Conveniently adjusted die bonder gravity balance mechanism
By symmetrically setting tension spring mechanisms on both sides of the load guide mechanism of the die bonder, and adjusting the fixing point of the tension springs using adjusting screws and adjusting seats, the problem of inaccurate adjustment of the die bonder's gravity balance is solved, and the motion accuracy and speed are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI FORESIGHT TECHNOLOGY CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-07-28
AI Technical Summary
In existing die bonders, the gravity balance structure of the bonding head cannot be effectively adjusted, causing the spring tension and the load gravity to be out of line, affecting motion accuracy and speed.
A tension spring mechanism is symmetrically set on both sides of the load guiding mechanism of the die bonder. Combined with the adjusting screw and adjusting seat, the position of the upper fixed point of the tension spring is adjusted by rotating the adjusting screw, so as to achieve balanced adjustment of the die bonder load.
It effectively reduces the friction caused by the eccentricity of the load and the balance spring, and improves the movement accuracy and speed of the bearing head.
Smart Images

Figure CN224566620U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of die bonder technology, specifically relating to a gravity balance mechanism for a die bonder that is easy to adjust. Background Technology
[0002] The die bonding process generally involves first dispensing adhesive onto the wafer mounting position on the support using a dispensing machine. The dispensed wafer is then moved to the bonding station, where the die bonder, driven by a drive assembly, picks up the wafer from the die-feeding mechanism and places it onto the support, completing the die bonding process. During die bonding, the bonding head needs to move up and down repeatedly; its speed and accuracy significantly impact the equipment. When the bonding head is driven by a linear motor, there is no balancing resistance when the linear motor is de-energized. Therefore, a separate mechanical structure is needed to balance the load of the motor-driven bonding head to prevent it from falling freely after power failure. Existing methods for balancing the Z-axis linear motor load primarily use a fixed spring to hold the load. However, this method has two problems: firstly, the spring force is generally not aligned with the load's weight; secondly, the exact position of the load during balancing cannot be adjusted. Utility Model Content
[0003] In view of this, the purpose of this utility model is to provide a conveniently adjustable gravity balancing mechanism for a die bonder, so as to overcome the shortcomings of the prior art.
[0004] To achieve the above objectives, this utility model is implemented through the following technical solution:
[0005] A conveniently adjustable gravity balancing mechanism for a die bonder is provided, applied to a die bonder load guiding mechanism. A tension spring mechanism for balancing the load of the die bonder is symmetrically arranged on both sides of the load guiding mechanism. The tension spring mechanism includes a fixed base, a tension spring, and an up-and-down adjustment mechanism. The up-and-down adjustment mechanism is mounted on the fixed base. The lower end of the tension spring is connected to the load of the die bonder. The up-and-down adjustment mechanism is fixedly connected to the upper fixed point of the tension spring and adjusts the up-and-down position of the upper fixed point of the tension spring.
[0006] As described in the easily adjustable gravity balancing mechanism for a die bonder, the up-and-down adjustment mechanism includes an adjusting screw and an adjusting base. The fixed base includes a vertical plate. The screw of the adjusting screw is rotatably and vertically housed within the vertical plate and threadedly connected to the adjusting base. The head of the adjusting screw protrudes from the top of the vertical plate. The upper end of the tension spring is fixedly connected to the adjusting base.
[0007] As described in the easily adjustable gravity balancing mechanism for a die bonder, the vertical plate of the fixed base is provided with a vertical through groove, and a guide screw is fixedly connected to the relative position on the adjusting base, the guide screw being able to slide up and down along the vertical through groove.
[0008] As described in the easily adjustable gravity balancing mechanism for the die bonder, there are two vertical through slots arranged in parallel to each other.
[0009] The beneficial effects of this utility model's technical solution are:
[0010] The symmetrical arrangement of tension springs on both sides of the load guiding mechanism to balance the load can effectively reduce the friction caused by the eccentricity between the load and the balance springs; the adjustable mechanism that can move along the height direction can easily adjust the position of the load in the height direction after the gravity of the balance load is applied. Attached Figure Description
[0011] To further illustrate the above-mentioned objectives, structural features, and effects of this utility model, the following will describe this utility model in detail with reference to the accompanying drawings.
