A scanning device and wafer production line

Abstract

The application discloses a scanning device and a wafer production line. The scanning device comprises a scanning mechanism, a base and an adjusting mechanism. The base comprises a movable mounting platform. The adjusting mechanism is arranged on the mounting platform and is used for arranging materials to be detected. The mounting platform is used for adjusting the detection position of the materials. The adjusting mechanism is used for adjusting the posture of the materials. The scanning mechanism is used for detecting the materials. In the application, the position to be detected in the materials is directed to the scanning mechanism through the mounting platform. The posture of the materials is adjusted through the adjusting mechanism. The position to be detected in the materials can be fully and multi-angle exposed to the scanning area of the scanning mechanism and detected. The problem that the angle needs to be manually adjusted for multiple times during detection in the related art, the detection efficiency is low, and the precision is not high is effectively solved.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a scanning device and a wafer production line. Background Technology

[0002] Wafer inspection is a crucial step in wafer processing. After cleaning away chemicals and contaminants from the wafer surface, it is inspected to ensure it meets specific standards and requirements before proceeding to the next processing step. In most wafer manufacturing production lines, when wafers reach the inspection stage, they are inspected manually one by one under intense light. This process requires multiple manual angle adjustments, is time-consuming, and lacks efficiency and accuracy. Utility Model Content

[0003] This application proposes a scanning device to effectively solve the technical problems of low efficiency and low accuracy of manual angle adjustment in related technologies.

[0004] This application also proposes a wafer production line including the aforementioned scanning device.

[0005] A first aspect of this application provides a scanning device, including: a scanning mechanism, a base, and an adjustment mechanism;

[0006] The base includes a movable mounting platform, and the adjustment mechanism is disposed on the mounting platform and used to set the material to be tested;

[0007] The installation platform is used to adjust the detection position of the material, and the adjustment mechanism is used to adjust the posture of the material.

[0008] The scanning mechanism is used to detect the material.

[0009] Furthermore, the adjustment mechanism includes a plurality of support arms, each of which is spaced apart and used to support the material. Each support arm is provided with a movable joint structure so that each support arm can be used to coordinately adjust the material.

[0010] Furthermore, one end of the support arm is hinged to the mounting platform, and the other end of the support arm is used to support the material. The joint structure includes at least two angle-adjustable joints so that each of the support arms can be used to adjust at least one of the roll angle or pitch angle of the material relative to the mounting platform.

[0011] Furthermore, the base includes a rotating shaft for driving the mounting platform to rotate, thereby enabling the mounting platform to adjust the orientation of the material.

[0012] Furthermore, the scanning mechanism includes a movable component and a scanning head assembly. The scanning head assembly is adjustablely disposed on the movable component, and the movable component is movable so that the relative positional relationship between the detection area of ​​the scanning head assembly and the material is adjustable.

[0013] Furthermore, the scanning device also includes a guide component, and the movable component is slidably disposed on the guide component so that the scanning head assembly can move in a direction relatively close to or away from the material;

[0014] And / or the scanning head assembly includes a scanning head body rotatably mounted on the movable component to make the detection direction of the scanning head body adjustable.

[0015] Furthermore, the scanning device also includes a first conveying mechanism, and the base has multiple components. The first conveying mechanism is used to transport the bases so that each base arrives sequentially at the detection area of ​​the scanning mechanism.

[0016] Furthermore, the scanning device also includes a feeding module, which is used to transfer the material to the adjustment mechanism.

[0017] Furthermore, the feeding module includes a robotic arm mechanism and a second conveying mechanism. The second conveying mechanism is used to transport the material, and the robotic arm mechanism is used to place the material on the second conveying mechanism onto the adjusting mechanism.

[0018] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects: by installing the platform so that the position to be detected in the material is oriented toward the scanning mechanism, and by adjusting the material posture through the adjustment mechanism, the position to be detected in the material can be fully and multi-angledly exposed to the scanning area of ​​the scanning mechanism for detection, effectively solving the problems of low detection efficiency and low accuracy in related technologies that require multiple manual angle adjustments during detection.

[0019] A second aspect of this application provides a wafer production line, including a scanning apparatus as described in the first aspect of this application.

[0020] It is easy to understand that the wafer production line in the second aspect embodiment of this application has the same technical effects as the scanning device in the first aspect embodiment, and therefore will not be described again.

[0021] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the interior of a scanning device provided in one embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of the base and adjustment mechanism provided in one embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the structure of a scanning mechanism provided in one embodiment of this application;

[0026] Figure 4 A schematic diagram of a first conveying mechanism transport base provided in one embodiment of this application;

[0027] Figure 5 This is a schematic diagram of a feeding module provided in one embodiment of this application.

