A coarse particle removal device for a chip manufacturing process

Abstract

The utility model discloses a kind of coarse particle removal devices of chip manufacturing process, belong to chip manufacturing technical field, comprising: chip detection device, and pre-washing treatment tank is communicated by pipeline;Dust collection component, output and the pre-washing treatment tank are communicated;Guiding component is connected with the inside of the pre-washing treatment tank, for guiding to the wafer that enters the pre-washing treatment tank, and make the coarse particle of wafer surface fall off;The first guiding cleaning component of setting passes through inclined guide plate and long slot screen structure, coarse particle can be separated directly by screen when wafer sliding lower surface;Through the first guiding cleaning component of setting, utilize the sliding characteristic of inclined guide plate and screen structure, separate the polishing residual coarse particle on the lower surface of wafer, the second guiding cleaning component of setting, for the wafer upper surface that slides over, remove coarse particle on upper surface adsorption force stronger;Both synergistically realize wafer upper and lower surface full coverage dust removal.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a coarse particle removal device in the chip manufacturing process. Background Technology

[0002] In the semiconductor chip manufacturing process, the pre-cleaning stage before photolithography is the core link that determines the photolithography accuracy and device yield. The photolithography process needs to transfer nanoscale patterns to the wafer surface. If suspended dust is adsorbed on the wafer during the transfer process, it will cause uneven photoresist coating, pattern transfer deviation, and even short circuit or open circuit of the device.

[0003] To address this issue, existing solutions include, for example, the wafer pre-cleaning device disclosed in CN115274863B, which attempts to improve efficiency by combining airflow purging with brush cleaning. However, it can only process a single surface of the wafer, and the particles detached by the brush cleaning are prone to redeposition due to the lack of a real-time negative pressure suction design, resulting in unsatisfactory cleaning effects. Utility Model Content

[0004] To address the problems of existing technologies, this utility model provides a coarse particle removal device for chip manufacturing processes, comprising: Pre-cleaning processing box is used to receive wafers that have been polished and are about to enter the photolithography process in chip manufacturing; The chip inspection device is connected to the pre-cleaning treatment box through a pipe and is used to detect the residual particles on the wafer surface to prevent substandard wafers from flowing into the photolithography process. The dust collection component has its output end connected to the pre-cleaning treatment box and is used to extract coarse particles that fall off during the wafer cleaning process in the pre-cleaning treatment box in real time. The guide assembly is connected to the interior of the pre-cleaning chamber and is used to guide and transport the wafers entering the pre-cleaning chamber, while simultaneously removing coarse particles from the wafer surface. The guiding components include: a first guiding and cleaning component and a second guiding and cleaning component, both of which are inclined. The first guide cleaning component is located close to the chip detection device, and one end of it is connected to the inner wall of the pre-cleaning treatment box. It is used to receive the wafers entering the pre-cleaning treatment box and clean the residual coarse particles on the lower surface of the wafers. One end of the second guide cleaning component is connected to the other end of the first guide cleaning component, and both sides of the second guide cleaning component are connected to the inner wall of the pre-cleaning treatment box, respectively. The second guide cleaning component is used to clean coarse particles on the upper surface of the wafer that slides from the first guide cleaning component.

[0005] Furthermore, the first guiding and cleaning assembly includes: a guide plate and a screen; The guide plate is inclined downward, with one end connected to the inner wall of the pre-cleaning treatment tank and the other end connected to the second guide cleaning assembly; The guide plate is provided with through slots at intervals, and each slot is connected to a screen, with the top of the screen flush with the top end face of the guide plate.

[0006] Furthermore, the second guiding cleaning assembly includes: a conveying and adsorption mechanism and a dust removal assembly; One end of the conveying and adsorption mechanism is connected to the other end of the first guiding and cleaning component; The dust removal component is connected to the top inner wall of the pre-cleaning treatment box, and the brush surface of the dust removal component is arranged facing the conveying and adsorption mechanism.

