Power conversion device and power supply apparatus

Abstract

The embodiment of the present application provides a power conversion device and a power supply device comprising the power conversion device, and relates to the technical field of charging. The power conversion device comprises a cold plate, a heat conduction piece and one or more power devices, the one or more power devices are used for power conversion on input electric energy; the cold plate is located on one side of the one or more power devices, the cold plate has a cooling channel for flowing of cooling liquid, the cold plate has a liquid inlet and a liquid outlet in communication with the cooling channel, and the cold plate further has a first boss, the first boss is protruded towards the one or more power devices, the first boss has an opening in communication with the cooling channel, and the opening is directed towards the one or more power devices; and the heat conduction piece is fixed to the cold plate and blocks the opening, and the heat conduction piece is used for connecting or contacting the one or more power devices.

Description

Technical Field

[0001] This application relates to the field of charging technology, and in particular to a power conversion device and power supply equipment. Background Technology

[0002] Power conversion devices are a core component of power supply equipment. The power devices within a power conversion device convert electrical energy into power, and heat dissipation is typically achieved through liquid cooling. Specifically, to dissipate heat from the power devices, a cooling plate for supplying coolant needs to form a convex shape, which connects to the power devices to dissipate heat.

[0003] In related technologies, a method of stretching a protrusion into a cold plate is used to integrally form the protrusion with the other parts of the cold plate. However, the protrusion on the cold plate is quite high. Using this technology, the high protrusion is not only difficult to process, but also the thickness of the protrusion is thin due to stretching, making it prone to damage and causing the coolant inside the cold plate to leak. Utility Model Content

[0004] This application provides a power conversion device and a power supply device including the power conversion device, which facilitates the production and manufacturing of cold plates and reduces the possibility of damage to the cold plates.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A first aspect of this application provides a power conversion device, which includes a cold plate, a heat-conducting element, and one or more power devices. The one or more power devices are used to convert input electrical energy into power. The cold plate is located on one side of the one or more power devices and has a cooling channel for coolant flow. The cold plate has an inlet and an outlet communicating with the cooling channel. The cold plate also has a first boss that protrudes toward the one or more power devices and has an opening communicating with the cooling channel. The opening faces the one or more power devices. The heat-conducting element is fixed to the cold plate and seals the opening. The heat-conducting element is used to connect to or contact the one or more power devices.

[0007] A power conversion device converts electrical energy input from a power source (e.g., the power grid) through power devices and then outputs (e.g., to a charging gun) to charge a device (e.g., an electric vehicle). In this device, coolant flows into a cooling channel from an inlet within a cold plate and then flows out from an outlet, circulating within the cold plate to cool the power conversion device. A first protrusion on the cold plate faces one or more power devices. A heat-conducting element is mounted at the opening of the first protrusion, supporting it and allowing it to be close to the power devices. Through connection or contact between the heat-conducting element and the power devices, heat from the power devices is transferred to the heat-conducting element, which in turn is transferred to the coolant. The flowing coolant continuously carries away heat from the heat-conducting element, achieving heat dissipation and cooling of the power devices.

[0008] In other words, the convex hull in related technologies is split into the first boss and the heat-conducting component in this application, eliminating the need to stretch a complete convex hull (which can be understood as a first boss without an opening) onto the cold plate. This reduces the processing difficulty of the cold plate and facilitates its production. Furthermore, by machining the first boss onto the cold plate and then sealing its opening with the heat-conducting component, compared to directly machining a complete convex hull onto the cold plate in related technologies, the combined structure of the first boss and the heat-conducting component in this application has a greater thickness, reducing the gap at which the first boss might break and lowering the possibility of damage to the cold plate.

[0009] In one alternative embodiment, the cold plate includes a first plate and a second plate fixedly connected together, the first plate being located on the side of the second plate facing one or more power devices, and a cooling channel being located between the first plate and the second plate; the first plate has a first boss, the second plate has a second boss, a portion of the second boss being located within the first boss, and the cooling channel including a first gap between a heat-conducting element and the second boss.

[0010] By fixing the first plate and the second plate together, a cooling channel is formed between them. A portion of the second boss on the second plate extends into the first boss on the first plate, reducing the gap between the two bosses. This decreases the amount of coolant needed to fill the cooling channel and facilitates coolant circulation. Furthermore, a first gap (part of the cooling channel) exists between the heat-conducting component and the second boss, allowing coolant to flow normally between them. This promotes heat exchange between the coolant and the heat-conducting component, effectively cooling the power device.

[0011] In one optional embodiment, the power conversion device further includes a first heat sink, which is fixed to the surface of the heat-conducting element away from one or more power devices. The first heat sink is located within a first gap and has a plurality of first slits for coolant flow.

[0012] The first heat sink is fixedly connected to the heat conductor. Heat from the power device is transferred to the first heat sink via the heat conductor. Since the first heat sink is located within the first gap and has multiple first slits, the coolant within the first gap can flow through these slits, thus ensuring sufficient contact and heat exchange with the first heat sink and absorbing a significant amount of heat from it. Furthermore, the multiple first slits increase the flow resistance of the coolant, reducing its flow velocity at the first gap. This allows for more efficient heat exchange between the coolant and the first heat sink and heat conductor within the first gap, further enhancing the cooling effect on the power device and increasing the heat dissipation efficiency of the cold plate.

[0013] Furthermore, setting the heat-conducting component and the first boss as two independent structures also makes it easier to process the first heat-dissipating component on the heat-conducting component, reducing production difficulty and cost.

[0014] In one alternative embodiment, the end of the first heat sink that faces away from the heat conductor is connected to or in contact with the second boss.

[0015] By connecting or contacting the first heat sink with the second protrusion, the possibility of coolant flowing between the first heat sink and the second protrusion is reduced, allowing more coolant to flow into the multiple first gaps, further improving the heat exchange efficiency between the coolant and the first heat sink, and further reducing the flow rate of coolant through the first gaps, which is beneficial for the cold plate to dissipate heat from the power devices.

[0016] In one optional embodiment, the first heat sink includes multiple parts, each part including one or more first gaps, and multiple power devices are provided, with each power device corresponding to one of the multiple parts; the power conversion device further includes one or more flow-blocking elements, which are fixed to the surface of the heat-conducting element away from the surface of the one or more power devices, and the one or more flow-blocking elements are located in the first gaps. The end of each flow-blocking element away from the heat-conducting element is connected to or contacts a second protrusion, and a flow-blocking element is provided between two adjacent parts.

[0017] The flow-blocking component obstructs the flow of coolant, reducing the likelihood of coolant flowing between adjacent sections of the first heat sink. This allows more coolant to flow through the first gap in each section, further improving the heat exchange efficiency between the coolant and the first heat sink. Each section of the first heat sink corresponds to a power device. By using multiple sections of the first heat sink, the flow rate of coolant as it passes through the area of ​​each power device is reduced, fully absorbing the heat from each cooling component. This targeted heat dissipation for multiple power devices results in higher heat dissipation efficiency for the cold plate.

[0018] In one optional embodiment, the cold plate and one or more power devices are arranged along a first direction. The first boss includes a first sidewall and a second sidewall arranged along a second direction, and the second boss includes a third sidewall and a fourth sidewall arranged along the second direction, which is perpendicular to the first direction. The cooling channel also includes a second gap located between the first sidewall and the third sidewall, and a third gap located between the second sidewall and the fourth sidewall. The second gap and the third gap are arranged along the second direction and are both in communication with the first gap.

[0019] Coolant entering through the inlet flows into the first gap through either the second or third gap. In the first gap, the coolant exchanges heat with the heat-conducting components, carrying away heat from the power devices before flowing into the other of the second and third gaps, and finally exiting through the outlet. The interconnected first, second, and third gaps allow coolant to flow between the first and second bosses, effectively dissipating heat from the power devices.

