complexity of the device, avoiding vibrations caused by the movement of other structures during chip coupling, improving the coupling effect of the optical module chips, and ensuring the quality of the silicon optical module. It should be noted that in this embodiment, the fixing mechanism 1 is a fixing plate. In other embodiments, the fixing mechanism 1 can also be a fixing frame or a fixing block. No limitation is made here.

[0047] Optionally, such as Figure 1 and Figure 2 As shown, in this embodiment, the fixing mechanism 1 has multiple through holes 11, which are arranged in an array at intervals on the fixing mechanism 1. The arrangement of multiple through holes 11 facilitates the installation of the chip adjustment mechanism 2 and the microscopic mechanism 3.

[0048] Specifically, in this embodiment, both the chip adjustment mechanism 2 and the microscopic mechanism 3 are fixedly connected to the fixing mechanism 1 via a bolt and nut assembly passing through the through hole 11. The bolt and nut assembly provides high connection strength, preventing movement of the chip adjustment mechanism 2 and the microscopic mechanism 3. In other embodiments, the chip adjustment mechanism 2 and the microscopic mechanism 3 are also fixedly connected to the fixing mechanism 1 via clips or fixing pins. No limitations are imposed here.

[0049] Optionally, such as Figure 1 As shown, in this embodiment, two six-axis adjustment components 21 are arranged parallel to each other, and two chip clamping components 22 are arranged opposite each other. This arrangement enables alignment and bonding of the chips on the two chip clamping components 22 during chip coupling, effectively reducing the coupling defect rate and improving the performance and reliability of the optical module. In other embodiments, the two six-axis adjustment components 21 are arranged parallel to each other, and the two chip clamping components 22 are arranged at an angle, or the two six-axis adjustment components 21 are arranged parallel to each other, and the two chip clamping components 22 are arranged vertically spaced, etc. No limitation is made here; any arrangement suitable for the coupling of chips in different optical modules is acceptable. It should be noted that in this embodiment, the two six-axis adjustment components 21 are arranged along... Figure 1 The two chip clamping components 22 are arranged parallel to each other in the front and back directions and are positioned along the same direction. Figure 1In other embodiments, the two six-axis adjustment components 21 are arranged in a front-to-back direction relative to each other. Figure 1 The two chip clamping components 22 are arranged parallel to each other in the left and right directions, and are positioned along the left and right sides. Figure 1 The left and right relative settings, etc., are not restricted here.

[0050] Optionally, such as Figure 1 As shown, in this embodiment, the six-axis adjustment component 21 is a six-axis displacement stage. The six-axis displacement stage enables the chip clamping component 22 to achieve precise adjustment of six degrees of freedom in three-dimensional space. In other embodiments, the six-axis adjustment component 21 can also be a six-axis robotic arm or a six-axis alignment platform, etc. No limitation is imposed here, as long as it enables the chip clamping component 22 to achieve adjustment of six degrees of freedom in three-dimensional space. It should be noted that in this embodiment, the movement accuracy of the six-axis displacement stage in three-dimensional space is 0.05 μm, and the rotation accuracy is 0.5 mrad. In other embodiments, the movement accuracy of the six-axis displacement stage in three-dimensional space can also be 0.1 μm, and the rotation accuracy can be 0.1 mrad, etc. No limitation is imposed here.

[0051] Optionally, such as Figure 2 As shown, each chip clamping assembly 22 includes a connector 221, a driver 222, and at least two clamping members 223. One end of the connector 221 is fixedly connected to the output end of the six-axis adjustment assembly 21, and the fixed end of the driver 222 is fixedly connected to the other end of the connector 221. At least two clamping members 223 are drivenly connected to the output end of the driver 222. The driver 222 can drive at least two clamping members 223 to move closer or further apart to clamp and release the chip.

[0052] When it is necessary to grasp the chip, the driver 222 drives at least two clamping members 223 to slowly close, ensuring that the chip remains stable during the grasping process. During the chip placement stage, the driver 222 drives at least two clamping members 223 to open smoothly, realizing the precise release of the chip. This makes the clamping and release processes efficient and smooth, ensuring the chip coupling effect.

[0053] Specifically, such as Figure 2 As shown, in this embodiment, the connector 221 is a T-shaped connector plate. In other embodiments, the connector 221 can also be an L-shaped connector plate, a straight connector plate, or a connector frame, etc. There are no limitations here.

