Pressure-sensitive combination switch
By integrating pressure-sensitive sensors and conductive springs, a single-device solution for light and heavy press functions in smart devices has been achieved. This solves the problems of structural complexity and high failure rate caused by multiple devices in existing technologies, and improves the compactness and reliability of the devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUICHUANGDA TECH
- Filing Date
- 2025-09-23
- Publication Date
- 2026-07-28
AI Technical Summary
In existing smart devices, pressure sensing and switching functions require multiple independent components, resulting in complex structures, large space occupation, high costs, high failure rates, and the inability to achieve multiple signal outputs.
It adopts a single pressure-sensitive switch body, which integrates light and heavy press functions through a pressure-sensitive sensor and a conductive spring. The first and second gold layers on the circuit board are isolated and distributed. The arched part of the conductive spring contacts different gold layers when pressed lightly and heavily to achieve signal output.
It integrates light and heavy press functions, simplifies the structure, saves space, reduces processing difficulty and failure rate, and improves response accuracy and product lifespan.
Smart Images
Figure CN224571237U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic components, and in particular to a pressure-sensitive combination switch. Background Technology
[0002] In existing technologies, the combination of pressure sensitivity and switching functions commonly found in smart devices is achieved through multiple independent components to realize the light touch and hard press functions. Specifically, it typically requires multiple discrete components: a light touch sensor to detect slight pressure changes and output a signal, for example, sensing a user's light press operation through a change in resistance value; and a hard press sensor to confirm the function or switch modes under greater pressure, for example, implementing function selection in the side button application of smartphones or smartwatches. Some devices also include an additional component (such as an isolation or integration structure) to coordinate the work of both. This approach is widely used in compact devices such as smartphones and smartwatches, and its core purpose is to enable previewing or quick operations (such as volume adjustment) through light touch, while hard presses perform confirmation or activate multi-function modes.
[0003] However, the aforementioned drawbacks of using a multi-component structure also objectively exist, mainly including high complexity, large space occupation, increased cost, and potential signal interference problems. Specifically, the need to install and connect multiple independent components significantly increases the difficulty of manufacturing and maintenance. For example, precise alignment of components is required during assembly, increasing production time and resource consumption. Furthermore, existing waterproof switches only have a press-to-conduct function, unable to achieve multiple signal output functions from a single button. Simultaneously, multiple components occupy additional physical space, which becomes a bottleneck in modern devices pursuing thinness and lightness, limiting design flexibility and product miniaturization. These drawbacks not only reduce overall performance but also increase the failure rate (such as loose springs or solder joints), making the device prone to problems during long-term use. Therefore, while existing technical solutions are functionally feasible, they are insufficient to meet the current market demand for efficient, compact, and low-cost multi-functional buttons. Utility Model Content
[0004] The present invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the main objective of this invention is to provide a pressure-sensitive combination switch, which addresses the problem in existing technologies where pressure sensing and switching functions cannot be integrated into a single device, resulting in complex structures, difficult manufacturing processes, and high failure rates.
[0005] To achieve the above objectives, this utility model provides a pressure-sensitive combination switch, comprising a pressure-sensitive switch body composed of a circuit board, a pressure-sensitive sensor, and a conductive spring. The pressure-sensitive sensor and the conductive spring are respectively disposed on both sides of the circuit board and are each connected to the solder pads of the circuit board. The conductive spring is arched to one side. Between the circuit board and the conductive spring, a circuit gold layer is exposed on the circuit board. The circuit gold layer includes a first gold layer and a second gold layer. The first gold layer is located on the outer ring of the second gold layer and forms an isolation between them. The first gold layer is in contact with the edge of the conductive spring, and the second gold layer corresponds to the arched part of the conductive spring.
[0006] As a further embodiment of this utility model, the circuit board has an outer frame surrounding the gold layer of the circuit on one side, and the outer frame limits the two ends of the conductive spring.
[0007] As a further embodiment of this utility model, a groove is formed inside the outer frame, the circuit gold layer is disposed at the bottom of the groove, and an outer shell film is provided on one side of the spring piece. The outer shell film is connected to the outer frame to form a sealing structure.
[0008] As a further embodiment of this utility model, a pressure head corresponding to the second gold layer is provided between the conductive spring and the outer shell membrane, and at the arched top position of the conductive spring piece.
[0009] As a further embodiment of this invention, the pressure sensor is a printed circuit structure disposed on the bottom of the circuit board.
[0010] As a further embodiment of this invention, the number of pressure-sensitive sensors disposed at the bottom of the circuit board is at least four, and they are evenly distributed at the bottom of the circuit board.
[0011] As a further embodiment of this invention, the conductive spring is composed of at least three conductive sheets stacked together.
[0012] The beneficial effects of this utility model are as follows: This solution integrates both light and heavy press functions through a single pressure-sensitive switch body.
