Load bearing device, process chamber and semiconductor process equipment

Abstract

The application discloses a bearing device, a process chamber and a semiconductor process equipment, and belongs to the technical field of semiconductor processing. At least part of the bearing device is arranged in a chamber body of the process chamber. The bearing device comprises a bearing disc and a connecting shaft. The bearing disc is provided with an in-disk heater for heating the bearing disc. The connecting shaft is coaxially connected with the bearing disc. An in-shaft heater is arranged in the connecting shaft. The in-shaft heater is connected with the bearing disc and used for heating the bearing disc. The in-shaft heater can assist in heating the bearing disc to compensate for heat loss of the part opposite to the connecting shaft of the bearing disc, improve the temperature uniformity of the bearing disc, and thus improve the problem of low temperature in the center area of the wafer, improve the density and film thickness consistency of the wafer surface film, and thus improve the yield of semiconductor devices.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a carrier device, a process chamber, and semiconductor process equipment. Background Technology

[0002] In the field of semiconductor processing technology, the carrier device with heating function is a key component of semiconductor process equipment. The carrier device includes a carrier disk and a connecting shaft coaxially connected to the carrier disk. The connecting shaft is connected to the cavity wall of the process chamber, allowing the carrier device to be installed within the process chamber. The carrier disk carries and heats the wafer, enabling the wafer to undergo processing within the required process temperature range. The temperature uniformity of the carrier disk directly affects the density and thickness consistency of the thin film on the wafer surface.

[0003] In related technologies, the connecting shaft can easily carry away the heat from the part of the carrier disk opposite to the connecting shaft, which can easily cause the temperature of that part of the carrier disk to be lower than the temperature of other parts of the carrier disk, resulting in uneven temperature distribution of the carrier disk. This can easily cause the temperature of the central area of ​​the wafer to be lower, leading to defects such as uneven film on the wafer. Utility Model Content

[0004] The purpose of this application is to provide a carrier device, a process chamber, and a semiconductor process equipment that can solve the problem of uneven temperature distribution of the carrier disk in related technologies.

[0005] In a first aspect, embodiments of this application provide a support device, at least a portion of which is disposed within the chamber body of a process chamber. The support device includes:

[0006] A support plate is provided with an in-plate heater, which is used to heat the support plate;

[0007] A connecting shaft is coaxially connected to the bearing plate. An internal heater is provided inside the connecting shaft. The internal heater is connected to the bearing plate and is used to heat the bearing plate.

[0008] Secondly, embodiments of this application also provide a process chamber, which includes a chamber body and the aforementioned support device, wherein at least a portion of the support device is disposed within the chamber body.

[0009] Thirdly, embodiments of this application also provide a semiconductor process apparatus, which includes the aforementioned process chamber and transfer chamber. A wafer transfer device is disposed in the transfer chamber, and the wafer transfer device is used to transfer a wafer between the process chamber and the transfer chamber.

[0010] In this embodiment, by providing an in-shaft heater within the connecting shaft, the in-shaft heater can provide auxiliary heating to the carrier disk, thereby compensating for heat loss in the portion of the carrier disk opposite to the connecting shaft, improving the temperature uniformity of the carrier disk, and thus improving the problem of low temperature in the central region of the wafer, improving the density and thickness consistency of the thin film on the wafer surface, which is beneficial to improving the yield of semiconductor devices. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of the support device disclosed in the embodiments of this application;

[0012] Figure 2 This is a diagram showing the connection relationship between the internal heater and the connector disclosed in the embodiments of this application;

[0013] Figure 3 This is a partial cross-sectional view of the support device disclosed in the embodiments of this application;

[0014] Figure 4 This is a partial cross-sectional view of the internal heater disclosed in the embodiments of this application.

