High efficiency temperature sensor production package structure

By designing a tray, support plate, and cardboard structure, and combining the precise dispensing of the vision dispensing machine with the positioning function of the support plate, the problems of low packaging efficiency of temperature sensors and the displacement of thermistors are solved, achieving a high-efficiency and low-cost packaging effect.

CN224561692UActive Publication Date: 2026-07-28GUANGDONG WANNUO SENSOR TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG WANNUO SENSOR TECH CO LTD
Filing Date
2025-08-05
Publication Date
2026-07-28

AI Technical Summary

Technical Problem

Existing temperature sensors have low packaging efficiency and are prone to thermistor displacement and poor centering during wiring and high-temperature curing processes.

Method used

The system employs a tray, support plate, and clamping plate structure. The support plate and tray are fixed with an adhesive layer, and epoxy resin is precisely injected using a vision-based glue applicator to achieve a stable connection between multiple wires and the hardware housing. The positioning function of the clamping plate and support plate ensures that the wires are accurately inserted into the housing and achieve a stable connection under the curing of epoxy resin.

Benefits of technology

This improved the packaging efficiency of temperature sensors by 150%, reduced production costs, ensured a stable connection between the wires and the housing, prevented thermistor displacement, and enhanced production efficiency and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to sensor production packaging structure technical field, especially in kind of high -efficient temperature sensor production packaging structure, including tray, the tray left end swing joint has no.
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Description

Technical Field

[0001] This utility model relates to the field of sensor manufacturing and packaging structure technology, and in particular to a high-efficiency temperature sensor manufacturing and packaging structure. Background Technology

[0002] Most temperature sensors on the market need to be encapsulated in various metal housings. In the early days, each product was usually encapsulated one by one, which resulted in low production efficiency. During the encapsulation and wiring process, in order to avoid the problem of glue overflow caused by the lead wire moving, the lead wire needs to be inserted against the housing wall, which resulted in poor centering effect. Moreover, thermistor displacement is prone to occur during the wiring process or when moving the sensor into the oven for high-temperature curing. Therefore, we have launched a high-efficiency temperature sensor production and packaging structure. Utility Model Content

[0003] The main objective of this invention is to provide a high-efficiency temperature sensor manufacturing and packaging structure, which can effectively solve the problems in the background art.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A high-efficiency temperature sensor manufacturing and packaging structure includes a tray. A second support plate is movably connected to the left end of the tray, and a first support plate is movably connected to the right end of the tray. The first and second support plates have the same structure. A retaining plate is movably connected to both the first and second support plates. Twenty-five wires are movably connected to the front end of the retaining plate. Two hundred metal housing parts are movably connected to the upper end of the tray.

[0006] Preferably, both the second support plate and the first support plate are "L" shaped structures, and an adhesive layer is fixedly connected to both the second support plate and the first support plate. Eight limiting grooves are opened at the left end of the second support plate and the right end of the first support plate, and several arc-shaped surfaces are provided at the upper end of both the second support plate and the first support plate.

[0007] By adopting the above technical solution, the curved surface makes it easier to insert the card into the first and second support plates, thus improving convenience.

[0008] Preferably, the second support plate and the first support plate are respectively installed on the left and right ends of the tray via adhesive layers.

[0009] Preferably, the front end of the card plate has twenty-five card slots.

[0010] Preferably, the twenty-five wires are located in twenty-five slots respectively.

[0011] Preferably, the upper end of the tray has two hundred slots.

[0012] Preferably, the two hundred slots are divided into eight rows, with twenty-five slots in each row.

[0013] This utility model has the following beneficial effects:

[0014] In this invention, a tray is set up, and several metal housing parts are inserted into slots opened on the tray according to production needs. An appropriate amount of epoxy resin is injected into the slots using a vision-based glue applicator. There are two hundred slots, arranged in eight rows of twenty-five each. Support plates number two and one are then glued to the left and right ends of the tray using adhesive. Twenty-five wires are clipped into twenty-five slots at the front end of a clip plate. After securing the twenty-five wires with tape, the clip plate is inserted into support plates number two and one. Support plates number two and one position the clip plate, aligning the wires fixed on it with the metal housing parts inserted at the top of the tray. As the clip plate descends, the ends of the wires are inserted into the metal housing parts. Under the action of the epoxy resin, the wires connect to the metal housing parts. Because multiple wires can be packaged at once, the packaging efficiency is 150% higher than single-wire packaging, offering the advantages of low cost and high efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the production and packaging structure of a high-efficiency temperature sensor according to the present invention.

[0016] Figure 2 This is a schematic diagram of the overall structure of the No. 2 support plate of the high-efficiency temperature sensor production and packaging structure of this utility model.

[0017] Figure 3 This is a schematic diagram of the overall structure of the cardboard for the production and packaging structure of a high-efficiency temperature sensor according to this utility model;

[0018] Figure 4 This is a cross-sectional schematic diagram of the tray used in the production and packaging structure of a high-efficiency temperature sensor according to this utility model.

[0019] In the diagram: 1. Tray; 2. Hardware housing; 3. Support plate 1; 4. Card plate; 5. Wire; 6. Support plate 2; 11. Groove; 41. Card slot; 61. Adhesive layer; 62. Curved surface; 63. Limiting groove. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Please see Figures 1-4 This utility model provides a technical solution:

[0024] A high-efficiency temperature sensor manufacturing and packaging structure includes a tray 1. A second support plate 6 is movably connected to the left end of the tray 1, and a first support plate 3 is movably connected to the right end of the tray 1. The first support plate 3 and the second support plate 6 have the same structure. A retaining plate 4 is movably connected to both the first support plate 3 and the second support plate 6. Twenty-five wires 5 are movably connected to the front end of the retaining plate 4. Two hundred metal housing parts 2 are movably connected to the upper end of the tray 1.

