A cooling table for wafer etching machine

Abstract

The utility model provides a kind of cooling platform for wafer etching machine, including cooling platform, be provided with opening, clamp insertion slot and wafer placement position on the cooling platform, the clamp insertion slot is located in the wafer placement position, the wafer placement position of the clamp insertion slot outside is provided with several wafer placement parts;The wafer placement part includes sunken platform and annular sheet, the cooling platform for wafer etching machine of the utility model can effectively reduce wafer cooling speed, eliminate wafer internal stress, to avoid wafer damage in turn.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a cooling stage for a wafer etching machine. Background Technology

[0002] In semiconductor manufacturing processes, wafer fabrication requires the removal of resist. Current methods for removing resist involve placing the wafer in a removal chamber and heating it at high temperatures to remove the resist.

[0003] In high-temperature dry resist stripping etching processes, the surface temperature of the processed wafer is high and requires cooling to reduce the wafer temperature before being returned to the wafer cassette. Existing cooling components include a wafer cooling platform. The wafer is placed on a wafer mounting position on the platform for cooling, with the wafer body in direct contact with the metal surface of the platform. Because metal-to-metal contact conducts heat quickly, excessively rapid cooling of wafers with high stress can prevent the internal stress from being released, potentially leading to stress fracture.

[0004] Therefore, existing wafer cooling platforms need to be improved to enable slow cooling of wafers and prevent wafer damage. Utility Model Content

[0005] The purpose of this invention is to provide a cooling platform for a wafer etching machine that can effectively reduce the wafer cooling rate, eliminate wafer internal stress, and thus prevent wafer damage.

[0006] Other objects and advantages of this utility model can be further understood from the technical features disclosed herein.

[0007] To achieve one or more of the above objectives or other objectives, the present invention provides a cooling platform for a wafer etching machine, comprising a cooling platform having an opening, a fixture insertion slot, and a wafer placement position. The fixture insertion slot is located within the wafer placement position, and the wafer placement position outside the fixture insertion slot is provided with a plurality of wafer placement portions; each wafer placement portion includes a settling platform and a circular ring plate.

[0008] The wafer placement position is circular, and several of the set-top platforms within the wafer placement position are symmetrically arranged around the center of the wafer placement position.

[0009] At least one pair of the circular ring plates are provided, and the circular ring plates are symmetrically arranged along the center of the wafer placement position; the circular ring plates are arranged against the inner side of the outer ring of the wafer placement position; the sink is arranged on the wafer placement position between the circular ring plates and the fixture insertion slot.

[0010] The settling platform is a ceramic settling platform, and the annular plate is a ceramic annular plate; the height of both the settling platform and the annular plate is higher than the surface of the wafer placement position, and the height of the settling platform and the annular plate are the same.

[0011] A cooling channel is provided in the central area of ​​the wafer placement position, and a number of air outlets are provided in the cooling channel; an air inlet channel is provided inside the cooling platform, and the air inlet channel is connected to the cooling channel; the air inlet channel is connected to an interface provided on the cooling platform, and an external air source is connected to the cooling channel and the air inlet channel through the interface.

[0012] The cooling channel is annular and is connected to the air inlet channel via a connector; the cooling channel is located near the top of the fixture insertion slot.

[0013] The air outlet is perpendicular to the surface of the cooling platform.

[0014] The cooling platform is symmetrically provided with multiple wafer placement positions and fixture insertion slots; the multiple cooling channels provided on the multiple fixture insertion slots are connected to an air inlet channel.

[0015] The recessed platform is cylindrical, and both the recessed platform and the annular plate are provided with placement holes; the placement hole is located at the center of the recessed platform; multiple placement holes are evenly distributed on the annular plate; a rubber pad assembly is fixed in the placement hole, the pad assembly includes a mushroom head and a connecting post; after the connecting post is inserted into the placement hole, the mushroom head is fixed on the recessed platform and the annular plate.

[0016] The mushroom head is a centrally protruding circular plate structure. A pair of protrusions are provided at the lower part of the mushroom head. After the pad assembly is fixed on the sinking platform and the annular plate, the protrusions contact the surfaces of the sinking platform and the annular plate. Compared with the prior art, the beneficial effects of this utility model mainly include: 1. By placing a cylindrical sinking platform and annular plate within the wafer placement position, and placing the wafer on the sinking platform and annular plate, the utility model avoids direct contact between the wafer and the metal surface of the cooling platform. Furthermore, by blowing inert gas through the cooling channel to slowly cool the wafer, the cooling rate of the wafer can be effectively slowed down, thus avoiding the problem of wafer damage due to insufficient internal stress release.

[0017] 2. The present invention provides a rubber pad assembly on the surface of the cylindrical stage and the annular plate. When the wafer is placed on the stage and the annular plate, the pad assembly supports the wafer body and acts as a buffer, further avoiding the risk of wafer damage.

