Wafer self-positioning lifting and feeding mechanism
The wafer self-positioning lifting and feeding mechanism, through the combination design of arc groove structure and pneumatic gripper, realizes the self-positioning and precise positioning of the wafer, which solves the problem of the high difficulty of operating the wafer positioning groove in the existing technology, and improves the efficiency and accuracy of wafer processing or inspection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DEXING YIFA POWER SEMICON CO LTD
- Filing Date
- 2025-08-16
- Publication Date
- 2026-07-24
AI Technical Summary
In the existing technology, the closed-loop structure of the wafer positioning groove edge makes wafer insertion and removal operations difficult, and the tight fit between the positioning groove and the wafer affects the operation efficiency.
The wafer self-positioning lifting and loading mechanism utilizes a carrier positioning slot with an arc groove structure and pneumatic grippers, combined with the design of a lifting seat and slider, to achieve initial positioning, lifting and precise positioning of the wafer. Loading is completed by inward movement of the clamping plate to ensure positional accuracy.
It simplifies wafer insertion and removal operations, improves positioning accuracy and automation level, reduces operational difficulty, and ensures the accuracy of subsequent processing or inspection.
Smart Images

Figure CN224556257U_ABST