[0025] In this embodiment, both the second support plate 6 and the first support plate 3 are "L" shaped structures. Adhesive layers 61 are fixedly connected to both the second support plate 6 and the first support plate 3. Eight limiting grooves 63 are opened at the left end of the second support plate 6 and the right end of the first support plate 3. Several arc-shaped surfaces 62 are provided at the upper end of the second support plate 6 and the upper end of the first support plate 3. The second support plate 6 and the first support plate 3 are respectively installed on the left and right ends of the tray 1 through the adhesive layers 61. Twenty-five slots 41 are opened at the front end of the card plate 4. Twenty-five wires 5 are respectively located in the twenty-five slots 41. Two hundred slots 11 are opened at the upper end of the tray 1. The two hundred slots 11 are divided into eight rows, and each row has twenty-five slots 11.

[0026] Through the above method: Twenty-five wires 5 are precisely snapped into the twenty-five slots 41 opened at the front end of the card plate 4 to ensure that each of the twenty-five wires 5 corresponds to one of them. Then, tape is used to further fix the twenty-five wires 5. The card plate 4 is carefully inserted into the second support plate 6 and the first support plate 3 to accurately position the card plate 4, so that the wires 5 fixed on the card plate 4 correspond precisely to the positions of the hardware housing 2 inserted at the upper end of the tray 1. As the card plate 4 slowly descends, the ends of the wires 5 are gradually inserted into the hardware housing 2. Under the curing effect of epoxy resin, the wires 5 and the hardware housing 2 are firmly connected.

[0027] It should be noted that this utility model describes a high-efficiency temperature sensor production and packaging structure. First, a specially made tray 1 is prepared. Several metal housing components 2 are then inserted in an orderly manner into pre-drilled slots 11 on the tray 1. There are two hundred slots 11, evenly divided into eight rows, with twenty-five slots 11 in each row. After all the metal housing components 2 are accurately inserted into the slots 11, the crucial glue application process begins. Using an advanced vision-based glue application machine, an appropriate amount of epoxy resin is precisely injected into each metal housing component 2. This vision-based glue application machine possesses high precision... The high-precision visual recognition system can accurately identify the position of the hardware housing 2 and control the amount of epoxy resin injected according to preset parameters, ensuring that each hardware housing 2 receives just the right amount of epoxy resin. This provides a reliable guarantee for the subsequent stable connection between the wire 5 and the hardware housing 2. After the glue application is completed, the support plate installation step is performed. The second support plate 6 and the first support plate 3 are firmly bonded and fixed to the left and right ends of the tray 1 using the adhesive layer 61. This ensures that the second support plate 6 and the first support plate 3 are tightly bonded to the tray 1, which will be crucial in subsequent operations. To ensure stability and prevent loosening or displacement, the wires 5 are pre-processed by precisely snapping them into the twenty-five slots 41 at the front end of the clamping plate 4, ensuring a one-to-one correspondence between the twenty-five wires 5. Then, tape is used to further secure the twenty-five wires 5, preventing them from shaking or falling off during subsequent operations. After securing the wires 5, the clamping plate 4 is carefully inserted into the second support plate 6 and the first support plate 3, allowing for precise positioning of the clamping plate 4 so that the wires 5 fixed on it align with the support. The metal housing 2 inserted at the top of the tray 1 is precisely positioned. As the tray 4 slowly descends, the end of the wire 5 is gradually inserted into the metal housing 2. Under the curing effect of epoxy resin, the wire 5 and the metal housing 2 are firmly connected. The biggest advantage of this packaging method is that multiple wires 5 can be packaged at one time. Compared with the traditional single-wire packaging method, the packaging efficiency is significantly improved. According to actual calculations, the efficiency is increased by 150%, while reducing production costs. It has the significant characteristics of low cost and high efficiency, providing strong support for the large-scale production of electronic products.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency temperature sensor manufacturing packaging structure, comprising a tray (1), characterized in that: The left end of the tray (1) is movably connected to a second support plate (6), and the right end of the tray (1) is movably connected to a first support plate (3). The first support plate (3) and the second support plate (6) have the same structure. The first support plate (3) and the second support plate (6) are movably connected together to a card plate (4). Twenty-five wires (5) are movably connected to the front end of the card plate (4). Two hundred hardware housing parts (2) are movably connected to the upper end of the tray (1). Both the second support plate (6) and the first support plate (3) are "L" shaped structures. An adhesive layer (61) is fixedly connected to both the second support plate (6) and the first support plate (3). Eight limiting grooves (63) are opened at the left end of the second support plate (6) and the right end of the first support plate (3). Several arc-shaped surfaces (62) are provided at the upper end of the second support plate (6) and the upper end of the first support plate (3).

2. The high-efficiency temperature sensor manufacturing and packaging structure according to claim 1, characterized in that: The second support plate (6) and the first support plate (3) are respectively installed on the left and right ends of the tray (1) through an adhesive layer (61).

3. The high-efficiency temperature sensor manufacturing and packaging structure according to claim 1, characterized in that: The front end of the card plate (4) has twenty-five card slots (41).

4. The high-efficiency temperature sensor manufacturing and packaging structure according to claim 1, characterized in that: The twenty-five wires (5) are located in twenty-five slots (41).

5. The high-efficiency temperature sensor manufacturing and packaging structure according to claim 1, characterized in that: The tray (1) has two hundred slots (11) on its upper end.

6. The high-efficiency temperature sensor manufacturing and packaging structure according to claim 5, characterized in that: The two hundred slots (11) are divided into eight rows, and each row has twenty-five slots (11).