[0020] In one optional embodiment, the power devices are arranged in a plurality of directions along a third direction, and the first and second directions are both perpendicular to the third direction; the power conversion device further includes a plurality of current sharing structures, and a plurality of current sharing structures arranged along the third direction are arranged in the second gap or the third gap. Each current sharing structure includes a plurality of current sharing plates arranged along the first direction, and each current sharing plate has a surface facing away from the second plate.

[0021] When multiple power devices are arranged along a third direction, the surface of the flow equalization plate facing away from the second plate guides a portion of the coolant to flow along this direction. Guided by multiple flow equalization structures, the coolant distribution in the third direction becomes more uniform. Furthermore, the space between adjacent flow equalization structures also allows coolant flow, enabling coolant in the second or third gap to flow into the first gap, thus dissipating heat from the multiple power devices. Because the coolant is more uniformly distributed in the second or third gap, its flow into the first gap also contributes to a more uniform distribution of coolant in the third direction. This facilitates uniform heat dissipation from the cold plate to the multiple power devices, reducing the likelihood of any single power device overheating. For example, if multiple flow equalization structures are installed in the second gap, some coolant flowing from the inlet will flow along the third direction, resulting in a more uniform distribution of coolant in the second gap.

[0022] In one optional embodiment, the cooling channel further includes a plurality of first sub-channels and a plurality of second sub-channels. The plurality of first sub-channels are arranged along a second direction, and each first sub-channel extends along a third direction. Both the first and second directions are perpendicular to the third direction. Each second sub-channel connects two adjacent first sub-channels. The two second sub-channels connected to the same first sub-channel are located at different ends of the first sub-channel in the third direction. A second gap, a third gap, and a plurality of first sub-channels are arranged sequentially along the second direction. The third gap connects to the first sub-channel closest to the third gap.

[0023] Multiple first sub-channels and multiple second sub-channels form a serpentine channel, which is part of a cooling channel. The serpentine shape of this cooling channel allows coolant to flow over a larger area of ​​the cold plate, cooling more electronic components within the power converter and improving its heat dissipation. The third gap connects to the nearest first sub-channel, allowing coolant to flow from the third gap into the nearest first sub-channel, or vice versa.

[0024] In one alternative implementation, one of the inlet and outlet is connected to the second gap, and the other is connected to the first sub-channel furthest from the third gap.

[0025] Taking a case where the inlet connects to the second gap and the outlet connects to the first sub-channel furthest from the third gap as an example, the coolant flowing in from the inlet flows into the second gap. The coolant in the second gap then flows into the first gap to exchange heat with the heat-conducting components, thus cooling the power devices. Afterward, the coolant flows into the third gap. Then, the coolant flows from the third gap into the first sub-channel closest to the third gap, and gradually flows through multiple first and second sub-channels, cooling other electronic components (excluding the power devices) within the power conversion device. Finally, it is discharged from the outlet. New coolant then flows in from the inlet, achieving a circulating supply of coolant to dissipate heat and cool the power conversion device.

[0026] In one optional embodiment, the power conversion device further includes one or more second heat sinks, with at least one of the plurality of first sub-channels having a second heat sink fixed therein, and each second heat sink having a plurality of second slits for coolant flow.

[0027] After the heat from some electronic components inside the power conversion device is transferred to the first plate, the heat on the first plate is transferred to the second heat sink. As the coolant flows through the multiple second gaps on the second heat sink, it can fully exchange heat with the second heat sink, absorbing a significant amount of heat from it. Furthermore, the second heat sink with multiple second gaps increases the flow resistance of the coolant. When the coolant flows through the first sub-channel equipped with the second heat sink, the second heat sink reduces the flow velocity of the coolant within that sub-channel, allowing for sufficient heat exchange between the coolant and the second heat sink within the first sub-channel, thus increasing the heat dissipation efficiency of the cold plate.

[0028] In addition, both the first plate and the second plate can be fixedly connected to the second heat sink, which improves the connection strength between the first plate and the second plate. Furthermore, the second heat sink can also support the first plate and the second plate, reducing the possibility of cold plate collapse (deformation of cooling channels) caused by pressure.

[0029] In one optional embodiment, the power conversion device further includes a circuit board and an inductor, with one or more power devices and the inductor fixed to the side of the circuit board facing the cold plate. The inductor is connected to the first plate, and in the arrangement direction of the circuit board and the cold plate, the inductor faces one or more second heat sinks.

[0030] The second heat sink is positioned so that it faces the electronic components that generate more heat, such as inductors. This increases the flow resistance of the coolant at the location of the inductor, allowing for targeted heat dissipation of inductors and other electronic components that generate more heat. This makes the heat dissipation of the cold plate more targeted and further increases the heat dissipation efficiency of the cold plate.

[0031] In one alternative embodiment, the heat-conducting element is located on the side of the first boss facing one or more power devices, and the heat-conducting element is fixedly connected to the surface of the first boss facing one or more power devices.

[0032] The above design is the first connection method between the heat-conducting component and the first boss provided in this application. The heat-conducting component is fixed to the end of the first boss facing one or more power devices, and the opening is sealed by the heat-conducting component. With this design, as long as the sum of the thickness of the heat-conducting component and the height of the first boss is sufficient to support the connection or contact between the heat-conducting component and the power device, the height of the first boss is reduced, thus reducing the processing difficulty of the cold plate.

[0033] In one optional embodiment, the heat-conducting component includes a heat-conducting plate and an annular mounting protrusion, the mounting protrusion being fixed to the surface of the heat-conducting plate away from one or more power devices; the mounting protrusion surrounds a first boss and is fixedly connected to the outer peripheral surface of the first boss, and the heat-conducting plate has an opening and is fixedly connected to one or more power devices.

[0034] The above design is the second connection method between the heat-conducting component and the first boss provided in this application. The heat-conducting component wraps around the end of the first boss to seal the opening.

[0035] In one optional embodiment, the heat-conducting element includes a heat-conducting plate and an annular mounting protrusion, the mounting protrusion being fixed to the surface of the heat-conducting plate opposite to one or more power devices; the mounting protrusion passes through an opening and is at least partially located within a cooling channel, the mounting protrusion being fixedly connected to the inner surface of a first boss, and the heat-conducting plate sealing the opening and being fixedly connected to one or more power devices.

[0036] The above design is the third connection method between the heat-conducting component and the first boss provided in this application. The heat-conducting component is inserted into the opening, and the opening is sealed by fixing the protrusion to the inner surface of the first boss.

[0037] A second aspect of this application provides a power supply device, which includes an equipment cabinet, a cooling assembly, and the aforementioned power conversion device. The power conversion device is located inside the equipment cabinet, and the cooling assembly is located inside or outside the equipment cabinet. The cooling assembly is used to drive coolant to flow between the inlet and the outlet.