[0007] Furthermore, the conveying and adsorption mechanism includes: a conveyor belt, a conveyor shaft, an adsorption plate, and a gas source assembly; Two conveyor shafts are provided, and both ends of the conveyor shafts are rotatably connected to the inner wall of the pre-cleaning treatment box. One end of the conveyor shaft passes through the pre-cleaning treatment box and is connected to a servo motor connected to the surface of the pre-cleaning treatment box. One of the conveying shafts is rotatably connected to the other end of the first guide cleaning assembly, and the other conveying shaft is connected to the bottom end face of the pre-cleaning treatment box via a support plate; The conveyor belt is sleeved between the conveyor shafts, and the conveyor belt is provided with an array of through holes; The top end face of the conveyor belt is flush with the top end face of the first guide cleaning assembly; The adsorption plate is located between the conveyor belts, and its two sides are fixedly connected to the inner wall of the pre-cleaning treatment box respectively. The top end face of the adsorption plate is provided with an array of adsorption holes, which are connected to an air source assembly located on the outer surface of the pre-cleaning treatment box through pipes, and the pipes extend out from one side of the adsorption plate. The dust removal component is positioned facing the upper surface of the conveyor belt and is spaced apart from the conveyor belt.

[0008] Furthermore, the dust removal assembly includes: an electrically telescopic rod and a brush; The electric telescopic rod is connected to the top end face of the pre-cleaning treatment box, and the output end of the electric telescopic rod is connected to the mounting frame. The brush is provided on the lower end face of the mounting frame, with the brush bristles facing the conveyor belt and a gap between them.

[0009] Furthermore, the dust collection assembly includes: a power pump set and a filter; The power pump unit is externally connected to the pre-cleaning treatment tank; The pre-cleaning treatment box is provided with an array of through holes, which are distributed on one side of the first guide cleaning component and the second guide cleaning component; The input end of the power pump unit is connected to the through hole via a pipe, and the output end of the power pump unit is connected to the filter.

[0010] The beneficial effects of this utility model are: The first guiding cleaning component uses the sliding characteristics of the inclined guide plate and the screen structure to separate the polishing residue coarse particles on the lower surface of the wafer. The second guiding cleaning component targets the upper surface of the wafer as it slides over, removing coarse particles with strong adsorption. The two components work together to achieve full coverage dust removal on both the upper and lower surfaces of the wafer.

[0011] The power pump set of the dust collection component is connected to the pre-cleaning treatment box, and the through holes of the pre-cleaning treatment box are directly distributed on one side of the first guide cleaning component and the second guide cleaning component, which can suck up the coarse particles that fall off during the operation of the two components in real time, ensuring the cleanliness of the wafer surface after the removal of coarse particles. Attached Figure Description

[0012] Figure 1 A schematic diagram of the overall structure of the rejection device provided by this utility model; Figure 2 This is a schematic diagram of the internal structure of the pre-cleaning treatment box provided by this utility model; Figure 3 This is a schematic diagram of one side of the pre-cleaning treatment box provided by this utility model.

[0013] Figure label: In the diagram: 1 is the chip detection device, 2 is the pre-cleaning treatment box, 3 is the guide plate, 4 is the screen, 5 is the conveyor belt, 6 is the conveyor shaft, 7 is the adsorption plate, 8 is the air source assembly, 9 is the electric telescopic rod, 10 is the brush, 11 is the power pump group, 12 is the servo motor, and 13 is the output pipe. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-3 This utility model provides a coarse particle removal device for chip manufacturing process, comprising: Pre-cleaning processing box 2 is used to receive wafers that have been polished and are about to enter the photolithography process in chip manufacturing; The chip inspection device 1 is fixedly connected to the pre-cleaning treatment box 2 through a pipe, and is used to detect the residual particles on the wafer surface to prevent substandard wafers from flowing into the photolithography process. The dust collection component has its output end connected to the pre-cleaning treatment box 2, and is used to suck up coarse particles that fall off during the wafer cleaning process in the pre-cleaning treatment box 2 in real time. The guide assembly is connected to the interior of the pre-cleaning treatment box 2 and is used to guide and transport the wafers entering the pre-cleaning treatment box 2, while simultaneously removing coarse particles from the wafer surface. The guiding components include: a first guiding and cleaning component and a second guiding and cleaning component, both of which are inclined. The first guide cleaning component is located close to the chip detection device 1, and one end of it is connected to the inner wall of the pre-cleaning treatment box 2. It is used to receive the wafers entering the pre-cleaning treatment box 2 and to remove dust from the lower surface of the wafers. One end of the second guide cleaning component is connected to the other end of the first guide cleaning component, and both sides of the second guide cleaning component are connected to the inner wall of the pre-cleaning treatment box 2 respectively. The second guide cleaning component is used to clean coarse particles on the upper surface of the wafer that slides from the first guide cleaning component.

