A straight row type LED lamp string processing device

Abstract

The utility model discloses a straight -type LED lamp string processingequipment, including pre -treatment mechanism, power on mechanism, tin mounting mechanism, chip installation mechanism, cutting line point gum mechanism, solid gum mechanism, line pulling mechanism and lamp string, and the lamp string includes a plurality of lamp string units, and the lamp string unit includes at least two power -on conductors and a plurality of lamp beads, and the cutting line point gum mechanism includes cutting line department and first point gum department, and cutting line department is used to realize the cutting of one power -on conductor in adjacent two lamp string units, and first point gum department is used to carry out point gum coating to the wire cutting place, and forms the series insulation part. The utility model optimizes the point gum procedure in the LED lamp string processing, and the step of dividing the lamp string and the point gum can be carried out simultaneously, saves the manpower cost and the occupied space of equipment, can also prevent the wire from breaking, influences the normal progress of processing production, improves production processing efficiency.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED string processing equipment, specifically relating to a straight-line LED string processing equipment. Background Technology

[0002] LED string processing equipment typically includes two types: disc type and straight type. The straight type has a clear division of labor among its various mechanisms and its arrangement is more suitable for assembly line production. However, it has the problem of large footprint and high total labor cost for each process. In addition, the traditional process requires dividing the LED string into string units containing several LED beads and connecting them in series before applying glue. This process is cumbersome and the wires are prone to breakage. Utility Model Content

[0003] To address the aforementioned issues, this utility model aims to provide a straight-line LED string processing device that optimizes the dispensing process in LED string processing. The steps of dividing the string and dispensing the adhesive can be performed simultaneously, saving labor costs and equipment space. It also prevents wire breakage, which could affect the normal operation of processing and production, thereby improving production efficiency.

[0004] The technical problem solved by this utility model can be achieved by the following technical solution: A straight-line LED string processing device includes a pre-processing mechanism, a power-on mechanism, a tinning mechanism, a chip mounting mechanism, a wire-cutting and dispensing mechanism, a glue-fixing mechanism, a wire-pulling mechanism, and a string of lights. The string of lights includes several string units, each string unit including at least two power-carrying wires and several LED beads. The wire-cutting and dispensing mechanism includes a wire-cutting part and a first dispensing part. The wire-cutting part is used to cut one of the power-carrying wires in two adjacent string units, and the first dispensing part is used to apply glue to the cut part of the wire and form a series insulation part.

[0005] It also includes a second dispensing mechanism, which includes a second dispensing section for dispensing adhesive onto LED chips located on power-carrying wires.

[0006] The pre-processing mechanism includes at least one wiring section, a roller section, and a flattening section. The wiring section is provided with several wiring grooves, and each wiring groove can accommodate a single energized wire. The energized wire is made of enameled wire. The roller section is used to polish the enameled coating of the energized wire and form a chip mounting area. The flattening section is provided with flattening components on the top and bottom, which are used to flatten the energized wire.

[0007] The energizing mechanism includes two energizing units, each connected to an external power source, which makes the energizing wires conductive.

[0008] The soldering mechanism includes a solder storage section, several solder dipping components, and a driving section. The solder storage section stores solder paste inside. The solder dipping components are mounted on the driving section, and a solder dipping tank is formed between the several solder dipping components. The driving section can drive the solder dipping components to move so that the solder dipping tank picks up the solder paste and applies the solder paste to the chip mounting area.

[0009] The chip mounting mechanism includes a solder section, a chip slot, a chip extraction section, a lateral drive section, a longitudinal drive section, and at least one optometry section. The chip extraction section moves in position through the lateral drive section and the longitudinal drive section, and the optometry section is located behind the solder section.

[0010] The soldering section uses hot air soldering; the core extraction section uses a negative pressure gun.

[0011] The adhesive curing mechanism includes a blower section and an adhesive curing section. The blower section is located at the bottom of the light string and is used to blow and shape the LED chips after they are coated with adhesive. The blower section moves with the light string. The adhesive curing section cures the adhesive.

[0012] The wire pulling mechanism includes at least one wire pulling unit, which includes a wire pulling part and a moving part. The wire pulling part can clamp the wire, and the moving part can move the wire pulling unit back and forth.

[0013] There are two pull wire units, arranged back and forth along the direction of the light string. The two pull wire units are the first pull wire unit and the second pull wire unit, which move back and forth alternately.