[0012] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;
[0013] Figure 2 This is a schematic diagram of the tension spring mechanism of a preferred embodiment of the present invention;
[0014] In the diagram: 1. Tension spring mechanism; 11. Fixed seat; 12. Tension spring; 13. Adjusting screw; 14. Adjusting seat; 15. Vertical through groove; 16. Guide fixing screw. Detailed Implementation
[0015] The terms “utility model” and “this utility model” used in this specification are intended to broadly refer to all subject matter of this specification and any of the following patent claims. Statements containing these terms should not be construed as limiting the subject matter described herein or limiting the meaning or scope of any of the following patent claims. Furthermore, this specification does not attempt to describe or limit the subject matter covered by any claim of any particular component, paragraph, statement, or drawing of this application. The subject matter should be understood with reference to the entire specification, all drawings, and any of the following claims. This utility model may have other embodiments and be practiced or implemented in other ways. Moreover, it should be understood that the wording and terminology used herein are for illustrative purposes and should not be considered limiting.
[0016] The details of the present invention will now be discussed with reference to the accompanying drawings, which are illustrated by way of example only. In the drawings, similar features or components may be labeled with the same reference numerals.
[0017] The use of the terms "comprising," "having," and "including," and variations thereof, herein means to include the items listed herein, their equivalents, and additional items. While reference may be made in the description of the drawings to directions such as above, below, upward, downward, backward, bottom, top, front, rear, etc., for convenience, reference is made relative to the drawings. These directions are not intended to literally accept or limit the invention in any form. Furthermore, terms such as "first," "second," "third," etc., are used herein for illustrative purposes and are not intended to indicate or imply importance or significance.
[0018] See Figure 1 As shown, the easily adjustable gravity balancing mechanism of this utility model is applied to the die bonder load guiding mechanism. Tension spring mechanisms 1 for balancing the load on the die bonder are symmetrically arranged on both sides of the load guiding mechanism. See also... Figure 2 As shown, the tension spring mechanism 1 includes a fixed base 11, a tension spring 12, and an up-down adjustment mechanism. The up-down adjustment mechanism is mounted on the fixed base 11. The lower end of the tension spring 12 is connected to the load on the bearing head. The up-down adjustment mechanism is fixedly connected to the upper fixed point of the tension spring 12 and adjusts the up-down position of the upper fixed point of the tension spring 12 to achieve the purpose of adjusting the up-down position of the load on the bearing head.
[0019] Furthermore, the up-and-down adjustment mechanism includes an adjusting screw 13 and an adjusting seat 14. The fixed seat 11 includes a vertical plate. The screw of the adjusting screw 13 is rotatably and vertically housed within the vertical plate and threadedly connected to the adjusting seat 14. The head of the adjusting screw 13 protrudes from the top of the vertical plate. The upper end of the tension spring 12 is fixedly connected to the adjusting seat 14. The spring coefficient of the tension spring 12 is determined according to the specific load-bearing capacity of the bearing.
[0020] The vertical plate of the fixed seat 11 is provided with a vertical through groove 15. A guide fixing screw 16 is fixedly connected to the relative position of the adjusting seat 14. The guide fixing screw 16 can slide up and down along the vertical through groove 15, and plays the role of guiding and fastening the adjusting seat 14 during the up and down movement of the adjusting seat 14.
[0021] Furthermore, there are two vertical through slots 15, which are arranged parallel to each other.
[0022] Rotate the head of the adjusting screw 13 to adjust the up and down position of the adjusting seat 14, thereby adjusting the specific up and down position of the bearing connected to the balance spring when the load is balanced.
[0023] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A conveniently adjustable gravity balancing mechanism for a die bonder, applied to the load guiding mechanism of the die bonder head, characterized in that, A tension spring mechanism for balancing the load on the bearing head is symmetrically arranged on both sides of the load guiding mechanism. The tension spring mechanism includes a fixed base, a tension spring, and an up-and-down adjustment mechanism. The up-and-down adjustment mechanism is located on the fixed base. The lower end of the tension spring is connected to the load on the bearing head. The up-and-down adjustment mechanism is fixedly connected to the upper fixed point of the tension spring and adjusts the up-and-down position of the upper fixed point of the tension spring.
2. The easily adjustable gravity balancing mechanism for a die bonder as described in claim 1, characterized in that, The up-down adjustment mechanism includes an adjustment screw and an adjustment seat. The fixed seat includes a vertical plate. The screw of the adjustment screw is rotatably and vertically housed in the vertical plate and threadedly connected to the adjustment seat. The head of the adjustment screw protrudes from the top of the vertical plate. The upper end of the tension spring is fixedly connected to the adjustment seat.
3. The easily adjustable gravity balancing mechanism for a die bonder as described in claim 2, characterized in that, The vertical plate of the fixed base is provided with a vertical through groove, and a guide screw is fixedly connected to the relative position on the adjusting base. The guide screw can slide up and down along the vertical through groove.
4. The easily adjustable gravity balancing mechanism for a die bonder as described in claim 3, characterized in that, The vertical through slots are two in number and are arranged parallel to each other.