Automatic feeding device for plastic sealing cake of integrated circuit wafer
By combining an electric push rod and a cylinder with a slider design, along with a buffer structure for the conveyor belt and discharge pipe, the problems of insufficient buffering performance and low positioning accuracy of the automatic integrated circuit wafer feeding device are solved, achieving efficient and stable wafer transportation and improving the degree of automation and packaging quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN LANGCHENGWEI ELECTRONIC EQUIP CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-28
AI Technical Summary
Existing automated feeding devices for integrated circuit wafers suffer from insufficient buffering performance, low positioning accuracy, and limited automation, which makes the wafers prone to damage or contamination during the unloading process, affecting packaging quality.
The design employs an electric push rod and a cylinder in conjunction with a slider to achieve flexible clamping and buffering. Combined with the buffering structure of the conveyor belt and the discharge pipe, the intermittent rotation of the discharge port is controlled by a motor, and the spring-limited stop bar provides buffering, thus achieving stable conveying of the material sheets.
It improves the positioning accuracy and automation of the material sheets, reduces the risk of damage and contamination, and ensures an efficient and stable continuous feeding process.
Smart Images
Figure CN224563725U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated circuit material technology, and in particular to an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers. Background Technology
[0002] With the rapid development of integrated circuit packaging technology, the molding process of integrated circuit wafers places higher demands on the precision and efficiency of automated feeding devices. Traditional manual feeding methods are not only inefficient, but also prone to wafer damage or contamination due to improper operation, affecting packaging quality.
[0003] While existing automated feeding equipment achieves a certain degree of automation, it still suffers from the following problems: Insufficient buffering performance: During the feeding process, the sheets are easily scratched or deformed due to direct falling or collisions, affecting the subsequent packaging effect. Low positioning accuracy: Some equipment uses mechanical clamping or pushing mechanisms, but lacks flexible buffering design, which can easily cause stress damage to the sheets during clamping or movement. Limited degree of automation: Existing devices have poor coordination in the sheet transfer, positioning, and delivery stages, making it difficult to achieve efficient and stable continuous feeding.
[0004] Utility model content.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers, comprising: a conveyor belt, two long rods fixedly installed on the top of the conveyor belt, a slider slidably connected to the outer surface of the two long rods, a cylinder fixedly installed on one side of the slider, two electric push rods (first type) fixedly installed on the bottom of the slider, a lifting block fixedly installed on the bottom of the two electric push rods (first type), an electric push rod (second type) fixedly installed on the bottom of the lifting block, a fixed semicircular block fixedly installed on one side of the electric push rod (second type), and a movable semicircular block fixedly installed on the bottom of the lifting block.
[0006] The technical effect of adopting the above-mentioned further solution is as follows: by starting the electric push rod one to push the lifting block downward, and then starting the electric push rod two again by external power, the electric push rod two moves to one side to clamp and fix the integrated circuit wafer. After clamping and fixing, the electric push rod one drives the integrated circuit wafer to move upward. By starting the cylinder, the slider moves on the outer surface of the long rod. At this time, the slider moves to the top of the feeding bin. The electric push rod two drives the fixed semicircular block to one side. At this time, the fixed semicircular block disengages from one side of the integrated circuit wafer. After disengagement, the integrated circuit wafer can be transported into the inside of the feeding bin.
[0007] In a preferred embodiment, a feed bin is fixedly installed on the top of the conveyor belt, a motor is fixedly installed on the bottom of the feed bin, and a rotating rod is fixedly installed on the output end of the motor.
[0008] The technical effect of adopting the above-mentioned further solution is that the motor drives the rotating rod to rotate, and the rotating rod drives the discharge port to rotate. Whenever the discharge port rotates to the bottom of the feeding hopper, the internal integrated circuit chip will enter the discharge pipe through the discharge port, realizing intermittent feeding.
[0009] In a preferred embodiment, a rotating disk is fixedly installed at the bottom end of the rotating rod, and a discharge port is opened on the outer surface of the rotating disk. The rotating disk is slidably connected to the bottom of the feeding bin, and a discharge pipe is fixedly installed at the top of the conveyor belt, with the discharge pipe located directly below the rotating disk.
[0010] The technical effect of adopting the above-mentioned further solution is that the material slides down through the discharge pipe to the upper surface of the two baffles, which is used to make it slide vertically.
[0011] In a preferred embodiment, crossbars are fixedly installed on both sides of the outer surface of the discharge pipe, connecting plates are fixedly installed at the bottom of the two crossbars, brackets are fixedly installed on opposite sides of the two connecting plates, rotating rods are movably embedded inside the two brackets, and stop strips are movably sleeved on the outer surface of the two rotating rods.
[0012] The technical effect of adopting the above-mentioned further solution is that the stop bar can be flipped by rotating in a semi-circular manner around the rotating rod as the center.