[0014] Compared with the prior art, this utility model has the following advantages: This utility model optimizes the glue dispensing process in the LED light string processing, and the steps of dividing the light string and dispensing glue can be carried out simultaneously, saving labor costs and equipment space, and also preventing wire breakage, which would affect the normal progress of processing and production, thereby improving production efficiency. Attached Figure Description

[0015] Figure 1 This is a side view of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of this utility model;

[0017] Figure 3 This is a side view of the tangential dispensing mechanism;

[0018] Figure 4 This is a schematic diagram of the pre-processing mechanism;

[0019] Figure 5 This is a side view of the energizing mechanism;

[0020] Figure 6 This is a schematic diagram of the tinning mechanism;

[0021] Figure 7 This is a schematic diagram of the chip mounting mechanism;

[0022] Figure 8 This is a side view of the adhesive fixing mechanism;

[0023] Figure 9 This is a schematic diagram of the wire pulling mechanism;

[0024] Figure 10 This is a schematic diagram of the structure of the light string;

[0025] Figure 11 This is a schematic diagram of the tangent section;

[0026] Figure 12 This is a schematic diagram of the dispensing section;

[0027] Figure 13 This is a schematic diagram of the structure of a current-carrying wire.

[0028] In the diagram: 1-Pre-processing mechanism, 11-Cable section, 111-Cable groove, 12-Roller section, 13-Flattening section, 131-Flattening component, 2-Power-on mechanism, 21-Power-on unit, 3-Soldering mechanism, 31-Solder storage section, 32-Soldering assembly, 321-Soldering tank, 33-Drive section, 4-Chip mounting mechanism, 41-Soldering section, 42-Chip slot, 43-Core picking section, 431-Negative pressure gun head, 44-Horizontal drive section, 45-Vertical drive section, 46-Optical examination section, 5-Cut and dispensing mechanism, 51-Cut section, 511-Lifting section, 512-Cam 52-First dispensing section, 521-Dispensing gun head, 53-Fixing section, 54-Guiding section, 541-Guiding component, 6-Second dispensing mechanism, 61-Second dispensing section, 7-Wire pulling mechanism, 71-Wire pulling unit, 711-Wire pulling section, 712-Moving section, 713-First wire pulling unit, 714-Second wire pulling unit, 8-Light string, 81-Light string unit, 811-Light bead, 82-Series insulation section, 83-Powered wire, 84-Chip mounting area, 85-Enameled sheath, 86-Powered core wire, 9-Fixing mechanism, 91-Blower section, 92-Fixing section. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0030] In the description of this utility model, it should be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "center", "end", "length", "outer end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Combined with appendix Figures 1 to 13 As shown, this embodiment discloses a straight-line LED string processing device, including a pre-processing mechanism 1, a power-on mechanism 2, a soldering mechanism 3, a chip mounting mechanism 4, a cutting and dispensing mechanism 5, a bonding mechanism 9, a wire pulling mechanism 7, and a string of lights 8. The string of lights 8 includes several string units 81, each string unit 81 including at least two power-carrying wires 83 and several LED beads 811. Each LED bead 811 includes a chip and a glue. The cutting and dispensing mechanism 5 includes a cutting part 51 and a first dispensing part 52.

[0032] In conjunction with the above installation structure, one of the power-carrying wires 83 between two adjacent light string units 81 is cut off to form a series insulation part 82. The power-carrying wires 83 of the series insulation part 82 are connected by adhesive, so that different light string units 81 are connected in series and several lamp beads 811 in a light string unit 81 are connected in parallel.

[0033] In conjunction with the above, the pre-processing mechanism 1 includes at least one wiring section 11, a roller section 12, and a flattening section 13. The wiring section 11 is provided with a plurality of wiring grooves 111, and each wiring groove 111 accommodates a single energized wire 83, so that the plurality of energized wires 83 are arranged at a set distance. In this embodiment, the energized wire 83 is an enameled wire. The roller section 12 is used to polish the enameled coating 85 of the energized wire 83 and form a chip mounting area 84, which facilitates the subsequent installation of chips and other components. The flattening section 13 is provided with flattening members 131 on the top and bottom, which can be used to flatten the energized wire 83.

[0034] In conjunction with the above, the energized conductor 83 also includes an energized core wire 86, which is located inside the enameled sheath 85. The energized core wire 86 is usually a metal conductor wire, preferably a copper wire.

[0035] In conjunction with the above installation structure, the wire cutting and dispensing mechanism 5 also includes a fixing part 53, which includes several telescopic fixing parts for fixing the wire and preventing the wire from moving randomly during the cutting process. The wire cutting part 51 includes a lifting part 511, with matching cutters arranged above and below the wire cutting part 51. A cam 512 is arranged below the lifting part 511, and the cam 512 is externally connected to a driving device. The driving device can make the cam 512 rotate, so that the convex part and flat part of the cam 512 support the lifting part 511, causing the lifting part 511 to move up and down, thereby driving the cutter to move up and down to cut the wire. The driving device adopts a structure such as motor drive or swing arm linkage.