[0013] Structurally, the pressure sensor is fixed to the bottom of the circuit board, and the conductive spring is mounted on the top of the circuit board. Both are connected to the circuit board solder pads. The conductive spring is arched, with its edge always in contact with the first exposed gold layer of the circuit board, while the arched part is suspended and corresponds to the second gold layer (the two gold layers are distributed in isolation).
[0014] In actual use, light pressure causes the circuit board to deform slightly, thus achieving one form of control; when pressed harder, the arched part of the conductive spring is pressed down and contacts the second gold layer, directly forming a circuit to conduct and output a switching signal, thus forming another form of control.
[0015] This technical solution completely replaces the traditional multi-component combination, solving a long-standing technical problem in the industry. It not only simplifies the structure, saves space, and allows for diverse application scenarios, but also eliminates malfunctions caused by assembly deviations of multiple components, improving response accuracy and product lifespan. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the technical solutions of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the overall structure of the pressure-sensitive switch body in this utility model.
[0018] Figure 2 This is a schematic diagram of the pressure sensors disposed at the bottom of the circuit board in this utility model.
[0019] Figure 3 This is a schematic diagram showing the circuit gold layer, conductive spring, and outer shell film disassembled from one side of the circuit board in this utility model.
[0020] Figure 4 A planar schematic diagram showing the first and second gold layers of the circuit gold layer in this utility model.
[0021] Figure 5 This is a schematic diagram of the components of the pressure-sensitive switch body in this utility model from a cross-sectional view.
[0022] Figure 6 This is a schematic diagram of the planar state of the pressure-sensitive sensors in this utility model when they are distributed at the bottom of the circuit board.
[0023] Figure 7 This is a schematic diagram of a circuit structure of the pressure-sensitive switch body in this utility model.
[0024] 1 Pressure-sensitive switch body 1021 Second gold layer 10 circuit board 103 Conductive spring 100 Outer frame 104 pressure head 101 tank 105 Outer membrane 102 Circuit gold layer 11 solder feet 1020 First Gold Layer 12 Pressure sensor Detailed Implementation
[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0026] The term "one embodiment" or "implementation" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this utility model. In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein.
[0027] Please see the appendix Figure 1-7 , The pressure-sensitive combination switch of this scheme mainly includes a pressure-sensitive switch body (1), which consists of a circuit board (10), a pressure sensor (12) and a conductive spring (103). The pressure sensor (12) is fixed on one side of the circuit board (10), and the conductive spring (103) is fixed on the other side of the circuit board (10). Both are directly connected to the solder pads (11) of the circuit board (10). The conductive spring (103) is designed to be arched to one side. On the side of the circuit board (10) facing the conductive spring (103), the circuit gold layer (102) is exposed. The circuit gold layer (102) is divided into a first gold layer (1020) and a second gold layer (1021). The first gold layer (1020) is located on the outer ring of the second gold layer (1021), and there is an isolation between the two. The first gold layer (1020) is always in contact with the edge of the conductive spring (103), while the second gold layer (1021) is aligned with the arched part of the conductive spring (103).
[0028] This technical solution achieves both light and heavy press functions using the aforementioned switching device.
[0029] Specifically, during a light press, external pressure causes a slight deformation of the circuit board (10), resulting in a change in the resistance value of the pressure sensor (12) at the bottom. The software of the main device monitors this change and can detect the light press operation. Understandably, the software can filter out interference signals within the tolerance range during a heavy press, avoiding malfunctions. During a heavy press, the conductive spring (103) is deformed under pressure, and the arched part sinks down to contact the second gold layer (1021). At this time, the second gold layer (1021) and the first gold layer (1020) are connected through the conductive spring (103), and a switch signal is output for function confirmation or multi-function mode switching. In this way, only one device is needed to solve the problem of requiring multiple independent sensors and switches in traditional solutions, greatly simplifying the structural assembly, reducing space occupation, reducing processing difficulty and failure rate, and solving a long-standing problem in the industry.
[0030] Reference Appendix Figure 3 In a preferred embodiment of this utility model, a frame (100) is provided on the side of the circuit board (10) facing the conductive spring (103) and surrounding the circuit gold layer (102). The main function of the frame (100) is to fix the position of the conductive spring (103), specifically to firmly restrict both ends of the conductive spring (103) within the frame (100) to prevent it from shifting or tilting during use.
[0031] Understandably, the outer frame (100) also protects the exposed circuit gold layer (102) from external contamination or physical damage, and provides assembly components for positioning and assembly with external structures (such as equipment housings and other assembly structures), such as waterproof housings.