[0016] The chip detection device is an existing device, which can be found in Chinese utility model patent with publication number CN113964058B.

[0017] The chip inspection device is used to identify coarse particles on the wafer surface. The output of the device is connected through a smooth circular pipe, ensuring that wafers with coarse particles on their surface that exceed the standard can be transported to the pre-cleaning treatment box without jamming or scratching.

[0018] The dust collection component output end is connected to the side wall of the pre-cleaning treatment box through a collection pipe, which is used to generate negative pressure in the area near the first guide cleaning component and the second guide cleaning component in the pre-cleaning treatment box, and to suck up the coarse particles that fall off the wafer in real time.

[0019] The guide assembly is fixedly connected to the inner wall of the pre-cleaning treatment box by bolts or welding. It is used to guide and transport the wafers entering the pre-cleaning treatment box from the pipeline along a preset path, and its own structural design can cause coarse particles on the wafer surface to fall off during the transportation process.

[0020] The first guiding cleaning component is located near the pipe outlet of the chip detection device, and its inlet end is connected to the corresponding position of the inner wall of the pre-cleaning treatment box by a detachable bolt. It is used to directly receive the wafer falling from the pipe, and at the same time, it separates and removes the coarse particles attached to the lower surface of the wafer through its own screen structure.

[0021] The inlet end of the second guide cleaning component is connected to the outlet end of the first guide cleaning component by an arc-shaped transition plate, and its two sides are fixed to the inner wall of the pre-cleaning treatment box by welding or bolts respectively. The second guide cleaning component cleans the upper surface of the wafer that slides smoothly from the first guide cleaning component through an adsorption fixing and brush structure, focusing on removing coarse particles with strong adsorption force.

[0022] In some embodiments, the first guide cleaning assembly includes: a guide plate 3 and a screen 4; The guide plate 3 is inclined downward, with one end connected to the inner wall of the pre-cleaning treatment box 2 and the other end connected to the second guide cleaning assembly; The guide plate 3 is provided with through slots at intervals, and each slot is connected to a screen 4, with the top of the screen 4 flush with the top end face of the guide plate 3.

[0023] The feed end of the guide plate is connected to the corresponding position of the inner wall of the pre-cleaning treatment box by a detachable bolt, and the discharge end is seamlessly connected to the feed end of the second guide cleaning component by an arc-shaped transition plate.

[0024] In some embodiments, the second guiding cleaning assembly includes: a conveying and adsorption mechanism and a dust removal assembly; One end of the conveying and adsorption mechanism is connected to the other end of the first guiding and cleaning component, and is used to convey the wafer in the pre-cleaning treatment box 2. At the same time, the wafer is adsorbed on its surface during the conveying process. The dust removal component is connected to the top inner wall of the pre-cleaning treatment box 2. The brush 10 of the dust removal component is positioned facing the conveying and adsorption mechanism and is used to perform coarse particle cleaning on the upper surface of the wafer on the conveying and adsorption mechanism.

[0025] The inlet of the conveying and adsorption mechanism is seamlessly connected to the outlet of the first guide cleaning component through an arc-shaped transition plate, which is used to convey the wafers in the pre-cleaning treatment box at a uniform speed. At the same time, the mechanism uses negative pressure adsorption to stably fix the wafers on its conveying surface, providing a stable foundation for cleaning coarse particles on the upper surface. The dust removal component is fixedly connected to the top inner wall of the pre-cleaning treatment box via bolts, and its installation height can be adjusted according to the wafer thickness. The brush surface of the dust removal component is set facing the conveying surface of the conveying and adsorption mechanism, with a 0.5-1mm gap reserved between the brush and the conveying surface to ensure that the brush can contact the coarse particles on the upper surface of the wafer without damaging the wafer. It is used to sweep the upper surface of the wafer fixed on the conveying and adsorption mechanism to specifically remove coarse particles with strong adsorption force.

