A heat dissipation module and electronic device

Abstract

The application provides a heat dissipation module and an electronic device. The heat dissipation module is applied to an electronic device, and the electronic device comprises a heat generating device. The heat dissipation module comprises a heat dissipation fin, a heat dissipation fan and a heat pipe. The heat dissipation module further comprises a closed loop fluid circuit, at least a part of the closed loop fluid circuit is in thermal conduction connection with the heat dissipation fin, the heat pipe and the heat generating device. The closed loop fluid circuit is configured to transport the heat of the heat generating device to the heat dissipation fin through the fluid in the closed loop fluid circuit. The fluid is circulated through the heat generating device after being cooled by the heat dissipation fan, so as to re-heat the heat generating device. The closed loop fluid circuit is formed by a driving member, a liquid outlet pipe, a liquid inlet pipe and a heat transfer pipe. The heat of the heat generating device can be transported to the heat dissipation fin. The heat dissipation fan is used for cooling. The cooled liquid is circulated through the heat generating device again, so that the heat generating device is effectively cooled.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation module and an electronic device. Background Technology

[0002] As laptop performance continues to improve, heat dissipation has become a key factor limiting its performance. Traditional air cooling methods are no longer sufficient to meet the cooling needs of high-power laptops, while current liquid cooling systems are limited in application due to size and cost constraints. Therefore, it is necessary to develop a new type of cooling module that can provide a more efficient cooling solution within a limited space, which has significant practical value. Utility Model Content

[0003] This disclosure provides a heat dissipation module and an electronic device to at least solve one of the technical problems existing in the prior art.

[0004] In a first aspect, this application provides a heat dissipation module applied to an electronic device, the electronic device including a heat-generating device; the heat dissipation module includes heat dissipation fins, a heat dissipation fan and a heat pipe, and the heat dissipation module further includes a closed-loop fluid circuit, at least a portion of the closed-loop fluid circuit being thermally connected to the heat dissipation fins, the heat pipe and the heat-generating device;

[0005] The closed-loop fluid circuit is configured to transfer the heat from the heating device to the heat sink fins through the fluid inside it, and the fluid, after being cooled by the cooling fan, circulates through the heating device to dissipate heat from the heating device again.

[0006] In one possible implementation, the closed-loop fluid circuit includes,

[0007] The inlet section has a channel for the fluid to flow through, and at least a portion of the inlet section is thermally connected to the heat dissipation fins and heat pipes.

[0008] The outflow section has an internal channel for the fluid to flow through. The first end of the outflow section is sealed and connected to the first end of the inflow section. At least a portion of the outflow section is thermally connected to the heat dissipation fins and heat pipes.

[0009] A driving component is sealed and connected to the second end of the inlet section and the second end of the outlet section, and the driving component is used to drive the fluid to circulate through the inlet section and the outlet section;

[0010] The inflow section and / or outflow section are also thermally connected to the heating device.

[0011] In one possible implementation, the inflow section includes,

[0012] The first heat transfer tube is attached to the upper and lower surfaces of the heat dissipation fins;

[0013] The liquid inlet pipe is sealed and connected at its first end to the first end of the first heat transfer pipe.

[0014] The outflow section includes a second heat transfer tube, which is attached to the upper and lower surfaces of the heat dissipation fins, and the first end of the second heat transfer tube is sealed and connected to the second end of the first heat transfer tube; and a liquid outlet tube, the first end of which is sealed and connected to the second end of the second heat transfer tube.

[0015] The driving component is sealed and connected to the second end of the liquid inlet pipe and the second end of the liquid outlet pipe; the first heat transfer pipe and the second heat transfer pipe located on the upper surface of the heat dissipation fins are both in contact with the lower surface of the heat pipe.

[0016] In one embodiment, both the first heat transfer tube and the second heat transfer tube are flat structures, and they extend side by side along the width direction of the heat dissipation fins.

[0017] In one embodiment, the liquid inlet tube is flexibly fitted to the upper surface of the heat pipe along its length.

[0018] In one embodiment, the liquid outlet pipe is connected to the heating device via a thermally conductive pad.

[0019] In one embodiment, at least one of the inlet pipe and the outlet pipe is connected to the heating device via a thermally conductive pad.

[0020] Secondly, this application provides an electronic device, including a heat-generating device, and also includes a heat dissipation module in any of the above-described possible embodiments.

