Semiconductor waste gas treatment power supply device

Abstract

The utility model provides a kind of semiconductor waste gas treatment power supply unit, it is related to semiconductor plasma waste gas treatment technical field, power supply unit includes shell, the heat dissipation component being arranged in the shell interior, mounting assembly and heating component, the shell includes air inlet side plate and air outlet side plate, air inlet is opened in the air inlet side plate, first air outlet is opened in the air outlet side plate, the heat dissipation component includes radiator, the mounting assembly includes air inlet mounting plate, first installation side plate and second installation side plate, the radiator is located between the air inlet mounting plate and the first installation side plate, the air inlet mounting plate is parallel with the length direction of the shell, the radiator is parallel with the air inlet mounting plate and is arranged, and the heating component is installed in the first installation side plate and the second installation side plate outside side.The utility model provides power supply unit by parallel arrangement heating component in the two sides of mounting assembly, it is convenient to maintain, overhaul.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor plasma exhaust gas treatment technology, and more specifically, to a semiconductor exhaust gas treatment power supply device. Background Technology

[0002] Waste gas treatment systems generated during semiconductor manufacturing require high-power power supplies, which generate significant heat during prolonged high-load operation. Traditional power supplies suffer from dispersed component layouts leading to chaotic airflow paths, low heat dissipation efficiency for critical heat-generating components (such as IGBT modules and transformers), and interleaved heat dissipation components, necessitating disassembly of the entire structure for maintenance and increasing downtime.

[0003] The above-mentioned problems urgently need to be solved, so this utility model provides a semiconductor waste gas treatment power supply device. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a semiconductor waste gas treatment power supply device with a compact structure and easy disassembly and maintenance of the heating components.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: a semiconductor waste gas treatment power supply device is provided, including a housing, a heat dissipation component, a mounting component and a heating component disposed inside the housing. The housing includes an air inlet side plate and an air outlet side plate. An air inlet is provided on the air inlet side plate and a first air outlet is provided on the air outlet side plate. The heat dissipation component includes a heat sink. The mounting component includes an air inlet mounting plate, a first mounting side plate and a second mounting side plate. The heat sink is disposed between the air inlet mounting plate and the first mounting side plate. The air inlet mounting plate is parallel to the length direction of the housing. The heat sink is arranged parallel to the air inlet mounting plate. The heating component is installed on the outside of the first mounting side plate and the second mounting side plate.

[0006] In this embodiment, the heat dissipation assembly is further configured to include a first fan mounted on the air inlet side plate and a second fan mounted on the air outlet side plate. An air inlet hole is provided on the air inlet mounting plate, and airflow passes through the air inlet and enters the radiator.

[0007] In this embodiment, the mounting assembly is further configured such that: the mounting assembly also includes an air outlet mounting plate, the air outlet mounting plate has ventilation holes in the air inlet direction, the air inlet diameter of the first fan is larger than the diameter of the air inlet hole, when the first fan is inlet, part of the airflow directly enters the interior of the radiator through the ventilation holes, and finally is discharged through the first air outlet.

[0008] In this embodiment, it is further configured that: the air inlet mounting plate has threaded holes to facilitate the installation of the heat dissipation component.

[0009] In this embodiment, the radiator is further configured such that: the radiator includes a body and fins, and airflow passes through the gaps between the fins to dissipate heat from the radiator.

[0010] In this embodiment, it is further configured that: an IO control interface, arc voltage feedback, communication interface, switch, wiring terminal, positive power supply terminal and negative power supply terminal are also installed on the air inlet side plate.

[0011] In this embodiment, it is further configured that: a second air outlet, an ammeter, a current adjustment knob, a remote switching switch and indicator lights are also installed on the air outlet side panel, and the indicator lights include a fault light, an overheat light and a start light.

[0012] In this embodiment, the housing is further configured such that: the housing also includes a first side plate and a second side plate, a first handle is installed on the outer side of the first side plate, and a second handle is installed on the outer side of the second side plate.

