A gluing device for processing electronic components
By introducing a brush cleaning mechanism into the adhesive application device, the problem of dust on the surface of components affecting the adhesion of adhesive was solved, achieving a highly efficient adhesive application effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING HAICHUANG HENGYUAN TECHNOLOGY CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-08-04
AI Technical Summary
Existing electronic component coating equipment fails to effectively remove surface dust before coating, affecting the adhesion of the adhesive.
A glue-applying device was designed, which includes a clamping mechanism, a transmission mechanism, and a cleaning mechanism. The device cleans the dust on the surface of the components with a brush, then applies glue and collects the dust to ensure the glue adhesion effect.
It effectively removes dust from the surface of components, improves the adhesion of the adhesive, and ensures the quality of the adhesive application.
Smart Images

Figure CN224586250U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component processing technology, and in particular to a glue coating device for electronic component processing. Background Technology
[0002] Electronic component coating is a process of applying adhesive to the surface or connection points of electronic components. The purpose of coating is to enhance the mechanical strength and electrical insulation performance of the components and prevent them from getting damp, corroded, or short-circuited.
[0003] A search revealed Chinese patent publication number CN222428397U, which discloses a high-efficiency adhesive coating device for the production of electronic components. This patent uses a first rotating shaft to drive a second rotating shaft via a belt. Simultaneously, the rotation of the first and second lead screws causes the movable seat to move left and right, thereby enabling the adhesive coating tube and brush head installed at the bottom to apply adhesive to the motor components on the placement board. However, this device has certain problems: the surface of the electronic components may have impurities and dust adhering to it, and direct application of adhesive will affect the adhesion of the adhesive. Utility Model Content
[0004] The purpose of this invention is to provide a gluing device for processing electronic components in order to solve the above-mentioned problems.
[0005] This utility model achieves the above objectives through the following technical solutions:
[0006] An adhesive coating device for processing electronic components includes a worktable, a clamping mechanism on the worktable, a top plate fixed above the worktable, a movable block slidably connected to the top plate, and an adjustment mechanism on the movable block, the adjustment mechanism including a rotating shaft.
[0007] A rotating shaft is rotatably connected to the front end of a moving block. A transmission mechanism is provided above the rotating shaft. A mounting block is fixedly connected to the front end of the rotating shaft. A first telescopic rod is fixedly installed on one side of the mounting block. A brush is fixedly connected to the end of the first telescopic rod away from the mounting block. A second telescopic rod is fixedly installed at the lower end of the mounting block. A glue applicator is fixedly connected to the lower end of the second telescopic rod. A scraper is fixedly connected to the lower end of the glue applicator. Multiple glue dispensing tubes are fixedly installed on the side of the glue applicator near the brush.
[0008] Preferably, the transmission mechanism includes a transmission motor, which is fixedly mounted on the front end of the moving block. The output shaft of the transmission motor is fixedly connected to a drive gear, and the rear end of the rotating shaft is fixedly connected to a driven gear, which meshes with the drive gear.
[0009] Preferably, the clamping mechanism includes a fixed frame, with symmetrical clamping plates slidably connected to both sides of the fixed frame, and an electric push rod fixedly installed between the clamping plates and the fixed frame.
[0010] Preferably, a movable lead screw is rotatably connected inside the top plate, and the movable lead screw is threadedly connected to the movable block. A drive motor is fixedly installed on one side of the top plate, and the drive motor is fixedly connected to the movable lead screw.
[0011] Preferably, a glue storage tank is fixedly connected to the upper end of the movable block, and a connecting pipe is fixedly connected to the lower end of the glue storage tank, with the lower end of the connecting pipe fixedly connected to the glue application box.
[0012] Preferably, a collection box is fixedly installed on one side of the lower end of the workbench, a filter plate is slidably connected to the front end of the collection box, and multiple through holes are opened on the workbench.
[0013] Preferably, the through hole is located at the upper end of one side of the filter plate, and an exhaust fan is fixedly installed on the side of the collection box away from the through hole.
[0014] The beneficial effects are as follows: the rotating shaft drives the mounting block to rotate, causing the first telescopic rod to rotate the brush downward by 90°. Then the brush moves downward and approaches the electronic components. When the moving block drives the brush to move, the brush sweeps the surface of the electronic components to clean them, avoiding dust adhering to the electronic components and affecting the adhesion of the adhesive.
