Earphone box dustproof structure and wireless earphone box
By employing a multi-layered dustproof structure, the design solves the problem of poor dustproof performance in traditional headphone cases, achieving more efficient dust blocking and component protection, and improving the dustproof performance and stability of the headphone case.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HORN AUDIO
- Filing Date
- 2025-08-25
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional headphone cases often have a single dustproof structure that makes it difficult to create an effective seal, allowing external dust to easily enter, affecting headphone performance and lifespan. Furthermore, the snap-fit structure is prone to loosening and wear, failing to provide reliable dust protection.
It adopts a multi-layer dustproof structure, including a dustproof upper cover assembly and a lower cover assembly. Through the multi-seal design of snap-fit and dustproof connectors, multiple dustproof barriers are formed to prevent dust from entering the earphone case from all directions.
It significantly improves the dustproof effect of the headphone case, prevents dust from entering, and enhances the working stability of components and the overall dustproof performance of the headphone case.
Smart Images
Figure CN224555762U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the technical field of dustproof headphone cases, and in particular to a dustproof headphone case structure and a wireless headphone case. Background Technology
[0002] Traditional headphone cases mostly use a single dustproof structure, with a simple flat cover or a single buckle for fixation. However, a single dustproof structure is difficult to form an effective seal. External dust can easily enter the headphone case through the gaps at the various joints, causing dust to accumulate on the headphone components and affecting the performance and lifespan of the headphones. On the other hand, with the increase of use, single buckles and other structures are prone to loosening and wear, further reducing the dustproof effect and failing to provide reliable dust protection for the PCB, battery and other components inside the headphone case.
[0003] Specifically, most headphone cases employ a single cover that adheres to the case body, or rely solely on a simple sealing ring for dust protection. A single dust barrier is insufficient to prevent dust intrusion from multiple directions. During daily opening and closing, and during handling and shaking, tiny gaps can easily develop at the connection between the cover and the case body due to assembly errors or long-term use, allowing dust to penetrate the interior of the headphone case and affecting the operational stability of the PCB, battery, and other components inside. Utility Model Content
[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a dustproof structure for an earphone case and a wireless earphone case that improves the dustproof effect of the earphone case through a multi-layer dustproof structure.
[0005] The purpose of this disclosure is achieved through the following technical solution:
[0006] A dustproof structure for an earphone case includes a dustproof upper cover assembly, a dustproof lower cover assembly, and an earphone placement box. The earphone placement box has a dustproof channel. The dustproof upper cover assembly and the dustproof lower cover assembly are disposed in the dustproof channel. The dustproof upper cover assembly and the dustproof lower cover assembly are interlocked with each other, and a component receiving cavity is formed between the dustproof upper cover assembly and the dustproof lower cover assembly.
[0007] The dustproof cover assembly includes a dustproof connector and a first snap-fit component. The dustproof connector has a cover snap-fit groove on its end face adjacent to the earphone case. The earphone case is provided with a cover snap-fit component, which snaps into the cover snap-fit groove. The first snap-fit component is connected to the end face of the dustproof connector opposite to the earphone case.
[0008] The dustproof bottom cover assembly includes a dustproof base plate and a second snap-fit component. The dustproof base plate has a dustproof groove around its periphery. The dustproof connector is snapped into the dustproof groove. The second snap-fit component is connected to the periphery of the dustproof base plate. The second snap-fit component has a bottom cover snap-fit groove. The first snap-fit component is snapped into the bottom cover snap-fit groove.
[0009] In one embodiment, there are multiple first and second snap-fit components, and each first snap-fit component snaps into a lower cover snap-fit groove opened in one of the second snap-fit components.
[0010] In one embodiment, the end face of the dustproof connector facing away from the dustproof base plate is provided with a first limiting boss, and the end face of the earphone holder adjacent to the dustproof connector is provided with a first limiting groove, and the first limiting boss abuts against the first limiting groove.
[0011] In one embodiment, the dustproof connector has a second limiting boss, and the end face of the earphone holder adjacent to the dustproof base plate is provided with a third limiting boss, the second limiting boss abutting against the third limiting boss.