[0038] The cooling assembly drives the coolant to circulate between the inlet and outlet, achieving continuous cooling of the power conversion device. The power supply equipment provided in this application includes the aforementioned power conversion device; therefore, the power supply equipment provided in this application solves the same technical problem and has the same technical effect as the power conversion device in the above-mentioned technical solution, and will not be elaborated further here. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the structure of a power supply device provided in an embodiment of this application;

[0040] Figure 2 This is a schematic diagram of another power supply device provided in an embodiment of this application;

[0041] Figure 3 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0042] Figure 4 This is a schematic diagram of a cooling assembly provided in an embodiment of this application;

[0043] Figure 5 This is a schematic diagram of another cooling component provided in an embodiment of this application;

[0044] Figure 6 This is a schematic diagram of the structure of a cold plate from one perspective, provided as an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the structure of a cold plate from another perspective, provided as an embodiment of this application;

[0046] Figure 8 A schematic diagram of an opening structure provided in an embodiment of this application;

[0047] Figure 9 This is a schematic diagram of the structure of a heat-conducting component provided in an embodiment of this application;

[0048] Figure 10 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0049] Figure 11 This is a schematic diagram of another heat-conducting component provided in an embodiment of this application;

[0050] Figure 12 This is a partially disassembled schematic diagram of a heat-conducting component provided in an embodiment of this application;

[0051] Figure 13 This is a schematic diagram of the structure of a first heat sink provided in an embodiment of this application;

[0052] Figure 14 This is a schematic diagram of the structure of a first gap provided in an embodiment of this application;

[0053] Figure 15 This is a schematic diagram of the structure of a heat-conducting surface provided in an embodiment of this application;

[0054] Figure 16 This is a schematic diagram of a flow equalization structure provided in an embodiment of this application;

[0055] Figure 17 This is a schematic diagram of the structure of a flow equalization plate provided in an embodiment of this application;

[0056] Figure 18 This is a schematic diagram of a cooling channel provided in an embodiment of this application;

[0057] Figure 19 A diagram illustrating a method for distinguishing between a first sub-channel and a second sub-channel, provided for embodiments of this application;

[0058] Figure 20 This is a schematic diagram of the structure of a second heat sink provided in an embodiment of this application;

[0059] Figure 21 This is a schematic diagram of the structure of an inductor provided in an embodiment of this application.

[0060] Figure label:

[0061] 100-Power supply equipment; 10-Equipment cabinet; 20-AC power distribution device; 30-DC power distribution device; 40-Power conversion device; 50-Charging gun; 60-First cable; 70-Second cable; 80-Terminal cabinet; 90-Cooling assembly; 901-Driver; 902-Heat exchanger; 9021-First heat exchange channel; 9022-Second heat exchange channel; 903-Fan; 904-Liquid storage tank; 1-Cold plate; 11-Cooling channel; 111-First sub-channel; 112-Second sub-channel; 113-Third sub-channel; 12-Liquid inlet; 13-Liquid outlet; 14-First plate; 141-First boss; 1410-Opening 1411-First sidewall; 1412-Second sidewall; 15-Second plate; 151-Second boss; 1511-Third sidewall; 1512-Fourth sidewall; 161-First gap; 162-Second gap; 163-Third gap; 17-Connector pipe; 2-Heat-conducting component; 21-Heat-conducting plate; 22-Mounting protrusion; 23-Heat-conducting surface; 3-Device housing; 4-Circuit board; 51-Power device; 52-Inductor; 6-First heat sink; 61-First gap; 611-Part; 7-Flow choke; 8-Flow equalization structure; 81-Flow equalization plate; 82-Fixing plate; 9-Second heat sink; 91-Second gap; 200-Cold source. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0063] In this application, unless otherwise expressly specified and limited, the terms "upper", "lower", "front", "back", "left", "right", etc., indicating orientation or positional relationship may be defined relative to the orientation of the components schematically placed in the accompanying drawings. These directional terms may be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings. They should not be construed as limitations on this application.

[0064] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0065] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0066] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0067] The X-axis, Y-axis, and Z-axis are three mutually perpendicular axes in a spatial rectangular coordinate system.

[0068] In the accompanying drawings of the embodiments of this application, solid structures such as components and assemblies are represented by guide lines; structures composed of multiple components are represented by guide lines with parentheses or solid arrows; and hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with hollow arrows.

[0069] This application provides a power supply device 100, Figure 1 An exemplary structure of a power supply device 100 is shown, with reference to Figure 1 The power supply equipment 100 is an integrated charging pile, which includes an equipment cabinet 10, an AC power distribution device 20, a DC power distribution device 30, and multiple power conversion devices 40. The AC power distribution device 20, the DC power distribution device 30, and the multiple power conversion devices 40 are all installed inside the equipment cabinet 10.

[0070] The input terminal of the AC power distribution device 20 is used to connect to a power source, which can be the power grid. The output terminal of the AC power distribution device 20 is connected to the input terminals of multiple power conversion devices 40, and the AC power distribution device 20 is used to control the on / off state of the circuit between the power source and the multiple power conversion devices 40. In one embodiment, some of the power conversion devices 40 are used to convert AC to DC, and some of the power conversion devices 40 are used for boosting or bucking voltage; in another embodiment, each power conversion device 40 is used to convert AC to DC. The output terminals of the multiple power conversion devices 40 are connected to the input terminal of the DC power distribution device 30.

[0071] In addition, refer to Figure 1 The power supply device 100 also includes at least one or more charging guns 50 and at least one or more first cables 60, in Figure 1In the illustrated embodiment, two charging guns 50 and two first cables 60 are provided. The charging guns 50 are located outside the equipment cabinet 10 and are used to connect to the device to be charged (e.g., an electric vehicle). The charging guns 50 are connected to the DC power distribution device 30 via corresponding first cables 60. The DC power distribution device 30 controls the on / off state of the circuit between the multiple power conversion devices 40 and the first cables 60. When the DC power distribution device 30 conducts the circuit between the first cables 60 and the multiple power conversion devices 40, the charging guns 50 can output the current after power conversion by the multiple power conversion devices 40.

[0072] In another embodiment, when the power supply device 100 is an integrated charging pile, the power supply device 100 is provided with a charging gun 50 and a first cable 60.

[0073] Figure 2 An exemplary diagram shows the structure of another power supply device 100, with reference to Figure 2 The power supply equipment 100 is a split-type charging pile, comprising a main unit and multiple terminal units. The main unit of the power supply equipment 100 includes an equipment cabinet 10, an AC power distribution device 20, a DC power distribution device 30 (also referred to as a power allocation device), and multiple power conversion devices 40, all installed within the equipment cabinet 10. The input terminal of the AC power distribution device 20 is used to connect to a power source (e.g., the power grid). Each power conversion device 40 performs power conversion. The DC power distribution device 30 is connected to the terminal units of the power supply equipment 100 via multiple second cables 70 to distribute the DC power output from the multiple power conversion devices 40 to one or more terminal units.

[0074] Reference Figure 2 Each terminal section of the power supply equipment 100 includes a terminal cabinet 80, a charging gun 50, and a first cable 60, wherein a portion of a second cable 70 extends into the terminal cabinet 80. Figure 2 In the illustrated embodiment, each terminal section has two charging guns 50 and two first cables 60. Each charging gun 50 is connected to the terminal cabinet 80 via the corresponding first cable 60. When the circuit between the first cable 60 and the second cable 70 is connected, the charging gun 50 can output the current after power conversion by multiple power conversion devices 40.

[0075] In another embodiment, a charging gun 50 and a first cable 60 are provided in each terminal section of the power supply device 100.

[0076] In another embodiment, the power supply device 100 is a power cabinet, for example, an uninterruptible power supply (UPS).

[0077] Among them, several power conversion devices 40 generate significant heat during operation, therefore cooling of the power conversion devices 40 is necessary, referring to... Figure 1 and Figure 2 The power supply equipment 100 also includes a cooling assembly 90, which is disposed at any suitable location within the equipment cabinet 10. In another embodiment, the cooling assembly 90 is disposed outside the equipment cabinet 10. The cooling assembly 90 is used to cool the plurality of power conversion devices 40. Figure 3 An exemplary structure of a power conversion device 40 is shown, with reference to Figure 3 The power conversion device 40 includes a cold plate 1, which has a cooling channel 11 for coolant flow. Figure 3 The cooling channel 11 is shielded by the outer shell of the cold plate 1. The cold plate 1 has an inlet 12 and an outlet 13 that communicate with the cooling channel 11. The cooling assembly 90 can drive the coolant to flow between the inlet 12 and the outlet 13.