[0021] In one embodiment, the heating device is provided in multiple ways, and is respectively designated as a first heating device and a second heating device, wherein the first heating device is thermally connected to the heat pipe;

[0022] The upper surface of the heat pipe located at the position of the first heating element is in contact with the liquid inlet pipe of the heat dissipation module;

[0023] The second heating element is connected to the liquid outlet pipe of the heat dissipation module via a thermally conductive pad.

[0024] In one embodiment, the heating device is provided in multiple ways, and is respectively designated as a first heating device and a second heating device, wherein the first heating device is thermally connected to the heat pipe;

[0025] The second heating device is connected to at least one of the liquid inlet pipe and liquid outlet pipe of the heat dissipation module via a thermally conductive pad.

[0026] Compared with the prior art, the advantages of this application are: 1) By adding a closed-loop fluid circuit in the heat dissipation module, the fluid circulating inside the closed-loop fluid circuit can transfer the heat of the heat-generating device to the heat dissipation fins to achieve water cooling. On the other hand, the heat of the heat-generating device can be transferred to the heat dissipation fins through the heat pipes of the heat dissipation module to achieve air cooling. Thus, the heat dissipation module of this application can achieve a combination of air cooling and water cooling, improve the heat dissipation efficiency of the heat dissipation module, and ensure the normal operation of electronic equipment.

[0027] 2) This application forms a closed-loop fluid circuit through the driving component, the liquid outlet pipe, the liquid inlet pipe, and the heat transfer pipe, which can transfer the heat of the heating device to the heat dissipation fins, and use the cooling fan to cool it down. The resulting cooling fluid is then circulated through the heating device again, thereby effectively cooling the heating device.

[0028] 3) This application adjusts the flow channel structure of the liquid inlet pipe and connects it to the upper surface of the heat pipe. The heat of the first heating device is transferred to the heat dissipation fins through the fluid in the pipe. After being cooled by the fan, the fluid circulates through the first heating device, thereby achieving enhanced heat dissipation of the first heating device.

[0029] 4) This application connects the liquid outlet pipe to the second heating element, and the cooling fluid in the liquid outlet pipe circulates through the second heating element, thereby achieving effective cooling of the second heating element.

[0030] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0031] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0032] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0033] Figure 1 A schematic diagram of a structure showing the connection between a heat dissipation module and a heat-generating device according to an embodiment of the present disclosure is shown;

[0034] Figure 2 An exploded view of the heat dissipation module and the heat-generating device in an embodiment of this disclosure is shown;

[0035] Figure 3 A schematic diagram of the structure of the heat dissipation module according to an embodiment of the present disclosure is shown;

[0036] Figure 4An exploded view of a heat dissipation module according to an embodiment of the present disclosure is shown;

[0037] Figure 5 A schematic diagram of the structure of the front water chamber cover of the heat dissipation module according to an embodiment of the present disclosure is shown;

[0038] Figure 6 A schematic diagram of the structure of the present disclosure embodiment showing the connection between the heat dissipation fins and the heat transfer pipe, the front liquid inlet structure and the tail water chamber structure;

[0039] Figure 7 It shows Figure 6 A side view;

[0040] Figure 8 It shows Figure 7 A cross-sectional view along the AA direction;

[0041] Figure 9 It shows Figure 7 Another sectional view along the AA direction;

[0042] Figure 10 It shows Figure 6 Disassembly diagram;

[0043] Figure 11 This illustration shows another structural diagram of the heat dissipation module and the heat-generating device connected according to an embodiment of the present disclosure.

[0044] The following are the labels in the diagram: 1-Heat dissipation module, 11-Heat dissipation fins, 12-Heat dissipation fan, 13-Heat pipe, 14-Closed-loop fluid circuit, 141-Inlet section, 142-Outlet section, 143-Drive component, 144-Front-end liquid inlet structure, 145-Tail-end water chamber structure, 1411-First heat transfer pipe, 1412-Inlet pipe, 1421-Second heat transfer pipe, 1422-Outlet pipe, 1441-Front-end water chamber cover, 1442-Front-end sealing cover, 1443-Inlet port, 1444-Outlet port, 1445-Water baffle, 1446-First opening, 1451-Tail-end seal, 1452-Tail-end water chamber cover, 1453-Second opening, 1454-Second chamber, 2-Heating element, 21-First heating element, 3-Main board. Detailed Implementation

[0045] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0046] Currently, most laptops using liquid cooling employ external liquid coolers, placing the radiator and pump externally, leaving only copper pipes inside the laptop. This results in bulky external devices that are inconvenient to carry, limiting their application within laptops. Traditional air-cooling modules are insufficient for the cooling demands of high-power laptops. Therefore, this application develops a novel cooling module combining air and liquid cooling, providing a more efficient cooling solution within a limited space, and possessing significant practical value.