[0054] Specifically, such as Figure 2As shown, in this embodiment, the driving component 222 is a parallel pneumatic gripper, and the movable ends of both grippers are connected to clamping components 223. This ensures that the two clamping components 223 remain parallel during movement, thereby ensuring the stability and accuracy of the clamping action and thus guaranteeing the coupling effect of the two chips. In other embodiments, the driving component 222 is an opening and closing type pneumatic gripper, and both grippers are connected to clamping components 223; or the driving component 222 is a three-finger pneumatic gripper, and the movable ends of all three grippers are connected to clamping components 223; or the driving component 222 is an electric gripper, and the movable ends of both grippers are connected to clamping components 223, etc. No limitations are imposed here. It should be noted that in this embodiment, the end of the clamping component 223 that holds the chip is a pointed tip. The pointed tip can easily penetrate into narrow spaces for clamping operations, while also reducing scratching and squeezing damage to the material surface. In other embodiments, the end of the clamping component 223 that holds the chip can also be a flat end, etc. No restrictions are imposed here, as long as the chip can be stably clamped.

[0055] Specifically, in this embodiment, the clamping force of the parallel pneumatic gripper is 0.3N-100N. It can be 0.3N, 3N, 30N, or 100N; no limitation is made in this embodiment. In other embodiments, the clamping force of the parallel pneumatic gripper can also be 0.1N-50N, etc. No limitation is made here.

[0056] Specifically, in this embodiment, the minimum size of the clamping member 223 is 0.2mm x 0.1mm. In other embodiments, the minimum size of the clamping member 223 is 0.1mm x 0.1mm, or the minimum size of the clamping member 223 is 0.3mm x 0.5mm, etc. No limitation is made here.

[0057] Optionally, in this embodiment, the surface of the clamping member 223 that contacts the chip is covered with an anti-slip coating, which ensures reliable clamping of the chip surface and avoids scratching the chip. In other embodiments, the surface of the clamping member 223 that contacts the chip may also be provided with silicone or rubber, etc. No limitations are imposed here.

[0058] Optionally, the optical coupling device also includes a power mechanism (not shown in the figure), which is fixedly mounted on the fixing mechanism 1 and is drive-connected to the chip clamping assembly 22. The power mechanism can drive the chip clamping assembly 22 to clamp or release the chip. The power mechanism provides driving force to the chip clamping assembly 22. It should be noted that the power mechanism is drive-connected to the driving component 222.

[0059] Specifically, in this embodiment, the power mechanism is a combination of an air compressor and a solenoid valve. Since the combination of an air compressor and a solenoid valve to drive the opening and closing of the parallel pneumatic gripper is existing technology, it will not be described further here. In other embodiments, the power mechanism may also be a combination of a hydraulic cylinder and a hydraulic valve, or a combination of a motor and a reducer, etc. No limitations are imposed here.

[0060] Optionally, such as Figure 3 As shown, in this embodiment, multiple microscopic mechanisms 3 are provided, and the multiple microscopic mechanisms 3 are spaced apart. The multiple spaced microscopic mechanisms 3 can observe the coupling of the two chips from multiple positions, further improving the reliability of chip coupling, and providing multi-view quantitative analysis data.

[0061] Specifically, such as Figure 3 As shown, in this embodiment, two microscopic mechanisms 3 are provided. One microscopic mechanism 3 is located directly above the two chip clamping assemblies 22, and the other is located beside one of the two six-axis adjustment assemblies 21. In other embodiments, the two microscopic mechanisms 3 can be positioned along... Figure 3 The two six-axis adjustment components 21 are positioned on opposite sides of each other in the front-to-back direction, or the two microscopic mechanisms 3 can be positioned along... Figure 3 The left and right directions are set on opposite sides of the two six-axis adjustment components 21, etc. No restrictions are placed here; the goal is to enable observation of the coupling between the two chips from multiple angles.