[0036] In conjunction with the above installation structure, the dispensing unit 52 also includes several dispensing gun heads 521. The dispensing gun heads 521 are mounted on another lifting unit 511. A cam 512 is provided below the lifting unit 511. The cam 512 is externally connected to a driving device. The driving device can make the cam 512 rotate, so that the convex and flat parts of the cam 512 support the lifting unit 511, causing the lifting unit 511 to move up and down, thereby driving the dispensing gun heads 521 to move up and down. The dispensing gun heads 521 store adhesive, and the adhesive can be injected at the gun head. The adhesive can connect the power-conducting wire 83 or the protection chip, while enhancing the waterproofness of the LED light. The first dispensing unit 52 is used to connect the cut wires, and the second dispensing unit 522 is used to dispense and seal the chip.

[0037] In conjunction with the above installation structure, the wire cutting and dispensing mechanism 5 also includes a guide part 54, which includes a guide member 541. The guide member 541 can move the energized wire 83 to cause the energized wire 83 to move out of the wire cutting part 51, thereby controlling the number of energized wires 83 cut. After the wire cutting is completed, the guide member 541 can be moved back to its original position to reset the energized wire 83.

[0038] In conjunction with the above-described installation structure, a second dispensing mechanism 6 is also included. The second dispensing mechanism 6 includes a second dispensing section 61, which is used to dispense adhesive onto the LED chip located on the power-conducting wire 83.

[0039] In summary, the power supply mechanism 2 includes two power supply units 21. Each power supply unit 21 is connected to an external power source and can make the wires conductive, providing power for subsequent testing of the light string 8's lighting effect and verification of whether the light string 8 has malfunctioned. Setting up two power supply units 21 can prevent the wires from not being energized due to poor contact, thereby providing a stable power supply to the wires.

[0040] In summary, the soldering mechanism 3 includes a solder storage section 31, several solder-dipping components 32, and a drive section 33. The solder storage section 31 is a tank containing solder paste. The solder-dipping components 32 are mounted on the drive section 33 to form a frame structure, and a solder-dipping tank 321 is formed between the several solder-dipping components 32. The drive section 33 adopts a drive structure such as a motor, and several telescopic rods (not shown in the figure) are provided inside the drive section 33, which can drive the solder-dipping components 32 to move up and down, so that the solder-dipping tank 321 is immersed in the solder storage section 31 to pick up the solder paste, and then moves to the power-conducting wire 83 to apply the solder paste to the chip mounting area 84.

[0041] In conjunction with the above, the chip mounting mechanism 4 includes a soldering section 41, a chip slot 42, a chip picking section 43, a lateral driving section 44, a longitudinal driving section 45, and at least one optometry section 46. The chip picking section 43 moves via the lateral driving section 44 and the longitudinal driving section 45 to pick up the chip from the chip slot 42 and mount the chip onto the power-conducting wire 83. In this embodiment, the chip picking section 43 includes at least one negative pressure nozzle 431, which can draw in gas to generate negative pressure, causing the chip to be drawn to the nozzle. The lateral driving section... 44 and the longitudinal drive unit 45 adopt a belt pulley drive structure; the soldering unit 41 is used to process the solder paste on the wires to make the solder paste and the chip more firmly installed. In this embodiment, the soldering unit 41 adopts hot air soldering. In other preferred embodiments, other solder paste soldering techniques commonly used in the prior art can also be used; the optometry unit 46 can check whether the light string 8 after the chip is installed is qualified. By setting multiple optometry units 46, the error is reduced and the verification accuracy is improved. The optometry unit 46 adopts commonly used optometry techniques in the prior art.

[0042] In summary, the adhesive curing mechanism 9 includes a blower section 91 and an adhesive curing section 92. The blower section 91 is located below the light string 8 and is used to blow and shape the LED chips after they are coated with adhesive. The blower section 91 moves with the light string. A sliding groove and a push-pull rod are provided below the blower section 91. The push-pull rod is externally connected to a drive device, which adopts a motor drive or a swing arm linkage structure. The push-pull rod can make the blower section 91 slide along the sliding groove, so that the blower section 91 moves along the adhesive line and moves with the adhesive, blowing air upward at a set flow rate and temperature to prevent the adhesive from dripping during the movement of the power-conducting wire 83, and at the same time shaping the adhesive into a set shape. The adhesive curing section 92 cures the adhesive, thereby protecting the internal LED chips. In this embodiment, the adhesive curing section 92 is a UV ultraviolet lamp. In other preferred embodiments, other adhesive curing technologies commonly used in the prior art can also be used.