[0012] In one embodiment, the second limiting boss and the dustproof connector form a second limiting groove, the upper cover snap-fit groove is connected to the second limiting groove, the upper cover snap-fit connector is connected to the third limiting boss, and the third limiting boss snaps into the second limiting groove.
[0013] In one embodiment, the dustproof cover assembly further includes a plurality of reinforcing members, which are spaced apart, and each reinforcing member is connected to the first snap-fit member and the dustproof connector respectively.
[0014] In one embodiment, the reinforcement has a wedge-shaped bevel.
[0015] In one embodiment, the dustproof base plate has a first dustproof strip and a second dustproof strip, both of which are connected to the dustproof base plate. A dustproof groove is formed between the first dustproof strip and the second dustproof strip. The dustproof connector is snapped into the dustproof groove. The first dustproof strip abuts against the earphone holder, and the second dustproof strip abuts against the dustproof connector.
[0016] In one embodiment, the height of the second dustproof strip is greater than or equal to the height of the first dustproof strip.
[0017] This application also provides a wireless earphone case, including the earphone case dustproof structure described in any embodiment.
[0018] Compared with the prior art, this disclosure has at least the following advantages:
[0019] The aforementioned dustproof structure of the headphone case forms multiple dustproof barriers through the interlocking of the upper cover latch and upper cover latch slot, the first latch and lower cover latch slot, and the tight fit between the dustproof connector and the dustproof groove. This effectively prevents dust particles from entering the headphone case from different directions. Compared to traditional single dustproof structures, the dustproof effect is significantly improved, preventing dust from entering the gaps in the headphone case and thus enhancing the operational stability of the components inside. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the dustproof structure of an earphone case according to one embodiment;
[0022] Figure 2 for Figure 1 A partial exploded view of the dustproof structure of the earphone case shown.
[0023] Figure 3 for Figure 1 Another exploded view of the dustproof structure of the earphone case shown. Detailed Implementation
[0024] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.
[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0027] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:
[0028] like Figure 1 and Figure 2 As shown, an embodiment of the present disclosure of the dustproof structure 10 for an earphone case includes a dustproof upper cover assembly 100, a dustproof lower cover assembly 200, and an earphone placement box 300. The earphone placement box 300 has a dustproof channel 3001. The dustproof upper cover assembly 100 and the dustproof lower cover assembly 200 are disposed in the dustproof channel 3001. The dustproof upper cover assembly 100 and the dustproof lower cover assembly 200 are interlocked with each other, and a component receiving cavity 2001 is formed between the dustproof upper cover assembly 100 and the dustproof lower cover assembly 200.
[0029] like Figure 3 As shown, the dustproof top cover assembly 100 includes a dustproof connector 110 and a first snap-fit connector 120. The dustproof connector 110 has a top cover snap-fit groove 1101 on its end face adjacent to the headphone holder 300. The headphone holder 300 is provided with a top cover snap-fit connector 310, which snaps into the top cover snap-fit groove 1101. The first snap-fit connector 120 is connected to the end face of the dustproof connector 110 away from the headphone holder 300. Specifically, the first snap-fit connector 120 is fixed inside the dustproof connector 110.
[0030] The dustproof bottom cover assembly 200 includes a dustproof base plate 210 and a second snap-fit member 220. A dustproof groove 2101 is provided around the periphery of the dustproof base plate 210. A dustproof connector 110 is snapped into the dustproof groove 2101. The second snap-fit member 220 is connected to the periphery of the dustproof base plate 210. The second snap-fit member 220 is provided with a bottom cover snap-fit groove 2201. A first snap-fit member 120 is snapped into the bottom cover snap-fit groove 2201.
[0031] In this embodiment, firstly, the dustproof cover assembly 100 is suspended above the dustproof channel 3001 of the earphone case 300, so that the end face of the dustproof connector 110 adjacent to the earphone case 300 is aligned with the edge of the dustproof channel 3001. Then, the dustproof cover assembly 100 is slowly pressed downwards, at which point the cover latch 310 on the earphone case 300 gradually approaches the cover latch groove 1101 on the dustproof connector 110. As the pressure is continuously applied, the cover latch 310 undergoes slight elastic deformation and smoothly enters the cover latch groove 1101. When the cover latch 310 is fully engaged in the cover latch groove 1101, the dustproof connector 110 covers the dustproof channel 3001, thereby forming the first layer of dustproof structure to prevent dust from entering the earphone case 300.