[0062] Optionally, such as Figure 3 As shown, each microscopic mechanism 3 includes a base 31, an adjustment component 32, and a microscopic component 33. The base 31 is fixedly and adjustablely connected to the fixing mechanism 1. One end of the adjustment component 32 is fixedly connected to the base 31, and the microscopic component 33 is fixedly connected to the other end of the adjustment component 32. The microscopic component 33 can adjust its position relative to the chip clamping component 22, allowing it to observe the chips on the two chip clamping components 22. Because the position of the microscopic component 33 relative to the chips is adjustable, the coupling of the two chips can be observed from different angles, providing intuitive guidance for chip coupling operations. It should be noted that in this embodiment, the microscopic component 33 is a bidirectional continuous zoom high-definition microscope. In other embodiments, the microscopic component 33 can also be a conventional microscope. No limitation is made here. Specifically, the magnification of the microscopic component 33 in this embodiment is 15x-300x. In other embodiments, the magnification of the microscopic component 33 can also be 30x-500x, etc. No limitation is made here.

[0063] Specifically, in this embodiment, the adjustment component 32 is a linear motion guide pair with a manual clamp. Since linear motion guide pairs with manual clamps are existing technology, they are not considered limiting here. In other embodiments, the adjustment component 32 can also be a manually adjustable pneumatic rod assembly or a linkage assembly, etc. No further limitations are imposed here.

[0064] Specifically, in this embodiment, such as Figure 3 As shown, multiple linear motion guide rail pairs with manual clamps are provided, and these multiple linear motion guide rail pairs with manual clamps are interconnected. This configuration enables the microscopic component 33 to achieve precise positioning and attitude adjustment in three-dimensional space, meeting the high-precision microscopic observation requirements under different working conditions.

[0065] Specifically, in this embodiment, the slide rail of the first linear motion guide pair with a manual clamp is fixedly connected to the base 31, and the microscope component 33 is disposed on the slider of the last linear motion guide pair with a manual clamp. In other embodiments, the slider of the first linear motion guide pair with a manual clamp is fixedly connected to the base 31, and the microscope component 33 is disposed on the slide rail of the last linear motion guide pair with a manual clamp. No limitations are imposed here.

[0066] Specifically, such as Figure 3 As shown, in this embodiment, the adjustment component 32 of the microscopic mechanism 3, located directly above the two chip clamping components 22, includes three interconnected linear motion guide pairs with manual clamps, enabling the microscopic component 33 to move along... Figure 2 Movement in the forward / backward, left / right, and up / down directions.

[0067] Specifically, such as Figure 3 As shown, in this embodiment, the adjustment component 32 of the microscopic mechanism 3, located beside the two chip clamping components 22, includes two interconnected linear motion guide pairs with manual clamps, enabling the microscopic component 33 to move along... Figure 2 Movement in the front-to-back direction and the extension direction of the microscopic component 33.

[0068] Optionally, such as Figures 2-4 As shown, the optical coupling device also includes a carrier mechanism 4, one end of which is fixedly connected to the fixing mechanism 1, and the other end of which is used to hold the chip. This configuration ensures the chip's position. It should be noted that the carrier mechanism 4 is fixedly connected to the fixing mechanism 1 using a combination of bolts and nuts. In other embodiments, the carrier mechanism 4 is also fixedly connected to the fixing mechanism 1 using snap-fit ​​devices or fixing pins. No limitation is made here.

[0069] Specifically, such as Figure 2 and Figure 3As shown, the loading mechanism 4 includes a loading component 41 and a lifting component 42. The loading component 41 can hold the chip, and the fixed end of the lifting component 42 is fixedly connected to the fixing mechanism 1. The output end of the lifting component 42 is drively connected to the loading component 41. The lifting component 42 can drive the loading component 41 along... Figure 2 The lifting mechanism moves vertically, accommodating chips of varying thicknesses. It should be noted that in this embodiment, the lifting assembly 42 is a single-axis lifting displacement stage; in other embodiments, the lifting assembly 42 may also be a pneumatic cylinder, etc. No limitations are imposed here.

[0070] Further optional, such as Figure 2 As shown, in this embodiment, the carrier assembly 41 includes a carrier body 411, a guide 412, and a limiting member 413. The guide 412 is disposed on the carrier body 411, and the limiting member 413 is slidably disposed on the guide 412. The limiting member 413 can restrict the coupled chip between the limiting member 413 and the carrier body 411. The above arrangement can fix the coupled chip, which can effectively prevent the chip from shifting or falling off during subsequent handling, testing, and other operations. Moreover, through reasonable structural design, it can provide sufficient limiting force without damaging the chip.

