Electronic ceramic with double layer electrode
By setting a double-layer electrode structure on the ceramic chip, including a first metal electrode layer and a second metal electrode layer, and setting conductive protrusions on the surface of the second electrode layer, the problem of easy detachment of single-layer electrodes is solved, the adhesion and conductivity of the electrodes are improved, and the stability and reliability of electronic ceramics are enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 广东达孚电子有限公司
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-24
AI Technical Summary
The adhesion between the single-layer metal electrode and the ceramic chip in existing electronic ceramics is weak, and it is easy to fall off during long-term operation, which affects the stability of electronic products.
A dual-electrode structure is adopted, wherein the first metal electrode layer is sprayed on the front and back of the ceramic chip, the second metal electrode layer is sprayed on the surface of the first metal electrode layer, and conductive protrusions are provided on the surface of the second metal electrode layer. The pins are connected by a solder layer, and the encapsulation layer covers the outside. Aluminum or nickel is used as the first electrode, copper or silver is used as the second electrode, and magnetic iron oxide particles are filled inside the encapsulation layer.
It improves the adhesion between the electrodes and the ceramic chip, reduces contact resistance, enhances current channel efficiency, protects the internal structure, and improves the conductivity stability and structural reliability of electronic ceramic components.
Smart Images
Figure CN224554177U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic ceramics, and more particularly to an electronic ceramic with double-layer electrodes. Background Technology
[0002] Electronic ceramics are functional ceramics based on inorganic ceramic materials, which are given specific electrical properties through doping. They are widely used in capacitors, varistors, thermistors and other electronic components. Electronic ceramics play an important role in the field of electronics, such as conducting current, inducing electrical signals or storing energy, and their performance stability is related to the reliability of electronic products.
[0003] In the prior art, the electrode structure in electronic ceramics is mostly a single-layer metal electrode, which is usually printed or deposited on the surface of the ceramic chip to serve as a contact point for connection with external circuits or other devices. However, the adhesion between the single-layer metal electrode and the ceramic chip is weak, and the electrode is prone to detachment during long-term operation, thus affecting the stability of electronic products.
[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide an electronic ceramic with double-layer electrodes that has stable performance and whose electrodes are not easily detached.
[0006] To achieve this objective, the present invention adopts the following technical solution: an electronic ceramic with double-layer electrodes, comprising a ceramic chip, a first metal electrode layer, a second metal electrode layer, pins, a solder layer, and an encapsulation layer;
[0007] The first metal electrode layer is sprayed onto both sides of the ceramic chip, and the second metal electrode layer is sprayed onto the surface of the first metal electrode layer;
[0008] The thickness of the second metal electrode layer is 0.15-0.25 μm, and conductive protrusions are provided on the surface of the second metal electrode layer, the thickness of the conductive protrusions being 1-2 μm;
[0009] The pins are connected to the surface of the conductive bumps via the solder layer, and the encapsulation layer covers the outside of the ceramic chip.
[0010] Using the above technical solution, in the electronic ceramic with double electrodes, the thickness of the first metal electrode layer is 0.25-0.35 μm.
[0011] In the above technical solution, the first metal electrode layer in the electronic ceramic with double electrodes is an aluminum electrode or a nickel electrode, and the second metal electrode layer is a copper electrode or a silver electrode.
[0012] Using the above technical solution, in the electronic ceramic with double electrodes, the area of the second metal electrode layer is smaller than the area of the first metal electrode layer;
[0013] The second metal electrode layer is composed of several longitudinally arrayed conductive grids.
[0014] Using the above technical solution, in the electronic ceramic with double-layer electrodes, the ceramic chip is one of the following shapes: circular, elliptical, square, or cylindrical.
[0015] Using the above technical solution, in the electronic ceramic with double electrodes, the encapsulation layer is an epoxy resin encapsulation layer or a phenolic resin encapsulation layer.