[0032] Then, the dustproof lower cover assembly 200 is brought close from below to the dustproof upper cover assembly 100 and the headphone holder 300, which already form the first layer of dustproof structure, so that the dustproof connector 110 is aligned with the dustproof groove 2101 around the periphery of the dustproof base plate 210. The dustproof lower cover assembly 200 is then slowly pushed upwards, and the dustproof connector 110 gradually enters the dustproof groove 2101. During the entry process, the dustproof connector 110 fits tightly against the side wall of the dustproof groove 2101, providing a sealing effect and preventing dust from entering from the bottom. Simultaneously, align the first latching member 120 with the lower cover latching groove 2201 on the second latching member 220, and continue pushing the dustproof lower cover assembly 200 upwards. This causes the first latching member 120 to elastically deform and enter the lower cover latching groove 2201. Once the first latching member 120 is fully engaged in the lower cover latching groove 2201, the dustproof lower cover assembly 200 and the dustproof upper cover assembly 100 are firmly connected, and the dustproof base plate 210 fits tightly against the bottom edge of the headphone case 300, further enhancing the dustproof effect of the headphone case. Finally, the entire dustproof structure 10 of the headphone case is assembled, forming a relatively enclosed space, thereby effectively protecting the headphones inside the headphone case 300 from dust intrusion.
[0033] Specifically, when the headphone case is in normal use, external dust may attempt to enter the headphone housing 300. The tight connection between the dustproof upper cover assembly 100 and the dustproof lower cover assembly 200 creates multiple dustproof barriers. The engagement of the upper cover latch 310 with the upper cover latch slot 1101 and the first latch 120 with the lower cover latch slot 2201 prevents dust from entering the component housing cavity 2001 through the gaps at the connection points of the headphone housing 300. Simultaneously, the tight fit between the dustproof connector 110 and the dustproof groove 2101 prevents dust from entering the component housing cavity 2001 from the bottom, thus avoiding dust affecting the operational stability of the PCB board, battery, and other components within the component housing cavity 2001.
[0034] The aforementioned dustproof structure 10 for the headphone case forms multiple dustproof barriers through the engagement of the upper cover latch 310 with the upper cover latch groove 1101, the first latch 120 with the lower cover latch groove 2201, and the tight fit between the dustproof connector 110 and the dustproof groove 2101. This effectively prevents dust particles from entering the headphone case 300 from different directions. Compared to traditional single dustproof structures, the dustproof effect is significantly improved, preventing dust from entering the gaps of the headphone case 300 and thus improving the operational stability of the components inside the headphone case 300.
[0035] like Figure 2 and Figure 3 As shown, in one embodiment, there are multiple first latching members 120 and multiple second latching members 220, with each first latching member 120 latching into a lower cover latching slot 2201 provided in one of the second latching members 220. In this embodiment, multiple first latching members 120 and second latching members 220 are evenly distributed at corresponding positions of the dustproof upper cover assembly 100 and the dustproof lower cover assembly 200, forming a stable multi-point latching structure. Compared to a single latching member design, this multi-point latching method can more evenly distribute the force borne during connection. When the headphone case is subjected to external impact during daily use, such as being accidentally dropped or squeezed, multiple latching points can jointly bear these external forces, avoiding loosening or damage to the latching due to excessive local force. The presence of multiple latching members increases the connection area and connection strength between the dustproof upper cover assembly 100 and the dustproof lower cover assembly 200.
