A semiconductor device conveying apparatus

Abstract

A kind of conveying device of semiconductor device belongs to the technical field of semiconductor manufacturing.It includes conveying track, and is provided with the bearing mechanism for placing semiconductor device on the surface of conveying track, it is characterized in that: conveying track is simultaneously passed through multiple execution stations arranged along its length direction, bearing mechanism is arranged on the surface of conveying track, bearing mechanism is independently reciprocated on the surface of conveying track, and the front and rear of adjacent two bearing mechanisms are butt-jointed, and bearing mechanism is passed at least one execution station on the path of reciprocation.In the technical scheme of the present application, multiple bearing mechanisms for placing semiconductor device are arranged on the surface of conveying track, and the processing of chip at different execution stations and butt-jointed transfer are realized in the reciprocation process of adjacent bearing mechanism, so that the processing efficiency of semiconductor device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and specifically to a semiconductor device conveying device. Background Technology

[0002] In existing chip manufacturing processes, multiple steps are required. Taking the Clip packaging process as an example, after the chip is mounted onto the frame, it still needs to go through multiple steps such as chip dispensing, jumper installation, frame loading, and receiving. To achieve the above steps, corresponding workstations need to be set up on the entire chip assembly line, and corresponding mechanisms need to be arranged at different workstations. For example, a dispensing mechanism is arranged at the chip dispensing workstation, and a punching mechanism and a pick-up mechanism are arranged at the jumper installation workstation.

[0003] In existing chip assembly lines, the frame containing the chip passes through all the workstations in sequence to complete all the processes. The entire movement of the frame is achieved by a conveying mechanism (such as a guide rail), as described in the Chinese invention patent with application number 202111674902.X, application date December 31, 2021, entitled "Fully Automatic Transistor CLIP Assembly Line and Method"; the Chinese utility model patent with application number 202021382135.6, application date July 14, 2020, entitled "Automatic Chip Jumper Installation Machine"; and the Chinese invention patent with application number 202411462375.X, application date October 18, 2024, entitled "Copper Sheet Bonding Equipment for Semiconductor Device Punching and Feeding and its Assembly Method".

[0004] However, existing technologies, including the aforementioned solutions, have low efficiency. For example, in the jumper installation process, multiple jumpers are typically arranged in the chip's jumper layout, and different jumpers may even be layered vertically. In existing technologies, only one feeding device and a corresponding picking device are usually set up at each workstation. This approach requires multiple workstations for jumper placement and removal, or multiple round trips using a single picking device, which easily leads to decreased efficiency and reliability. Therefore, the applicant of this application aims to design a completely new technical solution to realize the entire assembly process of the chip frame. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a semiconductor device conveying device that arranges multiple carrier mechanisms for placing semiconductor devices on the surface of the conveying guide rail, and realizes the processing and docking transfer of chips at different execution stations during the reciprocating operation of adjacent carrier mechanisms, thereby improving the semiconductor device processing efficiency.

[0006] The technical solution adopted by this utility model to solve its technical problem is: the semiconductor device conveying device includes a conveying guide rail, and a carrier mechanism for placing semiconductor devices is provided on the surface of the conveying guide rail. The feature is that: the conveying guide rail passes through multiple execution stations arranged along its length direction at the same time, multiple carrier mechanisms are arranged on the surface of the conveying guide rail, the carrier mechanisms reciprocate independently on the surface of the conveying guide rail, and two adjacent carrier mechanisms are connected front and rear, and the carrier mechanism passes through at least one execution station on the reciprocating path.

[0007] Preferably, the docking point between two adjacent carrier mechanisms is a temporary storage station, and a temporary storage mechanism for grasping and transferring semiconductor devices is provided at the temporary storage station.

[0008] Preferably, a plurality of reciprocating sliders are provided on the surface of the conveying guide rail, and a bearing mechanism is fixed on the surface of each slider.

