A material taking mechanism and a wire saw cutting machine

Abstract

A kind of material taking mechanism and wire saw cutting machine, it is applied to material is transported in wire saw cutting process, including installation platform, the transmission component for controlling installation platform motion on wire saw cutting equipment and the suction cup component for being set on installation platform and being used to adsorb material, suction cup component further includes installation shell and at least two positioning pieces, two positioning pieces are located at the end face of installation shell towards material, and at least two positioning pieces are provided with preset interval in the height direction of the end face of installation shell;Positioning piece is used to measure the uniformity of material surface.This material taking mechanism is by being provided with at least two positioning pieces in suction cup component, it is measured before surface before material adsorption, effectively detects the uniformity of material surface in vertical direction, improves the judgment accuracy before material taking, avoids the problems such as adsorption failure, deviation, slip-off caused by adsorbing on uneven surface, improves the stability and security of overall material taking process.

Description

Technical Field

[0001] This utility model relates to the field of crystal sawing, and in particular to a material handling mechanism and a wire saw cutting machine. Background Technology

[0002] In the photovoltaic, semiconductor and related high-precision material processing industries, silicon wafers (or crystal materials) cut from silicon rods by wire saws are characterized by thinness, brittle structure and fragile surface. Therefore, during the handling process after processing, high stability and flexibility are required for the adsorption and material handling device.

[0003] In existing technologies, vacuum chucks are widely used as the primary method for material handling. Common structures include chuck assemblies mounted on fixed or movable platforms. By controlling the suction cups to adhere to the material surface and generate negative pressure, they achieve the adsorption and transport of silicon wafers or crystal materials. These devices typically have a high degree of automation and are widely used in production lines for high-frequency, continuous material handling operations.

[0004] However, in practical applications, the silicon rod cross-section produced by wire saw cutting often exhibits non-perpendicularity, warping, unevenness, and other irregularities. This is especially true when the material is placed on a non-rigid reference platform such as a roller frame, where the cut surface may be significantly tilted relative to the platform or central axis. In such cases, if the suction cup assembly fails to accurately identify the unevenness of the material surface and directly performs the suction operation, the following problems may easily occur: Adsorption failure or missed adsorption: When there is a significant height difference between the suction cup contact surface and the material surface, some suction cups may not be able to fully adhere, resulting in insufficient negative pressure or uneven adsorption force, leading to weak adsorption or even missed adsorption.

[0005] Material damage or breakage: Due to the failure to identify surface height differences, suction cup adsorption may be concentrated at local high points, causing pressure concentration. In mild cases, the material may deform and slip off, and in severe cases, defects such as breakage and edge chipping may occur in the crystal silicon wafer. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a material handling mechanism and a wire saw cutting machine to solve the problem of not being able to determine the absorbability of materials before handling them.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A material handling mechanism is used to transport materials during wire saw cutting. It includes an installation platform, a conveying component for controlling the movement of the installation platform on the wire saw cutting equipment, and a suction cup assembly disposed on the installation platform for adsorbing materials. The suction cup assembly further includes an installation housing and at least two positioning members. The two positioning members are disposed on the end face of the installation housing facing the material, and the at least two positioning members are spaced at a predetermined distance in the height direction of the end face of the installation housing. The positioning members are used to measure the uniformity of the material surface.

[0008] In some embodiments, the suction cup assembly further includes a first driving member connected to the mounting platform and throttle connected to the mounting housing, the first driving member being used to adjust the position of the mounting housing in the height direction.

[0009] In some embodiments, the suction cup assembly further includes a clamping member connected to the mounting housing and disposed near the end face of the mounting housing where the positioning member is located, the clamping member being used to limit the material.

[0010] In some embodiments, the clamping member includes a receiving plate and two symmetrically arranged side clamps; the receiving plate is connected to the bottom of the mounting housing, and the side clamps are respectively located on both sides of the mounting housing in the width direction.

[0011] In some embodiments, the side clamps are provided with a first driving unit for controlling the two side clamps to move closer to or further away from each other.

[0012] In some embodiments, the suction cup assembly further includes a second driving member, which is kinetically connected to different positioning members and is used to drive the positioning members to abut against the material surface.