[0026] In some embodiments, the conveying and adsorption mechanism includes: a conveyor belt 5, a conveyor shaft 6, an adsorption plate 7, and a gas source assembly 8; Two conveyor shafts 6 are provided, and both ends of them are rotatably connected to the inner wall of the pre-cleaning treatment box 2. One end of one conveyor shaft 6 passes through the pre-cleaning treatment box 2 and is connected to a servo motor 12 connected to the surface of the pre-cleaning treatment box 2. One of the conveying shafts 6 is rotatably connected to the other end of the first guide cleaning assembly, and the other conveying shaft 6 is connected to the bottom end face of the pre-cleaning treatment box 2 through a support plate; The conveyor belt 5 is sleeved between the conveyor shafts 6, and the conveyor belt 5 is provided with an array of through holes; The top end face of the conveyor belt 5 is flush with the top end face of the first guide and cleaning assembly; The adsorption plate 7 is located between the conveyor belts 5, and its two sides are fixedly connected to the inner wall of the pre-cleaning treatment box 2 respectively. The top end face of the adsorption plate 7 is provided with an array of adsorption holes. The adsorption holes are connected to the air source assembly 8 located on the outer surface of the pre-cleaning treatment box 2 through pipes. The pipes extend out from one side of the adsorption plate 7. The dust removal component is positioned facing the upper surface of the conveyor belt 5 and is spaced apart from the conveyor belt.

[0027] The two ends of the conveyor shaft are rotatably connected to the inner wall of the pre-cleaning treatment box via deep groove ball bearings; one end of one of the conveyor shafts passes through the side wall of the pre-cleaning treatment box and is connected to the output end of a servo motor fixed on the outer surface of the pre-cleaning treatment box via a coupling, providing power for the operation of the conveyor belt; the conveyor shaft near the first guide cleaning assembly is rotatably connected to the discharge end of the first guide cleaning assembly via an arc-shaped transition plate, and the conveyor shaft away from the first guide cleaning assembly is fixedly connected to the bottom end face of the pre-cleaning treatment box via an L-shaped stainless steel support plate; The adsorption plate is made of aluminum alloy and is located between the upper and lower layers of the conveyor belt. Its two sides are fixedly connected to the inner wall of the pre-cleaning treatment box by bolts. Adsorption holes are arranged in an array along the width direction of the conveyor belt on the top end face of the adsorption plate. Dustproof nets are embedded in the adsorption holes. The adsorption holes are connected to the air source assembly set on the outer surface of the pre-cleaning treatment box through PVC pipes. The pipes pass out from one side of the adsorption plate and extend to the outside of the pre-cleaning treatment box. The brush of the dust removal component is positioned facing the upper surface of the conveyor belt, and there is a gap between the brush and the upper surface of the conveyor belt. The gap between the brush and the conveyor belt can be adjusted by an electric telescopic rod.

[0028] In some embodiments, the dust removal assembly includes: an electrically telescopic rod 9 and a brush 10; The electric telescopic rod 9 is connected to the top end face of the pre-cleaning treatment box 2. The output end of the electric telescopic rod 9 is connected to the mounting frame. The brush 10 is provided on the lower end face of the mounting frame. The bristles of the brush 10 are oriented towards the conveyor belt, and there is a gap between them.

[0029] The electric telescopic rod uses a small electric push rod of model DTZ100. Its fixed end is fixedly connected to the inner wall of the top end face of the pre-cleaning treatment box by bolts, and its output end is detachably connected to the mounting bracket by bolts. The mounting bracket is an aluminum alloy rectangular frame with a brush slot on its lower end. The brush bristles are made of hard nylon and contain conductive fibers (to eliminate static electricity and prevent coarse particles from being re-adsorbed).

[0030] In some embodiments, the dust collection assembly includes: a power pump set 11 and a filter; The power pump unit 11 is externally connected to the pre-cleaning treatment box 2; The pre-cleaning treatment box 2 is provided with an array of through holes, which are distributed on one side of the first guide cleaning component and the second guide cleaning component; The input end of the power pump set 11 is connected to the through hole through a pipe, and the output end of the power pump set 11 is connected to the filter.

[0031] The power pump unit uses a centrifugal fan and is fixed to the outer side wall of the pre-cleaning treatment box by a bracket; A series of through circular holes are arranged on the side wall of the pre-cleaning treatment box along the area below the first guide cleaning component and the second guide cleaning component. The inside of the through holes is machined into a flared shape (to increase the suction area of ​​coarse particles). The input end of the power pump unit is connected to the through holes through a PVC manifold pipe, and a valve is installed on the manifold pipe. The filter uses a HEPA high-efficiency filter, and its inlet is connected to the output of the power pump unit through a pipe; a drawer-type coarse particle collection box is set at the bottom of the filter to prevent coarse particles from being directly discharged and polluting the environment.