[0015] The additional technical features and advantages of this utility model will become more apparent from the following description, or may be learned through specific practice of this utility model. Attached Figure Description
[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0017] Figure 1 This is a perspective view of the adhesive coating device for processing electronic components according to the present invention;
[0018] Figure 2 This is a right-side view of the adhesive coating device for processing electronic components according to this utility model;
[0019] Figure 3 yes Figure 2 Enlarged view of point A;
[0020] Figure 4 This is a cross-sectional view of the collection box of the adhesive coating device for processing electronic components according to this utility model;
[0021] Figure 5 This is a rear view of the adhesive coating device for processing electronic components according to the present invention.
[0022] The reference numerals in the attached drawings are explained as follows: 101, workbench; 102, top plate; 201, fixed frame; 202, clamping plate; 301, moving lead screw; 302, moving block; 401, rotating shaft; 402, mounting block; 403, first telescopic rod; 404, brush; 405, second telescopic rod; 406, glue application box; 501, drive motor; 502, driving gear; 503, driven gear; 601, collection box; 602, filter plate; 701, glue storage box; 702, connecting pipe; 8, scraper. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0024] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0025] The present invention will be further described below with reference to the accompanying drawings:
[0026] like Figures 1-5 As shown, an adhesive coating device for processing electronic components includes a worktable 101, a clamping mechanism on the worktable 101, a top plate 102 fixed above the worktable 101, a movable block 302 slidably connected to the top plate 102, and an adjustment mechanism on the movable block 302, the adjustment mechanism including a rotating shaft 401.
[0027] A rotating shaft 401 is rotatably connected to the front end of a movable block 302. A transmission mechanism is provided above the rotating shaft 401. A mounting block 402 is fixedly connected to the front end of the rotating shaft 401. A first telescopic rod 403 is fixedly installed on one side of the mounting block 402. A brush 404 is fixedly connected to the end of the first telescopic rod 403 away from the mounting block 402. A second telescopic rod 405 is fixedly installed at the lower end of the mounting block 402. A glue applicator 406 is fixedly connected to the lower end of the second telescopic rod 405. A scraper 8 is fixedly connected to the lower end of the glue applicator 406. Multiple glue dispensing tubes are fixed to the side of the glue applicator 406 near the brush 404. In use, electronic components are placed on the workbench 101, and the electronic components are held in place by the clamping mechanism. Once fixed in place, the rotating shaft 401 drives the mounting block 402 to rotate, causing the first telescopic rod 403 to drive the brush 404 to rotate downwards by 90°. Then, the first telescopic rod 403 drives the brush 404 to move downwards and approach the electronic components. When the moving block 302 drives the brush 404 to move, the brush 404 sweeps the surface of the electronic components to clean them, preventing dust adhering to the electronic components from affecting the adhesion of the adhesive. Then, the rotating shaft 401 drives the glue application box 406 to rotate downwards and approach the electronic components. The second telescopic rod 405 drives the glue application box 406 to move downwards. Then, the adhesive flows from the glue outlet tube onto the electronic components for application. The moving block 302 drives the scraper 8 to move and scrape the adhesive evenly.
[0028] The transmission mechanism includes a drive motor 501, which is fixedly mounted on the front end of the moving block 302. The output shaft of the drive motor 501 is fixedly connected to a drive gear 502, and the rear end of the rotating shaft 401 is fixedly connected to a driven gear 503. The driven gear 503 meshes with the drive gear 502. The drive motor 501 drives the drive gear 502 to rotate, so that the drive gear 502 drives the rotating shaft 401 to rotate by meshing with the driven gear 503.
[0029] The clamping mechanism includes a fixed frame 201, with symmetrical clamping plates 202 slidably connected to both sides of the fixed frame 201. An electric push rod is fixedly installed between the clamping plates 202 and the fixed frame 201. The electric push rod drives the clamping plates 202 to approach the electronic components, so that the two clamping plates 202 simultaneously clamp and fix the electronic components.
[0030] A movable lead screw 301 is rotatably connected inside the top plate 102. The movable lead screw 301 is threadedly connected to the movable block 302. A drive motor is fixedly installed on one side of the top plate 102. The drive motor is fixedly connected to the movable lead screw 301. The drive motor drives the movable lead screw 301 to rotate, so that the movable lead screw 301 and the movable block 302 are threadedly engaged to drive the movable block 302 to move.
[0031] The upper end of the movable block 302 is fixedly connected to a glue storage tank 701, and the lower end of the glue storage tank 701 is fixedly connected to a connecting pipe 702. A delivery pump is installed inside the glue storage tank 701, and the lower end of the connecting pipe 702 is fixedly connected to the glue application box 406. The delivery pump delivers glue from the glue storage tank 701 into the glue application box 406 through the connecting pipe 702.
[0032] A collection box 601 is fixedly installed on one side of the lower end of the workbench 101. A filter plate 602 is slidably connected to the front end of the collection box 601. Multiple through holes are opened on the workbench 101.