[0013] In some embodiments, each of the positioning elements is provided with a sensing unit, which is used to acquire the movement distance of the corresponding positioning element under the drive of the second driving element.

[0014] In some embodiments, the suction cup assembly includes a first suction cup and a second suction cup; the adsorption area of ​​the first suction cup is larger than that of the second suction cup, and both the first and second suction cups are movably connected to the end face of the mounting housing facing the material.

[0015] In some embodiments, the number of the first suction cup is one, the number of the second suction cup is four, and the number of the positioning elements is four; the second suction cup and the positioning elements are evenly distributed on the end face of the mounting housing with the first suction cup as the center.

[0016] A wire saw cutting machine includes a material handling mechanism, wherein the conveying component of the material handling mechanism is slidably connected to the wire saw cutting machine, and the material handling mechanism is movable to the unloading area of ​​the wire saw cutting machine. The beneficial effects of this invention are as follows: By setting at least two positioning elements spaced apart along the height direction in the suction cup assembly, the surface of the material is measured before adsorption, effectively detecting the uniformity of the material surface in the vertical direction. Using the height data obtained from multiple positioning elements, it is possible to determine whether the material surface is tilted, undulating, or uneven, thereby deciding whether the current suction cup scheme is suitable for adsorption, or whether to change the suction cup structure (such as switching to a smaller or flexible suction cup) to adapt to the surface conditions. This structure improves the accuracy of the judgment before material handling, avoids problems such as adsorption failure, displacement, and slippage caused by adsorption on uneven surfaces, and improves the stability and safety of the overall material handling process. Attached Figure Description

[0017] Figure 1 This is an assembly diagram of a feeding structure in one embodiment; Figure 2 for Figure 1 A magnified view of a portion of the image; Figure 3 This is a front view of one of the feeding structures in the embodiment; Figure 4 This is a top view of one of the feeding structures in the embodiment; Figure 5 This is a schematic diagram of a wire saw cutting machine in one of the embodiments; Label Explanation: 1. Suction cup assembly; 11. Mounting housing; 12. Positioning component; 13. First drive component; 14. Clamping component; 141. Receiving plate; 142. Side clamping plate; 143. First drive unit; 15. First suction cup; 16. Second suction cup; 17. Push claw; 2. Mounting platform; 3. Conveying assembly; 4. Wire saw cutting machine. Detailed Implementation

[0018] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0019] Please refer to Figure 1 as well as Figure 2A material handling mechanism is used to transport materials during wire saw cutting. It includes a mounting platform 2, a conveying component 3 for controlling the movement of the mounting platform 2 on the wire saw cutting equipment, and a suction cup assembly 1 disposed on the mounting platform 2 for adsorbing materials. The suction cup assembly 1 also includes a mounting housing 11 and at least two positioning members 12. The two positioning members 12 are disposed on the end face of the mounting housing 11 facing the material, and the at least two positioning members 12 are provided with a preset distance in the height direction of the end face of the mounting housing 11. The positioning members 12 are used to measure the uniformity of the material surface.

[0020] As can be seen from the above description, the beneficial effects of this utility model are as follows: This material handling mechanism, by setting at least two positioning elements 12 arranged at intervals along the height direction in the suction cup assembly 1, allows for surface measurement before material adsorption, effectively detecting the uniformity of the material surface in the vertical direction. Using the height data obtained from multiple positioning elements 12, it is possible to determine whether the material surface is tilted, undulating, or uneven, thereby deciding whether it is suitable for the current suction cup solution or to change the suction cup structure (such as switching to a smaller or flexible suction cup) to adapt to the surface conditions. This structure improves the accuracy of judgment before material handling, avoids problems such as adsorption failure, displacement, and slippage caused by adsorption on uneven surfaces, and improves the stability and safety of the overall material handling process.

[0021] In some embodiments, the suction cup assembly 1 further includes a first driving member 13, which is connected to the mounting platform 2 and is throttle-connected to the mounting housing 11. The first driving member 13 is used to adjust the position of the mounting housing 11 in the height direction.

