An adaptive frequency modulation low power electronic ballast

Abstract

The utility model relates to the technical field of discharge lamp power supply, disclose a kind of self-adapting frequency modulation low-power electronic ballast, including ballast equipment, the front and back side of ballast equipment is provided with heat dissipation mechanism, the bottom of ballast equipment is provided with protective shell, the inside of protective shell is provided with protection mechanism, the bottom wall left and right sides of protective shell are provided with mounting mechanism;The heat dissipation mechanism includes two heat-conducting shells, the adjacent side of two The heat-conducting shell is respectively arranged at the front and back side of ballast equipment, and the left and right sides of ballast equipment are threadedly connected with a plurality of mounting bolts.In the utility model, heat exchange is carried out by contacting multiple heat dissipation fins with air, and the spacing between multiple heat dissipation fins is expanded by rotating the heat dissipation fins, achieving the purpose of improving heat dissipation effect and avoiding the situation that the service life of the ballast is reduced due to the entry of dust particles into its interior.

Description

Technical Field

[0001] This utility model relates to the field of discharge lamp power supply technology, and in particular to an adaptive frequency modulation low-power electronic ballast. Background Technology

[0002] The light emission of discharge lamps depends on the plasma discharge generated by gas ionization. Its power supply needs to meet the special requirements of high voltage breakdown of gas during startup and current limiting and voltage stabilization during stabilization. Conventional mains power cannot be directly adapted and a dedicated power supply device ballast is required to achieve power conversion and control. Among them, electronic ballast is an electronic device that provides a stable working power supply for fluorescent lamps and compact fluorescent gas discharge lamps. Its core function is to convert the mains frequency AC power into high frequency AC power through electronic circuits and realize the startup of the lamp tube.

[0003] Existing electronic ballasts use high-frequency switching technology, which generates strong electromagnetic radiation interference. If the electromagnetic shielding structure is not designed properly, it cannot effectively suppress electromagnetic radiation, which will interfere with surrounding electronic equipment and communication systems and affect their normal operation. However, traditional electronic ballasts still have the problem of installing the heat sinks of electronic components and power devices inside the housing. Moreover, the housing space is limited, and it is difficult to increase the heat dissipation area of ​​the heat sink. Even if holes or windows are made in the housing, poor heat dissipation will cause the power devices to overheat, disrupting the stability of electrical parameters. At the same time, dust, flying insects or foreign objects can enter the interior, reducing the service life of the electronic ballast. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides an adaptive frequency-modulated low-power electronic ballast, which aims to improve the problem that the heat dissipation area of ​​the heat sink is difficult to increase in the existing technology, resulting in a reduction in the service life of the electronic ballast.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an adaptive frequency modulation low-power electronic ballast, including a ballast device, heat dissipation mechanisms are provided on both the front and rear sides of the ballast device, a protective shell is provided at the bottom of the ballast device, a protective mechanism is provided inside the protective shell, and mounting mechanisms are provided on both the left and right sides of the bottom wall of the protective shell.

[0006] The heat dissipation mechanism includes two heat-conducting shells, with adjacent sides of the two heat-conducting shells respectively located on the front and rear sides of the ballast device. Multiple mounting bolts are threaded onto both the left and right sides of the ballast device, with the ends of each bolt threaded onto one side of a heat-conducting shell. Connecting grooves are provided on both the front and rear sides of the ballast device, and adjacent sides of the two heat-conducting shells engage with corresponding connecting grooves. Multiple limiting shafts are rotatably connected to the inner wall of each heat-conducting shell, with heat dissipation fins fixedly connected to one side of each limiting shaft. Adaptive frequency modulation interfaces are fixedly installed on both the left and right sides of the ballast device, and a positioning component is provided at the bottom of the ballast device.

[0007] As a further description of the above technical solution:

[0008] The protective mechanism includes a high-strength metal plate. The top of the high-strength metal plate is fixedly connected to the inner top wall of the protective shell. Multiple insulating grid plates are fixedly connected to the top wall of the high-strength metal plate. A pressure-resistant plate is fixedly connected to the bottom wall of the high-strength metal plate. Multiple pressure-resistant grooves are equidistantly provided on the bottom wall of the pressure-resistant plate. A silicone sealant layer is fixedly connected to the bottom of the pressure-resistant plate.