[0078] Figure 4 An exemplary structure of a cooling assembly 90 is shown, with reference to Figure 4 The cooling component 90 can cool the coolant and drive the coolant to flow between the inlet 12 and the outlet 13 to cool the power conversion device 40. Among these, in Figure 4 In the illustrated embodiment, the cooling assembly 90 includes a drive 901 (e.g., a liquid pump) and a heat exchanger 902 (e.g., a plate heat exchanger). The internal channels of the heat exchanger 902 include a first heat exchange channel 9021 and a second heat exchange channel 9022. The liquid inlet 12 and liquid outlet 13 of each cold plate 1 are connected to the first heat exchange channel 9021 of the heat exchanger 902, and the second heat exchange channel 9022 of the heat exchanger 902 is connected to the cold source 200.

[0079] Reference Figure 4 The drive unit 901 drives the coolant to flow. The coolant enters the cooling channel 11 of the cold plate 1 from the inlet 12 and absorbs the heat inside the power conversion device 40. After absorbing the heat, the coolant flows out from the outlet 13 and enters the heat exchanger 902 to exchange heat with the cold source 200. After the heat exchange, the temperature of the coolant decreases and it returns to the cooling channel 11 to continue cooling the power conversion device 40. This cycle repeats to achieve cyclic cooling of the power conversion device 40.

[0080] In one embodiment, the cold source 200 is disposed inside the equipment cabinet 10. In another embodiment, the cold source 200 is disposed outside the equipment cabinet 10.

[0081] In one embodiment, the cold source 200 includes a compressor, a condenser (or a cooling tower), a throttling valve, etc. These components are connected sequentially by pipes to form a closed system in which the refrigerant circulates. The liquid refrigerant absorbs heat from the coolant in the heat exchanger 902, vaporizing into a low-temperature, low-pressure gaseous refrigerant. This gaseous refrigerant is then drawn into the compressor, compressed into a high-pressure, high-temperature gaseous refrigerant, and discharged into the condenser. In the condenser, the gaseous refrigerant releases heat, condensing into a high-pressure liquid refrigerant. This liquid is then throttled by the throttling valve to become a low-pressure, low-temperature refrigerant, which re-enters the heat exchanger 902 to absorb heat and vaporize, achieving the purpose of cyclic refrigeration. In another embodiment, the cold source 200 can also be other suitable structures to exchange heat with the coolant in the heat exchanger 902.

[0082] Figure 5 An exemplary diagram shows the structure of another cooling component 90, with reference to Figure 5 The cooling assembly 90 includes a drive unit 901 (e.g., a liquid pump) and a heat exchanger 902 (e.g., a plate heat exchanger). The inlet 12 and outlet 13 of each cold plate 1 are connected to the internal channels of the heat exchanger 902. In this embodiment, the heat exchanger 902 exchanges heat with air. For example, the cooling assembly 90 also includes a fan 903, which blows air towards the heat exchanger 902, or draws air from outside the equipment cabinet 10 into the equipment cabinet 10 and passes it through the heat exchanger 902. The drive unit 901 drives the coolant to flow. The coolant enters the cooling channel 11 of the cold plate 1 through the inlet 12 and absorbs heat from inside the power conversion device 40. After absorbing heat, the coolant flows out from the outlet 13 and enters the heat exchanger 902 to exchange heat with the air. The temperature of the coolant decreases after heat exchange and it returns to the cooling channel 11 of the cold plate 1 to continue cooling the power conversion device 40, in a continuous cycle.

[0083] In order to further improve heat exchange efficiency, refer to Figure 5 Multiple heat exchangers 902 can be provided, and the internal channels of each heat exchanger 902 are connected to all liquid inlets 12 and all liquid outlets 13, so that multiple heat exchangers 902 are arranged in parallel.

[0084] exist Figure 4 and Figure 5 In the illustrated embodiment, multiple drive elements 901 are provided, and these drive elements 901 are arranged in parallel, with each drive element 901 capable of driving the flow of coolant. This design ensures that if one drive element 901 fails, the others will continue to operate, reducing the likelihood of the cooling assembly 90 stopping operation due to the failure of an individual drive element 901. In another embodiment, the cooling assembly 90 may also have only one drive element 901.

[0085] In addition, Figure 4 and Figure 5 In the illustrated embodiment, the cooling assembly 90 further includes a reservoir 904 for storing coolant, the reservoir 904 being connected to the drive 901 and the heat exchanger 902.

[0086] The cooling assembly 90 can be connected to the liquid inlet 12 and liquid outlet 13 of each cold plate 1 in any suitable manner. For example, the cooling assembly 90 can be connected to the liquid inlet 12 and liquid outlet 13 of each cold plate 1 through a cooling pipe. The cooling pipe may include a main pipe and multiple branch pipes, so that the cold plates 1 of the multiple power conversion devices 40 are connected in parallel or in series.

[0087] in, Figure 6 An exemplary view of the structure of a cold plate 1 is shown. Figure 7 An exemplary view of the structure of a cold plate 1 is shown from another perspective, with reference to... Figure 6 and Figure 7 The cold plate 1 also has a first boss 141, which is a boss structure on the cold plate 1. The first boss 141 has an opening 1410 at its end in the protrusion direction. Figure 8 An exemplary structure of opening 1410 is shown, with reference to Figure 8 The opening 1410 is connected to the cooling channel 11.

[0088] In addition, the power conversion device 40 also includes a heat-conducting component 2. Figure 9 An exemplary structure of a heat-conducting component 2 is shown, with reference to Figure 9 The heat-conducting component 2 is fixed to the cold plate 1 and seals the opening 1410. The power conversion device 40 also includes a device housing 3, a circuit board 4, and at least one (or more) power devices 51. Each power device 51 is fixed to the circuit board 4, and the circuit board 4 and the power devices 51 are installed inside the device housing 3. Furthermore, the cold plate 1 is also installed on the device housing 3. The power conversion device 40 can convert the electrical energy input from the power source through the power devices 51 and then output it to charge the device to be charged. The power devices 51 are one of the main heat sources inside the power conversion device 40, and the heat dissipation of the power devices 51 is gradually becoming a bottleneck restricting the development of the power supply equipment 100 towards higher power density. Therefore, it is necessary to specifically dissipate heat from the power devices 51 through the heat-conducting component 2 and the first protrusion 141 on the cold plate 1 to control the temperature of the power devices 51.

[0089] After the cold plate 1 is installed, it is positioned on one side of all power devices 51. The first boss 141 on the cold plate 1 protrudes towards the side where the power devices 51 are located, and the opening 1410 on the first boss 141 faces one or more power devices 51. The heat-conducting component 2 is installed at the opening 1410 of the first boss 141. The heat-conducting component 2 is supported by the first boss 141, so that the heat-conducting component 2 at the opening 1410 can be close to the power device 51 to be connected.

[0090] Reference Figure 9 The heat-conducting element 2 is used to connect (e.g., via bolt connection) or contact one or more power devices 51 facing the opening 1410. For example, if the power conversion device 40 further includes a single power device 51, the heat-conducting element 2 is used to connect that power device 51; or, if the power conversion device 40 further includes multiple power devices 51, the heat-conducting element 2 is used to connect one or more power devices 51. Furthermore, when the heat-conducting element 2 connects multiple power devices 51, it can connect all or only a portion of the power devices 51. In another embodiment, multiple heat-conducting elements 2 are provided, each heat-conducting element 2 being used to connect or contact one or more power devices 51. Through the connection between the heat-conducting element 2 and the power device 51, heat from the power device 51 can be transferred to the heat-conducting element 2, and the heat on the heat-conducting element 2 is then transferred to the coolant. The flowing coolant continuously carries away the heat from the heat-conducting element 2, thereby cooling the power device 51.