[0028] Figure label:

[0029] 100. Scanning mechanism; 110. Moving component; 120. Scanning head assembly; 121. Scanning head body;

[0030] 200. Base; 210. Mounting platform; 220. Rotating shaft;

[0031] 300. Adjustment mechanism; 310. Support arm; 311. Angle adjustment joint;

[0032] 400. Guide components;

[0033] 500. First transmission mechanism;

[0034] 600. Feeding module; 610. Robotic arm mechanism; 620. Second conveying mechanism;

[0035] 700. Materials. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] It is understood that indium phosphide (InP) is a compound semiconductor material with advantages such as high electron mobility, high optical transmittance, low noise, and high stability, and is widely used in the manufacture of high-speed communication devices, optical devices, sensors, and lasers. Given the increasingly demanding requirements for indium phosphide wafer processing lines, this application proposes a scanning device that automates wafer inspection to simplify and improve efficiency. However, it should be understood that any adaptive and simple modifications made by those skilled in the art based on the disclosure of the embodiments of this application, without inventive effort, to enable the scanning device to inspect other types of materials 700, should also be considered within the scope of protection of this application.

[0038] See Figures 1 to 5 As shown, an embodiment of the first aspect of this application discloses a scanning device, including a scanning mechanism 100, a base 200, and an adjustment mechanism 300.

[0039] The base 200 includes a movable mounting platform 210, and an adjustment mechanism 300 is mounted on the mounting platform 210 and used to set the material 700 to be detected; wherein, the mounting platform 210 is used to adjust the detection position of the material 700, the adjustment mechanism 300 is used to adjust the posture of the material 700, and the scanning mechanism 100 is used to detect the material 700.

[0040] In the embodiments of this application, the position to be detected in the material 700 is oriented toward the scanning mechanism 100 by the mounting platform 210, and the posture of the material 700 is adjusted by the adjustment mechanism 300, so that the position to be detected in the material 700 can be fully and multi-angledly exposed to the scanning area of ​​the scanning mechanism 100 for detection, thereby effectively solving the problems of low detection efficiency and low accuracy in related technologies that require multiple manual angle adjustments during detection.

[0041] It is understood that in some embodiments, the scanning mechanism 100 has a preset detection area. When the base 200 reaches this detection area, the scanning mechanism 100 scans and detects the material 700. During detection, the material 700 needs to be in a specific position or multiple different positions facing the scanning mechanism 100 for detection. In order to ensure the accuracy and precision of the detection, the same position also needs to be presented at multiple different angles. Based on this, the scanning device of this application embodiment is provided with a movable mounting platform 210, and the mounting platform 210 is provided with an adjustment mechanism 300 that can adjust the posture of the material 700. By adjusting the detection position of the material 700 by the movement of the mounting platform 210, the effect of presenting a specific position or sequentially presenting multiple different positions to be detected in the material 700 is achieved. Meanwhile, the adjustment mechanism 300 adjusts the posture of the material 700, so that when the position to be detected is detected, the condition information of the position is presented from multiple different angles. The scanning mechanism 100 determines whether the material 700 meets the actual production requirements based on the condition information of the different angles of the position to be detected, and finally completes the detection. This replaces the detection method of manually adjusting the angle in related technologies, and achieves the effect of improving detection efficiency and accuracy.

[0042] In some embodiments, the movable mounting platform 210 needs to adjust the detection position of the material 700 in conjunction with the detection range of the detection mechanism. Therefore, the movement mode of the mounting platform 210 can be adaptively designed according to the specific situation of the material 700 to be detected. The movement mode includes, but is not limited to, translation, rotation or curvilinear movement, so that the specific detection position or each position to be detected of the material 700 can be detected by the detection mechanism in sequence.

[0043] In some embodiments, the adjustment mechanism 300 includes, but is not limited to, a linkage mechanism, a robotic arm adjustment mechanism 300, or a gimbal adjustment mechanism 300, which are mechanisms capable of moving the material 700 in multiple directions or rotating it at multiple angles, thereby achieving the effect of adjusting the posture of the material 700.

[0044] In a specific embodiment, when this application is used, the installation platform 210 is driven to move, which in turn drives the adjustment mechanism 300 and the material 700 set on the adjustment mechanism 300 to move. After the material 700 is in the appropriate position to be tested, the posture of the material 700 is adjusted accordingly by the adjustment mechanism 300 according to the test items of the material 700, thereby completing the test.

[0045] The following will combine Figures 1 to 5 The scanning device disclosed in the embodiments of this application will be explained and described in detail.

