Wafer cleaning cavity annular groove forming chip removal device
By using a chip removal device formed by an annular groove in the wafer cleaning chamber, and employing a motor drive and a blower system, efficient collection and separation of waste chips are achieved, solving the problem of waste chip accumulation or falling, and improving processing quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ZHIXING MODEL TECH CO LTD
- Filing Date
- 2025-08-22
- Publication Date
- 2026-07-28
AI Technical Summary
During the machining of the annular groove in the wafer cleaning cavity, the waste chips generated by cutting are prone to accumulate or fall into the cavity, affecting the surface finish and dimensional accuracy of subsequent precision milling processes, and causing accelerated tool wear.
The wafer cleaning chamber uses an annular groove forming chip removal device. The rotating collar is driven by the first brake motor, combined with an electric push rod and a blower pump, to achieve efficient collection and separation of waste chips, avoiding waste chips remaining inside the product.
It significantly improves the surface finish and dimensional accuracy of the wafer cleaning chamber, increases production efficiency, avoids the interference of waste chips on subsequent precision milling processes, has a compact structure and flexible adjustment, and can be adapted to the processing needs of annular grooves of different specifications.
Smart Images

Figure CN224560650U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment and machining technology, specifically relating to a wafer cleaning cavity annular groove forming chip removal device. Background Technology
[0002] In the processing of semiconductor wafer cleaning cavities, the annular groove is a key structure for collecting and discharging waste liquid and debris. Its forming accuracy directly affects the sealing performance and chip removal efficiency of the cleaning cavity. Currently, the processing of annular grooves mostly adopts milling and other processes. Since the groove is annular and deep, the metal debris generated during processing is easy to accumulate in the groove or fall into the cavity. This not only affects the surface finish of subsequent precision milling processes, but may also cause problems such as accelerated tool wear and deviations in processing dimensional accuracy.
[0003] However, in the manufacturing process of the wafer cleaning cavity, the plastic substrate needs to be clamped and fixed on the machine tool, and the ring structure is milled by CNC machining. However, because the cavity product has a special configuration of multiple nested rings, when each ring part is machined in turn, the waste chips generated by cutting are easily dropped into the closed space inside the product due to the gap between the ring structure and gravity. When subsequent fine milling processes are carried out to improve the surface finish, the waste chips will interfere with the contact state between the tool and the workpiece surface, causing problems such as disordered machining patterns and excessive surface roughness, which seriously affects the product quality.
[0004] To address the aforementioned issues, this application proposes a wafer cleaning cavity annular groove forming chip removal device. Utility Model Content
[0005] To address the aforementioned problems in the existing technology, this utility model provides a wafer cleaning cavity annular groove forming chip removal device, which has the characteristic of preventing waste chips from remaining inside the product during cutting.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer cleaning chamber annular groove forming chip removal device, including a bottom shell, a controller fixedly connected to the front of the bottom shell, a rotating collar and a collection box fixedly connected to the upper surface of the bottom shell, a first brake motor installed inside the bottom shell, the power output end of the first brake motor passing through the bottom shell and the outer ring of the rotating collar in sequence and fixedly connected to the bottom surface of the inner ring of the rotating collar, a first electric push rod, a telescopic hose and an exhaust pump respectively installed above the bottom shell, the bottom end of the first electric push rod fixedly connected to the upper surface of the inner ring of the rotating collar, a second electric push rod fixedly connected to the telescopic end of the first electric push rod, and a rotating frame fixedly connected to the telescopic end of the second electric push rod;
[0007] A collection rack is fixedly connected to the inner wall of the rotating frame. A second brake motor is provided on the front of the rotating frame. The power output end of the second brake motor is fixedly connected to the rotating shaft of the rotating frame. The bottom end of the telescopic hose is fixedly connected to the output end of the collection rack. A filter plate is fixedly connected to the inner wall of the collection box. The right end of the telescopic hose passes through the collection box and extends above the filter plate. The input end of the exhaust pump passes through the collection box and extends below the filter plate.