[0009] Preferably, the temporary storage mechanism includes a temporary storage bracket, a lifting cylinder is fixed at the end of the temporary storage bracket, the piston rod of the lifting cylinder is vertically downward, a temporary storage gripper cylinder is provided at the piston rod of the lifting cylinder, the temporary storage gripper cylinder faces downward directly towards the conveying guide rail, and a temporary storage gripper is fixed at the output end of the temporary storage gripper cylinder.

[0010] Preferably, an output mechanism is also provided at the output end of the conveying guide rail.

[0011] Preferably, the output mechanism includes an output module, an output frame is slidably mounted on the surface of the output module, a liftable lifting plate is provided on the end face of the output frame facing the conveying guide rail, an output gripper cylinder is fixed at the bottom of the lifting plate, and an output gripper is fixed at the output end of the gripper cylinder.

[0012] Preferably, a receiving groove for accommodating semiconductor devices is provided on the surface of the supporting mechanism, an opening is provided at one corner of the receiving groove, a clamping plate is provided at the opening, and a clamping cylinder for driving the clamping plate is also provided inside the supporting mechanism.

[0013] Compared with the prior art, the beneficial effects of this utility model are: In the technical solution of this application, multiple carrier mechanisms for placing semiconductor devices are arranged on the surface of the conveyor rail. During the reciprocating operation of adjacent carrier mechanisms, the chip is processed and docked for transfer at different execution stations, thereby improving the processing efficiency of semiconductor devices.

[0014] By setting a temporary storage mechanism at the docking point of the two carrier mechanisms, the transfer of semiconductor devices is assisted by the two carrier mechanisms, and the transfer and processing of semiconductor devices are further automated.

[0015] By setting an output mechanism at the end of the transport guide, the semiconductor device can be further transferred. Attached Figure Description

[0016] Figure 1 Axonometric drawing of a semiconductor device assembly line.

[0017] Figure 2 for Figure 1 The diagram below shows the actuator at the workstation, omitting the actual actuator.

[0018] Figure 3 This is a front view of the output mechanism of the semiconductor device delivery device.

[0019] Figure 4 for Figure 3 The left view.

[0020] Figure 5 This is an isometric drawing of the carrier mechanism of the semiconductor device transport device.

[0021] Figure 6 The carrier mechanism for the transport of semiconductor devices is different from Figure 5 Another isometric view.

[0022] Figure 7 This is a top view of the carrier mechanism of the semiconductor device transport device.

[0023] Figure 8 This is a front view of the carrier mechanism of the semiconductor device transport device.

[0024] Figure 9 This is an isometric view of the temporary storage mechanism for the transport device of semiconductor devices.

[0025] Figure 10 This is a top view of the temporary storage mechanism for the semiconductor device transport device.

[0026] The components are as follows: 1. Working surface; 2. Workbench; 3. Execution station; 4. Conveying guide rail; 5. Bearing mechanism; 6. Temporary storage mechanism; 7. Output mechanism; 8. Output transmission mechanism; 9. Output frame; 10. Lifting plate; 11. Output gripper cylinder; 12. Output distance sensor; 13. Output gripper; 14. Output column; 15. Output beam; 16. Output module; 17. Lifting drive motor; 18. Clamping slot; 19. Base plate; 20. Top plate; 21. Proximity sensor; 22. Receiving slot; 23. Clamping plate; 24. Clamping cylinder; 25. Temporary storage column; 26. Temporary storage beam; 27. Lifting cylinder; 28. Lifting frame; 29. ​​Temporary storage distance sensor; 30. Temporary storage gripper cylinder; 31. Temporary storage gripper. Detailed Implementation

[0027] Figures 1-10This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figures 1-10 The present invention will be further described below.

[0028] like Figure 2 As shown, a semiconductor device conveying device (hereinafter referred to as the conveying device) includes a conveying guide rail 4 arranged on the surface of a worktable 2. The conveying guide rail 4 is implemented using a linear module known in the art. The surface of the worktable 2 is a working surface 1. The conveying guide rail 4 is arranged along the length direction of the working surface 1. The input end of the conveying guide rail 4 extends to the outside of the working surface 1 for docking with the previous process to transfer the semiconductor device with the chip mounted onto its surface. An output mechanism 7 is provided at the output end of the conveying guide rail 4 for transferring the semiconductor device that has completed the corresponding process on the working surface 1 to the subsequent process.