[0091] In other words, by adopting the solution of this application, it is not necessary to stretch a complete convex hull (the convex hull can be understood as the first boss 141 without the opening 1410) on the cold plate 1. By splitting the complete convex hull into the first boss 141 and the heat-conducting component 2, the processing difficulty of the cold plate 1 is reduced, which facilitates the production and manufacturing of the cold plate 1. Furthermore, by processing the first boss 141 on the cold plate 1 and then sealing the opening 1410 of the first boss 141 with the heat-conducting component 2, compared with directly processing a complete convex hull on the cold plate 1, the combined structure of the first boss 141 and the heat-conducting component 2 in this application has a greater thickness, which reduces the risk of the first boss 141 breaking and thus reduces the possibility of damage to the cold plate 1.

[0092] The heat-conducting component 2 can be mounted on the first boss 141 in any suitable manner, for example, in Figure 9In the illustrated embodiment, the heat-conducting element 2 includes a heat-conducting plate 21 and an annular mounting protrusion 22. The mounting protrusion 22 is fixed to the surface of the heat-conducting plate 21 facing away from the power device 51. For example, the heat-conducting plate 21 and the mounting protrusion 22 are integrally connected. The mounting protrusion 22 passes through the opening 1410 and is at least partially located within the cooling channel 11. For example, both the mounting protrusion 22 and the heat-conducting plate 21 are located within the cooling channel 11. The outer peripheral surface of the mounting protrusion 22 is fixedly connected to the inner surface of the first boss 141. The heat-conducting plate 21 seals the opening 1410 and is fixedly connected to one or more power devices 51. That is, the heat-conducting element 2 is inserted into the opening 1410, and the opening 1410 is sealed through the fixed connection between the mounting protrusion 22 and the inner surface of the first boss 141.

[0093] Figure 10 An exemplary diagram shows the structure of another heat-conducting component 2, with reference to Figure 10 The heat-conducting component 2 also includes a heat-conducting plate 21 and a mounting protrusion 22, the mounting protrusion 22 being fixed to the surface of the heat-conducting plate 21 facing away from the power device 51. Figure 9 The illustrated embodiment differs in that the mounting protrusion 22 surrounds the first protrusion 141 and is fixedly connected to the outer peripheral surface of the first protrusion 141. The heat-conducting plate 21 covers the opening 1410 and is fixedly connected to one or more power devices 51. The opening 1410 is sealed by wrapping the end of the first protrusion 141 with the heat-conducting element 2.

[0094] Figure 11 An exemplary embodiment shows the structure of another heat-conducting element 2, which is similar to... Figure 9 and Figure 10 The illustrated embodiment differs from the one shown, except that reference is made to... Figure 11 The heat-conducting component 2 is plate-shaped and located on the side of the first protrusion 141 facing one or more power devices 51. The heat-conducting component 2 is fixedly connected to the surface of the first protrusion 141 facing the power device 51. The heat-conducting component 2 covers an opening 1410 and is fixedly connected to one or more power devices 51. Specifically, by fixing the heat-conducting component 2 to the end of the first protrusion 141 facing the power device 51 and sealing the opening 1410, this design ensures that the sum of the thickness of the heat-conducting component 2 and the height of the first protrusion 141 is sufficient to support the connection between the heat-conducting component 2 and the power device 51. This reduces the height of the first protrusion 141 and decreases the processing difficulty of the cold plate 1.

[0095] If the heat-conducting component 2 and the first boss 141 are connected by welding (e.g., brazing), and the welding surfaces of the heat-conducting component 2 and the first boss 141 are in full contact, and ultrasonic testing is performed using a phased array probe after welding, it is easy to detect the weld strength between the heat-conducting component 2 and the first boss 141. By monitoring, the possibility of cold plate 1 sealing failure can be reduced, and the long-term reliability of product application can be improved.

[0096] The cold plate 1 can be any suitable structure; in one embodiment, Figure 12 An exemplary partial split structure of a cold plate 1 is shown, with reference to Figure 11 and Figure 12 The cold plate 1 includes a first plate 14 and a second plate 15 fixedly connected (e.g., welded). The first plate 14 is located on the side of the second plate 15 facing all power devices 51. A cooling channel 11 is located between the first plate 14 and the second plate 15. It is understood that the cooling channel 11 is formed between the first plate 14 and the second plate 15 by fixing the first plate 14 and the second plate 15 together. The first plate 14 and the second plate 15 can be any suitable structure. For example, both the first plate 14 and the second plate 15 can be machined from sheet metal to reduce the weight of the cold plate 1.

[0097] The first plate 14 has the aforementioned first boss 141, and the second plate 15 has a second boss 151. A portion of the second boss 151 is located within the first boss 141. That is, after the first plate 14 and the second plate 15 are fixedly connected, a portion of the second boss 151 extends into the first boss 141, reducing the gap between the first boss 141 and the second boss 151. This reduces the amount of coolant required to fill the cooling channel 11 and also facilitates the circulation of the coolant. To enable the coolant to flow through the heat-conducting component 2 and carry away its heat, the cooling channel 11 includes a first gap 161 between the heat-conducting component 2 and the second boss 151. That is, the first gap 161 is a part of the cooling channel 11, allowing the coolant to flow normally between the heat-conducting component 2 and the second boss 151. This facilitates heat exchange between the coolant and the heat-conducting component 2, achieving effective cooling of the power device 51.

[0098] In one embodiment, return Figures 9 to 11In either case, the cold plate 1 and the power device 51 are arranged along a first direction (parallel to the X-axis). The first boss 141 includes a first sidewall 1411 and a second sidewall 1412 arranged along a second direction (parallel to the Z-axis). The second boss 151 includes a third sidewall 1511 and a fourth sidewall 1512 arranged along the second direction, which is perpendicular to the first direction. In addition to the first gap 161, the cooling channel 11 also includes a second gap 162 located between the first sidewall 1411 and the third sidewall 1511, and a third gap 163 located between the second sidewall 1412 and the fourth sidewall 1512. The second gap 162 and the third gap 163 are arranged along the second direction and are both connected to the first gap 161. The coolant entering through inlet 12 flows into the first gap 161 through either the second gap 162 or the third gap 163. The coolant in the first gap 161 exchanges heat with the heat-conducting element 2, carrying away heat from the power device 51, before flowing into the other of the second and third gaps 162 and finally exiting through outlet 13. The interconnected first gap 161, second gap 162, and third gap 163 facilitate the flow of coolant between the first boss 141 and the second boss 151, effectively dissipating heat from the power device 51.

[0099] In one embodiment, the power conversion device 40 further includes a first heat sink 6. Figure 13 An exemplary structure of a first heat sink 6 is shown. The first heat sink 6 is fixed to the surface of the heat conductor 2 away from the connected power device 51. For example, the first heat sink 6 is integrally connected to the heat conductor 2, and heat from the power device 51 on the heat conductor 2 is transferred to the first heat sink 6. Furthermore, the first heat sink 6 is disposed within a first gap 161 and has multiple first slits 61 for coolant flow, allowing coolant to flow between the first gap 161, the second gap 162, and the third gap 163, thereby reducing the impact of the first heat sink 6 on coolant flow. Figure 14 An exemplary structure of a first gap 61 is shown, through which coolant can flow to the first heat sink 6, thereby achieving sufficient contact and heat exchange with the first heat sink 6 and absorbing more heat from the first heat sink 6. Furthermore, the first heat sink 6 with multiple first gaps 61 increases the flow resistance of the coolant, reduces the flow velocity of the coolant at the first gaps 161, and allows the coolant to fully exchange heat with the first heat sink 6 and the heat conductor 2 within the first gaps 161, thus increasing the heat dissipation efficiency of the cold plate 1.