[0015] Explanation of reference numerals in the attached figures:

[0016] 100 - Support plate; 110 - First air passage; 200 - In-plate heater; 210 - Second power supply component;

[0017] 220 - First insulating tube; 230 - Second temperature sensing element; 240 - Second insulating tube;

[0018] 300 - Connecting shaft; 310 - Second air vent channel; 400 - Internal heater; 410 - Internal heating element;

[0019] 411-First power supply component; 4111-First positive power supply line; 4112-First negative power supply line;

[0020] 420 - First temperature sensing element; 421 - First output cable; 430 - Reflector; 431 - Notch;

[0021] 440 - Cage; 441 - First part; 442 - Second part; 450 - Insulating and thermally conductive element;

[0022] 500 - Connector; 510 - First connecting part; 511 - Third air vent channel; 520 - Second connecting part;

[0023] 600 - Insulating sleeve; 610 - Insulating hole; 620 - Center hole; 630 - Boss; 700 - Elastic element;

[0024] 800 - First sealing ring; 900 - Second sealing ring. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0026] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0027] In related technologies, according to the heat transfer theory of rarefied gases, the lower the pressure, the worse the heat transfer effect of the gas. Because the central region of the carrier disk has a first vent channel, the back pressure in the central region of the wafer is lower than in other regions, which easily leads to a cold spot in the center of the wafer, meaning the temperature in the central region is lower than in other regions. Furthermore, since the carrier device is used in the vacuum environment of the process chamber, the connection between the connecting shaft and the main body of the process chamber needs to be sealed using a sealing structure to achieve the vacuum environment within the process chamber. To ensure the sealing performance of the sealing structure, a cooling structure is usually provided to cool the sealing structure and prevent it from failing. This design easily leads to the connecting shaft being affected by the cooling structure, causing heat from the central region of the carrier disk to be conducted to the cooling structure, resulting in the temperature in the central region of the carrier disk being lower than in other regions, thus causing uneven temperature distribution on the carrier disk. Therefore, to solve the problem of uneven temperature distribution on the carrier disk, this application provides a carrier device.

[0028] The carrier device, process chamber, and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0029] refer to Figures 1-4 The present application provides a carrier device, at least part of which can be used to be disposed in the chamber body of a process chamber. The carrier device may include a carrier disk 100 and a connecting shaft 300. The carrier disk 100 can be used to carry a wafer, and the connecting shaft 300 can be connected to the cavity wall of the chamber body so that the carrier device is fixed in the chamber body.

[0030] The carrier disk 100 may be equipped with an in-disk heater 200, which can be used to heat the carrier disk 100 so that the temperature of the wafer on the carrier disk 100 meets the process requirements. The connecting shaft 300 may be coaxially connected to the carrier disk 100, and an in-shaft heater 400 may be installed inside the connecting shaft 300. The in-shaft heater 400 may be connected to the carrier disk 100 and can be used to heat the carrier disk 100, so as to provide supplemental heating to the central area of ​​the carrier disk 100.

[0031] Here, the connecting shaft 300 is a hollow structure. The connecting shaft 300 and the bearing plate can be tightly welded. The inside of the connecting shaft 300 can be an atmospheric environment, and the outside of the connecting shaft 300 can be a vacuum environment. That is, the internal space of the main body of the chamber is a vacuum environment.

[0032] In this embodiment, by providing an in-spindle heater 400 within the connecting shaft 300, the in-spindle heater 400 can provide auxiliary heating to the carrier disk 100, compensating for heat loss in the portion of the carrier disk 100 opposite to the connecting shaft 300, improving the temperature uniformity of the carrier disk 100, and thus improving the problem of low temperature in the central region of the wafer, improving the density and thickness consistency of the thin film on the wafer surface, thereby contributing to improved yield of semiconductor devices. Furthermore, since the internal space of the connecting shaft 300 is not connected to the space outside the connecting shaft 300, providing an in-spindle heater 400 within the connecting shaft 300 does not easily affect the process environment within the process chamber.