[0029] Combination Figure 1 Multiple execution stations 3 are arranged on the surface of the working surface 1, and the multiple execution stations 3 are arranged along the extension direction of the conveying guide rail 4, which runs through all the execution stations 3. Each execution station 3 is equipped with a corresponding execution mechanism, such as a dispensing mechanism for dispensing adhesive to the chip, or a punching mechanism and a pick-up mechanism for transferring jumpers to the frame; if the chip layout has multiple layers (multiple jumpers), punching mechanisms and pick-up mechanisms can also be arranged at adjacent execution stations 3. The execution mechanisms arranged at the execution stations 3 are all implemented using methods known in the art. In this conveying device, the execution mechanisms themselves are not modified, therefore the specific structure and implementation method of the execution mechanisms will not be described in detail here.

[0030] Multiple sliders, numbered 1 to N, are arranged on the surface of the conveyor rail 4. Each slider also has a support mechanism 5 for placing semiconductor devices. Two adjacent sliders reciprocate on the surface of the conveyor rail 4 to exchange semiconductor devices. A temporary storage station is provided between two adjacent execution stations 3, with a temporary storage mechanism 6 at each station. The temporary storage mechanism 6 serves as the junction for two adjacent sliders, assisting the support mechanism 5 on the surfaces of the two sliders in transferring the semiconductor devices.

[0031] Specifically, the arrangement of sliders 1 to N is as follows: slider 1 is arranged between the input end of the conveyor rail 4 and the first temporary storage station, and only travels back and forth between the input end of the conveyor rail 4 and the first temporary storage station; slider 2 is arranged between the first temporary storage station and the second temporary storage station, and only travels back and forth between the first temporary storage station and the second temporary storage station; ...; slider N is arranged between the last temporary storage station and the output mechanism 7, and only travels back and forth between the last temporary storage station and the output mechanism 7.

[0032] The carrier mechanism 5, which travels between the input end of the conveyor rail 4 and the first temporary storage station, receives the semiconductor device from the previous process at the input end of the conveyor rail 4, moves to the first execution station 3 for processing, and continues to move to the first temporary storage station after processing. At the first temporary storage station, the temporary storage mechanism 6 removes the semiconductor device from the surface of the carrier mechanism 5. After unloading, the carrier mechanism 5 moves in the opposite direction to the input end of the conveyor rail 4, ready to receive the next semiconductor device. The carrier mechanism 5, which travels between the first and second temporary storage stations, moves to the first temporary storage station after unloading the semiconductor device. The temporary storage mechanism 6 at the first temporary storage station transfers the temporarily stored semiconductor device to its surface and sends it to the second execution station 3 for processing. After processing, it is sent to the second temporary storage station, and so on, until the semiconductor device processed at the final execution station 3 is sent to the output mechanism 7 for output to the subsequent process.

[0033] like Figures 3-4 As shown, the output mechanism 7 includes two output columns 14 arranged vertically side-by-side on the surface of the working surface 1. An output beam 15 is horizontally arranged on the top of each output column 14, perpendicular to the arrangement direction of the conveyor rail 4. An output module 16 is also arranged on the surface of the output beam 15, and the output module 16 is also implemented using a linear module as known in the art. An output frame 9 is fixed to a slider on the surface of the output module 16. A horizontal plate on the back of the output frame 9 is fixed to the surface of the slider of the output module 16. A vertical plate is vertically fixed to the end face of the output frame 9 facing the conveyor rail 4, and the vertical plate is located outside the output module 16.