[0100] The first heat sink 6 can be any suitable structure; in one embodiment, refer to... Figure 13 and Figure 14The first heat sink 6 includes a plurality of columnar teeth (e.g., cylindrical or prismatic), arranged in a matrix, with a first gap 61 between each adjacent columnar tooth, allowing coolant to flow through the plurality of first gaps 61 formed by the columnar teeth. In another embodiment, the first heat sink 6 includes a plurality of fins arranged along a third direction (parallel to the Y-axis), with a first direction and a second direction both perpendicular to the third direction, and a first gap 61 between each adjacent fin, allowing coolant to flow through the plurality of first gaps 61 formed by the fins.

[0101] To further improve the heat dissipation capability of the cold plate 1 for the power device 51, refer to Figure 13 The end of the first heat sink 6 facing away from the heat conductor 2 is connected (e.g., welded) or in contact with the second boss 151. It should be noted that as long as a portion of the end of the first heat sink 6 facing away from the heat conductor 2 is connected or in contact with the second boss 151, it is considered that the end of the first heat sink 6 facing away from the heat conductor 2 is connected or in contact with the second boss 151. This design reduces the likelihood of coolant flowing between the first heat sink 6 and the second boss 151, allowing more coolant to flow into the multiple first gaps 61, further improving the heat exchange efficiency between the coolant and the first heat sink 6, and further reducing the flow rate of coolant through the first gaps 161, which is beneficial for the cold plate 1 to dissipate heat from the power device 51.

[0102] In one embodiment, reference is made to... Figure 14 The first heat sink 6 includes multiple portions 611. For example, if the first heat sink 6 includes multiple columnar teeth, each portion 611 includes a portion of all columnar teeth; or, if the first heat sink 6 includes multiple fins, each portion 611 includes a portion of all fins. Each portion 611 includes one or more first slots 61. For example, each portion 611 includes multiple first slots 61, or, for example, each portion 611 includes only one first slot 61.

[0103] Furthermore, multiple power devices 51 are provided, and the heat-conducting plate 21 is fixedly connected to the multiple power devices 51. The multiple power devices 51 are arranged in a one-to-one correspondence with multiple parts 611 of the first heat sink 6. That is, each power device 51 and its corresponding part 611 are located on different sides of the heat-conducting plate 21 in the first direction (parallel to the X-axis).

[0104] Reference Figure 14 and Figure 15The power conversion device 40 also includes one or more flow-blocking elements 7 (plate-like structure or protrusion structure). Each flow-blocking element 7 is fixed to the surface of the heat-conducting element 2 away from the connected power device 51, such that each flow-blocking element 7 is located within the first gap 161. Furthermore, the end of each flow-blocking element 7 away from the heat-conducting element 2 is connected (e.g., welded) or in contact with the second protrusion 151, so that the flow-blocking element 7 can block the flow of coolant. The presence of a flow-blocking element 7 between two adjacent power devices 51 reduces the likelihood of coolant flowing between two adjacent portions 611 of the first heat sink 6, allowing more coolant to flow through the first gap 61 of each portion 611, further improving the heat exchange efficiency between the coolant and the first heat sink 6. Each part 611 of the first heat sink 6 is correspondingly set to a power device 51. Through the multiple parts 611 of the first heat sink 6, the flow rate of the coolant when it flows through the area where each power device 51 is located is reduced, so as to fully absorb the heat of the cooling component 90 and specifically dissipate heat from the power device 51, thereby making the heat dissipation efficiency of the cold plate 1 higher.

[0105] Furthermore, setting the heat-conducting component 2 and the first boss 141 as two independent structures also facilitates the processing of the first heat dissipation component 6 on the heat-conducting component 2, reducing production difficulty and cost.

[0106] Multiple power devices 51 can be arranged in any suitable orientation, for example, referring to Figure 15 Multiple power devices 51 are arranged along a third direction (parallel to the Y-axis); for example, the power devices 51 can also be arranged along a second direction. Taking the arrangement of multiple power devices 51 along a third direction as an example, in one embodiment, the power conversion device 40 also includes multiple flow-equalizing structures 8, which enable the coolant to be distributed more evenly in the third direction. Figure 16 An exemplary flow-sharing structure 8 is shown, in Figure 16 In the illustrated embodiment, both the second gap 162 and the third gap 163 are provided with a plurality of flow equalization structures 8 arranged along a third direction. In another embodiment, the second gap 162 or the third gap 163 is provided with a plurality of flow equalization structures 8 arranged along a third direction. For example, if coolant from the inlet 12 flows from the second gap 162 into the first gap 161, then a plurality of flow equalization structures 8 arranged along a third direction can be provided in the second gap 162; as another example, if coolant from the inlet 12 flows from the third gap 163 into the first gap 161, then a plurality of flow equalization structures 8 arranged along a third direction can be provided in the third gap 163.

[0107] Each flow equalization structure 8 includes multiple flow equalization plates 81 arranged along a first direction (parallel to the X-axis). Figure 17 An exemplary structure of a flow equalizer 81 is shown, wherein, with reference to Figure 16 and Figure 17 Each flow equalizer 81 has a surface facing away from the second plate 15, and the coolant can flow in a third direction (parallel to the Y-axis) under the guidance of the surface of the flow equalizer 81 facing away from the second plate 15. Figure 17 The multiple flow equalization plates 81 within the dashed box form a flow equalization structure 8. Figure 17 It can be seen quite intuitively that multiple flow-equalizing structures 8 are arranged along the third direction.

[0108] With multiple power devices 51 arranged along a third direction, the space between two adjacent flow-equalizing structures 8 allows coolant to flow, enabling the coolant in the second gap 162 or the third gap 163 to flow into the first gap 161, thus dissipating heat from the multiple power devices 51. Under the action of multiple flow-equalizing structures, the coolant is distributed more evenly in the third direction. For example, with multiple flow-equalizing structures 8 in the second gap 162, after the coolant from the inlet 12 flows into the second gap 162, a portion of the coolant will flow along the third direction, resulting in a more even distribution of coolant in the second gap 162. Similarly, after the coolant in the second gap 162 flows into the first gap 161, it also contributes to a more even distribution of coolant in the first gap 161 in the third direction. This facilitates uniform heat dissipation from the cold plate 1 to the multiple power devices 51, reducing the possibility of any single power device 51 overheating.

[0109] Reference Figure 16 and Figure 17 Multiple flow equalization structures 8 are provided within the second gap 162. After the coolant from the inlet 12 flows into the second gap 162, a portion of the coolant flows in the third direction, resulting in a relatively uniform distribution of coolant within the second gap 162 in the third direction. The space between adjacent flow equalization structures 8 also allows for coolant flow, enabling the coolant in the second gap 162 to flow into the first gap 161 for heat dissipation of multiple power devices 51. After the coolant flows into the third gap 163, the multiple flow equalization structures 8 within the third gap 163 ensure a uniform distribution of coolant in the third direction, facilitating the flow of coolant from the third gap 163 into other parts of the cooling channel 11. For example, refer to... Figure 16 The cooling channel 11 also includes a first sub-channel 111 that is closest to the third gap 163. A portion of the first sub-channel 111 is located below the third gap 163. If the coolant in the third gap 163 is evenly distributed in the third direction, the coolant entering the first sub-channel 111 can also be evenly distributed in the third direction, which is beneficial for the coolant to dissipate heat for other electronic components in the power device 51.

[0110] exist Figure 17In the illustrated embodiment, the power conversion device 40 further includes multiple fixing plates 82, and multiple current sharing structures 8 are fixed together by the multiple fixing plates 82, for example... Figure 17 The structure shown is achieved by... Figure 17 The structure shown is installed in the second gap 162 or the third gap 163, which enables the rapid installation of multiple flow equalization structures 8.