[0033] In optional embodiments of this application, such as Figure 1 and Figure 2 As shown, the in-shaft heater 400 may include an in-shaft heating element 410 and a reflector 430. The in-shaft heating element 410 can be used to heat the carrier plate 100. The reflector 430 can be located on the side of the in-shaft heating element 410 away from the carrier plate 100. The side of the reflector 430 facing the carrier plate 100 can be a reflective surface, specifically, the side of the reflector 430 facing the carrier plate 100 can be a mirror surface. In this embodiment, the reflector 430 can reflect the heat of the in-shaft heating element 410 to the carrier plate 100, thereby reducing heat loss in the direction away from the carrier plate 100 and preventing the sealing ring between the connecting shaft 300 and the chamber body from failing due to excessive heat.

[0034] In other embodiments, the in-shaft heater 400 may also exclude the reflector 430.

[0035] Optionally, the edge of the reflector 430 can be fitted against the inner wall of the connecting shaft 300. This arrangement can reduce the gap between the reflector 430 and the inner wall of the connecting shaft 300, and can also serve as a physical barrier to isolate the airflow between the heated and non-heated areas. This can effectively suppress the transfer of heat to the non-heated areas and areas far from the heated areas, thereby further reducing heat loss.

[0036] Alternatively, the side of the reflector 430 facing away from the carrier plate 100 may be matte. This arrangement can enhance the emissivity of the reflector 430, thereby further reducing heat loss in the direction facing away from the carrier plate 100.

[0037] In an optional embodiment, the in-shaft heater 400 further includes a first power supply component 411. One end of the first power supply component 411 can be electrically connected to the in-shaft heating element 410, and the other end of the first power supply component 411 can be electrically connected to a power supply device to supply power to the in-shaft heating element 410. For example, the first power supply component 411 may include a first positive power supply line 4111 and a first negative power supply line 4112. One end of the first positive power supply line 4111 is electrically connected to the positive terminal of the in-shaft heating element 410, and the other end of the first positive power supply line 4111 is electrically connected to the positive terminal of the power supply device. One end of the first negative power supply line 4112 is electrically connected to the negative terminal of the in-shaft heating element 410, and the other end of the first negative power supply line 4112 is electrically connected to the negative terminal of the power supply device.

[0038] like Figure 2 and Figure 4 As shown, the in-shaft heater 400 may further include a retainer 440, which may include a first part 441 and a second part 442 connected to the first part 441. The in-shaft heating element 410 may be disposed outside the first part 441, and the second part 442 may be sleeved outside the first power supply element 411 and may be used to connect to the chamber body. In this embodiment, the second part 442 is connected to the chamber body, which can fix the retainer 440 inside the connecting shaft 300. The first part 441 can provide support and fixation for the in-shaft heating element 410, and the second part 442 sleeved outside the first power supply element 411 can, on the one hand, isolate and insulate the first power supply element 411 from other components to prevent short circuits between the first power supply element 411 and other components. On the other hand, it eliminates the need for an additional insulating structure outside the first power supply element 411, thereby simplifying the structure of the in-shaft heater 400 and reducing the space occupied by the in-shaft heater 400.

[0039] In other embodiments, the in-shaft heater 400 may not include the retainer 440. For example, the in-shaft heater 410 may be connected to the carrier plate 100, such as by bonding the in-shaft heater 410 to the carrier plate 100, or by providing a fixing part on the carrier plate 100 for fixing the in-shaft heater 410.

[0040] Optionally, such as Figure 2 As shown, the reflector 430 can be disposed on the circumferential outer side of the second part 442. In this embodiment, the second part 442 can support and fix the reflector 430, thus eliminating the need for additional structures to fix and support the reflector 430.

[0041] Of course, the reflector 430 may not be located on the outer periphery of the second part 442; for example, the reflector 430 may be located below the second part 442.