[0013] In this embodiment, the heating component is further configured as follows: the heating component includes a switched capacitor, a rectifier bridge, a semiconductor, a fast recovery circuit, an arc-initiating high-frequency board, a control circuit board, and a host computer signal isolation board. The switched capacitor, the rectifier bridge, the semiconductor, and the DC blocking capacitor are installed on the outside of the main body, and the control circuit board and the host computer signal isolation board are installed on the side of the first mounting side plate away from the heat sink.

[0014] In this embodiment, the mounting assembly further includes a top plate, and the heating assembly includes a first main transformer and a DC blocking capacitor, wherein the first main transformer and the DC blocking capacitor are fixed on the top plate.

[0015] The beneficial effects of this utility model are as follows: The radiator of this utility model is located between the air inlet mounting plate and the first mounting side plate. The airflow passes through the radiator from the air inlet and is discharged from the first air outlet. The air inlet mounting plate is parallel to the length direction of the shell. The radiator is arranged parallel to the air inlet mounting plate. The heating element is installed on the outside of the first mounting side plate and the second mounting side plate, which facilitates the disassembly and maintenance of the heating element. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] In the picture: Figure 1 This is a schematic diagram of the structure of a semiconductor waste gas treatment power supply device according to the present invention; Figure 2 for Figure 1 Front view of the power supply unit; Figure 3 for Figure 1 Rear view of the power supply unit; Figure 4 for Figure 3 A schematic diagram of part of the internal structure of the power supply unit; Figure 5 for Figure 4 Exploded view of the power supply unit; Figure 6 for Figure 5 Front view of the mounting plate and heat sink; Figure 7 for Figure 6 Exploded view of the installed components and heat sink; Figure 8 for Figure 1 The left view after removing the second side panel; Figure 9 for Figure 1 The right view of the first side panel is removed.

[0018] 100. Power supply unit; 1. Housing; 11. Air inlet side panel; 111. Air inlet; 112. IO control interface; 113. Arc voltage feedback; 114. Communication interface; 115. Switch; 116. Terminal block; 117. Positive power supply terminal; 118. Negative power supply terminal; 12. Air outlet side panel; 121. First air outlet; 122. Second air outlet; 123. Ammeter; 124. Current adjustment knob; 125. Remote switching switch; 126. Indicator light; 1261. Fault light; 1262. Overheat light; 1263. Start light; 13. First side panel; 131. First handle; 14. Second side panel; 141. Second handle; 2. Heat dissipation components; 21. First fan; 22. Second fan; 23. Radiator; 231. Main body; 232. Fins; 3. Mounting components; 31. Air inlet mounting plate; 311. Air inlet hole; 312. Threaded hole; 32. First mounting side plate; 33. Second mounting side plate; 34. Air outlet mounting plate; 341. Ventilation hole; 35. Top plate; 4. Heating components; 41. Switched capacitor; 42. Rectifier bridge; 43. Semiconductor; 44. Fast recovery capacitor; 45. First main transformer; 46. DC blocking capacitor; 47. Arc initiation high-frequency board; 48. Control circuit board; 49. Host computer signal isolation board. Detailed Implementation

[0019] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basic structure of the present utility model in a schematic manner, so it only shows the components related to the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0020] As Figure 1-9 shown, the present utility model provides a semiconductor waste gas treatment power supply device 100, which includes a housing 1, a heat dissipation component 2, a mounting component 3 and a heating component 4 arranged inside the housing 1.

[0021] In this embodiment, specifically: the housing 1 includes an air inlet side plate 11, an air outlet side plate 12, a first side plate 13 and a second side plate 14.

[0022] In this embodiment, specifically: the air inlet side plate 11 is provided with an air inlet 111, an IO control interface 112, an arc voltage feedback 113, a communication interface 114, a switch 115, a wiring terminal 116, a power positive terminal 117 and a power negative terminal 118. In this embodiment, specifically: the air outlet side plate 12 is provided with a first air outlet 121, a second air outlet 122, an ammeter 123, a current adjustment knob 124, a remote switching switch 125 and an indicator light 126. The indicator light 126 includes a fault light 1261, an overheat light 1262 and a start light 1263.

[0023] In this embodiment, specifically: a first handle 131 is installed outside the first side plate 13, and a second handle 141 is installed outside the second side plate 14.

[0024] In this embodiment, specifically: the heat dissipation component 2 includes a first fan 21 installed on the air inlet side plate 11, a second fan 22 installed on the air outlet side plate 12 and a radiator 23.