[0047] Firstly, such as Figure 1-2 As shown, this application provides a heat dissipation module 1, which is applied to an electronic device, the electronic device including a heat-generating device 2; the heat dissipation module 1 includes heat dissipation fins 11, a heat dissipation fan 12 and a heat pipe 13, and the heat dissipation module 1 also includes a closed-loop fluid circuit 14, at least a portion of which is thermally connected to the heat dissipation fins 11, the heat pipe 13 and the heat-generating device 2.

[0048] The closed-loop fluid circuit 14 is configured to transfer the heat of the heat-generating device 2 to the heat sink fins 11 through the fluid inside it. The fluid, after being cooled by the cooling fan 12, circulates through the heat-generating device 2 to dissipate heat from the heat-generating device 2 again.

[0049] For example, in this application, the heat-generating device 2 includes, but is not limited to, a CPU chip (central processing unit), a GPU chip (graphics processing unit), a diode, an inductor, a resistor, a capacitor, etc.

[0050] For example, this electronic device includes, but is not limited to, laptops. Taking a laptop as an example, the CPU chip and GPU chip installed on the motherboard 3 are high-power heat-generating devices that generate a large amount of heat during operation. Therefore, heat pipes are commonly connected to them to transfer the heat generated during operation to the heat pipes through thermal conduction. The heat pipes then transfer the heat to the heat sink fins, which are further cooled by a cooling fan. However, this conventional air-cooling method can no longer meet the needs of high-performance laptops. In addition, other heat-generating components in laptops, such as inductors, resistors, and capacitors, also generate heat during operation. However, due to the internal space limitations of laptops, these heat-generating components usually do not have additional heat sinks such as heat pipes for heat dissipation. Therefore, this application sets up a closed-loop fluid circuit and connects it to these heat-generating components through thermal conduction to remove heat and dissipate it.

[0051] Taking a laptop as an example, this application incorporates a heat dissipation module 1 within the laptop. On one hand, the circulating fluid within this closed-loop fluid circuit transfers heat from the heat-generating components to the heat dissipation fins for water cooling. On the other hand, the heat pipes integrated into the heat dissipation module transfer heat from the heat-generating components to the heat dissipation fins for air cooling. Thus, this application's heat dissipation module combines air cooling and water cooling, providing a more efficient heat dissipation solution within a limited space, improving the heat dissipation efficiency of the heat dissipation module, and ensuring the normal operation of the laptop, demonstrating significant practical value. The core of this application lies in its improvement of the traditional stacked, snap-fit ​​fin structure of laptops, combining it with a water-cooling fin structure to achieve hybrid air and water cooling without significantly increasing the size of the heat dissipation module. Traditional laptop heat dissipation modules typically use soldering to connect stacked, snap-fit ​​fins to heat pipes, transferring heat from the core components to the heat dissipation fins, and then using a cooling fan to blow the heat into the external environment. This application, however, replaces the stacked, snap-fit ​​fins with a closed-loop fluid circuit design, soldering them to the heat pipes. The heat dissipation fins inside a laptop not only serve as the cold end of a traditional air-cooled heat pipe, but also as the cold end of a water-cooled system. By using a cooling fan to remove more heat, the temperature of the heat-generating components inside the laptop can be further reduced.

[0052] This application, by setting a closed-loop fluid circuit 14, which is thermally connected to the heat sink fins 11, heat pipes 13, and heat-generating device 2, can transfer the heat from the heat-generating device 2 to the heat sink fins 11. After being cooled by the cooling fan 12 (this is air cooling), the cooled fluid (collectively referred to as cooling fluid) circulates again through the heat-generating device 2, achieving effective cooling of the heat-generating device 2 again. Therefore, this application, by adding a closed-loop fluid circuit 14 to achieve water cooling and combining it with air cooling using the heat sink fins 11 and cooling fan 12, can achieve higher heat dissipation efficiency without significantly increasing the volume. This application combines water cooling and air cooling to form a complete heat exchange system. Therefore, compared with current traditional heat dissipation modules, the heat dissipation module structure of this application can conduct more heat to the heat sink fins, resulting in higher heat dissipation efficiency.

[0053] In some embodiments, such as Figure 1-2 As shown, the closed-loop fluid circuit 14 includes,

[0054] The inlet section 141 has a channel for fluid flow inside, and at least a portion of the inlet section 141 is thermally connected to the heat dissipation fins 11 and the heat pipe 13.