[0071] Specifically, such as Figure 2 and Figure 3 As shown, in this embodiment, the carrying body 411 is a carrying plate. In other embodiments, the carrying body 411 can also be a carrying block or a carrying rack, etc. No limitation is made here.

[0072] Specifically, such as Figure 2 and Figure 3 As shown, in this embodiment, the guide 412 is a guide rod. In other embodiments, the guide 412 can also be a guide rod or a guide rail, etc. No limitation is made here. It should be noted that in this embodiment, two guides 412 are provided. Figure 3 It extends in the left and right direction. In other embodiments, the guide 412 may also be provided as one or three, etc. There is no limitation here.

[0073] Specifically, such as Figure 2 and Figure 3 As shown, in this embodiment, the limiting member 413 is a limiting plate. In other embodiments, the limiting member 413 may also be a limiting block, etc. No limitation is made here.

[0074] This embodiment also provides a silicon photonics module, which is formed by coupling the silicon photonics modules through an optical coupling device. By utilizing the optical coupling device, there is no need to add other structures, avoiding the vibration of the two chips to be coupled caused by the movement of other structures, reducing the structural complexity of the device, improving the coupling effect of the optical module chips, and ensuring the quality of the optical module.

[0075] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An optical coupling device for coupling operations on a silicon photonics module chip, characterized in that, include: Fixed mechanism (1); The chip adjustment mechanism (2) includes two six-axis adjustment components (21), which are arranged at intervals. The fixed ends of the two six-axis adjustment components (21) are fixedly connected to the fixing mechanism (1). The output ends of the two six-axis adjustment components (21) are provided with chip clamping components (22), which are used to clamp the chip. Microscopic mechanism (3) is fixedly and adjustablely connected to the fixed mechanism (1), and the microscopic mechanism (3) is able to observe the chips on the two chip clamping assemblies (22).

2. The optical coupling device according to claim 1, characterized in that, The two six-axis adjustment components (21) are arranged in parallel and spaced apart, and the two chip clamping components (22) are arranged opposite to each other.

3. The optical coupling device according to claim 1, characterized in that, The six-axis adjustment assembly (21) is a six-axis displacement stage.

4. The optical coupling device according to claim 1, characterized in that, Each of the chip clamping components (22) includes: A connector (221), one end of which is fixedly connected to the output end of the six-axis adjustment assembly (21); A driving member (222) is provided, wherein the fixed end of the driving member (222) is fixedly connected to the other end of the connecting member (221); At least two clamping members (223) are tractively connected to the output end of the drive member (222), and the drive member (222) is capable of driving the at least two clamping members (223) to move closer or further apart relative to each other to clamp and release the chip.

5. The optical coupling device according to claim 1, characterized in that, The microscope mechanism (3) is provided in multiple ways, and the multiple microscope mechanisms (3) are arranged at intervals.

6. The optical coupling device according to claim 5, characterized in that, Each of the aforementioned microstructures (3) includes: A base (31) is fixedly and adjustablely connected to the fixing mechanism (1); An adjustment component (32) is provided, one end of which is fixedly connected to the base (31). Microscope assembly (33) is fixedly connected to the other end of adjustment assembly (32). Adjustment assembly (32) can adjust the position of microscope assembly (33) relative to chip clamping assembly (22). Microscope assembly (33) can observe the chips on the two chip clamping assemblies (22).

7. The optical coupling device according to any one of claims 1-6, characterized in that, The optical coupling device further includes: The power mechanism is fixedly mounted on the fixing mechanism (1) and is connected to the chip clamping assembly (22) in a transmission manner. The power mechanism can drive the chip clamping assembly (22) to clamp or release the chip.

8. The optical coupling device according to any one of claims 1-6, characterized in that, The optical coupling device further includes: The carrier mechanism (4) has one end fixedly connected to the fixing mechanism (1) and the other end of the carrier mechanism (4) is used to hold the chip.

9. The optical coupling device according to claim 8, characterized in that, The loading mechanism (4) includes: A carrier assembly (41) capable of holding the chip; The lifting assembly (42) has its fixed end fixedly connected to the fixed mechanism (1), and its output end is connected to the load assembly (41) via a transmission connection.

10. A silicon photonics module, characterized in that, The silicon photonics module is formed by coupling using the optical coupling device as described in any one of claims 1-9.

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