[0009] As a further description of the above technical solution:

[0010] The positioning component includes multiple limiting bolts, the top ends of which are threaded to the four corners of the bottom of the ballast device. The inner bottom wall of the protective shell has multiple limiting grooves, and the middle parts of the multiple limiting bolts are threaded to the corresponding limiting grooves.

[0011] As a further description of the above technical solution:

[0012] The mounting mechanism includes two mounting plates. The top walls of the two mounting plates are respectively fixedly connected to the left and right sides of the bottom wall of the protective shell. The top wall of the mounting plate is provided with a mounting hole in the middle. Two locking slots are provided on the opposite sides of the two mounting plates.

[0013] As a further description of the above technical solution:

[0014] The heat dissipation mechanism also includes two protective pads, the bottom walls of which are fixedly connected to the front and rear sides of the top wall of the ballast device.

[0015] As a further description of the above technical solution:

[0016] The bottom of the silicone sealant layer is fixedly connected to the inner bottom wall of the protective shell, and the plurality of insulating grid plates are arranged at equal intervals.

[0017] As a further description of the above technical solution:

[0018] The heat dissipation mechanism also includes multiple rubber rings, the inner walls of which are respectively fixedly connected to the middle of the mounting bolts.

[0019] As a further description of the above technical solution:

[0020] The ballast device has multiple heat dissipation slots on both the left and right sides of its top wall, and these slots are symmetrically arranged.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, the heat conduction inside the metal shell is carried out by the engagement of the heat-conducting shell and the connecting groove. Then, heat exchange occurs through multiple heat dissipation fins in contact with the air. Subsequently, the spacing between the multiple heat dissipation fins is increased by the rotation of the limiting shaft, thereby improving the heat dissipation effect. At the same time, the use of mounting bolts allows the heat dissipation mechanism to be easily replaced, improving its flexible maintenance effect and preventing the ballast from experiencing a reduction in service life due to dust particles entering its interior.

[0023] 2. In this utility model, the connection of high-strength metal plate and insulating grid plate strengthens the interior of the protective shell, thereby improving the internal strength of the protective shell. Subsequently, with the connection of the pressure-resistant plate and the connection of multiple pressure-resistant grooves, the pressure resistance of the protective shell can be further improved, thus achieving effective protection of the bottom of the electronic ballast. Attached Figure Description

[0024] Figure 1 This is a perspective view of an adaptive frequency modulation low-power electronic ballast proposed in this utility model;

[0025] Figure 2 This is a front view of an adaptive frequency modulation low-power electronic ballast proposed in this utility model;

[0026] Figure 3 This is a cross-sectional view of the protective housing of an adaptive frequency modulation low-power electronic ballast proposed in this utility model.

[0027] Figure 4 This is an exploded view of the heat dissipation mechanism of an adaptive frequency-modulated low-power electronic ballast proposed in this utility model;

[0028] Figure 5 This is a schematic diagram of the protection mechanism of an adaptive frequency modulation low-power electronic ballast proposed in this utility model.

[0029] Legend:

[0030] 1. Ballast equipment; 2. Heat dissipation mechanism; 201. Heat-conducting shell; 202. Limiting shaft; 203. Heat dissipation fins; 204. Connecting groove; 205. Adaptive frequency modulation interface; 206. Mounting bolt; 207. Protective pad; 208. Positioning component; 2081. Limiting bolt; 2082. Limiting groove; 209. Rubber ring; 3. Protective shell; 4. Protective mechanism; 401. High-strength metal plate; 402. Insulating grid plate; 403. Pressure-resistant plate; 404. Pressure-resistant groove; 405. Silicone sealant layer; 5. Mounting mechanism; 501. Mounting plate; 502. Mounting hole; 503. Locking groove; 6. Heat dissipation groove. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figure 1 , Figure 2 and Figure 4 An embodiment of this utility model is provided: an adaptive frequency modulation low-power electronic ballast, including a ballast device 1, with heat dissipation mechanisms 2 provided on both the front and rear sides of the ballast device 1. The heat dissipation mechanisms 2 are used to improve the heat dissipation effect of the ballast and prevent dust particles from entering through the slots and affecting the service life of the ballast. A protective shell 3 is provided at the bottom of the ballast device 1, and a protective mechanism 4 is provided inside the protective shell 3. Mounting mechanisms 5 are provided on both the left and right sides of the bottom wall of the protective shell 3.