[0111] In another embodiment, only one flow equalization structure 8 is provided in the second gap 162 or the third gap 163, and each flow equalization piece 81 of the flow equalization structure 8 extends in the third direction.

[0112] The shape of the cooling channel 11 can be designed as needed. In one embodiment provided in this application, the cooling channel 11 further includes a plurality of first sub-channels 111 and a plurality of second sub-channels 112. Figure 18 An exemplary structure of a cooling channel 11 is shown, with reference to Figure 18 Multiple first sub-channels 111 are arranged along a second direction (parallel to the Z-axis), and each first sub-channel 111 extends along a third direction (parallel to the Y-axis). Each second sub-channel 112 connects two adjacent first sub-channels 111. The two second sub-channels 112 connected to the same first sub-channel 111 are located at different ends of the first sub-channel 111 in the third direction. That is, the multiple first sub-channels 111 and the multiple second sub-channels 112 form a serpentine channel, which is part of the cooling channel 11. The serpentine shape of part of the cooling channel 11 allows the coolant to flow through more areas of the cold plate 1, cooling more electronic components within the power conversion device 40 and improving the heat dissipation effect of the power conversion device 40.

[0113] in, Figure 19 An exemplary diagram illustrating the distinction between a first sub-channel 111 and a second sub-channel 112 is shown, with reference to... Figure 19 The portion of cooling channel 11 between dashed lines L1 and L2 is a first sub-channel 111 extending in a third direction (the first sub-channel 111 furthest from the third gap 163). The portion of cooling channel 11 between dashed lines L3 and L4 is also a first sub-channel 111 extending in a third direction. The portion of cooling channel 11 between dashed lines L5 and L6 is also a first sub-channel 111 extending in a third direction (the first sub-channel 111 closest to the third gap 163). The portion of cooling channel 11 between dashed lines L2 and L3 (and used to connect two adjacent first sub-channels 111) is a second sub-channel 112. The other first sub-channels 111 and second sub-channels 112 of cooling channel 11 are also determined in this way, and will not be elaborated here.

[0114] Reference Figure 18 and Figure 19 and assist in combination Figure 16 The second gap 162, the third gap 163, and the plurality of first sub-channels 111 are arranged sequentially along the second direction (parallel to the Z-axis). That is, the second gap 162 and the third gap 163 are both located on the same side of the plurality of first sub-channels 111 in the second direction, and the second gap 162 is located on the side of the third gap 163 away from the plurality of first sub-channels 111. The third gap 163 is connected to the first sub-channel 111 closest to the third gap 163, so that coolant can flow from the third gap 163 into the first sub-channel 111 closest to the third gap 163, or coolant can flow from the first sub-channel 111 closest to the third gap 163 into the third gap 163.

[0115] Among them, reference Figure 18 and Figure 19 One of the inlet 12 and the outlet 13 is connected to the second gap 162, and the other is connected to the first sub-channel 111, which is furthest from the third gap 163. For example, the inlet 12 is connected to the second gap 162, and the outlet 13 is connected to the first sub-channel 111, which is furthest from the third gap 163; or, for another example, the outlet 13 is connected to the second gap 162, and the inlet 12 is connected to the first sub-channel 111, which is furthest from the third gap 163.

[0116] Taking the example of inlet 12 connecting to the second gap 162 and outlet 13 connecting to the first sub-channel 111 furthest from the third gap 163, refer to... Figure 18 and Figure 19 In one embodiment, the cooling channel 11 further includes a third sub-channel 113, which connects to the first sub-channel 111 furthest from the third gap 163, and also connects to the liquid outlet 13. That is, the liquid outlet 13 connects to the first sub-channel 111 furthest from the third gap 163 via the third sub-channel 113. In another embodiment, the liquid outlet 13 directly connects to the first sub-channel 111 furthest from the third gap 163 (there are no other channel structures between them). Furthermore, in one embodiment, the cold plate 1 also includes a transfer pipe 17. (Refer to previous section) Figure 6 and Figure 16 The adapter pipe 17 connects to the second gap 162, and the adapter pipe 17 also connects to the liquid inlet 12, that is, the liquid inlet 12 connects to the second gap 162 through the adapter pipe 17. In another embodiment, the cooling channel 11 further includes a fourth sub-channel, through which the liquid inlet 12 connects to the second gap 162. In another embodiment, the liquid inlet 12 is directly connected to the second gap 162 (there are no other channel structures between them).

[0117] With the above design, the coolant flowing in from the inlet 12 flows into the second gap 162 through the adapter 17. The coolant flowing into the second gap 162 then flows into the first gap 161 to exchange heat with the heat-conducting component 2, thereby cooling the power device 51. Afterward, the coolant flows into the third gap 163. Then, the coolant flows from the third gap 163 into the first sub-channel 111 closest to the third gap 163, and gradually flows through multiple first sub-channels 111 and multiple second sub-channels 112, cooling multiple electronic components (other than the power device 51) in the power conversion device 40, and then is discharged from the outlet 13. New coolant then flows in from the inlet 12 again, realizing the circulation supply of coolant, thereby dissipating heat and cooling the power conversion device 40.

[0118] In one embodiment, after multiple power conversion devices 40 are installed, the second direction (parallel to the Z-axis) can be parallel to the vertical direction (or, the direction of gravity), thereby reducing the amount of copper busbars (used to connect the power conversion devices 40 and other devices) used in the equipment cabinet 10. This is because serpentine pathways are prone to errors at corners (e.g., Figure 18 Bubbles accumulate in the area where the dotted circle is located. The outlet 13 is positioned above the inlet 12. Due to the characteristic that bubbles rise to the surface, the bubbles in the coolant will rise to the top layer, for example, the first sub-channel 111 furthest from the third gap 163, and then be discharged from the outlet 13. Furthermore, to reduce bubble accumulation, no space is designed within the cooling channel 11 to trap bubbles; for example, the corner between the first sub-channel 111 and the second sub-channel 112 is smoothly transitioned. Figure 18 The area where the dotted coil is located is more conducive to the flow of air bubbles in the coolant to the top layer of the cooling channel 11. Furthermore, electronic components with lower heat can be placed at the corners of the cooling channel 11, reducing the impact of air bubbles on the heat dissipation of electronic components.

[0119] In one embodiment, the power conversion device 40 further includes one or more second heat sinks 9. Figure 20 An exemplary structure of a second heat sink 9 is shown, with reference to Figure 20 A second heat sink 9 is fixed within one or more first sub-channels 111, for example, in Figure 20 In the illustrated embodiment, a second heat sink 9 is fixed within each of two or more first sub-channels 111. Furthermore, each second heat sink 9 has multiple second slits 91 for coolant flow. The second heat sink 9 can be any suitable structure, such as a heat sink fin, a corrugated plate, or, for example, a second heat sink 9 comprising multiple columnar teeth, as long as multiple second slits 91 for coolant flow are formed on the second heat sink 9.

[0120] The second heat sink 9 can also be a complete structure, for example... Figure 20 The second heat sink 9(A) can also be a structure composed of multiple parts, for example... Figure 20 The second heat sink 9(B) and the second heat sink 9(C) each include two parts.

[0121] In one embodiment, the second heat sink 9 may be fixedly connected to either the first plate 14 or the second plate 15 (e.g., by welding). In another embodiment, the second heat sink 9 is fixedly connected to both the first plate 14 and the second plate 15, thereby increasing the connection strength between the first plate 14 and the second plate 15.