[0022] As can be seen from the above description, by setting the first driving component 13, the mounting housing 11 can be precisely adjusted in the height direction. In effective cooperation with the wire saw cutting equipment, the entire material handling structure can avoid obstacles and move in the process, so that the suction cup assembly 1 can accurately target the material adsorption area and transport the material.

[0023] In this embodiment, the material handling mechanism is used in the process of transporting silicon wafers after the silicon rod has been cut by a wire saw. This mechanism is mounted on an automated platform that can move freely along the XYZ axes, and mainly includes a mounting platform 2, a suction cup assembly 1, a conveying assembly 3, and a first driving component 13. The first driving component 13 is either a servo motor or a cylinder. When the driving component is a cylinder, its cylinder body is fixedly connected to both sides of the mounting platform 2 in the width direction, and the piston rod is connected to the top of the mounting housing 11 of the suction cup assembly 1. The suction cup assembly 1 includes a mounting housing 11, a suction cup body, a positioning component 12, a clamping structure, etc. In actual use, the system determines whether the current material cross-section is flat and uniform based on measurement data from the positioning component 12 (e.g., a surface tilt sensor).

[0024] This structure is particularly suitable for scenarios where the silicon rod cutting surface has a certain tilt or the roller frame height has a slight deviation. It effectively improves the adaptability to complex working conditions, increases work efficiency, and improves the slicing success rate. For example, when the difference between the end faces of the material is ≥0.8mm and the thickness is less than 2mm, the sample does not meet the cutting requirements. Cutting rashly will cause the cutting line saw to cut into the suction cup and damage the equipment.

[0025] Specifically, the suction cup assembly 1 further includes a clamping member 14, which is connected to the mounting housing 11 and disposed near the end face of the mounting housing 11 where the positioning member 12 is located. The clamping member 14 is used to limit the material.

[0026] As described above, by adding a clamping component 14 to the front end of the suction cup assembly 1, the material is initially limited and fixed before adsorption, preventing the material from shifting due to rolling, swaying, or external disturbance. This is particularly suitable for cut silicon rod crystals. Please refer to... Figures 2 to 4 Preferably, the clamping member 14 includes a receiving plate 141 and two symmetrically arranged side clamping plates 142; the receiving plate 141 is connected to the bottom of the mounting housing 11, and the side clamping plates 142 are respectively disposed on both sides of the mounting housing 11 in the width direction.

[0027] As described above, the clamping member 14 consists of a receiving plate 141 and two symmetrical side clamping plates 142. The receiving plate 141 provides bottom support, and the side clamping plates 142 provide lateral clamping, forming a three-sided support structure. This structure is suitable for various cylindrical or polygonal materials, effectively preventing lateral sliding or rotation of the material, and significantly enhancing the support stability and anti-disturbance capability before adsorption while maintaining a simple structure.

[0028] In some embodiments, the side clamps 142 are provided with a first drive unit 143, which is used to control the two side clamps 142 to move closer to or further away from each other.

[0029] As can be seen from the above description, by equipping the side clamping plate 142 with the first drive unit 143, the opening and closing distance of the two clamping plates can be controlled, making the device suitable for materials of different widths or diameters, and enabling the clamping and release of materials at the required positions throughout the process, thereby improving the automation capability of the device.

[0030] Specifically, the suction cup assembly 1 further includes a second driving member, which is connected to different positioning members 12 and is used to drive the positioning members 12 to abut against the material surface.

[0031] As described above, this material handling mechanism uses a second driving component to drive the positioning component 12 to actively extend and contact the material surface, avoiding measurement errors caused by the positioning component 12 being naturally suspended or in elastic contact. This structure ensures that each positioning point obtains stable and accurate contact data, and is especially suitable for materials with rough surfaces or irregular bumps, effectively improving the accuracy and reliability of surface uniformity judgment.

[0032] Preferably, each of the positioning elements 12 is provided with a sensing unit, which is used to obtain the movement distance of the corresponding positioning element 12 under the drive of the second driving element.