[0046] In some embodiments of this application, such as Figure 1 and Figure 2The adjustment mechanism 300 includes multiple support arms 310, each spaced apart and used to support the material 700. Each support arm 310 has a movable joint structure, allowing for coordinated adjustment of the material 700. It is understood that the movable joint structures on the support arms 310, when requiring adjustment of the material 700's orientation, move in unison, thereby collaboratively changing the wafer angle for defect scanning.

[0047] In some embodiments, the multiple support arms 310 are arranged in a non-linear manner, which makes the adjustment of the posture of the material 700 more precise and accurate when each support arm 310 moves through the joint structure.

[0048] In some embodiments, multiple support arms 310 are arranged in a circular array with reference to the center of the mounting platform 210.

[0049] Furthermore, one end of the support arm 310 is hinged to the mounting platform 210, and the other end of the support arm 310 is used to support the material 700. The joint structure includes at least two angle adjustment joints 311 so that each support arm 310 can be used to adjust at least one of the roll angle or pitch angle of the material 700 relative to the mounting platform 210.

[0050] Understandably, with one end of the support arm 310 hinged and the other end supporting the material 700, the joint structure includes at least two angle adjustment joints 311, so that the support arm 310 is divided into at least three sections based on the angle adjustment joints 311. Thus, the support arm 310 has corresponding degrees of freedom of movement and can adjust the roll angle or pitch angle of the material 700.

[0051] In some embodiments, taking the mounting platform 210 as a reference, the roller angle is the angle at which the material 700 rotates about the longitudinal direction of the mounting platform 210, and the pitch angle is the angle at which the material 700 rotates about the transverse direction of the mounting platform 210. In specific adjustments, either the roller angle or the pitch angle of the material 700 can be adjusted individually, or both can be adjusted simultaneously to achieve the effect of adjusting the posture.

[0052] In some embodiments, the joint structure includes at least two angle-adjustable joints 311 that divide the support arm 310 into at least three sections, wherein the length of each section is adaptively adjustable, thereby achieving the effect of each support arm 310 coordinating to adjust at least one of the roll angle or pitch angle of the material 700, and the adjustment accuracy will vary based on the adjustment of the length of each section.

[0053] In some embodiments of this application, when the material 700 to be tested is a wafer, the base 200 includes a rotation shaft 220, which is used to drive the mounting platform 210 to rotate so that the mounting platform 210 can be used to adjust the orientation of the material 700.

[0054] Understandably, based on the general defect scanning items and main inspection locations of the wafer, the mounting platform 210 rotates the material 700 to adjust the relative orientation of the material 700 and the scanning mechanism 100, thus meeting the position adjustment requirements during scanning. Specifically, the mounting platform 210 rotates around the axis of the rotation shaft 220, causing the wafer to move and changing its yaw angle. Combined with the adjustment of at least one of the roll or pitch angles of the wafer by each support arm 310, the wafer can be fully angled for defect scanning.

[0055] In some embodiments, the base 200 includes a base 200, a rotating shaft 220, and a mounting platform 210. The base 200 is fixedly mounted or mounted on the first conveying mechanism 500. The rotating shaft 220 is mounted on the base 200 and is used to support the mounting platform 210. The rotating shaft 220 can drive the mounting platform 210 to rotate, thereby adjusting the orientation of the material 700.

[0056] In one specific embodiment, the installation platform 210 is first driven to rotate, which in turn drives the adjustment mechanism 300 and the material 700 set on the adjustment mechanism 300 to rotate. After the material 700 is in the appropriate orientation, the adjustment mechanism 300 adjusts the posture of the material 700 according to the test item of the material 700. Specifically, it adjusts the roller angle and pitch angle of the material 700 to complete the test.

[0057] In some embodiments, the rotating shaft 220 can rotate and drive the mounting platform 210 to rotate through gear transmission, lead screw transmission, belt transmission or direct motor drive.

[0058] It should be understood that if the scanning and detection effect of material 700 is to be improved, it can be achieved not only by adjusting the position and orientation of material 700, but also by adjusting the relative positional relationship between the scanning range of scanning mechanism 100 and material 700.

[0059] In some embodiments of this application, such as Figure 1 and Figure 3 The scanning mechanism 100 includes a movable component 110 and a scanning head assembly 120. The scanning head assembly 120 is adjustablely disposed on the movable component 110. The movable component 110 is movable so that the relative positional relationship between the detection area of ​​the scanning head assembly 120 and the material 700 is adjustable.

