Composite electrode structure of an electronic ceramic chip

Abstract

The utility model discloses a kind of composite electrode structures of electronic ceramic chip, including ceramic chip, first metal electrode layer and second metal electrode layer;The first metal electrode layer is sprayed on the front and back of ceramic chip, the second metal electrode layer is sprayed on the surface of first metal electrode layer, the area of second metal electrode layer is less than or equal to the area of first metal electrode layer, the middle part of second metal electrode layer is equipped with protruding part.The utility model by spraying first metal electrode layer on the front and back of ceramic chip, and spraying second metal electrode layer on the surface of first metal electrode layer, so, can be through the interface bonding of first metal electrode layer and generate force, enhance the adhesion of second metal electrode layer, avoid the problem that electrode falls off or cracks;The protruding part set in the middle part of second metal electrode layer, can form greater cladding area in welding process, and improve the current conduction performance of electronic ceramic.

Description

Technical Field

[0001] This utility model relates to the field of electronic ceramics, and in particular to a composite electrode structure for an electronic ceramic chip. Background Technology

[0002] Electronic ceramic chips are tiny blocks with specific electrical or structural functions, made from ceramic materials through processes such as sintering. They are widely used in capacitors, varistors, thermistors, and other electronic components.

[0003] In the prior art, the electrode structure in electronic ceramics is mostly a single-layer metal electrode, which is usually printed or deposited on the surface of the ceramic chip to serve as a conductive terminal to external circuits or other devices. However, the adhesion between the single-layer metal electrode and the ceramic chip is weak, and the electrode is prone to detachment during long-term operation. In addition, the metal electrodes on the ceramic chip are usually set with a single structure of uniform thickness, which leads to problems such as interface cracking or solder joint failure of the metal electrode during long-term use, thereby affecting the electrical performance and reliability of electronic ceramics.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a composite electrode structure for an electronic ceramic chip with stable performance and electrodes that are not easily detached.

[0006] To achieve this objective, the present invention adopts the following technical solution: a composite electrode structure for an electronic ceramic chip, comprising a ceramic chip, a first metal electrode layer, and a second metal electrode layer;

[0007] The first metal electrode layer is sprayed on both sides of the ceramic chip, and the second metal electrode layer is sprayed on the surface of the first metal electrode layer. The first metal electrode layer is an aluminum electrode or a nickel electrode, and the second metal electrode layer is a copper electrode or a silver electrode.

[0008] The area of ​​the second metal electrode layer is less than or equal to the area of ​​the first metal electrode layer. The second metal electrode layer has a protrusion in the middle. The thickness of the second metal electrode layer is T1, the thickness of the protrusion is T2, and the thickness ratio of T1 to T2 is 1:1.5-3.

[0009] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the thickness of the first metal electrode layer is 0.25-0.35μm.

[0010] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the thickness T1 of the second metal electrode layer is 0.15-0.25 μm;

[0011] The thickness T2 of the protrusion is 0.24-0.75 μm.

[0012] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the first metal electrode layer is an aluminum electrode, and the second metal electrode layer is a copper electrode.

[0013] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the ceramic chip is a disc-shaped structure.

[0014] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the area of ​​the second metal electrode layer is smaller than the area of ​​the first metal electrode layer, so that the edge of the first metal electrode layer has an annular exposed area not covered by the second metal electrode layer.

[0015] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the thickness of the ceramic chip is 0.3-4mm.

[0016] Using the above technical solution, in the composite electrode structure of the electronic ceramic chip, the ceramic chip is one type of ceramic chip used for varistors, thermistors, or ceramic capacitors.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention involves spraying a first metal electrode layer onto both sides of a ceramic chip, and then spraying a second metal electrode layer onto the surface of the first metal electrode layer. This enhances the adhesion of the second metal electrode layer through the interfacial bonding force of the first metal electrode layer, preventing electrode detachment or cracking. An annular exposed area, not covered by the second metal electrode layer, is formed at the edge of the first metal electrode layer. This exposed area allows the encapsulating resin to adhere more firmly to the surface of the first metal electrode layer, thereby improving the encapsulation and sealing performance of the ceramic chip. A protrusion in the middle of the second metal electrode layer creates a larger coverage area during welding and reduces contact resistance, thus improving the current conduction performance of the electronic ceramic. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0021] Figure 1 This is a side view of Embodiment 1 of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention;

[0023] Figure 3 This is a side view of Embodiment 2 of the present invention;

[0024] Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model. Detailed Implementation

[0025] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0027] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] Example 1

[0029] like Figure 1 and Figure 2 As shown, this embodiment of the present invention provides a composite electrode structure for an electronic ceramic chip, including a ceramic chip 1, a first metal electrode layer 21, and a second metal electrode layer 22. The first metal electrode layer 21 is sprayed onto the front and back surfaces of the ceramic chip 1, and the second metal electrode layer 22 is sprayed onto the surface of the first metal electrode layer 21. The first metal electrode layer 21 is an aluminum electrode, and the second metal electrode layer 22 is a copper electrode. By setting the first metal electrode layer 21 as an aluminum electrode and coating it onto the front and back surfaces of the ceramic chip 1 by thermal spraying, a stable interface can be formed with the ceramic chip 1 during high-temperature sintering, thereby improving the adhesion of the electrode to the ceramic chip 1 and avoiding problems such as electrode detachment or warping. By setting the second metal electrode layer 22 as a copper electrode, the conductivity and low contact resistance of the copper electrode can enhance the conductivity efficiency of the ceramic chip 1.