[0008] As a preferred embodiment of this utility model, two connecting frames are fixedly connected to both the front and back of the bottom shell, and each connecting frame is provided with a fixing pin inside.
[0009] As a preferred embodiment of this utility model, the left side of the bottom shell is movably hinged to an opening and closing door, and the left side of the opening and closing door is fixedly connected to a handle.
[0010] As a preferred embodiment of this utility model, a connecting seat is fixedly connected to the left side of the first brake motor, and the upper surface of the connecting seat is fixedly connected to the inner top wall of the bottom shell.
[0011] As a preferred embodiment of this utility model, the front of the collection box is hinged to a sealing door, and the front of the sealing door is fixedly connected to an auxiliary frame.
[0012] As a preferred embodiment of this utility model, the bottom surface of the exhaust pump is fixedly connected to a support base, and the bottom surface of the support base is fixedly connected to the upper surface of the bottom shell.
[0013] As a preferred embodiment of this utility model, three limiting frames are fixedly connected to the outer surfaces of the first electric push rod and the second electric push rod, and each of the limiting frames is sleeved on the outside of the telescopic hose.
[0014] As a preferred embodiment of this utility model, a fixing frame is fixedly connected to the right side of the second brake motor, and the back of the fixing frame is fixedly connected to the front of the rotating frame.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: The first brake motor drives the rotating collar to rotate, causing the related components to move in a circular motion. Combined with the telescopic adjustment of the first and second electric push rods, the spatial position of the collection rack can be precisely controlled. The second brake motor drives the rotating rack to rotate, allowing the collection rack to flexibly adjust its angle and precisely move to the processing area of the multi-ring nested structure, achieving targeted and efficient collection of waste chips. Simultaneously, the exhaust pump generates continuous negative pressure, quickly transporting the collected waste chips to the collection box via a telescopic hose. The filter plate achieves efficient separation of air and chips, effectively preventing waste chip residue or drift pollution. The entire device achieves real-time dynamic removal of waste chips, completely eliminating interference with subsequent precision milling processes, significantly improving the surface finish and dimensional accuracy of the wafer cleaning chamber. Furthermore, its compact structure and flexible adjustment allow it to adapt to the chip removal requirements of different sized annular grooves, effectively improving production efficiency. Attached Figure Description
[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is a cross-sectional view of the rotating collar in this utility model;
[0019] Figure 3 This is a schematic diagram of the structure of the collection box in this utility model;
[0020] Figure 4 This is a right-side structural schematic diagram of the exhaust pump in this utility model;
[0021] Figure 5 This is a schematic diagram of the telescopic hose in this utility model;
[0022] Figure 6 This is a schematic diagram of the rotating frame in this utility model;
[0023] In the diagram: 1. Bottom shell; 2. Rotating collar; 3. Handle; 4. Opening / closing door; 5. Fixing pin; 6. Connecting frame; 7. Controller; 8. Connecting seat; 9. First brake motor; 10. Collection box; 11. Sealing door; 12. Assist frame; 13. Filter plate; 14. Support seat; 15. Exhaust pump; 16. First electric push rod; 17. Telescopic hose; 18. Limiting frame; 19. Second electric push rod; 20. Fixing frame; 21. Second brake motor; 22. Rotating frame; 23. Collection frame. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example
[0025] Please see Figure 1-6 The present invention provides the following technical solution: a wafer cleaning chamber annular groove forming chip removal device, including a bottom shell 1, a controller 7 fixedly connected to the front of the bottom shell 1, a rotating collar 2 and a collection box 10 fixedly connected to the upper surface of the bottom shell 1 respectively, a first brake motor 9 is provided inside the bottom shell 1, the power output end of the first brake motor 9 passes through the outer ring of the bottom shell 1 and the rotating collar 2 in sequence and is fixedly connected to the bottom surface of the inner ring of the rotating collar 2, a first electric push rod 16, a telescopic hose 17 and an exhaust pump 15 are respectively provided on the top of the bottom shell 1, the bottom end of the first electric push rod 16 is fixedly connected to the upper surface of the inner ring of the rotating collar 2, the telescopic end of the first electric push rod 16 is fixedly connected to a second electric push rod 19, and the telescopic end of the second electric push rod 19 is fixedly connected to a rotating frame 22;
[0026] A collection rack 23 is fixedly connected to the inner wall of the rotating frame 22. A second brake motor 21 is provided on the front of the rotating frame 22. The power output end of the second brake motor 21 is fixedly connected to the rotating shaft of the rotating frame 22. The bottom end of the telescopic hose 17 is fixedly connected to the output end of the collection rack 23. A filter plate 13 is fixedly connected to the inner wall of the collection box 10. The right end of the telescopic hose 17 passes through the collection box 10 and extends to the top of the filter plate 13. The input end of the exhaust pump 15 passes through the collection box 10 and extends to the bottom of the filter plate 13.