[0036] In one embodiment, such as Figure 2As shown, the dustproof connector 110 has a first limiting boss 111 on its end face away from the dustproof base plate 210, and the earphone case 300 has a first limiting groove 3002 on its end face adjacent to the dustproof connector 110. The first limiting boss 111 abuts against the first limiting groove 3002. In this embodiment, when the dustproof cover assembly 100 is installed on the earphone case 300, the first limiting boss 111 abuts tightly against the first limiting groove 3002, which can effectively limit the horizontal movement of the dustproof cover assembly 100, thereby ensuring that the cover latch 310 and the cover latch groove 1101 are always in a tight latching state, and no gaps will appear due to loosening, further enhancing the stability of the first layer of dustproof structure and effectively preventing dust from entering the earphone case 300 from above. Furthermore, during the installation of the dustproof cover assembly 100 and the headphone case 300, when the dustproof cover assembly 100 is suspended above the dustproof channel 3001, the first limiting boss 111 can quickly align with the first limiting groove 3002, guiding the dustproof connector 110 to approach the headphone case 300 in a preset accurate posture. This avoids misalignment between the cover latch 310 and the cover latch groove 1101 due to offset during installation, thereby significantly improving assembly efficiency and reducing the time cost caused by repeated adjustments.
[0037] In one embodiment, such as Figure 3 As shown, the dustproof connector 110 has a second limiting boss 112, and the earphone case 300 has a third limiting boss 320 on its end face adjacent to the dustproof base plate 210. The second limiting boss 112 abuts against the third limiting boss 320. In this embodiment, the abutment of the second limiting boss 112 and the third limiting boss 320 forms an additional sealing barrier between the dustproof connector 110 and the earphone case 300. When external dust attempts to enter through the lateral gap between the dustproof connector 110 and the earphone case 300, the tight abutment of the two limiting bosses effectively blocks the intrusion of dust, further improving the dustproof effect of the earphone case and ensuring that the inside of the earphone case 300 remains clean at all times.
[0038] In one embodiment, such as Figure 2 As shown, the second limiting boss 112 and the dustproof connector 110 form a second limiting groove 1102, and the upper cover snap-fit groove 1101 communicates with the second limiting groove 1102, as shown. Figure 3As shown, the top cover latch 310 is connected to the third limiting boss 320, which latches into the second limiting groove 1102. In this embodiment, the latching engagement of the second limiting groove 1102 and the third limiting boss 320 creates another layer of dustproof structure for the headphone case. When external dust attempts to enter the headphone case 300 from various directions, the second limiting groove 1102 and the third limiting boss 320 fit tightly together, effectively preventing dust from entering through the sides and the gap between the top cover and the connector, thus enhancing the overall dustproof performance. Combined with the latching dustproof structure of the top cover latch 310 and the top cover latching groove 1101, the multiple latching structures further improve the dustproof reliability of the headphone case 300.
[0039] In one embodiment, such as Figure 3 As shown, the dustproof top cover assembly 100 also includes multiple reinforcing members 130, which are spaced apart. Each reinforcing member 130 is connected to the first snap-fit member 120 and the dustproof connector 110, respectively. In this embodiment, the reinforcing members 130 are spaced apart and connected to the first snap-fit member 120, thereby constructing multiple support structures on the first snap-fit member 120. This effectively disperses the external force on the first snap-fit member 120, preventing it from deforming or being damaged due to excessive local stress. This ensures that the first snap-fit member 120 and the lower cover snap-fit groove 2201 on the second snap-fit member 220 always maintain a tight snap-fit state and will not loosen due to external impact, thereby improving the stability of the connection between the dustproof top cover assembly 100 and the dustproof lower cover assembly 200.
[0040] like Figure 2 and Figure 3 As shown, in one embodiment, the reinforcement member 130 has a wedge-shaped bevel. In this embodiment, when the dust cover assembly 100 and the dust cover assembly 200 are assembled, the wedge-shaped bevel acts as a guide during the process of inserting the first snap-fit member 120 into the lower cover snap-fit groove 2201. As the dust cover assembly 200 moves upward, the first snap-fit member 120 gradually approaches the lower cover snap-fit groove 2201. The wedge-shaped bevel first contacts the edge of the lower cover snap-fit groove 2201, and its inclined surface can smoothly guide the first snap-fit member 120 into the lower cover snap-fit groove 2201, reducing jamming during the assembly process, making the assembly process smoother and more efficient, and reducing the risk of component damage due to assembly difficulties.