[0033] The heat dissipation mechanism 2 includes two heat-conducting shells 201. The adjacent sides of the two heat-conducting shells 201 are respectively located on the front and rear sides of the ballast device 1. Multiple mounting bolts 206 are threaded onto both the left and right sides of the ballast device 1. By rotating the mounting bolts 206, the heat-conducting shells 201 can be installed on the front and rear sides of the ballast device 1. The ends of the multiple mounting bolts 206 are threaded onto one side of the heat-conducting shell 201. Connecting grooves 204 are provided on both the front and rear sides of the ballast device 1. The adjacent sides of the two heat-conducting shells 201 respectively engage with the corresponding connecting grooves 204. The connecting grooves 204 provide initial fixation and limitation for the heat-conducting shells 201. The inner wall of the heat-conducting shell 201... Multiple limiting shafts 202 are rotatably connected. The limiting shafts 202 can limit the rotation of the heat sink 203. At the same time, the limiting shafts 202 are made of metal, which does not affect the heat transfer efficiency. The heat sink 203 is fixedly connected to one side of the limiting shaft 202. The rotation of the limiting shaft 202 can increase the spacing between the multiple heat sink 203, thereby improving the heat dissipation efficiency. The left and right sides of the ballast device 1 are fixedly installed with adaptive frequency modulation interfaces 205. The adaptive low power frequency modulation of the ballast can be completed through the adaptive frequency modulation interface 205. The bottom of the ballast device 1 is provided with a positioning component 208.

[0034] The positioning component 208 includes multiple limiting bolts 2081. The top ends of the multiple limiting bolts 2081 are threadedly connected to the four corners of the bottom of the ballast device 1. Through the threaded connection of the limiting bolts 2081, the protective shell 3 can be fixedly installed at the bottom of the ballast device 1. The inner bottom wall of the protective shell 3 is provided with multiple limiting grooves 2082. The middle part of the multiple limiting bolts 2081 is threadedly connected to the corresponding limiting grooves 2082.

[0035] Specifically, the heat dissipation mechanism 2 on the front and rear sides of the ballast device 1 is used to improve heat dissipation and prevent dust particles from entering through the slots, thus affecting its service life. A protective shell 3 is provided at the bottom. In the heat dissipation mechanism 2, two heat-conducting shells 201 are respectively located on the front and rear sides of the ballast device 1 on adjacent sides. By rotating multiple mounting bolts 206, the heat-conducting shells 201 can be installed on the inner walls of the front and rear sides of the ballast device 1. At the same time, the connecting groove 204 engages with the adjacent side of the heat-conducting shell 201, initially fixing and limiting the heat-conducting shell 201. Multiple metal limiting shafts 2 are rotatably connected to the inner wall of the heat-conducting shell 201. 02 The heat sink fins 203 are rotated and limited without affecting the heat transfer efficiency. The heat sink fins 203 fixed on one side of the limiting shaft 202 expand the spacing between them by rotating, thereby improving the heat dissipation efficiency. The adaptive frequency modulation interface 205 fixedly installed on the left and right sides of the ballast device 1 completes the adaptive low power frequency modulation work. The top of the multiple limiting bolts 2081 are respectively threaded at the four corners of the bottom of the ballast device 1, and the protective shell 3 is fixedly installed at its bottom. The multiple limiting grooves 2082 opened in the inner bottom wall of the protective shell 3 are threadedly connected to the middle of the corresponding limiting bolts 2081.

[0036] Reference Figure 1 , Figure 3 and Figure 5 The protective mechanism 4 includes a high-strength metal plate 401. The top of the high-strength metal plate 401 is fixedly connected to the inner top wall of the protective shell 3. Through the connection of the high-strength metal plate 401, it can work with multiple insulating grid plates 402 to improve the strength of the protective shell 3. Multiple insulating grid plates 402 are fixedly connected to the top wall of the high-strength metal plate 401, and a pressure-resistant plate 403 is fixedly connected to the bottom wall of the high-strength metal plate 401. At the same time, the pressure-resistant plate 403 can improve the pressure resistance of the bottom of the protective shell 3, reducing the impact of pressure on the ballast device 1. Multiple pressure-resistant grooves 404 are equidistantly opened on the bottom wall of the pressure-resistant plate 403, and a silicone sealant layer 405 is fixedly connected to the bottom of the pressure-resistant plate 403. Through the connection of the silicone sealant layer 405, the intrusion of water vapor at the bottom can be effectively improved, thus improving the sealing effect.