[0055] The outlet section 142 has a channel for fluid flow inside. The first end of the outlet section 142 is sealed and connected to the first end of the inlet section 141. At least a portion of the outlet section 142 is thermally connected to the heat dissipation fins 11 and the heat pipe 13.

[0056] The driving component 143 is sealed and connected to the second end of the inlet section 141 and the second end of the outlet section 142. The driving component 143 is used to drive the fluid to circulate through the inlet section 141 and the outlet section 142.

[0057] The inlet section 141 and / or outlet section 142 are also thermally connected to the heating element 2.

[0058] For example, the drive unit 143 includes, but is not limited to, a water pump for driving fluid circulation through the inlet section 141 and the outlet section 142.

[0059] Taking a laptop as an example, the water pump is built into the laptop. Of course, this application can also be equipped with an external water pump power system to achieve more efficient heat dissipation. Due to the internal size constraints of laptops, the internal water pump solution usually has a relatively small flow rate and pressure. By using an external water pump, the internal fluid channels of the heat dissipation module can pass through a larger flow rate, thereby improving heat dissipation efficiency. In addition, since the external device is only a water pump system, its design volume will be significantly smaller than that of current conventional external water cooling radiators.

[0060] In this application, the closed-loop fluid circuit 14 is a closed-loop circuit composed of an inlet section 141, an outlet section 142, and a drive element 143, allowing the fluid to circulate between the inlet section, the outlet section, and the drive element. Because the inlet section 141 and / or the outlet section 142 are thermally connected to the heat-generating device 2, the heat generated by the heat-generating device 2 is conducted to the fluid within it. Furthermore, because the inlet section 141 is also thermally connected to the heat sink fins and heat pipes, the heat transferred from the heat-generating device to the heat pipes is also transferred to the inlet section. When the fluid inside the inlet section flows past the heat sink fins, the cooling fan connected to the heat sink fins carries away the heat in the fluid, as well as the heat from the heat pipes and the inlet section, thus dissipating heat and lowering the temperature. The resulting coolant enters the outlet section 142, and then, driven by the drive element, circulates back through the inlet section. After passing the heat-generating device, it is cooled again, improving the heat dissipation efficiency of the heat-generating device.

[0061] Furthermore, such as Figure 2-4 As shown, in the closed-loop fluid circuit 14, the inlet section 141 includes a first heat transfer pipe 1411, which is attached to the upper and lower surfaces of the heat dissipation fins 11; and a liquid inlet pipe 1412, the first end of which is sealed and connected to the first end of the first heat transfer pipe 1411.

[0062] The outflow section 142 includes a second heat transfer tube 1421, which is attached to the upper and lower surfaces of the heat dissipation fins 11, and the first end of the second heat transfer tube 1421 is sealed and connected to the second end of the first heat transfer tube 1411; and a liquid outlet tube 1422, which is sealed and connected to the second end of the second heat transfer tube 1421.

[0063] The drive unit 143 is sealed and connected to the second end of the liquid inlet pipe 1412 and the second end of the liquid outlet pipe 1422; the first heat transfer pipe 1411 and the second heat transfer pipe 1421 located on the upper surface of the heat dissipation fins 11 are both in contact with the lower surface of the heat pipe 13.

[0064] For example, such as Figure 2 As shown, both the first heat transfer tube 1411 and the second heat transfer tube 1421 are flat structures, and they extend side by side along the width direction of the heat dissipation fins 11. Taking the flat structure of the first heat transfer tube 1411 as an example, a round tube can be flattened into shape with a wall thickness of 0.2 mm. Taking a flat first heat transfer tube with a total thickness of 1 mm as an example, it has a fluid flow channel with a height of 0.6 mm inside. Figure 4 As shown, there are two first heat transfer pipes 1411, which are respectively attached to the upper and lower surfaces of the heat dissipation fins 11. There are two second heat transfer pipes 1421, which are respectively attached to the upper and lower surfaces of the heat dissipation fins 11. The first heat transfer pipes 1411 and the second heat transfer pipes 1421 located on the same surface of the heat dissipation fins are arranged side by side.

[0065] For example, the materials of the first heat transfer tube 1411 and the second heat transfer tube 1421 include, but are not limited to, metals such as copper and aluminum. The materials of the liquid inlet tube and the liquid outlet tube include, but are not limited to, metals such as copper and aluminum.