[0042] Alternatively, the in-shaft heater 400 may include at least two reflectors 430, which may be spaced apart along the axial direction of the connecting shaft 300. This arrangement can further prevent heat loss in the direction away from the bearing plate 100.

[0043] In this embodiment, as Figure 2 As shown, each reflector 430 is disposed on the circumferential outer side of the second part 442. Specifically, the reflector 430 is disposed on the outer side wall of the second part 442.

[0044] In some embodiments, such as Figure 2 As shown, the internal heating element 410 may include an armored heating tube, which is formed by a heating wire spirally wound around the outside of the first part 441. Alternatively, the internal heating element 410 can also heat the carrier plate 100 through radiation from a light source; for example, the internal heating element 410 can be a heating lamp. Here, the length of the first part 441 can be 50-60 mm, the area covered by the first part 441 is the heating zone, and the area covered by the second part 442 is the non-heating zone. The armored heating tube only heats the area within the first part 441.

[0045] In optional embodiments, such as Figure 1 and Figure 4 As shown, the in-spindle heater 400 may further include a first temperature sensing element 420, at least a portion of which may be located within the in-spindle heater 410 and used to detect the temperature of the in-spindle heater 410. This configuration allows for real-time monitoring of the temperature of the in-spindle heater 410, facilitating the monitoring of the temperature at the connection between the carrier disk 100 and the connecting shaft 300, thereby preventing issues where the temperature in the central region of the wafer fails to meet process requirements.

[0046] In other embodiments, the in-shaft heater 400 may also exclude the first temperature sensing element 420.

[0047] Optionally, the bearing device may also include a control unit, which may be electrically connected to the internal heating element 410 and the first temperature detection element 420. The control unit may adjust the heating temperature of the internal heating element 410 according to the detection signal of the first temperature detection element 420.

[0048] For example, the first temperature sensing element 420 can be a first thermocouple. The first thermocouple can be disposed within the first portion 441 of the retainer 440, and the first thermocouple includes a first output cable 421. The first output cable 421 can pass through the second portion 442 and be electrically connected to the control unit to facilitate the transmission of the detection signal to the control unit. In this embodiment, since the thermocouple can be made into a rod-shaped, wire-shaped, or armored structure, setting the first temperature sensing element 420 as a first thermocouple can facilitate its placement within the first portion 441 of the retainer 440, thereby making full use of the space within the retainer 440 and reducing the volume of the in-shaft heater 400.

[0049] Here, the cold junction cable of the first thermocouple can be the first output cable 421 of the first thermocouple.

[0050] In optional embodiments, such as Figure 1 and Figure 3 As shown, a second power supply component 210 may also be provided within the connecting shaft 300. One end of the second power supply component 210 can be electrically connected to the in-pan heater 200, and the other end of the second power supply component 210 can be electrically connected to a power supply device to supply power to the in-pan heater 200. For example, the second power supply component 210 may include a second positive power supply line and a second negative power supply line. One end of the second positive power supply line is electrically connected to the in-pan heater 200, and the other end of the second positive power supply line is electrically connected to the positive terminal of the power supply device. One end of the second negative power supply line is electrically connected to the negative terminal of the in-pan heater 200, and the other end of the second negative power supply line is electrically connected to the negative terminal of the power supply device.

[0051] like Figure 1 As shown, a second temperature sensing element 230 can also be provided within the connecting shaft 300. The second temperature sensing element 230 can contact the carrier tray 100 and can be used to detect the temperature of the carrier tray 100. This configuration allows for real-time monitoring of the temperature of the carrier tray 100, enabling the adjustment of the temperature of the heater 200 within the tray based on the temperature of the carrier tray 100, thereby ensuring that the temperature of the carrier tray 100 meets the requirements of the wafer process. For example, the second temperature sensing element 230 can be a second thermocouple, which includes a second output cable. The second output cable can be electrically connected to the control unit to transmit the detection signal to the control unit.

[0052] Of course, the second temperature sensing element 230 may not be installed inside the connecting shaft 300.