[0034] A guide rail is vertically fixed to the surface of the vertical plate of the output frame 9, and a lifting plate 10 is clamped onto the surface of the guide rail. An output transmission mechanism 8 is also provided on one side of the guide rail on the surface of the vertical plate, and a lifting drive motor 17 is provided on the surface of the horizontal plate. The motor shaft of the lifting drive motor 17 passes through the vertical plate and is connected to the output transmission mechanism 8. The output transmission mechanism 8 is implemented using a synchronous belt mechanism, including two vertically arranged pulleys and a synchronous belt installed between the two pulleys. After the motor shaft of the lifting drive motor 17 passes through the vertical plate, it is coaxially fixed to one of the pulleys (the drive pulley). The side of the lifting plate 10 is fixed to the synchronous belt. Therefore, when the lifting drive motor 17 rotates, it can drive the lifting plate 10 to move up and down in the vertical direction under the guidance of the guide rail through the output transmission mechanism 8.

[0035] An output gripper cylinder 11 is fixed at the bottom of the lifting plate 10, and an output gripper 13 is fixed at the output end of the output gripper cylinder 11. An output ranging sensor 12 is set at each of the two output grippers 13.

[0036] like Figures 9-10 As shown, the temporary storage mechanism 6 includes a temporary storage column 25 vertically mounted on the surface of the working surface 1. A temporary storage beam 26 is horizontally mounted on the top of the temporary storage column 25, and the temporary storage beam 26 is perpendicular to the arrangement direction of the conveying guide rail 4. A lifting cylinder 27 is fixed to the end of the temporary storage beam 26, and the piston rod of the lifting cylinder 27 points vertically downward. A lifting frame 28 is fixed to the side of the piston rod of the lifting cylinder 27, and a temporary storage gripper cylinder 30 is fixed to the bottom of the lifting frame 28, with the temporary storage gripper cylinder 30 pointing downward directly towards the conveying guide rail 4. A set of temporary storage grippers 31 is fixed relative to the output end of the temporary storage gripper cylinder 30, and a temporary storage distance sensor 29 is respectively mounted at each of the two temporary storage grippers 31.

[0037] like Figures 5-8 As shown, the supporting mechanism 5 includes a vertically spaced base plate 19 and a top plate 20. The base plate 19 is used to fix the corresponding slider, and the base plate 19 and the top plate 20 are connected as a whole by multiple connecting posts at the four corners. A receiving groove 22 for accommodating semiconductor devices is formed on the surface of the top plate 20. Clamping grooves 18 are further formed outward at opposite ends of the receiving groove 22, and the bottom of the clamping grooves 18 is lower than the bottom of the receiving groove 22. A groove is also formed in the middle of the receiving groove 22, and a proximity sensor 21 is arranged in the groove, with the entire proximity sensor 21 located within the groove.

[0038] An opening communicating with the receiving groove 22 is provided at one corner of the top plate 20. A clamping plate 23 is provided at this opening, and a clamping cylinder 24 is fixed on the bottom surface of the top plate 20. The piston rod of the clamping cylinder 24 is connected to the clamping plate 23. When the proximity sensor 21 detects that a semiconductor device has been placed in, the clamping cylinder 24 is activated, driving the clamping plate 23 to move towards one side of the receiving groove 22, thereby fixing the semiconductor device in the receiving groove 22.

[0039] The specific working process and working principle are as follows: The carrier mechanism 5, which travels back and forth between the input end of the conveyor rail 4 and the first temporary storage station, receives the semiconductor device sent from the previous process at the input end of the conveyor rail 4. At this time, the semiconductor device is located in the receiving groove 22 on the surface of the carrier mechanism 5. After the proximity sensor 21 detects that the semiconductor device has been placed, the clamping cylinder 24 is activated, driving the clamping plate 23 to move to one side of the receiving groove 22, and the semiconductor device is fixed in the receiving groove 22 by the clamping plate 23.