[0033] As described above, each positioning element 12 is equipped with a sensor that can acquire its extension distance under the drive of the second driving element in real time. By combining the differences in the extension amounts of multiple positioning elements 12, it is possible to determine whether there is a significant slope or unevenness on the material surface. Through data comparison, a height error model can be constructed, providing a basis for subsequent suction cup selection or position compensation, thereby avoiding the adsorption of unqualified materials and improving the intelligence level and fault tolerance of the equipment. For example, when a positioning element 12 contacts the material surface, the sensor of each positioning element 12 acquires the movement distance of the positioning element 12, and calculates the range value of the unevenness of the material surface based on the movement distance. If the range value is greater than a preset value (such as 0.8mm), an alarm is triggered, and the suction cup cannot adsorb the material due to excessive unevenness.

[0034] Please refer to Figures 1 to 3 In some embodiments, the suction cup assembly 1 includes a first suction cup 15 and a second suction cup 16; the adsorption area of ​​the first suction cup 15 is larger than that of the second suction cup 16, and both the first suction cup 15 and the second suction cup 16 are movably connected to the end face of the mounting housing 11 facing the material.

[0035] As described above, the first suction cup 15 and the second suction cup 16 have different adsorption areas, allowing for flexible selection based on the material surface conditions. The first suction cup 15 has a large area, suitable for overall adsorption on flat areas; the second suction cup 16 has a small area, suitable for adsorption on undulating surfaces or corners, improving adaptability to different material surface conditions, and is especially suitable for silicon wafers or rods with varying thicknesses on the cut surfaces, thus improving adsorption quality and efficiency.

[0036] Specifically, there is one first suction cup 15, four second suction cups 16, and four positioning elements 12; the second suction cups 16 and the positioning elements 12 are evenly distributed on the end face of the mounting housing 11 with the first suction cup 15 as the center.

[0037] As described above, placing a first suction cup 15 at the center, with four second suction cups 16 and four positioning components 12 evenly distributed around it, not only ensures the symmetry and balance of the suction force, but also enables multi-point data acquisition, accurately capturing the height information around the material cross-section. This structure facilitates rapid judgment of the overall tilt degree, cross-sectional warping, etc., and allows for adjustments to the suction strategy or material placement posture accordingly, greatly improving the controllability and consistency of high-precision material handling operations.

[0038] Preferably, the four positioning elements 12 are symmetrically distributed around the first suction cup 15, and each pair of the four positioning elements 12 is located at the same height, so that the uniformity of the material surface can be measured simultaneously in both the X and Y axes, thus improving the accuracy of the test. In this embodiment, since the end face of the material after cutting (or the original end face) may not be perpendicular to the center line of the roller group in the wire saw cutting machine, four positioning elements are set to calculate the range of the cut end face. If the range is ≥0.8mm, the state of the material needs to be adjusted before further processing.

[0039] In some embodiments, the suction cup assembly 1 further includes a pusher 17 connected to the end face of the mounting housing 11 away from the material.

[0040] As described above, by setting the pusher 17 at the end of the suction cup assembly 1 away from the material, the material can be smoothly unloaded from the suction station after adsorption is completed. This structure is simple and easy to coordinate with existing conveying systems, optimizing the overall loading and unloading cycle.

[0041] Please refer to Figure 1 and Figure 4 Preferably, the pusher 17 cooperates with the first driving component 13. After the suction cup assembly 1 adsorbs the material, it is placed on the track in the process. Under the action of the first driving component 13 and the conveying component 3, the entire suction cup assembly 1 moves to the other direction of the material, so that the pusher 17 gets closer to the material, thus facilitating material unloading.

[0042] Please refer to Figure 5 A wire saw cutting machine 4 includes a material handling mechanism, wherein the conveying component 3 of the material handling mechanism is slidably connected to the wire saw cutting machine 4, and the material handling mechanism is movable to the unloading area of ​​the wire saw cutting machine.