[0016] Using the above technical solution, in the electronic ceramic with double-layer electrodes, the encapsulation layer is filled with magnetic iron oxide particles, the filling rate of the magnetic iron oxide particles is 5-10%, and the particle size of the magnetic iron oxide particles is 20-50nm.
[0017] Using the above technical solution, in the electronic ceramic with double-layer electrodes, the pin has a bent section at the connection point near the solder layer.
[0018] Using the above technical solution, in the electronic ceramic with double-layer electrodes, the ceramic chip is any one of the ceramic chips used for varistors, thermistors, or ceramic capacitors.
[0019] Compared with the prior art, the present invention has the following beneficial effects:
[0020] This invention provides a first metal electrode layer on both sides of a ceramic chip and a second metal electrode layer on the surface of the first metal electrode layer by thermal spraying. The first metal electrode layer enhances the adhesion to the ceramic chip and prevents electrode peeling. The second metal electrode layer reduces contact resistance and improves conductivity. The conductive protrusions improve the efficiency of the current channel, and the encapsulation layer protects the internal structure from external corrosion, thereby improving the conductivity stability and structural reliability of electronic ceramic components. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0023] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;
[0024] Figure 2 This is a schematic diagram of the side of the electronic ceramic component of this utility model;
[0025] Figure 3 This is a structural schematic diagram of Embodiment 2 of the present invention. Detailed Implementation
[0026] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.
[0027] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.
[0028] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0029] Example 1
[0030] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an electronic ceramic with double-layer electrodes, including a ceramic chip 1, a first metal electrode layer 21, a second metal electrode layer 22, pins 3, a solder layer 4, and an encapsulation layer 5;
[0031] The first metal electrode layer 21 is sprayed onto the front and back surfaces of the ceramic chip 1, and the second metal electrode layer 22 is sprayed onto the surface of the first metal electrode layer 21. The first metal electrode layer 21, as the metal layer in contact with the ceramic chip 1, can be made of a material with good interface compatibility with ceramics to enhance the adhesion of the electrode to the surface of the ceramic chip 1 and avoid electrode peeling or detachment due to mismatch of interface stress or thermal expansion coefficient. The second metal electrode layer 22 is thermally sprayed onto the surface of the first metal electrode layer 21. The second metal electrode layer 22 is made of a material with high conductivity to reduce the contact resistance of the electrode and thus improve the current conduction efficiency.
[0032] The thickness of the first metal electrode layer 21 is 0.25 μm, and the thickness of the second metal electrode layer 22 is 0.15 μm. The surface of the second metal electrode layer 22 is provided with conductive protrusions 221, and the thickness of the conductive protrusions 221 is 1 μm. By adding conductive protrusions 221 with a thickness of 1 μm to the surface of the relatively thin second metal electrode layer 22, the contact volume per unit area and the solder adhesion points can be increased through the micro-protrusion structure, thereby improving the coverage of the solder layer 4 during the welding process. At the same time, the conductive protrusions 221 can also enhance the local current channel, reduce the contact resistance of the welding interface, and improve the overall current carrying efficiency.
[0033] The pin 3 is connected to the surface of the conductive protrusion 221 through the solder layer 4. The encapsulation layer 5 wraps around the ceramic chip 1. The encapsulation layer 5 not only has insulating properties, but also has a barrier protection function. The shell isolates external moisture, dust and corrosive gases and other media from entering the electronic ceramic, preventing oxidation, corrosion or short circuit of the electrodes or solder joints.
[0034] Furthermore, the first metal electrode layer 21 is an aluminum electrode or a nickel electrode, and the second metal electrode layer 22 is a copper electrode or a silver electrode. In this embodiment, the first metal electrode layer 21 is an aluminum electrode, and the second metal electrode layer 22 is a copper electrode. The aluminum electrode has a high chemical affinity with the oxide of the ceramic chip 1, which can generate a dense and uniform alumina layer during sintering, thereby improving the adhesion strength of the electrode and preventing electrode peeling. Copper has a low resistivity, which can improve the current carrying capacity of the pin 3. In addition, the thermal expansion coefficients of the aluminum electrode and the copper electrode are relatively close, which can reduce the stress difference generated by the multilayer electrode under the temperature gradient and reduce the risk of fatigue cracking during long-term operation of electronic ceramics.