[0032] Reference Appendix Figure 3 In a preferred embodiment of this utility model, an accommodating groove (101) is formed inside the outer frame (100), a circuit gold layer (102) is disposed at the bottom of the groove (101), and a shell film (105) is covered above the conductive spring sheet (103). The shell film (105) is tightly connected to the edge of the outer frame (100), thereby completely sealing the conductive spring sheet (103), circuit gold layer (102) and other components inside the groove (101) to form a dustproof and waterproof closed structure.
[0033] Reference Appendix Figure 3 , 5 In a preferred embodiment of this utility model, a pressure head (104) structure is added between the top of the arched part of the conductive spring sheet (103) and the outer shell film (105). The position of the pressure head (104) is precisely aligned with the second gold layer (1021) area of the circuit gold layer (102).
[0034] In practice, when the user applies pressure, the pressure head (104) transmits the pressure to the arched top of the conductive spring (103) through the outer shell membrane (105), causing the conductive spring (103) to press down and deform to contact the second gold layer (1021) more quickly and stably. This avoids the problem of uneven local deformation or delayed response that may occur when directly pressing the conductive spring (103). The pressure head (104) only acts on the center position of the spring and does not affect the sealing structure formed by the outer frame (100) and the outer shell membrane (105), ensuring that the waterproof and dustproof performance is not affected.
[0035] Reference Appendix Figure 2 , 6 In a preferred embodiment of this utility model, the pressure sensor (12) of this solution is directly fabricated on the bottom of the circuit board (10) using a printed circuit structure. That is, the sensor circuit and the circuit board (10) are integrally formed by printing process, which eliminates the assembly process of traditional independent sensors, eliminates the risk of loose solder joints or connection failure, makes the sensor signal detection more stable and accurate, and further reduces the production difficulty and cost.
[0036] Reference Appendix Figure 2 , 6 In a preferred embodiment of this invention, at least four pressure-sensitive sensors (12) are provided at the bottom of the circuit board (10). These sensors are evenly distributed in different areas of the circuit board (10). No matter from which angle the user presses the switch, at least two sensors can detect the pressure change simultaneously, which greatly improves the signal recognition accuracy and anti-interference capability of light-press operation. Furthermore, the cooperation of multiple sensors can reduce the risk of single sensor failure, ensuring the stability and reliability of pressure detection. Especially in complex usage scenarios (such as underwater, high and low temperatures, and slopes, etc.), it can still accurately distinguish between light and heavy press actions.
[0037] Reference Appendix Figure 3 , 5 In a preferred embodiment of this utility model, the conductive spring (103) of this solution is a multi-layer structure design, which can be configured as a stacked spring composed of at least 3 layers of conductive sheets, thereby enhancing the overall elasticity and mechanical strength of the spring, so that it can quickly return to its original shape after repeated pressing, avoiding single-point deformation fatigue and extending service life.
[0038] It is easy to understand that the multilayer conductive sheet structure of this solution can also improve the stability and conductivity uniformity of the contact with the circuit gold layer (102), ensuring that the conduction signal is more reliable when pressed again.
[0039] The following points need to be explained: (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.
[0040] (2) Where there is no conflict, features of the same embodiment and different embodiments of this disclosure can be combined with each other.
[0041] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. A pressure-sensitive combination switch, characterized in that, include The main body of the pressure-sensitive switch consists of a circuit board, a pressure-sensitive sensor, and a conductive spring. The pressure-sensitive sensor and the conductive spring are respectively disposed on both sides of the circuit board and are each connected to the solder pads of the circuit board. The conductive spring is arched to one side. Between the circuit board and the conductive spring, a circuit gold layer is exposed on the circuit board. The circuit gold layer includes a first gold layer and a second gold layer. The first gold layer is located on the outer ring of the second gold layer and forms an isolation between them. The first gold layer is in contact with the edge of the conductive spring, and the second gold layer corresponds to the arched part of the conductive spring.
2. The pressure-sensitive combination switch according to claim 1, characterized in that, The circuit board has an outer frame surrounding the gold layer of the circuit on one side, and the outer frame limits the two ends of the conductive spring.
3. The pressure-sensitive combination switch according to claim 2, characterized in that, The outer frame has a groove inside, the circuit gold layer is disposed at the bottom of the groove, and the outer shell film is provided on one side of the spring piece. The outer shell film is connected to the outer frame to form a sealed structure.
4. The pressure-sensitive combination switch according to claim 3, characterized in that, Between the spring and the outer shell membrane, and at the arched top of the conductive spring sheet, there is a pressure head corresponding to the second gold layer.
5. The pressure-sensitive combination switch according to claim 1, characterized in that, The pressure-sensitive sensor is a printed circuit structure located at the bottom of the circuit board.
6. The pressure-sensitive combination switch according to claim 1, characterized in that, The circuit board has at least four pressure sensors at its bottom, which are evenly distributed on the bottom of the circuit board.
7. The pressure-sensitive combination switch according to claim 1, characterized in that, The conductive spring is composed of at least three conductive sheets stacked together.