[0027] In this embodiment, the controller 7 adopts a programmable logic controller (PLC), which is a digital computing control system designed specifically for industrial environments. It stores instructions such as logic operations and sequential control through a programmable memory, and realizes precise control of mechanical devices through digital or analog input / output interfaces. It can effectively coordinate the collaborative operation of components such as the first brake motor 9, the second brake motor 21, and the electric push rod. The first brake motor 9 and the second brake motor 21 are both drive motors with integrated braking devices, consisting of a motor body and an electromagnetic brake mechanism. They can operate normally when powered on and brake quickly when powered off, ensuring the stability and positioning accuracy of the equipment. The rotating collar 2 adopts a split structure of inner and outer rings. The outer ring is fixed to the upper surface of the bottom shell 1, and the inner ring is fixedly connected to the first electric push rod 16. The first brake motor 9 drives the inner ring to rotate, thereby driving the first electric push rod 16 and connected components to perform circumferential motion, providing basic power support for the collection of waste from the annular groove processing.
[0028] Specifically, the bottom shell 1 has two connecting frames 6 fixedly connected to both the front and back sides. Each connecting frame 6 has a fixing pin 5 inside. In this embodiment, the bottom shell 1 can be stably installed on the designated work position of the processing equipment or on the ground foundation through the cooperation of the connecting frame 6 and the fixing pin 5. The four connection points form a symmetrically distributed fixed structure, which effectively disperses the vibration load generated during the operation of the device, avoids overall displacement due to mechanical movement, and ensures the stability of chip removal operation.
[0029] Specifically, an opening and closing door 4 is movably hinged to the left side of the bottom shell 1, and a handle 3 is fixedly connected to the left side of the opening and closing door 4. In this embodiment, by setting the opening and closing door 4, the internal space of the bottom shell 1 can be easily opened, which facilitates the inspection, maintenance or replacement of core components such as the first brake motor 9. The design of the handle 3 improves the convenience of opening and closing operation, and at the same time, it can form a closed protection in the closed state to prevent dust and debris from entering the interior of the bottom shell 1 and affecting the operation of electrical components.
[0030] Specifically, a connecting seat 8 is fixedly connected to the left side of the first brake motor 9. The upper surface of the connecting seat 8 is fixedly connected to the inner top wall of the bottom shell 1. In this embodiment, the first brake motor 9 is firmly fixed inside the bottom shell 1 by the connecting seat 8, which not only ensures the structural stability of the motor during operation, but also avoids direct contact between the motor and the inner wall of the bottom shell 1 to generate resonance noise. At the same time, it provides heat dissipation space for the motor and ensures its reliability during long-term operation.
[0031] Specifically, a sealing door 11 is hinged to the front of the collection box 10, and an auxiliary frame 12 is fixedly connected to the front of the sealing door 11. In this embodiment, the sealing door 11 enables the closed storage of the collection box 10, preventing the leakage of internal waste and causing environmental pollution. The auxiliary frame 12 makes it easier for operators to open the sealing door 11 with less effort, so as to regularly clean the waste accumulated on the filter plate 13. At the same time, the sealing structure can ensure the stability of the negative pressure inside the collection box 10 when the exhaust pump 15 is working.