[0037] Specifically, the top of the high-strength metal plate 401 is fixedly connected to the inner top wall of the protective shell 3, and multiple insulating grid plates 402 are fixedly connected to the top wall. The combination of the two can improve the strength of the protective shell 3. The bottom wall of the high-strength metal plate 401 is fixedly connected to the pressure-resistant plate 403, which can improve the pressure resistance of the bottom of the protective shell 3 and reduce the impact of the pressure on the ballast device 1. The bottom wall of the pressure-resistant plate 403 is provided with multiple pressure-resistant grooves 404 at equal intervals to further enhance the pressure resistance. The bottom of the pressure-resistant plate 403 is fixedly connected to the silicone sealant layer 405, which can effectively prevent moisture from entering the bottom and improve the sealing effect.

[0038] Reference Figure 1 , Figure 4 and Figure 5 The mounting mechanism 5 includes two mounting plates 501, the top walls of which are fixedly connected to the left and right sides of the bottom wall of the protective shell 3, respectively. The top wall of the mounting plate 501 has a mounting hole 502 in the middle, and two slots 503 are provided on the opposite sides of the two mounting plates 501. The heat dissipation mechanism 2 also includes two protective pads 207, the bottom walls of which are fixedly connected to the front and rear sides of the top wall of the ballast device 1, respectively. The bottom of the silicone sealant layer 405 is fixedly connected to the inner bottom wall of the protective shell 3, and the multiple insulating grid plates 402 are arranged at equal intervals.

[0039] Specifically, the two mounting plates 501 and the mounting holes 502 enable the protective shell 3 and the ballast device 1 to be fixedly installed. The multiple slots 503 facilitate the installation operation. The protective pad 207 protects the top of the ballast device 1. The multiple insulating grid plates 402 are arranged at equal intervals, which improves the uniformity of the strength distribution.

[0040] Reference Figure 1 , Figure 2 and Figure 3 The heat dissipation mechanism 2 also includes multiple rubber rings 209, the inner walls of which are fixedly connected to the middle of the mounting bolts 206 respectively; multiple heat dissipation grooves 6 are provided on the left and right sides of the top wall of the ballast device 1, and the multiple heat dissipation grooves 6 are symmetrically opened, and the heat dissipation grooves 6 do not connect the interior of the ballast device 1 with the outside.

[0041] Specifically, the connection of multiple rubber rings 209 reduces rotational damage to the housing of the ballast device 1 caused by the mounting bolts 206, and the opening of multiple heat dissipation slots 6 further improves the heat dissipation effect.

[0042] Working principle: During use, rotating the mounting bolts 206 fixes the left and right sides of the heat-conducting shell 201 into the connecting groove 204 of the ballast device 1. Conversely, rotating the bolts allows the heat-conducting shell 201 to be disassembled, improving maintenance flexibility. After installation, the heat-conducting shell 201 conducts heat from the metal casing of the ballast device 1. Subsequently, the limiting shaft 202 performs limited rotation on the heat dissipation fins 203 fixed on one side. Since the limiting shaft 202 is made of metal and does not affect heat conduction, normal heat dissipation is achieved. The heat dissipation fins 203 are rotated by the limiting shaft 202 to expand the spacing between multiple heat dissipation fins 203, so as to achieve heat exchange with air and improve heat dissipation efficiency. The adaptive frequency modulation interface 205 fixed on the left and right sides of the ballast device 1 completes the adaptive low power frequency modulation. In its bottom positioning component 208, the top of multiple limiting bolts 2081 are threaded to the four corners of the bottom of the ballast device 1, and the middle is threaded to the corresponding limiting groove 2082 opened in the inner bottom wall of the protective shell 3, so as to fix the protective shell 3 to its bottom.