[0066] Furthermore, such as Figure 3-6 , Figure 10As shown, the closed-loop fluid circuit 14 also includes a front-end liquid inlet structure 144 and a rear-end water chamber structure 145. The front-end liquid inlet structure 144 includes a front-end water chamber cover 1441 and a front-end sealing cover 1442. The front-end water chamber cover 1441 is a cavity structure with openings at both ends. Specifically, the first end of the front-end water chamber cover 1441 has an inlet 1443 and an outlet 1444 that communicate with the first chamber inside it. A water baffle 1445 is provided in the first chamber of the front-end water chamber cover. The water baffle 1445 separates the inlet and outlet, thereby dividing the first chamber into two independent sub-chambers to define the flow channels. The front-end sealing cover 1442 also has a first opening 1446 at the position corresponding to the first heat transfer tube 1411 and the second heat transfer tube 1421. The second end of the front water chamber cover 1441 and the water baffle 1445 therein are sealed and fixedly connected to the first end face of the front sealing cover 1442 (for example, by high-temperature soldering); the first ends of the first heat transfer tube 1411 and the second heat transfer tube 1421 pass through the first opening 1446 of the front sealing cover 1442 and extend into the two compartments of the front water chamber cover 1441, respectively. Figure 8-9 As shown. The connection between the first heat transfer tube 1411 and the second heat transfer tube 1421 and the first opening 1446 is sealed. Thus, the fluid entering from the inlet will only enter the first heat transfer tube, and the fluid flowing out from the second heat transfer tube will only flow out from the outlet.

[0067] like Figure 4 , Figure 9 As shown, the tail end water chamber structure 145 includes a tail end seal 1451 and a tail end water chamber cover 1452. The tail end seal 1451 has the same structure as the front end seal cover 1442. The tail end seal 1451 and the tail end water chamber cover 1452 are sealed and fixedly connected (e.g., welded) to form a second chamber 1454 structure for fluid flow between them. The tail end seal 1451 has a second opening 1453 at the position corresponding to the first heat transfer tube and the second heat transfer tube, respectively, which communicates with the second chamber 1454. The second ends of the first heat transfer tube and the second heat transfer tube pass through the second opening 1453 and extend into the second chamber 1454. The connection between the first heat transfer tube and the second heat transfer tube and the second opening 1453 is sealed.

[0068] For example, both the front liquid inlet structure 144 and the rear water chamber structure 145 can be formed by pressure molding. Since the first and second heat transfer pipes are flattened round tubes and assembled by welding, the manufacturing process is mature, resulting in a smaller cost increase compared to traditional air-cooled fins. Furthermore, compared to traditional cooling modules, which are limited by the welding of heat pipes to fins, requiring the heat pipe's width to occupy space in the internal plane of the laptop, and with strict limitations on the heat pipe's bending angle to ensure sufficient Qmax (maximum heat output), this application's cooling module with hybrid air-water cooling offers greater flexibility in liquid path design, does not occupy space in the motherboard plane, and avoids excessive small-angle bends that could lead to high flow resistance.

[0069] For example, the closed-loop fluid circuit 14 has two heat dissipation methods:

[0070] The first heat dissipation method: such as Figure 1-2 As shown, the first heat transfer pipe 1411 of the inlet section 141 is attached to the upper and lower surfaces of the heat dissipation fins 11, and the second heat transfer pipe 1421 of the outlet section 142 is attached to the upper and lower surfaces of the heat dissipation fins 11. A heat pipe 13 is attached to the upper surfaces of the first heat transfer pipe 1411 and the second heat transfer pipe 1421 located on the upper surface of the heat dissipation fins 11. The end of the heat pipe 13 is attached to the upper surfaces of the first and second heat transfer pipes, and the middle part of the heat pipe 13 is in direct contact with the first heat-generating device to achieve a heat conduction connection between the two (or the middle part of the heat pipe 13 can also overlap with the first heat-generating device through a thermally conductive pad to achieve a heat conduction connection between the heat pipe and the first heat-generating device). The first heat-generating device includes, but is not limited to, CPU chips and GPU chips. The liquid inlet pipe 1412 of the inlet section 141 is adaptively bent along the length direction of the heat pipe 13 and attached to the upper surface of the heat pipe 13.