[0032] Specifically, a support base 14 is fixedly connected to the bottom surface of the exhaust pump 15. The bottom surface of the support base 14 is fixedly connected to the upper surface of the bottom shell 1. In this embodiment, the exhaust pump 15 is raised and stably installed on the bottom shell 1 by the support base 14, which not only avoids the exhaust pump 15 from directly contacting the bottom shell 1 and transmitting vibration, but also increases the ventilation gap at the bottom of the pump body, which is conducive to heat dissipation of the equipment. At the same time, it improves the rationality of the layout of the connecting pipe between the exhaust pump 15 and the collection box 10.
[0033] Specifically, three limiting frames 18 are fixedly connected to the outer surfaces of the first electric push rod 16 and the second electric push rod 19. Each limiting frame 18 is sleeved on the outside of the telescopic hose 17. In this embodiment, the telescopic hose 17 is positioned at multiple points by the limiting frames 18, which can prevent the hose from getting tangled, bent or overstretched during the movement of the equipment, ensuring the smoothness of the waste conveying channel. At the same time, the hose moves synchronously with the extension and retraction of the equipment, improving the coordination of the overall structure.
[0034] Specifically, a fixing frame 20 is fixedly connected to the right side of the second brake motor 21. The back of the fixing frame 20 is fixedly connected to the front of the rotating frame 22. In this embodiment, the second brake motor 21 and the rotating frame 22 are rigidly connected by the fixing frame 20, which not only ensures the coaxiality of the motor power output end and the rotating shaft of the rotating frame 22, ensuring power transmission efficiency, but also enhances the vibration resistance of the motor during operation, and avoids the connection from loosening and affecting the angle adjustment accuracy due to long-term operation.
[0035] The working principle and usage process of this utility model are as follows: In use, firstly, the device is securely installed in the designated position of the machine tool processing area using the connecting bracket 6 and fixing pin 5 on the front and back of the base shell 1, ensuring that the base shell 1 remains horizontal to avoid vibrations during operation affecting chip removal accuracy. Next, electrical connections are completed, connecting the controller 7 to the first brake motor 9, the second brake motor 21, the first electric push rod 16, the second electric push rod 19, and the exhaust pump 15. Then, the system is initialized and debugged, setting the operating parameters of each component. When the wafer cleaning chamber begins annular groove processing, the controller 7 starts the first brake motor 9, whose power output end passes through the outer ring of the base shell 1 and the rotating collar 2, driving... The inner ring of the rotating collar 2 rotates, thereby driving the first electric push rod 16, the second electric push rod 19, the rotating frame 22, and the collecting frame 23, which are fixed on the inner ring, to perform a circular motion to adjust the angle. At the same time, the controller 7 controls the first electric push rod 16 to extend radially and the second electric push rod 19 to extend axially, precisely adjusting the position of the collecting frame 23 in three-dimensional space so that it is aligned with the annular groove area being processed. Then, the second brake motor 21 is started to drive the rotating frame 22 to rotate, adjusting the angle of the collecting frame 23 so that it can move precisely above the gap of the multi-ring nested structure, ensuring that the waste collection port of the collecting frame 23 is precisely aligned with the cutting point. During the processing, the exhaust pump 15 continuously runs to generate negative pressure, which is then released through the extension... The flexible hose 17 creates suction at the collection frame 23. When the cutting chips detach from the workpiece, they are immediately captured by the collection frame 23 and sucked into the collection box 10 under negative pressure via the flexible hose 17. The chips fall to the bottom of the collection box after hitting the filter plate 13 inside the collection box 10 with the airflow, while the filtered airflow is discharged by the exhaust pump 15, achieving efficient separation of chips and air, preventing chips from scattering and polluting the processing environment or remaining inside the cavity. When maintenance is required, the operator can open the opening door 4 on the left side of the bottom shell 1 through the handle 3 to inspect or replace core components such as the first brake motor 9 and the connecting seat 8 inside the bottom shell 1. If there is a large accumulation of chips in the collection box 10, the front of the collection box 10 can be opened through the auxiliary frame 12. The sealing door 11 cleans the waste debris on the surface of the filter plate 13 to prevent the filter plate 13 from clogging and affecting the negative pressure effect of the exhaust pump 15. During the operation of the device, the limit frame 18 will perform multi-point positioning of the telescopic hose 17 to prevent the hose from getting tangled, bent or overstretched when the equipment moves. When it is necessary to stop the machine, if it is an emergency, the controller 7 will control the first brake motor 9 and the second brake motor 21 to cut off the power, and the electromagnetic brake mechanism will brake immediately to prevent the collection rack 23 from shifting due to inertia and ensure the safety of the equipment. If it is a normal stop, the exhaust pump 15 will be turned off first. After all the waste debris remaining in the collection rack 23 is sucked into the collection box 10, each motor and electric push rod will be turned off in sequence. Finally, the current parameters will be saved by the controller 7 so that they can be directly called up next time.