[0035] Furthermore, the ceramic chip 1 can be one of the following shapes: circular, elliptical, square, or cylindrical. In this embodiment, the ceramic chip 1 is circular.
[0036] Furthermore, the encapsulation layer 5 is a phenolic resin encapsulation layer. After curing, the phenolic resin can form a dense structure to effectively encapsulate the ceramic chip 1 and its electrode connection parts, preventing the electronic ceramic from being structurally damaged by external impact, temperature and humidity changes or chemical corrosion.
[0037] Furthermore, the pin 3 has a bent section 31 at the connection point near the solder layer 4. This design can improve the connection strength of the pin 3, avoid stress concentration and solder joint cracking, thereby improving the reliability of electronic ceramics.
[0038] Furthermore, the ceramic chip 1 is a ceramic chip 1 used for a varistor.
[0039] Example 2
[0040] like Figure 2 and Figure 3 As shown, this utility model embodiment provides an electronic ceramic with double-layer electrodes, including a ceramic chip 1, a first metal electrode layer 21, a second metal electrode layer 22, pins 3, a solder layer 4, and an encapsulation layer 5;
[0041] The first metal electrode layer 21 is sprayed onto the front and back surfaces of the ceramic chip 1, and the second metal electrode layer 22 is sprayed onto the surface of the first metal electrode layer 21. The first metal electrode layer 21, as the metal layer in contact with the ceramic chip 1, can be made of a material with good interface compatibility with ceramics to enhance the adhesion of the electrode to the surface of the ceramic chip 1 and avoid electrode peeling or detachment due to mismatch of interface stress or thermal expansion coefficient. The second metal electrode layer 22 is thermally sprayed onto the surface of the first metal electrode layer 21. The second metal electrode layer 22 is made of a material with high conductivity to reduce the contact resistance of the electrode and thus improve the current conduction efficiency.
[0042] The thickness of the first metal electrode layer 21 is 0.35 μm, the thickness of the second metal electrode layer 22 is 0.25 μm, and a conductive protrusion 221 with a thickness of 2 μm is provided on the surface of the second metal electrode layer 22. The conductive protrusion 221 with a thickness of 2 μm is added to the surface of the relatively thin second metal electrode layer 22. The micro-protrusion structure increases the contact volume per unit area and the solder adhesion points, improves the coverage of the solder layer 4 during the welding process, and at the same time, the conductive protrusion 221 can also enhance the local current channel, reduce the contact resistance of the welding interface, and improve the overall current carrying efficiency.
[0043] The pin 3 is connected to the surface of the conductive protrusion 221 through the solder layer 4. The encapsulation layer 5 wraps around the ceramic chip 1. The encapsulation layer 5 not only has insulating properties, but also has a barrier protection function. The shell isolates external moisture, dust and corrosive gases and other media from entering the electronic ceramic, preventing oxidation, corrosion or short circuit of the electrodes or solder joints.
[0044] Furthermore, the first metal electrode layer 21 is an aluminum electrode or a nickel electrode, and the second metal electrode layer 22 is a copper electrode or a silver electrode. In this embodiment, the first metal electrode layer 21 is an aluminum electrode, and the second metal electrode layer 22 is a copper electrode. The aluminum electrode has a high chemical affinity with the oxide of the ceramic chip 1, which can generate a dense and uniform alumina layer during sintering, thereby improving the adhesion strength of the electrode and preventing electrode peeling. Copper has a low resistivity, which can improve the current carrying capacity of the pin 3. In addition, the thermal expansion coefficients of the aluminum electrode and the copper electrode are relatively close, which can reduce the stress difference generated by the multilayer electrode under the temperature gradient and reduce the risk of fatigue cracking during long-term operation of electronic ceramics.