[0060] It is understood that the movable component 110 allows for adjustment of the relative position between the scanning head assembly 120 and the material 700. Simultaneously, the scanning head assembly 120 is configured as an adjustable structure, allowing for adjustment of the detection area by changing the irradiation angle. The complementary relationship between the movable component 110 and the scanning head assembly 120 achieves the effect of adjusting the relative position between the detection area of ​​the scanning head assembly 120 and the material 700, further improving detection accuracy.

[0061] In some embodiments of this application, such as Figure 1 and Figure 3 The scanning device also includes a guide member 400, on which a movable component 110 is slidably disposed, so that the scanning head assembly 120 can move in a direction relatively close to or away from the material 700.

[0062] It is understandable that the guide component 400 is used to guide the movement of the movable component 110, so that it can move and adjust in a preset direction, and adjust the relative positional relationship between the detection area and the material 700 according to different scanning requirements, thereby improving the applicability of this scanning device.

[0063] In some embodiments, the guide component 400 may be configured as a common guide structure, including but not limited to slide rails, grooves, or guide rods. In some embodiments, the movable component 110 is a structure adapted to the guide component 400, including but not limited to sliders, sliding protrusions, or guide blocks.

[0064] In some embodiments of this application, such as Figure 1 and Figure 3 The scanning head assembly 120 includes a scanning head body 121, which is rotatably mounted on the movable assembly 110 so that the detection direction of the scanning head body 121 is adjustable.

[0065] It is understood that the scanning head body 121 is rotatable and can adjust the detection angle, so that after the active component 110 is in the preset position, the range of the detection area can be adjusted by changing the illumination angle, thereby further improving the detection accuracy.

[0066] In some embodiments, the scanning head body 121 may be rotatably mounted on the movable assembly 110 by means of components including but not limited to universal joints, flexible hinges, rotary joints, etc.

[0067] In one specific embodiment, the scanning head body 121 has multiple parts and is spaced apart on the active component 110, thereby improving the detection accuracy by detecting through multiple scanning head bodies 121 respectively.

[0068] In some embodiments of this application, such as Figure 1 and Figure 4 The scanning device also includes a first conveying mechanism 500. Multiple bases 200 are provided, and the first conveying mechanism 500 is used to transport the bases 200 so that each base 200 sequentially arrives at the detection area of ​​the scanning mechanism 100. It is understood that by transporting each base 200 through the first conveying mechanism 500, each wafer on each base 200 can be sequentially scanned for defects. Through mechanical automation, wafer inspection becomes simpler and more convenient, improving inspection efficiency.

[0069] In some embodiments of this application, such as Figure 1 and Figure 5 The scanning device also includes a loading module 600, which is used to transfer the material 700 to the adjusting mechanism 300. It can be understood that the loading module 600 is used to sequentially transfer the material 700 to the adjusting mechanism 300 on the base 200, and to automate the loading action through mechanical means, so as to make the inspection of the wafers simpler and more convenient, and improve the inspection efficiency.

[0070] In some embodiments, the feeding module 600 includes a robotic arm mechanism 610 and a second conveying mechanism 620. The second conveying mechanism 620 is used to transport material 700, and the robotic arm mechanism 610 is used to place the material 700 on the second conveying mechanism 620 onto the adjusting mechanism 300. It is understood that the second conveying mechanism 620 is used to transport material 700, the robotic arm mechanism 610 is used to sequentially transfer material 700, and then the adjusting mechanism 300, the mounting platform 210, and the scanning mechanism 100 cooperate to complete the detection, thereby improving operational efficiency while ensuring accurate feeding.

[0071] In some embodiments, the robotic arm mechanism 610 includes a movable base, a rotatable support rod, and a vacuum suction gripper. The movable base allows the robotic arm to move and adjust its position, while the rotatable support rod drives the vacuum suction gripper to rotate, enabling it to reach the positions of the second conveying mechanism 620 and the adjusting mechanism 300. The vacuum suction gripper then transfers the material by vacuum suction.

[0072] In other embodiments, the robotic arm mechanism 610 may also employ common end effectors such as grippers or slots, depending on the specific type of material, to achieve the effect of grasping and transferring materials.

[0073] In some embodiments, the first conveying mechanism 500 and the second conveying mechanism 620 may be configured to include, but are not limited to, common conveying mechanisms such as conveyor belt mechanisms and conveyor chain plate mechanisms.

[0074] In one specific embodiment, the protective chamber and the outer chamber of the scanning chamber are filled with nitrogen. The wafer is transported via the protective chamber conveyor belt. A robotic arm transports the wafer from the protective chamber conveyor belt to the base 200 on the scanning chamber conveyor belt, which is equipped with a mechanism that can change the angle. The wafer is then scanned by the scanning mechanism 100 to complete the inspection.