[0071] When the first heat-generating device (e.g., CPU chip, GPU chip) is working, the heat generated is transferred to the heat pipe 13. On one hand, the heat is transferred to the first heat transfer pipe and heat dissipation fins through the heat pipe 13, and the cooling fan is used for heat dissipation. On the other hand, the fluid inside the liquid inlet pipe 1412 attached to the surface of the heat pipe 13 absorbs part of the heat on the heat pipe 13. Then the fluid that has absorbed the heat enters the first heat transfer pipe 1411 through the liquid inlet 1443, and then transfers the heat to the heat dissipation fins. The cooling fan dissipates the heat and cools the fluid in the first heat transfer pipe. The resulting cooling fluid enters the second heat transfer pipe 1421 from the tail end water chamber structure 145, and then flows out from the liquid outlet 1444 into the liquid outlet pipe 1422. The driving component 143 then drives the cooling fluid back into the liquid inlet pipe 1412, and then circulates through the first heat-generating device to enhance the heat dissipation of the first heat-generating device.

[0072] Furthermore, the outlet pipe 1422 can also be connected to the second heat-generating device via a thermally conductive pad. This second heat-generating device includes, but is not limited to, diodes, inductors, resistors, and capacitors. After the cooling fluid enters the outlet pipe, because the outlet pipe is connected to the second heat-generating device, the heat generated by the second heat-generating device during operation is transferred to the outlet pipe. The cooling fluid in the outlet pipe then dissipates heat from the second heat-generating device, thereby effectively cooling the heat-generating devices on the motherboard.

[0073] The second heat dissipation method, such as Figure 11 As shown, the first heat transfer pipe 1411 of the inlet section 141 is attached to the upper and lower surfaces of the heat dissipation fins 11, and the second heat transfer pipe 1421 of the outlet section 142 is attached to the upper and lower surfaces of the heat dissipation fins 11. A heat pipe 13 is attached to the upper surfaces of the first heat transfer pipe 1411 and the second heat transfer pipe 1421 located on the upper surface of the heat dissipation fins 11. The end of the heat pipe 13 is attached to the upper surfaces of the first and second heat transfer pipes, and the middle portion of the heat pipe 13 is in direct contact with a first heat-generating device to achieve a thermal conduction connection between them (or the middle portion of the heat pipe 13 can also overlap with the first heat-generating device through a thermally conductive pad to achieve a thermal conduction connection between the heat pipe and the first heat-generating device). The first heat-generating device includes, but is not limited to, a CPU chip and a GPU chip. At least one of the liquid inlet pipe 1412 and the liquid outlet pipe 1422 overlaps with a second heat-generating device through a thermally conductive pad. The second heat-generating device includes, but is not limited to, a diode, an inductor, a resistor, and a capacitor.

[0074] When the first heat-generating device (e.g., CPU chip, GPU chip) operates, the generated heat is transferred to heat pipe 13. On one hand, the heat is sequentially transferred through heat pipe 13 to the first heat transfer pipe and the heat sink fins, where a cooling fan dissipates the heat, cooling the heat sink fins, the first heat transfer pipe, and the heat pipe itself. Simultaneously, the fluid inside the first heat transfer pipe is cooled. The resulting cooling fluid flows out from the outlet, through the outlet pipe and the drive component, and then circulates again through the inlet pipe and the first heat transfer pipe, further enhancing the dissipation of the heat transferred by the heat pipe. On the other hand, because the outlet pipe is connected to the second heat-generating device (e.g., diode, inductor, resistor, capacitor), the heat generated by the second heat-generating device during operation is absorbed by the cooling fluid in the outlet pipe, effectively cooling the second heat-generating device. Alternatively, when the inlet pipe is connected to the second heat-generating device, the cooling fluid circulating into the inlet pipe absorbs the heat generated by the second heat-generating device during operation, effectively cooling it.

[0075] In both of the above-mentioned heat dissipation methods, the liquid inlet pipe can achieve heat conduction connection with the first and second heating devices through direct or indirect contact. After absorbing heat from the first / second heating devices, the high-temperature fluid inside the liquid inlet pipe flows out from the liquid inlet pipe and enters the first chamber of the front liquid inlet structure from the liquid inlet port 1443. After being split, it enters the first heat transfer pipe 1411 on the upper and lower surfaces of the heat dissipation fins. The high-temperature fluid in the first heat transfer pipe 1411 conducts heat to the heat dissipation fins 11. The large heat dissipation area of ​​the heat dissipation fins is used to achieve rapid cooling. After being cooled by the cooling fan, it flows out from the liquid outlet port 1444, forming a cold end.

