Wafer self-positioning lifting and feeding mechanism

The wafer self-positioning lifting and feeding mechanism, through the combination design of arc groove structure and pneumatic gripper, realizes the self-positioning and precise positioning of the wafer, which solves the problem of the high difficulty of operating the wafer positioning groove in the existing technology, and improves the efficiency and accuracy of wafer processing or inspection.

CN224556257UActive Publication Date: 2026-07-24DEXING YIFA POWER SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DEXING YIFA POWER SEMICON CO LTD
Filing Date
2025-08-16
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

In the existing technology, the closed-loop structure of the wafer positioning groove edge makes wafer insertion and removal operations difficult, and the tight fit between the positioning groove and the wafer affects the operation efficiency.

Method used

The wafer self-positioning lifting and loading mechanism utilizes a carrier positioning slot with an arc groove structure and pneumatic grippers, combined with the design of a lifting seat and slider, to achieve initial positioning, lifting and precise positioning of the wafer. Loading is completed by inward movement of the clamping plate to ensure positional accuracy.

Benefits of technology

It simplifies wafer insertion and removal operations, improves positioning accuracy and automation level, reduces operational difficulty, and ensures the accuracy of subsequent processing or inspection.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224556257U_ABST
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Abstract

The utility model discloses a kind of wafer self-positioning jacking feeding mechanisms, it includes: pedestal, fixed plate, lifting seat, carrier and pneumatic clamping jaw, lifting seat is set on pedestal liftablely, first support located in the lifting seat both sides is provided on pedestal, fixed plate is set in the top of two sides first support, transversely setting slide rail on lifting seat, two sliding blocks are provided on slide rail, carrier is set on sliding block, the top surface recessed of carrier is provided with the positioning slot corresponding with one side of wafer, positioning slot opening extends to the inside edge of carrier, wafer is set on the positioning slot of two carriers, avoiding hole located above wafer is provided on fixed plate, pneumatic clamping jaw is set in the bottom of fixed plate and located in the rear of avoiding hole, the output end of pneumatic clamping jaw is symmetrically provided with the suspension rod extending to two sides, clamping plate corresponding with carrier is provided on suspension rod and extends forward, the jacking feeding of wafer can be carried out, positioning accuracy is ensured, and the difficulty of wafer placement and removal operation is reduced.
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