[0040] The carrier mechanism 5, driven by its bottom slider, moves to the first execution station 3 for processing. After completing the processing at the first execution station 3, it continues to move to the first temporary storage station. At this time, the lifting cylinder 27 actuates, sending the temporary storage gripper cylinder 30 to the carrier mechanism 5 via the lifting frame 28. The temporary storage grippers 31 on both sides enter the clamping groove 18, and the temporary storage gripper cylinder 30 actuates, clamping the semiconductor device through the temporary storage grippers 31. After the clamping cylinder 24 actuates to release the semiconductor device, the piston rod of the lifting cylinder 27 rises, removing the semiconductor device from the surface of the carrier mechanism 5. After unloading, the carrier mechanism 5 moves in the opposite direction to the input end of the conveyor rail 4, ready to receive the next semiconductor device.

[0041] The carrier mechanism 5, which travels between the first and second temporary storage stations, moves to the first temporary storage station after unloading the semiconductor device. At the first temporary storage station, the lifting cylinder 27 in the temporary storage mechanism 6 actuates, sending the temporary storage gripper cylinder 30 to the carrier mechanism 5 via the lifting frame 28. The temporary storage grippers 31 on both sides enter the clamping groove 18, transferring the semiconductor device to the receiving groove 22. The temporary storage gripper cylinder 30 actuates to release the semiconductor device. After the proximity sensor 21 detects the semiconductor device being placed, the clamping cylinder 24 actuates to fix the semiconductor device, and the piston rod of the lifting cylinder 27 rises. Then, the carrier mechanism 5 sends the semiconductor device loaded on its surface to the second execution station 3 for processing. After processing, it is sent to the second temporary storage station, and so on, until the semiconductor device, after processing at the final execution station 3, is sent to the output mechanism 7 for output to the subsequent process.

[0042] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A semiconductor device transport device, comprising a transport guide rail (4), wherein a support mechanism (5) for placing semiconductor devices is provided on the surface of the transport guide rail (4), characterized in that: The conveying guide rail (4) passes through multiple execution stations (3) arranged along its length. Multiple carrying mechanisms (5) are arranged on the surface of the conveying guide rail (4). The carrying mechanisms (5) reciprocate independently on the surface of the conveying guide rail (4), and two adjacent carrying mechanisms (5) are connected front and back. The carrying mechanism (5) passes through at least one execution station (3) on the reciprocating path.

2. The semiconductor device conveying device according to claim 1, characterized in that: The docking point of two adjacent carrier mechanisms (5) is a temporary storage station, and a temporary storage mechanism (6) is set up at the temporary storage station to realize the gripping and transfer of semiconductor devices.

3. The semiconductor device conveying device according to claim 1, characterized in that: Multiple reciprocating sliders are provided on the surface of the conveying guide rail (4), and a bearing mechanism (5) is fixed on the surface of each slider.

4. The semiconductor device conveying device according to claim 2, characterized in that: The temporary storage mechanism (6) includes a temporary storage bracket, and a lifting cylinder (27) is fixed at the end of the temporary storage bracket. The piston rod of the lifting cylinder (27) is vertically downward. A temporary storage gripper cylinder (30) is provided at the piston rod of the lifting cylinder (27). The temporary storage gripper cylinder (30) faces downward directly towards the conveying guide rail (4). A temporary storage gripper (31) is fixed at the output end of the temporary storage gripper cylinder (30).

5. The semiconductor device conveying device according to claim 1, characterized in that: An output mechanism (7) is also provided at the output end of the conveying guide rail (4).

6. The semiconductor device conveying device according to claim 5, characterized in that: The output mechanism (7) includes an output module (16), an output frame (9) is slidably mounted on the surface of the output module (16), a liftable lifting plate (10) is provided on the end face of the output frame (9) facing the conveying guide rail (4), an output gripper cylinder (11) is fixed at the bottom of the lifting plate (10), and an output gripper (13) is fixed at the output end of the gripper cylinder (11).

7. The semiconductor device conveying device according to claim 1, characterized in that: A receiving groove (22) for accommodating semiconductor devices is provided on the surface of the support mechanism (5). An opening is provided at one corner of the receiving groove (22), and a clamping plate (23) is provided at the opening. A clamping cylinder (24) for driving the clamping plate (23) is also provided inside the support mechanism (5).

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