[0041] In one embodiment, such as Figure 2As shown, the dustproof base plate 210 has a first dustproof strip 211 and a second dustproof strip 212. The first dustproof strip 211 and the second dustproof strip 212 are both connected to the dustproof base plate 210. A dustproof groove 2101 is formed between the first dustproof strip 211 and the second dustproof strip 212. The dustproof connector 110 is snapped into the dustproof groove 2101. The first dustproof strip 211 abuts against the headphone holder 300, and the second dustproof strip 212 abuts against the dustproof connector 110. In this embodiment, when external dust attempts to intrude from the connection between the headphone case 300 and the dustproof base plate 210, the tight contact between the first dustproof strip 211 and the headphone case 300 first forms a dustproof structure, which can fully fill the tiny gaps between the two and prevent dust from directly entering the headphone case; as for dust that may penetrate from the joint between the dustproof connector 110 and the dustproof base plate 210, the fit between the second dustproof strip 212 and the dustproof connector 110 forms a second barrier, which, together with the side wall of the dustproof groove 2101, forms a "maze-like" path, thereby increasing the difficulty for dust to penetrate.
[0042] like Figure 2 and Figure 3 As shown, in one embodiment, the height of the second dustproof strip 212 is greater than or equal to the height of the first dustproof strip 211. In this embodiment, the first dustproof strip 211 prevents external dust from entering through the connection between the headphone case 300 and the dustproof base plate 210, and it fits tightly against the headphone case 300 to form the first dustproof structure, thereby effectively intercepting most of the dust. In addition, the second dustproof strip 212, whose height is not less than that of the first dustproof strip 211, fits tightly against the dustproof connector 110 to form the second dustproof barrier, improving the overall dustproof performance of the headphone case 300 and ensuring that the inside of the headphone case 300 is not disturbed by dust.
[0043] This application also provides a wireless earphone case, including an earphone case dustproof structure 10 according to any embodiment. In this embodiment, firstly, the dustproof top cover assembly 100 is suspended above the dustproof channel 3001 of the earphone placement case 300, so that the end face of the dustproof connector 110 adjacent to the earphone placement case 300 is aligned with the edge of the dustproof channel 3001. Then, the dustproof top cover assembly 100 is slowly pressed down, at which time the top cover latch 310 on the earphone placement case 300 gradually approaches the top cover latch groove 1101 on the dustproof connector 110. As the pressure is continuously applied, the top cover latch 310 undergoes slight elastic deformation and smoothly enters the top cover latch groove 1101. When the top cover latch 310 is fully engaged in the top cover latch groove 1101, the dustproof connector 110 covers the top of the dustproof channel 3001, thereby forming a first layer of dustproof structure to prevent dust from entering the interior of the earphone placement case 300. Then, the dustproof lower cover assembly 200 is brought close from below to the dustproof upper cover assembly 100 and the headphone holder 300, which already form the first layer of dustproof structure, so that the dustproof connector 110 is aligned with the dustproof groove 2101 around the periphery of the dustproof base plate 210. The dustproof lower cover assembly 200 is then slowly pushed upwards, and the dustproof connector 110 gradually enters the dustproof groove 2101. During the entry process, the dustproof connector 110 fits tightly against the side wall of the dustproof groove 2101, providing a sealing effect and preventing dust from entering from the bottom. Simultaneously, align the lower cover slot 2201 on the first latching member 120 and the second latching member 220, and continue pushing the dustproof lower cover assembly 200 upwards. This causes the first latching member 120 to elastically deform and enter the lower cover slot 2201. Once the first latching member 120 is fully engaged in the lower cover slot 2201, the dustproof lower cover assembly 200 and the dustproof upper cover assembly 100 are firmly connected, and the dustproof base plate 210 fits tightly against the bottom edge of the headphone case 300, further enhancing the dustproof effect of the headphone case. Finally, the entire dustproof structure 10 of the headphone case is assembled, forming a relatively enclosed space, thereby effectively protecting the headphones inside the headphone case 300 from dust intrusion. Specifically, when the headphone case is in normal use, external dust will attempt to enter the headphone case 300. Due to the tight connection between the dustproof upper cover assembly 100 and the dustproof lower cover assembly 200, multiple dustproof barriers are formed. The engagement between the upper cover latch 310 and the upper cover latch slot 1101, and the engagement between the first latch 120 and the lower cover latch slot 2201, makes it difficult for dust to enter through the gap at the connection of the headphone case 300. At the same time, the tight fit between the dustproof connector 110 and the dustproof groove 2101 prevents dust from entering from the bottom.