[0076] For example, in this application, the heat dissipation benefit analysis of this heat dissipation module is as follows: Since the volume of water pumps (driving components) that can be supported inside current laptops is limited, the flow rate of the water pump is also limited. Taking an operating point flow rate of 100ml / min as an example, the heat dissipation benefit it can bring can be roughly calculated as follows:

[0077] ① Assume the working liquid (fluid) experiences a temperature rise of 3℃ upon passing through the heat source.

[0078] ② The working fluid can be deionized water or ultrapure water, with a density of 1000 kg / m³. 3 Its specific heat capacity is 4186 J / kg℃.

[0079] The heat formula is Q = m × c × ΔT, where m is the mass, c is the specific heat capacity, and ΔT is the temperature change.

[0080] Q = 1.667 × 10 -6 m 3 / s×1000kg / m 3 ×4186J / kg℃×3℃≈21W

[0081] Considering the thermal resistance between the heat source and the working fluid, it is estimated that this solution can provide a heat dissipation benefit of more than 15W compared to conventional heat dissipation solutions, and this benefit will be further increased as the water pump flow rate increases.

[0082] Secondly, this application also provides an electronic device, including a heat-generating device and a heat dissipation module. For example, such as Figure 1 As shown, the heating device 2 has multiple components, designated as a first heating device and a second heating device. The first heating device includes, but is not limited to, a CPU chip and a GPU chip. The second heating device includes, but is not limited to, an inductor, a capacitor, a resistor, and a diode. The first heating device 21 is thermally connected to the heat pipe 13, and the lower surface of the end of the heat pipe 13 is in contact with the first heat transfer pipe 1411 and the second heat transfer pipe 1421 of the heat dissipation module, respectively.

[0083] The upper surface of the heat pipe 13 located at the position of the first heating element is in contact with the liquid inlet pipe 1412 of the heat dissipation module; the second heating element is connected to the liquid outlet pipe 1422 of the heat dissipation module through a thermally conductive pad.

[0084] Taking a laptop as an example, the motherboard 3 of a laptop contains many high-power heat-generating components, such as CPU chips, GPU chips, inductors, capacitors, resistors, diodes, etc. Due to internal space limitations, laptops typically only connect heat pipes to the core components—the CPU chip—to transfer the heat generated during operation to the heat sink fins. The cooling fan then dissipates the heat, cooling the heat pipes and fins, and consequently, the CPU and GPU chips. However, other high-power heat-generating components cannot be effectively cooled during operation, affecting the laptop's performance. Therefore, this application, by adding a closed-loop fluid circuit to the laptop's cooling module, achieves a combination of air cooling and water cooling, improving the heat dissipation efficiency for heat-generating components.

[0085] Specifically, such as Figure 1 As shown, the middle section of heat pipe 13 is connected to the CPU chip and GPU chip via a thermally conductive pad to achieve heat conduction between them. To further enhance heat dissipation for the CPU and GPU chips, a liquid inlet pipe 1412 is attached to the upper surface of the heat pipe above the GPU and CPU chip areas. The liquid inlet pipe is adaptively bent along the length of the heat pipe and spans the GPU and CPU chip areas. Thus, the heat generated by the CPU and GPU chips is transferred to the heat pipe and the fluid within the liquid inlet pipe. The heat pipes transfer heat to the heat dissipation fins, while the fluid in the inlet pipe enters the first heat transfer pipe from the inlet. The first heat transfer pipe also transfers heat to the heat dissipation fins, where the cooling fan dissipates and cools the heat, carrying away the heat from the heat pipes, the first heat transfer pipe, and the fluid inside them; thus cooling the CPU and GPU chips. The cooling fluid inside the first heat transfer pipe flows out from the second heat transfer pipe and the outlet, then circulates back into the inlet pipe. After flowing over the area above the CPU and GPU chips, it again carries away the heat conducted from the CPU and GPU chips to the heat pipes, further enhancing the cooling of the CPU and GPU chips.

[0086] Since the second heating element (such as an inductor or resistor) conducts heat through an overlap between the heat-conducting pad and the outlet pipe 1422, the cooling fluid flowing from the outlet also carries away the heat transferred from the second heating element to the outlet pipe, thus effectively cooling the second heating element. The outlet pipe can be adapted to the distribution of the second heating element to achieve better heat conduction.