[0122] Because the first plate 14 is closer to the electronic components inside the power conversion device 40, the heat from some electronic components inside the power conversion device 40 is transferred to the first plate 14, and then the heat on the first plate 14 is transferred to the second heat sink 9. After the coolant flows through the multiple second gaps 91 on the second heat sink 9, it can fully exchange heat with the second heat sink 9 and absorb more heat from the second heat sink 9. In addition, the second heat sink 9 with multiple second gaps 91 can increase the flow resistance of the coolant. When the coolant flows through the first sub-channel 111 where the second heat sink 9 is provided, the second heat sink 9 reduces the flow rate of the coolant in the first sub-channel 111, so that the coolant can fully exchange heat with the second heat sink 9 in the first sub-channel 111, thereby increasing the heat dissipation efficiency of the cold plate 1.

[0123] In addition, the second heat sink 9 can also support the first plate 14 and the second plate 15, reducing the possibility of the cold plate 1 collapsing (cooling channel 11 deforming) due to pressure.

[0124] In one embodiment, in the arrangement direction of the circuit board 4 and the cold plate 1 (first direction), the second heat sink 9 is oriented towards the electronic components that generate more heat. For example, the power conversion device 40 also includes an inductor 52. Figure 21 An exemplary structure of an inductor 52 is shown, with reference to Figure 21 The inductor 52 and each power device 51 are fixed to the side of the circuit board 4 facing the cold plate 1, and the inductor 52 is connected to the first plate 14 of the cold plate 1, for example, by thermally conductive adhesive. Furthermore, in the arrangement direction of the circuit board 4 and the power devices 51, the inductor 52 faces a second heat sink 9. This increases the flow resistance of the coolant at the location of the inductor 52, allowing for targeted heat dissipation of electronic components such as the inductor 52 that generate significant heat, making the heat dissipation of the cold plate 1 more targeted and further increasing the heat dissipation efficiency of the cold plate 1.

[0125] Furthermore, the area where the first plate 14 and the second plate 15 are connected (e.g., the welding area) can be any area other than the cooling channel 11, for example, refer to [reference]. Figure 20 The first plate 14 and the second plate 15 are fixedly connected to each other in the area surrounding the cooling channel 11. In one embodiment, to further enhance the stability of the connection between the first plate 14 and the second plate 15, the area where the first plate 14 and the second plate 15 are connected may be surrounded by the cooling channel 11, for example, referring back to the reference. Figure 18 The first plate 14 and the second plate 15 are also connected to each other in the M region, and each M region is surrounded by cooling channels 11.

[0126] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device, characterized in that, include: One or more power devices, the one or more power devices being used to perform power conversion on input electrical energy; A cold plate is located on one side of the one or more power devices. The cold plate has a cooling channel for coolant flow. The cold plate has an inlet and an outlet communicating with the cooling channel. The cold plate also has a first boss that protrudes toward the one or more power devices. The first boss has an opening communicating with the cooling channel that faces the one or more power devices. A heat-conducting component, which is fixed to a cold plate and seals the opening, is used to connect to or contact the one or more power devices.

2. The power conversion device according to claim 1, characterized in that, The cold plate includes a first plate and a second plate fixedly connected together, the first plate being located on the side of the second plate facing the one or more power devices, and the cooling channel being located between the first plate and the second plate; The first plate has the first boss, the second plate has the second boss, a portion of the second boss is located within the first boss, and the cooling channel includes a first gap between the heat-conducting element and the second boss.

3. The power conversion device according to claim 2, characterized in that, The power conversion device further includes a first heat sink, which is fixed to the surface of the heat-conducting element away from the one or more power devices. The first heat sink is located within the first gap and has a plurality of first slits for the flow of the coolant.

4. The power conversion device according to claim 3, characterized in that, The end of the first heat sink that is away from the heat conductor is connected to or in contact with the second boss.

5. The power conversion device according to claim 3 or 4, characterized in that, The first heat sink includes multiple parts, each of the multiple parts includes one or more of the first gaps, and multiple power devices are provided, with each of the multiple power devices corresponding to one of the multiple parts; The power conversion device further includes one or more flow-blocking elements, which are fixed to the surface of the heat-conducting element away from the one or more power devices. The one or more flow-blocking elements are located within the first gap. The end of each flow-blocking element away from the heat-conducting element is connected to or contacts the second boss. At least one flow-blocking element is provided between two adjacent portions.

6. The power conversion device according to any one of claims 2-5, characterized in that, The cold plate and the one or more power devices are arranged along a first direction. The first boss includes a first sidewall and a second sidewall arranged along a second direction. The second boss includes a third sidewall and a fourth sidewall arranged along the second direction. The second direction is perpendicular to the first direction. The cooling channel further includes a second gap located between the first sidewall and the third sidewall, and a third gap located between the second sidewall and the fourth sidewall. The second gap and the third gap are arranged along the second direction and are both connected to the first gap.

7. The power conversion device according to claim 6, characterized in that, The power devices are arranged in multiple directions along a third direction, and both the first direction and the second direction are perpendicular to the third direction. The power conversion device further includes multiple current sharing structures. Multiple current sharing structures arranged along the third direction are disposed in the second gap or the third gap. Each current sharing structure includes multiple current sharing plates arranged along the first direction. Each current sharing plate has a surface facing away from the second plate.

8. The power conversion device according to claim 6 or 7, characterized in that, The cooling channel further includes a plurality of first sub-channels and a plurality of second sub-channels. The plurality of first sub-channels are arranged along the second direction. Each of the plurality of first sub-channels extends along a third direction. Both the first direction and the second direction are perpendicular to the third direction. Each of the plurality of second sub-channels connects to two adjacent first sub-channels. The two second sub-channels connected to the same first sub-channel are located at different ends of the same first sub-channel in the third direction. The second gap, the third gap, and the plurality of first sub-channels are arranged sequentially along the second direction, and the third gap is connected to the first sub-channel closest to the third gap.

9. The power conversion device according to claim 8, characterized in that, One of the liquid inlet and the liquid outlet is connected to the second gap, and the other is connected to the first sub-channel that is furthest from the third gap.

10. The power conversion device according to any one of claims 6-9, characterized in that, The power conversion device further includes one or more second heat sinks, and at least one of the plurality of first sub-channels has a second heat sink fixed therein. Each of the one or more second heat sinks has a plurality of second slits for the flow of the coolant.

11. The power conversion device according to claim 10, characterized in that, The power conversion device further includes a circuit board and an inductor. The one or more power devices and the inductor are fixed to the side of the circuit board facing the cold plate. The inductor is connected to the first board. In the arrangement direction of the circuit board and the cold plate, the inductor faces the second heat sink.

12. The power conversion device according to any one of claims 1-11, characterized in that, The heat-conducting component is located on the side of the first boss facing the one or more power devices, and the heat-conducting component is fixedly connected to the surface of the first boss facing the one or more power devices.

13. The power conversion device according to any one of claims 1-11, characterized in that, The heat-conducting component includes a heat-conducting plate and an annular mounting protrusion, the mounting protrusion being fixed to the surface of the heat-conducting plate opposite to the one or more power devices; The mounting protrusion surrounds the first boss and is fixedly connected to the outer peripheral surface of the first boss, and the heat-conducting plate covers the opening and is fixedly connected to the one or more power devices.

14. The power conversion device according to any one of claims 1-11, characterized in that, The heat-conducting component includes a heat-conducting plate and an annular mounting protrusion, the mounting protrusion being fixed to the surface of the heat-conducting plate opposite to the one or more power devices; The mounting protrusion passes through the opening and is at least partially located within the cooling channel. The mounting protrusion is fixedly connected to the inner surface of the first boss. The heat-conducting plate seals the opening and is fixedly connected to the one or more power devices.

15. A power supply device, characterized in that, The device includes an equipment cabinet, a cooling assembly, and a power conversion device according to any one of claims 1-14, wherein the power conversion device is located inside the equipment cabinet, the cooling assembly is located inside or outside the equipment cabinet, and the cooling assembly is used to drive the coolant to flow between the inlet and the outlet.

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