[0043] In summary, the material handling mechanism and wire saw cutting machine provided by this utility model are particularly suitable for the automatic adsorption and handling of brittle materials such as silicon rods and wafers after wire saw cutting. Through systematic optimization of the suction cup assembly structure, especially the integration of positioning components, clamping structures, multi-specification suction cups, pusher mechanisms, and multi-drive component coordinated control, the device's adaptability to different working conditions and materials with different morphologies, as well as its operational stability, are significantly improved, offering the following comprehensive technical advantages: Intelligent detection and evaluation of material surface uniformity: This invention features multiple positioning elements distributed along the height direction at the end of the suction cup assembly, preferably four symmetrically arranged. These elements allow for precise measurement of the inclination and undulation of the material cross-section before adsorption. By comparing the extension distances of each positioning element, a material surface height difference model is constructed, providing a valid basis for determining whether the suction cup is suitable for adsorption, thus avoiding blind adsorption failures, skewed adsorption, or damage from fragments.

[0044] With height adjustment and multiple suction cups, the success rate of material handling is improved: The combination of a first and second driving component allows for overall height adjustment of the suction cup assembly and active extension of the positioning component. When a tilt or height difference is detected on the material surface, the suction cup assembly's posture is automatically adjusted to ensure adhesion between the suction cup's adsorption surface and the silicon wafer surface. Simultaneously, a large-area first suction cup and four distributed small-area second suction cups are dynamically activated based on surface conditions, improving adsorption coverage and stability, and effectively reducing the breakage rate during the adsorption process.

[0045] Multiple limiting designs before adsorption ensure stable suction cup adhesion: This invention uses a clamping structure (including a receiving plate and side clamping plates) to clamp the edges of silicon rods or wafers, preventing suction cup misalignment or adsorption failure due to rolling, vibration, or slight slippage before adsorption. The side clamping plates, in conjunction with the first drive unit, can be adjusted to open and close, adapting to material specifications of different diameters or cross-sections, enhancing the device's adaptability and automation level.

[0046] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A material handling mechanism for conveying materials during wire saw cutting, comprising an installation platform, a conveying assembly for controlling the movement of the installation platform on a wire saw cutting device, and a suction cup assembly disposed on the installation platform for adsorbing materials, characterized in that: The suction cup assembly further includes a mounting housing and at least two positioning members. The two positioning members are disposed on the end face of the mounting housing facing the material, and the at least two positioning members are provided with a preset distance in the height direction of the end face of the mounting housing. The positioning members are used to measure the uniformity of the material surface.

2. The material handling mechanism according to claim 1, characterized in that: The suction cup assembly further includes a first driving member, which is connected to the mounting platform and pulsatorically connected to the mounting housing. The first driving member is used to adjust the position of the mounting housing in the height direction.

3. The material handling mechanism according to claim 2, characterized in that: The suction cup assembly also includes a clamping member, which is connected to the mounting housing and disposed near the end face of the mounting housing where the positioning member is located. The clamping member is used to limit the material.

4. The material handling mechanism according to claim 3, characterized in that: The clamping component includes a receiving plate and two symmetrically arranged side clamps; the receiving plate is connected to the bottom of the mounting housing, and the side clamps are respectively located on both sides of the width direction of the mounting housing.

5. The material handling mechanism according to claim 4, characterized in that: The side clamps are provided with a first driving unit, which is used to control the two side clamps to move closer to or further away from each other.

6. The material handling mechanism according to claim 1, characterized in that: The suction cup assembly further includes a second driving member, which is connected to different positioning members and is used to drive the positioning members to abut against the material surface.

7. A material handling mechanism according to claim 6, characterized in that: Each of the positioning elements is provided with a sensing unit, which is used to obtain the movement distance of the corresponding positioning element under the drive of the second driving element.

8. The material handling mechanism according to claim 1, characterized in that: The suction cup assembly includes a first suction cup and a second suction cup; the adsorption area of ​​the first suction cup is larger than that of the second suction cup, and both the first and second suction cups are movably connected to the end face of the mounting housing facing the material.

9. A material handling mechanism according to claim 8, characterized in that: The number of first suction cups is one, the number of second suction cups is four, and the number of positioning components is four; the second suction cups and the positioning components are evenly distributed on the end face of the mounting housing with the first suction cup as the center.

10. A wire saw cutting machine, characterized in that: The invention includes a material handling mechanism as described in any one of claims 1-9, wherein the conveying component of the material handling mechanism is slidably connected to the wire saw cutting machine, and the material handling mechanism is movable to the unloading area of ​​the wire saw cutting machine.

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