[0013] In a preferred embodiment, springs are fixedly installed on the outer surfaces of both baffles, and one end of each spring is fixedly installed on both sides of the outer surface of the discharge pipe. The two baffles are located directly below the discharge pipe.
[0014] The technical effect of adopting the above-mentioned further solution is that, under the limiting action of the two springs, the baffle has elasticity to buffer the integrated circuit wafers sliding down the discharge pipe. At the same time, the integrated circuit wafers enter the upper surface of the conveyor belt and are transported and fed by the conveyor belt.
[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0016] 1. In use, the motor is started by an external power source, which drives the rotating rod to rotate. The rotating rod drives the discharge port to rotate. Whenever the discharge port rotates to the bottom of the feeding hopper, the integrated circuit wafers inside will enter the discharge pipe through the discharge port. At this time, they slide down the discharge pipe onto the upper surface of the two baffles. Under the limiting action of the two springs, the baffles have elasticity to buffer the integrated circuit wafers sliding down the discharge pipe. At the same time, the integrated circuit wafers enter the upper surface of the conveyor belt and are transported by the conveyor belt.
[0017] 2. In use, this utility model is activated by starting the electric push rod one to push the lifting block downwards. Then, the electric push rod two is activated again by an external power source. At this time, the electric push rod two moves to one side to clamp and fix the integrated circuit wafer. After clamping and fixing, the electric push rod one drives the integrated circuit wafer to move upwards. The cylinder is activated to push the slider to move on the outer surface of the long rod. At this time, the slider moves to the top of the feeding bin. The electric push rod two drives the fixed semicircular block to one side. At this time, the fixed semicircular block disengages from one side of the integrated circuit wafer. After disengagement, the integrated circuit wafer can be transported into the inside of the feeding bin. Attached Figure Description
[0018] Figure 1 This utility model provides a three-dimensional structural schematic diagram of an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers;
[0019] Figure 2 This utility model provides a schematic diagram of the motor structure of an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers;
[0020] Figure 3 This utility model provides a schematic diagram of the structure of the baffle of an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers;
[0021] Figure 4 This utility model presents a side view schematic diagram of an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers.
[0022] Legend: 101. Conveyor belt; 102. Feed hopper; 103. Motor; 104. Rotary disc; 105. Rotating rod; 106. Discharge port; 107. Discharge pipe; 108. Horizontal bar; 109. Spring; 110. Stop bar; 111. Rotating rod; 112. Support; 113. Connecting plate; 114. Cylinder; 115. Slider; 116. Long rod; 117. Electric push rod one; 118. Lifting block; 119. Electric push rod two; 120. Fixed semicircular block; 121. Moving semicircular block. Detailed Implementation
[0023] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.
[0025] Please see Figures 1 to 4This utility model provides an automatic feeding device for plastic encapsulation cakes of integrated circuit wafers, comprising: a conveyor belt 101, two long rods 116 fixedly installed on the top of the conveyor belt 101, sliders 115 slidably connected to the outer surfaces of the two long rods 116, a cylinder 114 fixedly installed on one side of the slider 115, two electric push rods 117 fixedly installed on the bottom of the slider 115, a lifting block 118 fixedly installed on the bottom of the two electric push rods 117, an electric push rod 119 fixedly installed on the bottom of the lifting block 118, a fixed semicircular block 120 fixedly installed on one side of the electric push rod 119, and a movable semicircular block 121 fixedly installed on the bottom of the lifting block 118. By activating the electric push rod 117, the lifting block 118 is pushed downward. Then, the electric push rod 119 is activated again by the external power supply. At this time, the electric push rod 119 moves to one side to clamp and fix the integrated circuit wafer. After clamping and fixing, the electric push rod 117 drives the integrated circuit wafer to move upward. By activating the cylinder 114, the slider 115 moves on the outer surface of the long rod 116. At this time, the slider 115 moves to the top of the feeding bin 102. The electric push rod 119 drives the fixed semicircular block 120 to move to one side. At this time, the fixed semicircular block 120 disengages from one side of the integrated circuit wafer. After disengagement, the integrated circuit wafer can be transported into the inside of the feeding bin 102.
[0026] like Figures 1 to 4 As shown, a feeding bin 102 is fixedly installed on the top of the conveyor belt 101, and a motor 103 is fixedly installed on the bottom of the feeding bin 102. A rotating rod 105 is fixedly installed on the output end of the motor 103. The motor 103 drives the rotating rod 105 to rotate, and the rotating rod 105 drives the discharge port 106 to rotate. Whenever the discharge port 106 rotates to the bottom of the feeding bin 102, the integrated circuit chips inside will enter the discharge pipe 107 through the discharge port 106, realizing intermittent feeding.
[0027] like Figures 1 to 4 As shown, a rotating disk 104 is fixedly installed at the bottom of the rotating rod 105. A discharge port 106 is opened on the outer surface of the rotating disk 104. The rotating disk 104 is slidably connected to the bottom of the feed bin 102. A discharge pipe 107 is fixedly installed on the top of the conveyor belt 101. The discharge pipe 107 is located directly below the rotating disk 104. The material slides down through the discharge pipe 107 to the upper surface of the two baffles 110 for vertical sliding.