[0053] Optionally, at least a portion of the second power supply component 210 may be fitted with a first insulating tube 220, and at least a portion of the second temperature sensing element 230 may be fitted with a second insulating tube 240. Specifically, the second output cable of the second temperature sensing element 230 is fitted with a second insulating tube 240. This arrangement prevents short circuits between the second power supply component 210 and the second temperature sensing element 230 and other components, thereby ensuring the heating performance of the in-pan heater 200 and the performance of the second temperature sensing element 230.

[0054] Of course, the first insulating tube 220 may not be fitted over the second power supply component 210, and the second insulating tube 240 may not be fitted over the second temperature sensing element 230. For example, the reflector 430 may be an insulating plate, and the second power supply component 210 and the second temperature sensing element 230 may be respectively embedded in the notch 431 of the reflector 430, so as to separate the second power supply component 210, the second temperature sensing element 230 and other components through the reflector 430.

[0055] In optional embodiments, such as Figure 2 As shown, the reflector 430 may have at least two notches 431, which are spaced apart circumferentially along the reflector 430. The first insulating tube 220 and the second insulating tube 240 may be respectively embedded in their respective notches 431. This arrangement allows the reflector 430 to limit the movement of the second power supply component 210 and the second temperature sensing element 230, preventing them from shaking and ensuring their stable position. Furthermore, the reflector 430 can isolate the second power supply component 210 and the second temperature sensing element 230 from other components, preventing interference or short circuits.

[0056] Of course, the notch 431 may not be provided on the reflector 430.

[0057] In some embodiments, the in-pad heater 200 may include at least two heaters, each distributed radially outward from the center of the carrier disk 100, to enable zoned heating of the carrier disk 100, thereby enabling zoned heating of the wafers on the carrier disk 100 to ensure uniform temperature of the carrier disk 100. Exemplarily, the in-pad heater 200 includes two heaters, specifically a first heater and a second heater. The first heater may be opposite the central region of the carrier disk 100, and the second heater may be opposite the edge region of the carrier disk 100, enabling zoned heating of the central and edge regions of the carrier disk 100. The first heater may be a circular structure with a diameter of 270 mm, and the second heater may be an annular structure with an inner diameter of 270 mm and an outer diameter of 330 mm. The aforementioned second temperature sensing element 230 can be used to detect the temperature of the first heater, and the temperature of the second heater may be proportional to the temperature of the first heater. This configuration allows for indirect monitoring of the temperature of the second heater by monitoring the temperature of the first heater.

[0058] Of course, the in-plate heater 200 may also include only one heater.

[0059] It should be noted that the number and structure of the heaters in the in-panel heater 200 are not specifically limited here; they can be set according to actual needs. Optionally, the in-panel heater 200 can be a ceramic heater or a metal heater made of materials such as aluminum or stainless steel.

[0060] For example, two second power supply components 210 may be provided within the connecting shaft 300. Each second power supply component 210 may be electrically connected to the first heater and the second heater respectively, so as to heat the first heater and the second heater respectively. Optionally, each second power supply component 210 may include a second positive power supply line and a second negative power supply line. A first insulating tube 220 is provided around each of the second positive power supply line and the second negative power supply line to prevent short circuits between the second positive power supply line and the second negative power supply line or between the second positive power supply line and other components.

[0061] Optionally, such as Figure 2 As shown, the reflector 430 may have six slots 431. The second positive power supply line and the second negative power supply line of the second power supply component 210, which are electrically connected to the first heater and the second heater, are respectively embedded in four slots 431. One of the remaining two slots 431 is used to embed the second output cable of the second temperature sensing element 230, and the other slot 431 can be used to embed the radio frequency power supply cable, which is used to provide radio frequency energy to the electrodes on the carrier plate 100.