[0033] The through hole is located on the upper side of one side of the filter plate 602. A fan is fixedly installed on the side of the collection box 601 away from the through hole. When the fan is turned on, airflow is generated, which causes the brush 404 to sweep the electronic components and move to the top of the collection box 601, sucking dust and impurities into the collection box 601. The impurities will stay on the filter plate 602. After the work is completed, the filter plate 602 is pulled out for cleaning.
[0034] Working principle: During use, electronic components are placed within the fixed frame 201. An electric push rod drives the clamping plate 202 closer to the electronic components, causing both clamping plates 202 to simultaneously clamp and fix the components. Subsequently, the drive motor 501 drives the drive gear 502 to rotate, which in turn meshes with the driven gear 503, causing the rotating shaft 401 to rotate. The rotating shaft 401 then rotates the mounting block 402, causing the first telescopic rod 403 to rotate the brush 404 downwards by 90°. The first telescopic rod 403 then moves the brush 404 downwards towards the electronic components. The drive motor then drives the moving screw 301 to rotate, causing it to engage with the moving block 302, which in turn moves the brush. During operation, the brush 404 sweeps across the surface of the electronic components to clean them, preventing dust from affecting the adhesion of the adhesive. The exhaust fan is activated to generate airflow, causing the brush 404 to sweep across the electronic components and move above the collection box 601, sucking in dust and impurities. The impurities will remain on the filter plate 602. After the operation is completed, the filter plate 602 is pulled out for cleaning. Then, the rotating shaft 401 drives the glue application box 406 to rotate downwards and approach the electronic components. The second telescopic rod 405 drives the glue application box 406 to move downwards. The delivery pump delivers the adhesive from the glue storage tank 701 through the connecting pipe 702 into the glue application box 406. Then, the adhesive flows from the glue outlet pipe onto the electronic components for application. The moving block 302 drives the scraper 8 to move and smooth the adhesive.
[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A glue-applying device for processing electronic components, comprising a worktable (101), wherein a clamping mechanism is provided on the worktable (101), and a top plate (102) is fixed above the worktable (101), characterized in that: A movable block (302) is slidably connected to the top plate (102), and an adjustment mechanism is provided on the movable block (302), the adjustment mechanism including a rotating shaft (401); The rotating shaft (401) is rotatably connected to the front end of the moving block (302). A transmission mechanism is provided above the rotating shaft (401). An installation block (402) is fixedly connected to the front end of the rotating shaft (401). A first telescopic rod (403) is fixedly installed on one side of the installation block (402). A brush (404) is fixedly connected to the end of the first telescopic rod (403) away from the installation block (402). A second telescopic rod (405) is fixedly installed at the lower end of the installation block (402). A glue applicator (406) is fixedly connected to the lower end of the glue applicator (406). A scraper (8) is fixedly connected to the lower end of the glue applicator (406). Multiple glue outlet tubes are fixed on the side of the glue applicator (406) near the brush (404).
2. The adhesive coating device for processing electronic components according to claim 1, characterized in that: The transmission mechanism includes a transmission motor (501), which is fixedly installed at the front end of the moving block (302). The output shaft of the transmission motor (501) is fixedly connected to a drive gear (502), and the rear end of the rotating shaft (401) is fixedly connected to a driven gear (503), which meshes with the drive gear (502).
3. The apparatus according to claim 1, wherein the apparatus is characterized by: The clamping mechanism includes a fixed frame (201), and symmetrical clamping plates (202) are slidably connected to both sides of the fixed frame (201). An electric push rod is fixedly installed between the clamping plate (202) and the fixed frame (201).
4. The apparatus according to claim 1, wherein the apparatus is characterized by: A movable lead screw (301) is rotatably connected inside the top plate (102). The movable lead screw (301) is threadedly connected to the movable block (302). A drive motor is fixedly installed on one side of the top plate (102). The drive motor is fixedly connected to the movable lead screw (301).
5. The adhesive coating device for processing electronic components according to claim 1, characterized in that: The upper end of the movable block (302) is fixedly connected to a glue storage tank (701), and the lower end of the glue storage tank (701) is fixedly connected to a connecting pipe (702). The lower end of the connecting pipe (702) is fixedly connected to the glue application box (406).
6. The adhesive coating apparatus for processing electronic components according to claim 1, characterized in that: A collection box (601) is fixedly installed on one side of the lower end of the workbench (101), and a filter plate (602) is slidably connected to the front end of the collection box (601). Multiple through holes are provided on the workbench (101).
7. The adhesive coating apparatus for processing electronic components according to claim 6, characterized in that: The through hole is located at the upper end of one side of the filter plate (602), and a fan is fixedly installed on the side of the collection box (601) away from the through hole.