[0043] Furthermore, the top of the high-strength metal plate 401 is fixedly connected to the inner top wall of the protective shell 3, and works in conjunction with the connection of multiple insulating grid plates 402 to strengthen the interior of the protective shell 3 and improve its internal strength. The bottom wall of the high-strength metal plate 401 is fixedly connected to a pressure-resistant plate 403. Multiple pressure-resistant grooves 404 opened on the bottom wall of the pressure-resistant plate 403 can improve the toughness of the pressure-resistant plate 403, thereby improving the pressure resistance of the protective shell 3 and effectively protecting the bottom of the electronic ballast, reducing the impact of pressure on the bottom on the ballast device 1. The silicone sealant layer 405 fixedly connected to the bottom of the pressure-resistant plate 403 prevents moisture from entering from the bottom and improves the sealing effect.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An adaptive frequency-modulated low-power electronic ballast, comprising a ballast device (1), characterized in that: The ballast device (1) is provided with heat dissipation mechanism (2) on both the front and rear sides, and a protective shell (3) is provided at the bottom of the ballast device (1). A protective mechanism (4) is provided inside the protective shell (3), and an installation mechanism (5) is provided on both the left and right sides of the bottom wall of the protective shell (3). The heat dissipation mechanism (2) includes two heat-conducting shells (201). The adjacent sides of the two heat-conducting shells (201) are respectively arranged on the front and rear sides of the ballast device (1). The left and right sides of the ballast device (1) are threaded with multiple mounting bolts (206). The ends of the multiple mounting bolts (206) are threaded to one side of the heat-conducting shell (201). The front and rear sides of the ballast device (1) are provided with connecting grooves (204). The adjacent sides of the two heat-conducting shells (201) are respectively engaged with the corresponding connecting grooves (204). The inner wall of the heat-conducting shell (201) is rotatably connected with multiple limiting shafts (202). One side of the limiting shaft (202) is fixedly connected with a heat dissipation fin (203). The left and right sides of the ballast device (1) are fixedly installed with adaptive frequency modulation interfaces (205). The bottom of the ballast device (1) is provided with a positioning component (208).

2. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The protective mechanism (4) includes a high-strength metal plate (401), the top of which is fixedly connected to the inner top wall of the protective shell (3), a plurality of insulating grid plates (402) are fixedly connected to the top wall of the high-strength metal plate (401), a pressure-resistant plate (403) is fixedly connected to the bottom wall of the high-strength metal plate (401), a plurality of pressure-resistant grooves (404) are equidistantly provided on the bottom wall of the pressure-resistant plate (403), and a silicone sealant layer (405) is fixedly connected to the bottom of the pressure-resistant plate (403).

3. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The positioning component (208) includes multiple limiting bolts (2081), the top ends of the multiple limiting bolts (2081) are respectively threaded to the four corners of the bottom of the ballast device (1), and the inner bottom wall of the protective shell (3) is provided with multiple limiting grooves (2082), and the middle part of the multiple limiting bolts (2081) is respectively threaded to the corresponding limiting grooves (2082).

4. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The installation mechanism (5) includes two mounting plates (501). The top walls of the two mounting plates (501) are respectively fixedly connected to the left and right sides of the bottom wall of the protective shell (3). The mounting plate (501) has a mounting hole (502) in the middle of its top wall. The two mounting plates (501) each have two slots (503) on the opposite side.

5. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The heat dissipation mechanism (2) also includes two protective pads (207), the bottom walls of which are fixedly connected to the front and rear sides of the top wall of the ballast device (1).

6. The adaptive frequency-modulated low-power electronic ballast according to claim 2, characterized in that: The bottom of the silicone sealant layer (405) is fixedly connected to the inner bottom wall of the protective shell (3), and the plurality of insulating grid plates (402) are arranged at equal intervals.

7. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The heat dissipation mechanism (2) also includes a plurality of rubber rings (209), the inner walls of which are respectively fixedly connected to the middle of the mounting bolts (206).

8. The adaptive frequency-modulated low-power electronic ballast according to claim 1, characterized in that: The top wall of the ballast device (1) is provided with multiple heat dissipation slots (6) on both the left and right sides, and the multiple heat dissipation slots (6) are symmetrically arranged.

Images