[0062] In optional embodiments of this application, such as Figure 3 As shown, the supporting device may further include an elastic element 700. The first end of the elastic element 700 can be connected to the chamber body, and the second end can be connected to the in-shaft heater 400. The elastic element 700 can drive the in-shaft heater 400 to abut against the supporting plate 100. In this embodiment, the elastic element 700 can apply a force towards the supporting plate 100 to the in-shaft heater 400, ensuring good contact between the in-shaft heater 400 and the supporting plate 100, thereby enhancing the heat conduction between the in-shaft heater 400 and the supporting plate 100, and better supplementing the heat to the central area of ​​the supporting plate 100. For example, the second end of the elastic element 700 can abut against the second portion 442 of the retainer 440 to apply a force towards the supporting plate 100 to the retainer 440, thereby ensuring good contact between the in-shaft heater 410 and the supporting plate 100. Here, the elastic element 700 can be a compression spring.

[0063] In other embodiments, the support device may also exclude the elastic element 700.

[0064] In optional embodiments, such as Figures 1-3 As shown, the bearing device may further include a connector 500, through which the connecting shaft 300 can be connected to the chamber body. The elastic member 700 can be located within the connector 500, and the first end of the elastic member 700 can be connected to the connector 500. This arrangement facilitates the connection of the connecting shaft 300 to the chamber body and prevents the connecting shaft 300 from being directly connected to the chamber body, thereby reducing heat loss from the connecting shaft 300. Furthermore, the connector 500 provides installation space for the elastic member 700, eliminating the need for additional installation space for the elastic member 700, thus making the entire bearing device structure more compact.

[0065] Of course, the bearing device may also exclude the connector 500. The end of the connecting shaft 300 away from the bearing plate 100 is directly connected to the cavity wall of the chamber body. Furthermore, the chamber body may be provided with a space for accommodating the elastic element 700.

[0066] In optional embodiments, such as Figure 1 and Figure 3As shown, an insulating sleeve 600 can be provided inside the connector 500, and an elastic member 700 can be located inside the insulating sleeve 600. The first end of the elastic member 700 can be connected to the insulating sleeve 600, and a portion of the in-shaft heater 400 can be located inside the insulating sleeve 600. In this embodiment, the insulating sleeve 600 provides a fixed space for the elastic member 700 and prevents radial displacement of the elastic member 700. Furthermore, the insulating sleeve 600 reduces heat loss to the connector 500 or the chamber body, thereby further preventing the sealing ring from overheating and failing. In this embodiment, the insulating sleeve 600 can be connected to the connector 500 by screws.

[0067] like Figure 3 As shown, the supporting device may further include a second power supply component 210. An insulating hole 610 may be provided on the insulating sleeve 600, and the second power supply component 210 may pass through the insulating hole 610. This arrangement can limit the movement of the second power supply component 210, preventing it from shaking or shifting, and also preventing it from contacting other components and causing short circuits or leakage. For example, the insulating sleeve 600 may have at least two insulating holes 610, and the second output cable of the second temperature sensing element 230 may also pass through the corresponding insulating hole 610, as may the radio frequency power supply cable.

[0068] In other embodiments, the insulating sleeve 600 may not be provided inside the connector 500. For example, a fixing platform for fixing the elastic member 700 may be provided inside the connector 500 to fix the elastic member 700 inside the connector 500. In addition, the first insulating tube 220 outside the second power supply member 210 may be inserted inside the connector 500 to prevent the second power supply member 210 from making electrical contact with the connector 500 and causing leakage or short circuit.

[0069] Optionally, such as Figure 3 As shown, the insulating sleeve 600 is provided with a central hole 620, the elastic element 700 is located inside the central hole 620, a portion of the shaft heater 400 is located inside the central hole 620, and a boss 630 can be provided inside the central hole 620. The boss 630 is used to support the elastic element 700. In the radial direction of the connecting shaft 300, the elastic element 700 is limited to the hole wall of the central hole 620. This arrangement can prevent the elastic element 700 from radially shifting.