[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A wafer cleaning chamber annular groove forming chip removal device, characterized in that: Includes a bottom shell (1), a controller (7) is fixedly connected to the front of the bottom shell (1), a rotating collar (2) and a collection box (10) are fixedly connected to the upper surface of the bottom shell (1), a first brake motor (9) is provided inside the bottom shell (1), the power output end of the first brake motor (9) passes through the outer ring of the bottom shell (1) and the rotating collar (2) in sequence and is fixedly connected to the bottom surface of the inner ring of the rotating collar (2), a first electric push rod (16), a telescopic hose (17) and an exhaust pump (15) are respectively provided on the top of the bottom shell (1), the bottom end of the first electric push rod (16) is fixedly connected to the upper surface of the inner ring of the rotating collar (2), the telescopic end of the first electric push rod (16) is fixedly connected to a second electric push rod (19), and the telescopic end of the second electric push rod (19) is fixedly connected to a rotating frame (22). A collection rack (23) is fixedly connected to the inner wall of the rotating frame (22). A second brake motor (21) is provided on the front of the rotating frame (22). The power output end of the second brake motor (21) is fixedly connected to the rotating shaft of the rotating frame (22). The bottom end of the telescopic hose (17) is fixedly connected to the output end of the collection rack (23). A filter plate (13) is fixedly connected to the inner wall of the collection box (10). The right end of the telescopic hose (17) passes through the collection box (10) and extends to the top of the filter plate (13). The input end of the exhaust pump (15) passes through the collection box (10) and extends to the bottom of the filter plate (13).
2. The ring groove forming chip removal device for a wafer cleaning chamber according to claim 1, characterized in that: The bottom shell (1) has two connecting brackets (6) fixedly connected to its front and back sides, and each connecting bracket (6) has a fixing pin (5) inside.
3. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: The bottom shell (1) has a hinged door (4) on its left side, and a handle (3) is fixedly connected to the left side of the hinged door (4).
4. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: A connecting seat (8) is fixedly connected to the left side of the first brake motor (9), and the upper surface of the connecting seat (8) is fixedly connected to the inner top wall of the bottom shell (1).
5. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: The front of the collection box (10) is hinged to a sealing door (11), and the front of the sealing door (11) is fixedly connected to an auxiliary frame (12).
6. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: The bottom surface of the exhaust pump (15) is fixedly connected to a support base (14), and the bottom surface of the support base (14) is fixedly connected to the upper surface of the bottom shell (1).
7. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: The outer surfaces of the first electric push rod (16) and the second electric push rod (19) are each fixedly connected with three limit frames (18), and each limit frame (18) is sleeved on the outside of the telescopic hose (17).
8. The wafer cleaning cavity annular groove forming chip removal device according to claim 1, characterized in that: The right side of the second brake motor (21) is fixedly connected to a fixing frame (20), and the back of the fixing frame (20) is fixedly connected to the front of the rotating frame (22).