[0025] In this embodiment, specifically: the mounting component 3 is integrally in a "C" - shaped structure. The mounting component 3 includes an air inlet mounting plate 31, a first mounting side plate 32, a second mounting side plate 33, an air outlet mounting plate 34 and a top plate 35. The air inlet mounting plate 31 is parallel to the length direction of the housing 1, and the radiator 23 is arranged parallel to the air inlet mounting plate 31.

[0026] In this embodiment, specifically: there are two air inlets 111, two air inlet holes 311 and two first air outlets 121.

[0027] In this embodiment, specifically: the first fan 21 and the second fan 22 are installed inside the first air outlet 121.

[0028] In this embodiment, specifically: an air inlet hole 311 is provided on the air inlet mounting plate 31, and the airflow passes through the air inlet 111 and enters the radiator 23 through the air inlet hole 311.

[0029] In this embodiment, specifically: the air outlet mounting plate 34 has a ventilation hole 341 in the air inlet direction, the air inlet diameter of the first fan 21 is larger than the diameter of the air inlet hole 311, when the first fan 21 takes in air, part of the airflow directly enters the radiator 23 through the ventilation hole 341 and is finally discharged through the first air outlet 121.

[0030] In this embodiment, specifically: the air inlet mounting plate 31 is provided with threaded holes 312, and threaded holes 312 are provided at the connection points between the air inlet mounting plate 31, the first mounting side plate 32, the second mounting side plate 33, the air outlet mounting plate 34 and the top plate 35. Screws pass through the threaded holes 312 to fix the air inlet mounting plate 31, the first mounting side plate 32, the second mounting side plate 33, the air outlet mounting plate 34 and the top plate 35 together.

[0031] In this embodiment, specifically: the first side plate 13 and the second side plate 14 are arranged parallel to the first mounting side plate 32 and the second mounting side plate 33, and the heating component 4 is arranged on the side close to the housing 1. In this embodiment, specifically: the radiator 23 includes a main body 231 and fins 232, and the airflow passes through the gap between the fins 232 to dissipate heat from the radiator 23.

[0032] In this embodiment, specifically: the fins 232 of the radiator 23 adopt a high thermal conductivity aluminum interdigitated / toothed design, and the gap density matches the fan air pressure to ensure low wind resistance and efficient heat exchange.

[0033] In this embodiment, specifically: the heating component 4 includes a switched capacitor 41, a rectifier bridge 42, a semiconductor 43, a fast recovery capacitor 44, a first main transformer 45, a DC blocking capacitor 46, an arc-starting high-frequency board 47, a control circuit board 48, and a host computer signal isolation board 49. The switched capacitor 41, the rectifier bridge 42, the semiconductor 43, and the DC blocking capacitor 46 are installed on the outside of the main body 231. The control circuit board 48 and the host computer signal isolation board 49 are installed on the side of the first mounting side plate 32 away from the heat sink 23. The first main transformer 45 and the DC blocking capacitor 46 are fixed on the top plate 35.

[0034] The working process of the semiconductor waste gas treatment power supply device of this utility model: The user starts the power supply device 100 through the switch 115 on the housing 1. At this time, the first fan 21 and the second fan 22 start to work, forming an air flow. Under the action of the first fan 21, the air flow enters the interior of the housing 1 from the air inlet 111 on the air inlet side plate 11. Part of the air flow directly passes through the air inlet holes 311 on the air inlet mounting plate 31 of the mounting assembly 3 and enters the interior of the radiator 23. Another part of the air flow directly blows towards the heat generating component 4, taking away the heat generated by the heat generating component 4, passing through the ventilation holes 341 and entering the interior of the radiator 23, and finally being discharged from the first air outlet 121 under the action of the second fan 22.

[0035] The beneficial effects of a semiconductor waste gas treatment power supply device of the present utility model: 1. Through the unique design of the heat dissipation component 2, including the first fan 21, the second fan 22, the mounting assembly 3 and the radiator 23, efficient heat dissipation of the heat generating component 4 inside the housing 1 is achieved, ensuring the stable operation of the power supply device 100 under high load working conditions.