[0018] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of a cooling platform for a wafer etching machine according to the present invention.

[0021] Figure 2 This is a schematic diagram of the pad assembly of this utility model.

[0022] In the diagram: 1. Cooling platform; 2. Opening; 21. Fixture insertion slot; 3. Cooling channel; 31. Air outlet; 32. Connector; 4. Wafer placement position; 5. Recessed platform; 6. Circular ring plate; 7. Pad assembly; 71. Mushroom head; 72. Connecting post; 73. Bump; 8. Air inlet channel; 9. Interface. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of this utility model shown in and described with reference to the drawings are merely exemplary, and this utility model is not limited to these embodiments.

[0024] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0025] Example 1 See Figure 1 Embodiment 1 provides a cooling stage for a wafer etching machine. The cooling stage includes a rectangular cooling platform 1, a horn-shaped opening 2, a fixture insertion slot 21 connected to the opening 2, and a circular wafer placement position 4. The fixture insertion slot 21 is located inside the wafer placement position 4, and the wafer placement position 4 outside the fixture insertion slot 21 is provided with a plurality of wafer placement parts. The wafer placement part includes a countersink 5 and a circular ring 6.

[0026] The multiple recessed platforms 5 and the annular plate 6 provided in this application can be used to support the wafer body, avoiding direct contact between the wafer body and the metal surface of the cooling platform 1, and solving the problem of wafer damage caused by the inability to release internal stress due to rapid cooling. At the same time, the wafer placement structure of the multiple recessed platforms 5 and the annular plate 6 can provide better support for the wafer.

[0027] Several recessed platforms 5 are symmetrically arranged around the center of the wafer placement position 4, and are located on the wafer placement position 4 outside the fixture insertion slot 21, thus not affecting the wafer insertion operation. At least one pair of annular plates 6 are provided, symmetrically arranged around the center of the wafer placement position 4, and are positioned against the inner side of the outer ring of the wafer placement position 4. The at least one pair of annular plates 6 provides support for the edge of the wafer, while the multiple symmetrical recessed platforms 5 located inside the annular plates 6, in conjunction with the annular plates 6, achieve a good support effect for the wafer. Simultaneously, when the external wafer is fed into the wafer placement position using the fixture, the multiple support points on the wafer placement position allow the wafer to be placed smoothly and with uniform force.

[0028] The settling platform 5 is a ceramic settling platform, and the circular ring plate 6 is a ceramic ring plate. The ceramic settling platform 5 and the ceramic ring plate have the advantages of wear resistance, high temperature resistance, and long service life. The ceramic settling platform 5 and the ceramic ring plate are both higher than the surface of the wafer placement position 4, and the ceramic settling platform 5 and the ceramic ring plate are at the same height. The wafer placed on the settling platform 5 and the circular ring plate 6 can be kept at the same level as the cooling platform 1.

[0029] To ensure controllable wafer cooling without the wafer contacting the metal surface of the cooling platform 1, a cooling channel 3 is provided within the wafer placement position 4. The cooling channel 3 is located near the center of the wafer placement position 4. Several air outlets 31 are provided on the cooling channel 3, with each outlet perpendicular to the surface of the cooling platform 1. Therefore, when the wafer is placed, the air outlets 31 can face the wafer body directly, delivering an inert gas for heat dissipation, such as nitrogen. An air inlet channel 8 is provided inside the cooling platform 1, connecting to the cooling channel 3. The air inlet channel 8 connects to an interface 9 on the cooling platform 1, allowing external air sources to enter the cooling channel 3 and the air inlet channel 8 through this interface 9 to cool the wafer.

[0030] The cooling channel 3 is annular, and with multiple air outlets 31 evenly arranged on the circular cooling channel 3, uniform airflow can be achieved. The cooling channel 3 is connected to the air inlet channel 8 via a connector 32. The air inlet channel 8 is a channel formed inside the cooling platform 1. A through hole is formed on the surface of the cooling platform 1 near the cooling channel 3, connecting to the air inlet channel 8. One end of the connector 32 is inserted into this through hole, and the other end is connected to the cooling channel 3, which optimizes the structure of the device. The specific connection structure of the connector 32 is described in [details omitted]. Figure 1 It is not shown in detail above, but based on Figure 1 Based on the content discussed above, the specific connection scheme of connector 32 should be easily known.

[0031] The cooling channel 3 is located near the top of the fixture insertion slot 21.

[0032] by Figure 1 For example, Figure 1 Two wafer placement positions 4 and the fixture insertion slots are symmetrically arranged on the cooling platform 1. Two cooling channels 3 on the two fixture insertion slots are connected to an air inlet channel 8. This air inlet channel 8 can be connected to an external source using a single interface 9, further simplifying the configuration of the air inlet channel 8. Embodiment 1 uses two wafer placement positions 4, fixture insertion slots, and cooling channels 3 as an example for illustration. In actual configuration, the number of wafer placement positions 4, fixture insertion slots, and cooling channels 3 can be selected according to actual needs.