[0045] Furthermore, the area of the second metal electrode layer 22 is smaller than that of the first metal electrode layer 21. This prevents the edge of the second metal electrode layer 22 from extending to the boundary of the ceramic chip 1, thereby reducing the risk of edge short circuits and improving the interface stability between electrode layers. The second metal electrode layer 22 is composed of a plurality of longitudinally arrayed conductive grids 220. The conductive grids 220 can realize multi-path current shunting, thereby improving the overall conductivity uniformity. At the same time, the gaps between the conductive grids 220 also enhance the heat dissipation capability of the electrode and reduce the problem of local heat accumulation in electronic ceramics under high power operation. In addition, the conductive grid 220 structure can achieve high functional performance while maintaining a low material usage, so as to meet the manufacturing requirements of lightweight and low cost.
[0046] Furthermore, the ceramic chip 1 can be one of the following shapes: circular, elliptical, square, or cylindrical. In this embodiment, the ceramic chip 1 is circular.
[0047] Furthermore, the encapsulation layer 5 is an epoxy resin encapsulation layer, which is filled with magnetic iron oxide particles. The filling rate of the magnetic iron oxide particles is 10%, and the particle size of the magnetic iron oxide particles is 50 nm. By dispersing magnetic iron oxide particles with a particle size of 50 nm in the epoxy resin encapsulation layer, a weak magnetic barrier layer can be formed without significantly affecting the adhesion and thermal stability of the material. This absorbs and attenuates external electromagnetic interference, thereby improving the electromagnetic compatibility of electronic ceramics in high-frequency environments.
[0048] Furthermore, the pin 3 has a bent section 31 at the connection point near the solder layer 4. This design can improve the connection strength of the pin 3, avoid stress concentration and solder joint cracking, thereby improving the reliability of electronic ceramics.
[0049] Furthermore, the ceramic chip 1 is a ceramic chip 1 used in a ceramic capacitor.
[0050] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. An electronic ceramic having a double-layer electrode, characterized in that, It includes a ceramic chip, a first metal electrode layer, a second metal electrode layer, pins, a solder layer, and a packaging layer; The first metal electrode layer is sprayed onto both sides of the ceramic chip, and the second metal electrode layer is sprayed onto the surface of the first metal electrode layer; The thickness of the second metal electrode layer is 0.15-0.25 μm, and conductive protrusions are provided on the surface of the second metal electrode layer, the thickness of the conductive protrusions being 1-2 μm; The pins are connected to the surface of the conductive bumps via the solder layer, and the encapsulation layer covers the outside of the ceramic chip.
2. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The thickness of the first metal electrode layer is 0.25-0.35 μm.
3. The electronic ceramic with double-layer electrodes according to claim 2, characterized in that, The first metal electrode layer is an aluminum electrode or a nickel electrode, and the second metal electrode layer is a copper electrode or a silver electrode.
4. The electronic ceramic with double-layer electrodes according to claim 2, characterized in that, The area of the second metal electrode layer is smaller than the area of the first metal electrode layer; The second metal electrode layer is composed of several longitudinally arrayed conductive grids.
5. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The ceramic chip is one of the following shapes: circular, elliptical, square, or cylindrical.
6. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The encapsulation layer is an epoxy resin encapsulation layer or a phenolic resin encapsulation layer.
7. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The encapsulation layer is filled with magnetic iron oxide particles, the filling rate of which is 5-10%, and the particle size of which is 20-50 nm.
8. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The pin has a bent section at the connection point near the solder layer.
9. The electronic ceramic with double-layer electrodes according to claim 1, characterized in that, The ceramic chip is one type of ceramic chip used in varistors, thermistors, or ceramic capacitors.