[0030] The area of ​​the second metal electrode layer 22 is smaller than that of the first metal electrode layer 21, so that the edge of the first metal electrode layer 21 has an annular exposed area 210 that is not covered by the second metal electrode layer 22. The annular exposed area 210 allows the external encapsulating resin to adhere to the surface of the first metal electrode layer 21. Since the surface of the first metal electrode layer 21 is rougher than that of the second metal electrode layer 22, that is, the roughness of the first metal electrode layer 21 is greater than that of the second metal electrode layer 22, the surface of the first metal electrode layer 21 has more micro-textures, which facilitates the penetration of the encapsulating resin, thereby achieving stronger interface adhesion and improving the encapsulation effect of the ceramic chip 1.

[0031] The second metal electrode layer 22 has a protrusion 221 in the middle. The thickness of the second metal electrode layer 22 is T1, and the thickness of the protrusion 221 is T2. The thickness ratio of T1 to T2 is 1:1.5. This makes the second metal electrode layer 22 form a protrusion in the middle region, which allows it to contact the pins first during the welding, packaging or electrical connection of the ceramic chip 1, and forms a larger coverage area during the welding process, reducing contact resistance and improving the current conduction performance of the electronic ceramic.

[0032] In this embodiment, the thickness of the first metal electrode layer 21 is 0.25 μm, the thickness T1 of the second metal electrode layer 22 is 0.2 μm, the thickness T2 of the protrusion 221 is 0.3 μm, and the thickness of the ceramic chip 1 is 4 mm.

[0033] Furthermore, the ceramic chip 1 has a circular structure.

[0034] Furthermore, the ceramic chip 1 is a ceramic chip 1 used for a varistor.

[0035] Example 2

[0036] like Figure 3 and Figure 4 As shown, this embodiment of the present invention provides a composite electrode structure for an electronic ceramic chip, including a ceramic chip 1, a first metal electrode layer 21, and a second metal electrode layer 22. The first metal electrode layer 21 is sprayed onto the front and back surfaces of the ceramic chip 1, and the second metal electrode layer 22 is sprayed onto the surface of the first metal electrode layer 21. The first metal electrode layer 21 is a nickel electrode, and the second metal electrode layer 22 is a silver electrode. By setting the first metal electrode layer 21 as a nickel electrode and coating it onto the front and back surfaces of the ceramic chip 1 by thermal spraying, a stable interface can be formed with the ceramic chip 1 during high-temperature sintering, thereby improving the adhesion of the electrode to the ceramic chip 1 and avoiding problems such as electrode detachment or warping. By setting the second metal electrode layer 22 as a silver electrode, the conductivity and low contact resistance of the silver electrode can enhance the conductivity efficiency of the ceramic chip 1.

[0037] The area of ​​the second metal electrode layer 22 is equal to the area of ​​the first metal electrode layer 21. A protrusion 221 is provided in the middle of the second metal electrode layer 22. The thickness of the second metal electrode layer 22 is T1, and the thickness of the protrusion 221 is T2, with a thickness ratio of T1:T2 of 1:3. This creates a protrusion in the middle region of the second metal electrode layer 22, allowing it to make initial contact with the pins during the welding, packaging, or electrical connection of the ceramic chip 1. This also results in a larger coverage area during welding, reducing contact resistance and improving the current conduction performance of the electronic ceramic.

[0038] In this embodiment, the thickness of the first metal electrode layer 21 is 0.35 μm, the thickness T1 of the second metal electrode layer 22 is 0.25 μm, the thickness T2 of the protrusion 221 is 0.75 μm, and the thickness of the ceramic chip 1 is 2 mm.

[0039] Furthermore, the ceramic chip 1 has a circular structure.

[0040] Furthermore, the ceramic chip 1 is a ceramic chip 1 used for a thermistor.

[0041] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A composite electrode structure for an electronic ceramic chip, characterized in that, It includes a ceramic chip, a first metal electrode layer, and a second metal electrode layer; The first metal electrode layer is sprayed on both sides of the ceramic chip, and the second metal electrode layer is sprayed on the surface of the first metal electrode layer. The first metal electrode layer is an aluminum electrode or a nickel electrode, and the second metal electrode layer is a copper electrode or a silver electrode. The area of ​​the second metal electrode layer is less than or equal to the area of ​​the first metal electrode layer. The second metal electrode layer has a protrusion in the middle. The thickness of the second metal electrode layer is T1, the thickness of the protrusion is T2, and the thickness ratio of T1 to T2 is 1:1.5-3.

2. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The thickness of the first metal electrode layer is 0.25-0.35 μm.

3. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The thickness T1 of the second metal electrode layer is 0.15-0.25 μm; The thickness T2 of the protrusion is 0.24-0.75 μm.

4. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The first metal electrode layer is an aluminum electrode, and the second metal electrode layer is a copper electrode.

5. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The ceramic chip has a circular structure.

6. The composite electrode structure of the electronic ceramic chip according to claim 5, characterized in that, The area of ​​the second metal electrode layer is smaller than that of the first metal electrode layer, so that the edge of the first metal electrode layer has an annular exposed area that is not covered by the second metal electrode layer.

7. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The thickness of the ceramic chip is 0.3-4 mm.

8. The composite electrode structure of the electronic ceramic chip according to claim 1, characterized in that, The ceramic chip is one type of ceramic chip used in varistors, thermistors, or ceramic capacitors.

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