[0033] The recessed platform 5 is cylindrical, and both the recessed platform 5 and the annular plate 6 are provided with placement holes; the placement holes are located at the center of the recessed platform 5; multiple placement holes are evenly arranged on the annular plate 6; a rubber pad assembly 7 is fixed in the placement hole, and the pad assembly 7 is made of high-temperature resistant rubber. Figure 2 As shown, the pad assembly 7 includes a mushroom head 71 and a connecting post 72. After the connecting post 72 is inserted into the placement hole, the mushroom head 71 is fixed on the recessed platform 5 and the annular plate 6. The mushroom head 71 is a circular plate structure with a central protrusion. A pair of protrusions 73 are provided on the lower part of the mushroom head 71. After the pad assembly 7 is fixed on the recessed platform 5 and the annular plate 6, the protrusions 73 are in contact with the surfaces of the recessed platform 5 and the annular plate 6. At this time, there is a gap between the mushroom head 71 and the recessed platform 5 and the annular plate 6. This gap is designed to facilitate the removal of the mushroom head 71 and facilitate the replacement of the mushroom head 71 (due to long-term high-temperature operation, the mushroom head 71 is prone to aging and wear, so regular maintenance and replacement are required).

[0034] In the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] Furthermore, it should be noted that in this specification, "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cooling platform for a wafer etching machine, comprising a cooling platform (1), wherein the cooling platform (1) is provided with an opening (2), a fixture insertion slot (21), and a wafer placement position (4), characterized in that, The fixture insertion slot (21) is located inside the wafer placement position (4), and the wafer placement position (4) outside the fixture insertion slot (21) is provided with a plurality of wafer placement parts; The wafer placement section includes a settling platform (5) and a circular ring (6).

2. The cooling stage for a wafer etching machine according to claim 1, characterized in that, The wafer placement position (4) is circular, and several of the set-top platforms (5) within the wafer placement position (4) are symmetrically arranged along the center of the wafer placement position (4).

3. A cooling stage for a wafer etching machine according to claim 2, characterized in that, At least one pair of the circular ring plates (6) are provided, and the circular ring plates (6) are symmetrically arranged along the center of the wafer placement position (4); The annular plate (6) is disposed against the inner side of the outer ring of the wafer placement position (4); The settling platform (5) is located on the wafer placement position (4) between the annular plate (6) and the fixture insertion slot (21).

4. A cooling stage for a wafer etching machine according to claim 2, characterized in that, The sinking platform (5) is a ceramic sinking platform, and the circular ring (6) is a ceramic ring; The height of the settling platform (5) and the annular plate (6) are both higher than the surface of the wafer placement position (4), and the height of the settling platform (5) and the annular plate (6) are the same.

5. A cooling stage for a wafer etching machine according to claim 2, characterized in that, A cooling channel (3) is provided in the central area of ​​the wafer placement position (4). The cooling channel (3) is provided with several air outlets (31); The cooling platform (1) has an air inlet channel (8) inside, and the air inlet channel (8) is connected to the cooling channel (3); The air inlet channel (8) is connected to the interface (9) set on the cooling platform (1), and the external air source is connected to the cooling channel (3) and the air inlet channel (8) through the interface (9).

6. A cooling stage for a wafer etching machine according to claim 5, characterized in that, The cooling channel (3) is circular and is connected to the air inlet channel (8) via a connector (32). The cooling channel (3) is located near the top of the clamp insertion slot (21).

7. A cooling stage for a wafer etching machine according to claim 5, characterized in that, The air outlet (31) is perpendicular to the surface of the cooling platform (1).

8. A cooling stage for a wafer etching machine according to claim 5, characterized in that, Multiple wafer placement positions (4) and fixture insertion slots (21) are symmetrically arranged on the cooling platform (1). The multiple cooling channels (3) provided on the multiple clamp insertion slots (21) are connected to an air inlet channel (8).

9. A cooling stage for a wafer etching machine according to claim 1, characterized in that, The recessed platform (5) is cylindrical, and both the recessed platform (5) and the annular plate (6) are provided with placement holes; The placement hole is provided at the center of the sinking platform (5); Multiple placement holes are evenly arranged on the annular plate (6); A rubber pad assembly (7) is fixed inside the placement hole. The pad assembly (7) includes a mushroom head (71) and a connecting post (72). After the connecting post (72) is inserted into the placement hole, the mushroom head (71) is fixed on the sink plate (5) and the annular plate (6).

10. A cooling stage for a wafer etching machine according to claim 9, characterized in that, The mushroom head (71) is a centrally protruding circular plate structure. A pair of protrusions (73) are provided at the lower part of the mushroom head (71). After the pad assembly (7) is fixed on the sinking platform (5) and the annular plate (6), the protrusions (73) are in contact with the surfaces of the sinking platform (5) and the annular plate (6).

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