[0075] The scanning device of this application embodiment is described in detail below with reference to a specific example. It should be noted that the following embodiment is merely an exemplary description and should not be construed as limiting the embodiments of this application.

[0076] See Figures 1 to 5 As shown, the scanning device in this embodiment includes five parts. The first part is a nitrogen-filled protective chamber and an outer chamber of the scanning chamber, with a slide rail inside for mounting the scanning mechanism 100, enabling the scanning mechanism 100 to perform sliding scanning. The second part is a loading conveyor belt for transporting wafers, which move along with the loading conveyor belt. The third part is a loading robot for transporting wafers from the loading conveyor belt of the protective chamber to the scanning conveyor belt of the fourth part, the scanning chamber. The fourth part is a scanning conveyor belt for transporting a base 200 and the wafers on the base 200; the base 200 supports a mechanism with adjustable angles; the mechanism with adjustable angles is used to change the angle of the wafer for defect scanning. The mechanism with adjustable angles includes a mounting platform 210, a rotating pillar, and a mechanical finger supporting the wafer. The rotating pillar can drive the entire structure above the pillar to rotate, and the mechanical finger includes an adjustable-angle joint. By rotating the mounting platform 210, the adjustable-angle joint of the mechanical finger changes the angle of the wafer. The fifth part is the scanning mechanism 100, which includes a rotatable and angle-adjustable scanning head. The scanning head can slide and scan within the slide rail based on the cooperation of the slide rail and the movable component 110.

[0077] The scanning device in this application uses a robotic arm for loading and unloading wafers, allowing the robotic arm to perform wafer picking and placing operations at only a few points, reducing the area occupied by the scanning equipment. Through mechanical automation, the wafer angle is changed, and with the sliding scanning head, defects are scanned on the wafer, improving efficiency and detection effect, and making it simpler and more convenient to use.

[0078] The second aspect of this application discloses a wafer production line, including: a scanning device according to the first aspect of this application.

[0079] It is easy to understand that the wafer production line in the second aspect embodiment of this application has the same technical effects as the scanning device in the first aspect embodiment, and therefore will not be described again.

[0080] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0081] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0082] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0083] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A scanning device, characterized in that, include: Scanning mechanism, base, and adjustment mechanism; The base includes a movable mounting platform, and the adjustment mechanism is disposed on the mounting platform and used to set the material to be tested; The installation platform is used to adjust the detection position of the material, and the adjustment mechanism is used to adjust the posture of the material. The scanning mechanism is used to detect the material.

2. The scanning device according to claim 1, characterized in that: The adjustment mechanism includes multiple support arms, each of which is spaced apart and used to support the material. Each support arm is provided with a movable joint structure so that each support arm can be used to coordinately adjust the material.

3. The scanning device according to claim 2, characterized in that: One end of the support arm is hinged to the mounting platform, and the other end of the support arm is used to support the material. The joint structure includes at least two angle-adjustable joints so that each of the support arms can be used to adjust at least one of the roll angle or pitch angle of the material relative to the mounting platform.

4. The scanning device according to claim 1, characterized in that: The base includes a rotating shaft for driving the mounting platform to rotate, thereby enabling the mounting platform to adjust the orientation of the material.

5. The scanning device according to claim 1, characterized in that: The scanning mechanism includes a movable component and a scanning head assembly. The scanning head assembly is adjustablely disposed on the movable component, and the movable component is movable so that the relative positional relationship between the detection area of ​​the scanning head assembly and the material is adjustable.

6. The scanning device according to claim 5, characterized in that: The scanning device further includes a guide component, and the movable component is slidably disposed on the guide component so that the scanning head assembly can move in a direction relatively close to or away from the material; And / or the scanning head assembly includes a scanning head body rotatably mounted on the movable component to make the detection direction of the scanning head body adjustable.

7. The scanning device according to claim 1, characterized in that: The scanning device further includes a first conveying mechanism. The base has multiple components. The first conveying mechanism is used to transport the bases so that each base arrives sequentially at the detection area of ​​the scanning mechanism.

8. The scanning device according to claim 1, characterized in that: The scanning device also includes a feeding module, which is used to transfer the material to the adjustment mechanism.

9. The scanning device according to claim 8, characterized in that: The feeding module includes a robotic arm mechanism and a second conveying mechanism. The second conveying mechanism is used to transport the material, and the robotic arm mechanism is used to place the material on the second conveying mechanism onto the adjusting mechanism.

10. A wafer production line, characterized in that, include: The scanning apparatus as described in any one of claims 1 to 9.

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