[0032] In addition, the bottom of the pre-cleaning chamber is fixedly connected to a discharge pipe located on the right side of the second guide cleaning assembly, which is used to discharge the wafers inside the pre-cleaning chamber.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A coarse particle removal device for a chip manufacturing process, characterized in that, include: Pre-cleaning processing box is used to receive wafers that have been polished and are about to enter the photolithography process in chip manufacturing; The chip inspection device is connected to the pre-cleaning treatment box through a pipe and is used to detect the residual particles on the wafer surface to prevent substandard wafers from flowing into the photolithography process. The dust collection component has its output end connected to the pre-cleaning treatment box and is used to extract coarse particles that fall off during the wafer cleaning process in the pre-cleaning treatment box in real time. The guide assembly is connected to the interior of the pre-cleaning chamber and is used to guide and transport the wafers entering the pre-cleaning chamber, while simultaneously removing coarse particles from the wafer surface. The guiding components include: a first guiding and cleaning component and a second guiding and cleaning component, both of which are inclined. The first guide cleaning component is located close to the chip detection device, and one end of it is connected to the inner wall of the pre-cleaning treatment box. It is used to receive the wafers entering the pre-cleaning treatment box and clean the residual coarse particles on the lower surface of the wafers. One end of the second guide cleaning component is connected to the other end of the first guide cleaning component, and both sides of the second guide cleaning component are connected to the inner wall of the pre-cleaning treatment box, respectively. The second guide cleaning component is used to clean coarse particles on the upper surface of the wafer that slides from the first guide cleaning component.

2. The coarse particle removal device for chip manufacturing process according to claim 1, characterized in that, The first guiding and cleaning assembly includes: a guide plate and a screen; The guide plate is inclined downward, with one end connected to the inner wall of the pre-cleaning treatment tank and the other end connected to the second guide cleaning assembly; The guide plate is provided with through slots at intervals, and each slot is connected to a screen, with the top of the screen flush with the top end face of the guide plate.

3. The coarse particle removal device for chip manufacturing process according to claim 1, characterized in that, The second guiding cleaning assembly includes: a conveying and adsorption mechanism and a dust removal assembly; One end of the conveying and adsorption mechanism is connected to the other end of the first guiding and cleaning component; The dust removal component is connected to the top inner wall of the pre-cleaning treatment box, and the brush surface of the dust removal component is arranged facing the conveying and adsorption mechanism.

4. The coarse particle removal device for chip manufacturing process according to claim 3, characterized in that, The conveying and adsorption mechanism includes: a conveyor belt, a conveyor shaft, an adsorption plate, and a gas source assembly; Two conveyor shafts are provided, and both ends of the conveyor shafts are rotatably connected to the inner wall of the pre-cleaning treatment box. One end of the conveyor shaft passes through the pre-cleaning treatment box and is connected to a servo motor connected to the surface of the pre-cleaning treatment box. One of the conveying shafts is rotatably connected to the other end of the first guide cleaning assembly, and the other conveying shaft is connected to the bottom end face of the pre-cleaning treatment box via a support plate; The conveyor belt is sleeved between the conveyor shafts, and the conveyor belt is provided with an array of through holes; The top end face of the conveyor belt is flush with the top end face of the first guide cleaning assembly; The adsorption plate is located between the conveyor belts, and its two sides are fixedly connected to the inner wall of the pre-cleaning treatment box respectively. The top end face of the adsorption plate is provided with an array of adsorption holes, which are connected to an air source assembly located on the outer surface of the pre-cleaning treatment box through pipes, and the pipes extend out from one side of the adsorption plate. The dust removal component is positioned facing the upper surface of the conveyor belt and is spaced apart from the conveyor belt.

5. The coarse particle removal device for chip manufacturing process according to claim 4, characterized in that, The dust removal assembly includes: an electric telescopic rod and a brush; The electric telescopic rod is connected to the top end face of the pre-cleaning treatment box, and the output end of the electric telescopic rod is connected to the mounting frame. The brush is provided on the lower end face of the mounting frame, with the brush bristles facing the conveyor belt and a gap between them.

6. The coarse particle removal device for chip manufacturing process according to claim 1, characterized in that, The dust collection assembly includes: a power pump set and a filter; The power pump unit is externally connected to the pre-cleaning treatment tank; The pre-cleaning treatment box is provided with an array of through holes, which are distributed on one side of the first guide cleaning component and the second guide cleaning component; The input end of the power pump unit is connected to the through hole via a pipe, and the output end of the power pump unit is connected to the filter.

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