[0044] Compared with the prior art, this disclosure has at least the following advantages:
[0045] The aforementioned dustproof structure 10 for the headphone case forms multiple dustproof barriers through the engagement of the upper cover latch 310 with the upper cover latch groove 1101, the first latch 120 with the lower cover latch groove 2201, and the tight fit between the dustproof connector 110 and the dustproof groove 2101. This effectively prevents dust particles from entering the headphone case 300 from different directions. Compared to traditional single dustproof structures, the dustproof effect is significantly improved, preventing dust from entering the gaps of the headphone case 300 and thus improving the operational stability of the components inside the headphone case 300.
[0046] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.
Claims
1. A dustproof structure for an earphone case, characterized in that, The device includes a dustproof upper cover assembly, a dustproof lower cover assembly, and an earphone holder. The earphone holder has a dustproof channel, and the dustproof upper cover assembly and the dustproof lower cover assembly are disposed within the dustproof channel. The dustproof upper cover assembly and the dustproof lower cover assembly are interlocked with each other, forming a component receiving cavity between them. The dustproof cover assembly includes a dustproof connector and a first snap-fit component. The dustproof connector has a cover snap-fit groove on its end face adjacent to the earphone case. The earphone case is provided with a cover snap-fit component, which snaps into the cover snap-fit groove. The first snap-fit component is connected to the end face of the dustproof connector opposite to the earphone case. The dustproof bottom cover assembly includes a dustproof base plate and a second snap-fit component. The dustproof base plate has a dustproof groove around its periphery. The dustproof connector is snapped into the dustproof groove. The second snap-fit component is connected to the periphery of the dustproof base plate. The second snap-fit component has a bottom cover snap-fit groove. The first snap-fit component is snapped into the bottom cover snap-fit groove.
2. The dustproof structure for the earphone case according to claim 1, characterized in that, There are multiple first and second snap-fit components, and each first snap-fit component snaps into a lower cover snap-fit slot opened in one of the second snap-fit components.
3. The dustproof structure for the earphone case according to claim 1, characterized in that, The dustproof connector has a first limiting boss on its end face away from the dustproof base plate, and the earphone case has a first limiting groove on its end face adjacent to the dustproof connector, with the first limiting boss abutting against the first limiting groove.
4. The dustproof structure for the earphone case according to claim 1, characterized in that, The dustproof connector has a second limiting boss, and the end face of the earphone placement box adjacent to the dustproof base plate is provided with a third limiting boss, and the second limiting boss abuts against the third limiting boss.
5. The dustproof structure for the earphone case according to claim 4, characterized in that, The second limiting boss and the dustproof connector form a second limiting groove. The upper cover snap-fit groove is connected to the second limiting groove. The upper cover snap-fit connector is connected to the third limiting boss. The third limiting boss snaps into the second limiting groove.
6. The dustproof structure for the earphone case according to claim 1, characterized in that, The dustproof cover assembly also includes multiple reinforcing members, which are spaced apart, and each reinforcing member is connected to the first snap-fit member and the dustproof connector respectively.
7. The dustproof structure for the earphone case according to claim 6, characterized in that, The reinforcement has a wedge-shaped inclined surface.
8. The dustproof structure for the earphone case according to claim 1, characterized in that, The dustproof base plate has a first dustproof strip and a second dustproof strip, both of which are connected to the dustproof base plate. A dustproof groove is formed between the first dustproof strip and the second dustproof strip. The dustproof connector is snapped into the dustproof groove. The first dustproof strip abuts against the earphone case, and the second dustproof strip abuts against the dustproof connector.
9. The dustproof structure for the earphone case according to claim 8, characterized in that, The height of the second dustproof strip is greater than or equal to the height of the first dustproof strip.
10. A wireless earphone case, characterized in that, Includes the dustproof structure for the headphone case as described in any one of claims 1 to 9.