[0070] In optional embodiments, such as Figure 1As shown, the in-shaft heater 400 may include an in-shaft heating element 410 and an insulating heat-conducting element 450. One end of the insulating heat-conducting element 450 may be connected to the in-shaft heating element 410, and the other end of the insulating heat-conducting element 450 may contact the support plate 100. In this embodiment, the in-shaft heating element 410 contacts the support plate 100 through the insulating heat-conducting element 450, which can prevent the in-shaft heating element 410 and the support plate 100 from directly contacting each other and causing mutual wear, thus easily causing damage to the in-shaft heating element 410 or the support plate 100. It can also prevent the in-shaft heating element 410 from making electrical contact with the in-plate heater 200 inside the support plate 100.

[0071] Alternatively, the insulating heat-conducting element 450 may be made of alumina (Al2O3), aluminum nitride (AlN), or other insulating and high thermal conductivity materials to enhance the heat transfer effect to the carrier plate 100.

[0072] The insulating sleeve 600 can be made of high-temperature resistant insulating materials such as alumina (Al2O3), aluminum nitride (AlN), polyetheretherketone (PEEK), and polytetrafluoroethylene (PTFE) to provide insulation protection for the second power supply component 210 and prevent the second power supply component 210 from coming into contact with the shaft heater 400 and short-circuiting.

[0073] Based on the carrier device provided in the embodiments of this application, the embodiments of this application also provide a process chamber, which may include a chamber body and the carrier device described in any of the above embodiments, and at least a portion of the carrier device may be disposed within the chamber body.

[0074] The beneficial effects achieved by the process chamber provided in this application embodiment are consistent with the beneficial effects achieved by the carrier device provided in this application embodiment, and will not be repeated here.

[0075] In an optional embodiment, the connector 500 described above includes a first connecting portion 510 and a second connecting portion 520 coaxially connected to the first connecting portion 510. The first connecting portion 510 and the connecting shaft 300 can be connected by connecting screws. The second connecting portion 520 can pass through the cavity wall of the chamber body and connect to the cavity wall of the chamber body. Furthermore, a first sealing ring 800 can be provided between the first connecting portion 510 and the cavity wall of the chamber body to ensure the sealing performance within the chamber body. Here, to ensure the sealing performance of the first sealing ring 800, a cooling structure for cooling the first sealing ring 800 can be provided on the cavity wall of the chamber body.

[0076] In optional embodiments, such as Figure 1As shown, the carrier disk 100 may be provided with at least two first air vent channels 110, the connecting shaft 300 may be provided with at least two second air vent channels 310, and the first connecting part 510 may be provided with at least two third air vent channels 511. Each first air vent channel 110, each second air vent channel 310, and each third air vent channel 511 are connected in a corresponding manner. Furthermore, each third air vent channel 511 can be connected to a vacuum pump for vacuum adsorption of the wafers carried on the carrier disk 100.

[0077] To ensure the sealing between the second vent channel 310 and the third vent channel 511, such as Figure 1 As shown, a second sealing ring 900 may be provided between the connecting shaft 300 and the first connecting part 510 to prevent the second vent channel 310 and the third vent channel 511 from communicating with the internal space of the process chamber and thus failing to adsorb the wafer.

[0078] Based on the process chamber provided in the embodiments of this application, the embodiments of this application also provide a semiconductor process apparatus. The semiconductor process apparatus may include the process chamber and the transfer chamber described above. A wafer transfer device may be provided in the transfer chamber, and the wafer transfer device may be used to transfer wafers between the process chamber and the transfer chamber.

[0079] The beneficial effects achieved by the semiconductor process equipment provided in this application embodiment are consistent with the beneficial effects achieved by the process chamber provided in this application embodiment, and will not be repeated here.