[0087] Of course, such as Figure 11As shown, there can also be multiple heating devices, designated as a first heating device and a second heating device. The first heating device includes, but is not limited to, a CPU chip and a GPU chip. The second heating device includes, but is not limited to, an inductor, a capacitor, a resistor, and a diode. The first heating device is thermally connected to the heat pipe 13, and the lower surface of the end of the heat pipe 13 contacts the first heat transfer pipe and the second heat transfer pipe of the heat dissipation module, respectively. The second heating device overlaps with at least one of the liquid inlet pipe 1412 and the liquid outlet pipe 1422 of the heat dissipation module through a thermally conductive pad. The liquid inlet pipe and the liquid outlet pipe can be adaptively bent according to the distribution position of the second heating device to achieve better thermal conduction connection. The fluid in the liquid inlet pipe 1412 carries away heat after flowing through the second heating device. After passing through the first heat transfer pipe and being cooled by the heat dissipation fins, the resulting cooling fluid circulates through the liquid outlet pipe and the liquid inlet pipe, effectively cooling the second heating device that it overlaps with. Similarly, when the cooling fluid passes through the liquid outlet pipe, it can also effectively cool the second heating device that it overlaps with.

[0088] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0089] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0090] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0091] The terms "connection," "direct connection," "indirect connection," "fixed connection," "installation," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. The terms "installation," "connection," and "fixed connection" can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0092] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heat dissipation module, applied to an electronic device, the electronic device including a heat-generating device; the heat dissipation module including heat dissipation fins, a heat dissipation fan, and a heat pipe, characterized in that: The heat dissipation module further includes a closed-loop fluid circuit, at least a portion of which is thermally connected to the heat dissipation fins, the heat pipe, and the heat-generating device. The closed-loop fluid circuit is configured to transfer the heat from the heating device to the heat sink fins through the fluid inside it, and the fluid, after being cooled by the cooling fan, circulates through the heating device to dissipate heat from the heating device again.

2. The heat dissipation module according to claim 1, characterized in that: The closed-loop fluid circuit includes, The inlet section has a channel for the fluid to flow through, and at least a portion of the inlet section is thermally connected to the heat dissipation fins and heat pipes. The outflow section has an internal channel for the fluid to flow through. The first end of the outflow section is sealed and connected to the first end of the inflow section. At least a portion of the outflow section is thermally connected to the heat dissipation fins and heat pipes. A driving component is sealed and connected to the second end of the inlet section and the second end of the outlet section, and the driving component is used to drive the fluid to circulate through the inlet section and the outlet section; The inlet section and / or outlet section are also thermally connected to the heating device.

3. The heat dissipation module according to claim 2, characterized in that: The inlet section includes a first heat transfer tube, which is attached to the upper and lower surfaces of the heat dissipation fins; and a liquid inlet tube, the first end of which is sealed and connected to the first end of the first heat transfer tube. The outflow section includes a second heat transfer tube, which is attached to the upper and lower surfaces of the heat dissipation fins, and the first end of the second heat transfer tube is sealed and connected to the second end of the first heat transfer tube; and a liquid outlet tube, the first end of which is sealed and connected to the second end of the second heat transfer tube. The driving component is sealed and connected to the second end of the liquid inlet pipe and the second end of the liquid outlet pipe; the first heat transfer pipe and the second heat transfer pipe located on the upper surface of the heat dissipation fins are both in contact with the lower surface of the heat pipe.

4. The heat dissipation module according to claim 3, characterized in that: Both the first heat transfer tube and the second heat transfer tube are flat structures, and they extend side by side along the width direction of the heat dissipation fins.

5. The heat dissipation module according to claim 3, characterized in that: The liquid inlet tube is flexibly fitted to the upper surface of the heat pipe along its length.

6. The heat dissipation module according to claim 5, characterized in that: The liquid outlet pipe is connected to the heating device via a thermally conductive pad.

7. The heat dissipation module according to claim 3, characterized in that: At least one of the inlet pipe and the outlet pipe is connected to the heating device via a thermally conductive pad.

8. An electronic device, comprising a heating element, characterized in that: It also includes the heat dissipation module as described in any one of claims 1-7.

9. The electronic device according to claim 8, characterized in that: The heating device is provided in multiple ways, and is respectively designated as a first heating device and a second heating device. The first heating device is thermally connected to the heat pipe. The upper surface of the heat pipe located at the position of the first heating element is in contact with the liquid inlet pipe of the heat dissipation module; The second heating element is connected to the liquid outlet pipe of the heat dissipation module via a thermally conductive pad.

10. The electronic device according to claim 8, characterized in that: The heating device is provided in multiple ways, and is respectively designated as a first heating device and a second heating device. The first heating device is thermally connected to the heat pipe. The second heating device is connected to at least one of the liquid inlet pipe and liquid outlet pipe of the heat dissipation module via a thermally conductive pad.

Images