[0028] like Figures 1 to 4As shown, horizontal bars 108 are fixedly installed on both sides of the outer surface of the discharge pipe 107. Connecting plates 113 are fixedly installed at the bottom of the two horizontal bars 108. Supports 112 are fixedly installed on opposite sides of the two connecting plates 113. Rotating rods 111 are movably embedded inside the two supports 112. Stop bars 110 are movably sleeved on the outer surface of the two rotating rods 111. The stop bars 110 can be flipped by rotating in a semi-circular manner around the rotating rods 111.
[0029] like Figures 1 to 4 As shown, springs 109 are fixedly installed on the outer surfaces of the two baffles 110. One end of each spring 109 is fixedly installed on both sides of the outer surface of the discharge pipe 107. The two baffles 110 are located directly below the discharge pipe 107. Under the limiting action of the two springs 109, the baffles 110 have elasticity to buffer the integrated circuit wafers that slide down the discharge pipe 107. At the same time, the integrated circuit wafers enter the upper surface of the conveyor belt 101 and are conveyed and fed by the conveyor belt 101.
[0030] Working principle: During use, the electric push rod 117 is activated to push the lifting block 118 downward. Then, the electric push rod 119 is activated again via external power. At this time, the electric push rod 119 moves to one side to clamp and fix the integrated circuit wafer. After clamping and fixing, the electric push rod 117 drives the integrated circuit wafer upward. The cylinder 114 then pushes the slider 115 to move on the outer surface of the long rod 116. At this time, the slider 115 moves above the feeding bin 102. The electric push rod 119 then drives the fixed semicircular block 120 to one side. The fixed semicircular block 120 then disengages from one side of the integrated circuit wafer, allowing the integrated circuit wafer to be transported to the feeding bin. Inside 102, the motor 103 is started by an external power source. The motor 103 drives the rotating rod 105 to rotate, and the rotating rod 105 drives the discharge port 106 to rotate. Whenever the discharge port 106 rotates to the bottom of the feeding bin 102, the integrated circuit wafers inside will enter the discharge pipe 107 through the discharge port 106. At this time, they slide down through the discharge pipe 107 to the upper surface of the two baffles 110. Under the limiting action of the two springs 109, the baffles 110 have elasticity to buffer the integrated circuit wafers sliding down the discharge pipe 107. At the same time, the integrated circuit wafers enter the upper surface of the conveyor belt 101 and are conveyed and fed by the conveyor belt 101.
[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.
Claims
1. An automatic feeding device for plastic encapsulation cakes of integrated circuit wafers, comprising: The conveyor belt (101) is characterized in that two long rods (116) are fixedly installed on the top of the conveyor belt (101), and sliders (115) are slidably connected to the outer surfaces of the two long rods (116). A cylinder (114) is fixedly installed on one side of the slider (115), and two electric push rods (117) are fixedly installed on the bottom of the slider (115). A lifting block (118) is fixedly installed on the bottom of the two electric push rods (117), and an electric push rod (119) is fixedly installed on the bottom of the lifting block (118). A fixed semicircular block (120) is fixedly installed on one side of the electric push rod (119), and a movable semicircular block (121) is fixedly installed on the bottom of the lifting block (118).
2. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 1, characterized in that: A feed bin (102) is fixedly installed on the top of the conveyor belt (101), and a motor (103) is fixedly installed on the bottom of the feed bin (102).
3. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 2, characterized in that: A rotating rod (105) is fixedly installed at the output end of the motor (103).
4. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 3, characterized in that: A rotating disk (104) is fixedly installed at the bottom end of the rotating rod (105), and a discharge port (106) is opened on the outer surface of the rotating disk (104).
5. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 4, characterized in that: The rotating disk (104) is slidably connected to the bottom of the feed hopper (102), and the top of the conveyor belt (101) is fixedly installed with a discharge pipe (107), which is located directly below the rotating disk (104).
6. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 5, characterized in that: A horizontal bar (108) is fixedly installed on both sides of the outer surface of the discharge pipe (107), a connecting plate (113) is fixedly installed at the bottom of the two horizontal bars (108), and a bracket (112) is fixedly installed on the opposite side of the two connecting plates (113).
7. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 6, characterized in that: The two brackets (112) are each movably fitted with a rotating rod (111), and the outer surfaces of the two rotating rods (111) are each movably fitted with a stop strip (110).
8. The automatic feeding device for plastic encapsulation cakes of integrated circuit wafers according to claim 7, characterized in that: Springs (109) are fixedly installed on the outer surfaces of the two baffles (110), and one end of each spring (109) is fixedly installed on both sides of the outer surface of the discharge pipe (107). The two baffles (110) are located directly below the discharge pipe (107).