[0036] 2. The mounting assembly 3 is set in a "C" - shaped structure, surrounding the radiator 23. The heat generating component 4 is installed outside the mounting assembly 3. The air flow passes through the air inlet 111, passes through the radiator 23 and the heat generating component 4, and is discharged from the air outlet. The overall layout is compact and reasonable, saving space.

[0037] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0038] It should be noted that the terms "first", "second", etc. in the description and claims of the present application and the above - mentioned drawings are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described here can be implemented in an order different from those illustrated or described here.

[0039] Inspired by the ideal embodiments of the present utility model as described above, through the above - mentioned description, relevant staff can make various changes and modifications without departing from the scope of the present utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A semiconductor waste gas treatment power supply device, characterized in that: The device includes a housing (1), a heat dissipation assembly (2), a mounting assembly (3), and a heating assembly (4) disposed inside the housing (1). The housing (1) includes an air inlet side plate (11) and an air outlet side plate (12). An air inlet (111) is provided on the air inlet side plate (11), and a first air outlet (121) is provided on the air outlet side plate (12). The heat dissipation assembly (2) includes a radiator (23). The mounting assembly (3) includes an air inlet mounting plate (31), a first mounting side plate (32), and a second mounting side plate (33). The radiator (23) is disposed between the air inlet mounting plate (31) and the first mounting side plate (32). The air inlet mounting plate (31) is parallel to the length direction of the housing (1), and the radiator (23) is arranged parallel to the air inlet mounting plate (31). The heating assembly (4) is installed on the outside of the first mounting side plate (32) and the second mounting side plate (33).

2. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The heat dissipation assembly (2) also includes a first fan (21) installed on the air inlet side plate (11) and a second fan (22) installed on the air outlet side plate (12). An air inlet hole (311) is provided on the air inlet mounting plate (311). The airflow passes through the air inlet (111) and enters the radiator (23) through the air inlet hole (311).

3. The semiconductor waste gas treatment power supply device according to claim 2, characterized in that: The mounting assembly (3) also includes an air outlet mounting plate (34), which has a ventilation hole (341) in the air inlet direction. The air inlet diameter of the first fan (21) is larger than the diameter of the air inlet hole (311). When the first fan (21) takes in air, part of the airflow directly enters the radiator (23) through the ventilation hole (341) and is finally discharged through the first air outlet (121).

4. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The air inlet mounting plate (31) has a threaded hole (312) to facilitate the installation of the heat dissipation component (2).

5. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The radiator (23) includes a body (231) and fins (232), and airflow passes through the gaps between the fins (232) to dissipate heat from the radiator (23).

6. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The air inlet side plate (11) is also equipped with an IO control interface (112), arc voltage feedback (113), communication interface (114), switch (115), wiring terminal (116), power positive terminal (117) and power negative terminal (118).

7. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The air outlet side panel (12) is also equipped with a second air outlet (122), an ammeter (123), a current adjustment knob (124), a remote switching switch (125) and an indicator light (126), the indicator light (126) including a fault light (1261), an overheat light (1262) and a start light (1263).

8. The semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The housing (1) also includes a first side plate (13) and a second side plate (14), with a first handle (131) installed on the outside of the first side plate (13) and a second handle (141) installed on the outside of the second side plate (14).

9. A semiconductor waste gas treatment power supply device according to claim 5, characterized in that: The heat-generating component (4) includes a switched capacitor (41), a rectifier bridge (42), a semiconductor (43), a fast recovery capacitor (44), a DC blocking capacitor (46), an arc-starting high-frequency board (47), a control circuit board (48), and a host computer signal isolation board (49). The switched capacitor (41), the rectifier bridge (42), the semiconductor (43), and the DC blocking capacitor (46) are installed on the outside of the main body (231). The control circuit board (48) and the host computer signal isolation board (49) are installed on the side of the first mounting side plate (32) away from the heat sink (23).

10. A semiconductor waste gas treatment power supply device according to claim 1, characterized in that: The mounting assembly (3) also includes a top plate (35), and the heating assembly (4) also includes a first main transformer (45) and a DC blocking capacitor (46), with the first main transformer (45) and the DC blocking capacitor (46) fixed on the top plate (35).

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