[0080] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A support device, at least a portion of which is disposed within the chamber body of a process chamber, characterized in that, include: The carrier plate (100) is provided with an in-plate heater (200), which is used to heat the carrier plate (100). A connecting shaft (300) is coaxially connected to the bearing plate (100). An internal heater (400) is provided inside the connecting shaft (300). The internal heater (400) is connected to the bearing plate (100) and is used to heat the bearing plate (100).

2. The bearing device according to claim 1, characterized in that, The in-shaft heater (400) includes: An internal heating element (410) is used to heat the bearing plate (100). A reflector (430) is located on the side of the inner heating element (410) away from the support plate (100), and the side of the reflector (430) facing the support plate (100) is the reflective surface.

3. The bearing device according to claim 2, characterized in that, The in-shaft heater (400) also includes: The first power supply component (411) has one end electrically connected to the internal heating component (410) and the other end electrically connected to the power supply device. The retainer (440) includes a first part (441) and a second part (442) connected to the first part (441). The in-shaft heating element (410) is disposed outside the first part (441). The second part (442) is sleeved outside the first power supply element (411) and is used to connect to the chamber body. The reflector (430) is disposed on the circumferential outer side of the second part (442).

4. The bearing device according to claim 2, characterized in that, The in-shaft heater (400) further includes a first temperature sensing element (420), at least a portion of which is located within the in-shaft heater (410) and is used to detect the temperature of the in-shaft heater (410).

5. The bearing device according to claim 2, characterized in that, The connecting shaft (300) is also provided with a second power supply component (210) and a second temperature detection element (230). One end of the second power supply component (210) is electrically connected to the heater (200) inside the plate, and the other end of the second power supply component (210) is used to be electrically connected to the power supply device. The second temperature detection element (230) is in contact with the support plate (100) and is used to detect the temperature of the support plate (100). The second power supply element (210) is covered with a first insulating tube (220) at least part of its outer casing, and the second temperature sensing element (230) is covered with a second insulating tube (240) at least part of its outer casing.

6. The bearing device according to claim 5, characterized in that, The reflector (430) is provided with at least two notches (431), and each notch (431) is distributed at intervals along the circumference of the reflector (430). The first insulating tube (220) and the second insulating tube (240) are respectively embedded in their respective notches (431).

7. The bearing device according to claim 1, characterized in that, The bearing device further includes an elastic element (700), the first end of which is used to connect with the chamber body, the second end of which is connected with the in-shaft heater (400), and the elastic element (700) is used to drive the in-shaft heater (400) to abut against the bearing plate (100).

8. The bearing device according to claim 7, characterized in that, The bearing device further includes a connector (500), the connecting shaft (300) is connected to the chamber body through the connector (500), the elastic element (700) is located inside the connector (500), and the first end of the elastic element (700) is connected to the connector (500).

9. The bearing device according to claim 8, characterized in that, An insulating sleeve (600) is provided inside the connector (500), the elastic element (700) is located inside the insulating sleeve (600), and the first end of the elastic element (700) is connected to the insulating sleeve (600), and part of the in-shaft heater (400) is located inside the insulating sleeve (600); The bearing device further includes a second power supply component (210), and the insulating sleeve (600) is provided with an insulating hole (610), and the second power supply component (210) passes through the insulating hole (610).

10. The bearing device according to claim 1, characterized in that, The in-shaft heater (400) includes an in-shaft heating element (410) and an insulating heat-conducting element (450). One end of the insulating heat-conducting element (450) is connected to the in-shaft heating element (410), and the other end of the insulating heat-conducting element (450) is in contact with the carrier plate (100).

11. A process chamber, characterized in that, It includes a chamber body and a support device as described in any one of claims 1-10, wherein at least a portion of the support device is disposed within the chamber body.

12. A semiconductor process apparatus, characterized in that, The invention includes the process chamber and the transfer chamber as described in claim 11, wherein a wafer transfer device is provided in the transfer chamber, and the wafer transfer device is used to transfer a wafer between the process chamber and the transfer chamber.

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