[0043] In conjunction with the above, the pull-wire mechanism 7 includes at least one pull-wire unit 71. Each pull-wire unit 71 includes a pull-wire portion 711 and a moving portion 712. There are two pull-wire units 71, arranged front and back along the direction of the light string 8. The two pull-wire units 71 are respectively the first pull-wire unit 713 and the second pull-wire unit 714. The pull-wire portion 711 can clamp the energized wire 83. A sliding groove is provided below the moving portion 712. The moving portion 712 is externally connected to a motor-driven pulley (not shown in the figure), which allows the moving portion 712 to slide back and forth, thus moving the pull-wire unit 71 forward and backward. The first pulling unit 713 moves, thereby pulling the energized conductor 83; when the first pulling unit 713 moves the energized conductor 83, the second pulling unit 714 can return to its original position; when the second pulling unit 714 moves the energized conductor 83, the first pulling unit 713 can return to its original position; thus, the energized conductor 83 is pulled successively, realizing reciprocating alternating pulling, increasing pulling efficiency, improving the stability of the energized conductor 83 during pulling, and optimizing the stress situation of the energized conductor 83, preventing the energized conductor 83 from breaking during the pulling process.

[0044] This invention optimizes the dispensing process in LED string processing, allowing the steps of dividing the string and dispensing to be performed simultaneously. This saves labor costs and equipment space, prevents wire breakage that could disrupt normal production, and improves production efficiency.

[0045] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the utility model. Any simple modifications, equivalent changes, or alterations made to the above embodiments based on the technical principles of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A linear LED string processing device, comprising a pre-processing mechanism (1), a power-on mechanism (2), a soldering mechanism (3), a chip mounting mechanism (4), a wire-cutting and dispensing mechanism (5), a glue-fixing mechanism (9), a wire-pulling mechanism (7), and a string of lights (8), wherein the string of lights (8) comprises a plurality of string units (81), and each string unit (81) comprises at least two power-conducting wires (83) and a plurality of LED beads (811), characterized in that: The tangent dispensing mechanism (5) includes a tangent section (51) and a first dispensing section (52). The tangent section (51) is used to cut one of the live wires (83) in two adjacent light string units (81). The first dispensing section (52) is used to apply adhesive to the cut part of the wire and form a series insulation part (82).

2. The linear LED string processing device according to claim 1, characterized in that: It also includes a second dispensing mechanism (6), which includes a second dispensing section (61) for dispensing and coating LED chips located on the power-carrying wire (83).

3. The linear LED string processing device according to claim 1, characterized in that: The pre-processing mechanism (1) includes at least one wiring section (11), a roller section (12), and a flattening section (13). The wiring section (11) is provided with a plurality of wiring grooves (111). Each wiring groove (111) accommodates a single energized wire (83). The energized wire (83) is made of enameled wire. The roller section (12) is used to polish the enameled coating (85) of the energized wire (83) and form a chip mounting area (84). The flattening section (13) is provided with flattening components (131) on the top and bottom. The flattening components (131) are used to flatten the energized wire (83).

4. The straight-line LED string processing device according to claim 1, characterized in that: The power supply mechanism (2) includes two power supply units (21), which are connected to an external power source and make the power supply wire (83) conductive.

5. The linear LED string processing device according to claim 3, characterized in that: The tinning mechanism (3) includes a tin storage section (31), a plurality of tin-dipping components (32) and a driving section (33). The tin storage section (31) stores solder paste inside. The tin-dipping components (32) are mounted on the driving section (33). A tin-dipping tank (321) is formed between the plurality of tin-dipping components (32). The driving section (33) can drive the tin-dipping components (32) to move so that the tin-dipping tank (321) picks up the solder paste and applies the solder paste to the chip mounting area (84).

6. The linear LED string processing device according to claim 4, characterized in that: The chip mounting mechanism (4) includes a solder section (41), a chip slot (42), a chip extraction section (43), a lateral drive section (44), a longitudinal drive section (45), and at least one optometry section (46). The chip extraction section (43) moves in position through the lateral drive section (44) and the longitudinal drive section (45). The optometry section (46) is located behind the solder section (41).

7. The linear LED string processing device according to claim 6, characterized in that: The soldering part (41) adopts hot air soldering; the core taking part (43) adopts a negative pressure gun head (431).

8. The linear LED string processing device according to claim 6, characterized in that: The adhesive curing mechanism (9) includes a blower section (91) and an adhesive curing section (92). The blower section (91) is located at the lower part of the light string (8). The blower section (91) is used to blow and shape the LED chip after it is coated with adhesive. The blower section (91) is used to move with the light string. The adhesive curing section (92) cures the adhesive.

9. A linear LED string processing device according to any one of claims 1 to 8, characterized in that: The wire pulling mechanism (7) includes at least one wire pulling unit (71), which includes a wire pulling part (711) and a moving part (712). The wire pulling part (711) can clamp the wire, and the moving part (712) can move the wire pulling unit (71) back and forth.

10. The linear LED string processing device according to claim 9, characterized in that: There are two pull wire units (71), which are arranged back and forth along the direction of the light string (8). The two pull wire units (71) are the first pull wire unit (713) and the second pull wire unit (714), respectively. The first pull wire unit (713) and the second pull wire unit (714) move back and forth alternately.

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