A dustproof inductor heat dissipation structure
By combining a grid heat dissipation mechanism and heat pipes, the heat dissipation problem of inductors in high-density packaging or airless cooling environments is solved, achieving automatic adjustment of heat dissipation openings and dust prevention, thus improving the durability and stability of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-08-04
AI Technical Summary
Existing inductors have limited heat dissipation performance in high-density packaging or airless environments, and common heat dissipation methods are prone to dust accumulation or have complex structures and high costs.
It adopts a grid heat dissipation mechanism, including deformation plates and dustproof mesh, which automatically adjusts the heat dissipation openings according to the temperature. Combined with heat pipes and heat dissipation components, it achieves efficient heat dissipation and dust prevention.
It enables automatic adjustment of heat dissipation openings in complex environments to prevent dust from entering, improve equipment durability and stability, and is suitable for high-current application scenarios.
Smart Images
Figure CN224595329U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of inductor heat dissipation technology, and in particular to a heat dissipation structure for a dustproof inductor. Background Technology
[0002] Inductors, as key magnetic components in electronic devices, are widely used in power modules, filter circuits, converters and other scenarios. During long-term operation, they generate heat due to high-frequency current and core loss. If heat dissipation is not timely, it may cause performance drift, power reduction or even device failure. Therefore, a good heat dissipation structure is crucial to ensure the stable operation of inductors.
[0003] In existing technologies, capacitors often achieve heat dissipation and protection functions by opening fixed ventilation holes, adding filters, or connecting external fans. However, fixed ventilation holes are prone to dust accumulation, filters are prone to clogging, and external fans have complex structures and increased costs, making them unsuitable for all scenarios, especially in applications with high-density packaging or without air cooling. Utility Model Content
[0004] Therefore, it is necessary to provide a heat dissipation structure for dustproof inductors, which addresses the problem that inductors are often cooled and protected by fixed ventilation holes, filters, or external fans, but the holes are prone to dust accumulation and the filters are prone to clogging, especially in high-density packaging or airless environments where the effect is limited.
[0005] A heat dissipation structure for a dustproof inductor includes: a protective shell, in which a capacitor is fixedly installed, and two connecting wires are fixedly installed on one side of the capacitor, with the other ends of the two connecting wires extending out of the protective shell; and a grid heat dissipation mechanism, which is disposed on the outside of the protective shell for automatically adjusting the heat dissipation openings according to the temperature; wherein the grid heat dissipation mechanism includes a heat dissipation shell fixedly installed on the outside of the capacitor, a grid assembly disposed on the outside of the protective shell, and a heat dissipation assembly disposed on the outside of the connecting wires.
[0006] The grille assembly includes multiple connecting frames fixedly installed on the surface of the protective shell. Each of the multiple connecting frames is connected to the heat dissipation shell. Multiple fixing frames are fixedly installed inside the connecting frames, and each fixing frame is provided with a deformation plate inside.
[0007] The deformable piece is configured as an arc shape, and one side of the deformable piece extends out of the outer side of the fixing frame.
[0008] Telescopic plates are fixedly installed on both sides of the deformable sheet, and the two telescopic plates on opposite sides are fixedly connected to the inner wall of the fixed frame.
[0009] A dustproof net is fixedly installed inside the connecting frame, and the dustproof net is located between multiple deformable plates and the protective shell.
[0010] The heat dissipation shell is located on one side of a plurality of connected frames, and the plurality of connected frames are equidistantly distributed.
[0011] The heat dissipation component includes multiple heat dissipation holes formed on the surface of the heat dissipation shell, and the multiple heat dissipation holes are respectively located on one side of multiple corresponding connecting frames.
[0012] A heat-conducting pipe is fixedly installed on the outside of the connecting line. The top end of the heat-conducting pipe is in contact with the heat dissipation shell, and the bottom end of the heat-conducting pipe extends out of the heat dissipation shell. Multiple heat dissipation grooves are opened on the surface of the heat-conducting pipe, and a sealing plate is fixedly installed between the heat-conducting pipe and the protective shell.
[0013] Beneficial effects
[0014] 1. During use, the grille assembly automatically adjusts its heat dissipation openings according to temperature changes. It opens automatically to form a heat dissipation channel when the temperature rises and closes automatically when the temperature drops, effectively preventing dust and improving the equipment's durability and stability in complex environments. The external heat dissipation components of the connecting cables can simultaneously dissipate heat, preventing localized overheating of the cables, making it suitable for high-current applications.
[0015] 2. The top of the heat pipe is in direct contact with the heat sink, efficiently dissipating the heat transferred by the connecting wire. The bottom extends out of the heat sink, expanding the heat diffusion path, and the surface heat dissipation grooves increase the heat dissipation area, improving convection and heat exchange efficiency. At the same time, the sealing plate effectively prevents dust or moisture from entering the housing through the interface. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the main structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the grille heat dissipation mechanism of this utility model;
[0019] Figure 3 This is a schematic diagram of the internal structure of the connecting frame of this utility model;
[0020] Figure 4 This is a schematic diagram of the deformation sheet and telescopic plate structure of this utility model;
[0021] Figure 5 This is a schematic diagram of the heat dissipation component structure of this utility model.
[0022] Figure label:
[0023] 100. Protective shell; 110. Capacitor; 200. Connecting wire; 300. Grille heat dissipation mechanism; 310. Heat dissipation shell; 320. Grille assembly; 321. Connecting frame; 322. Fixing frame; 323. Deformation plate; 324. Telescopic plate; 335. Dustproof net; 330. Heat dissipation assembly; 331. Heat dissipation hole; 332. Heat conduction pipe; 333. Heat dissipation groove; 334. Sealing plate. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0025] The following is combined Figures 1-5 This invention describes a heat dissipation structure for a dustproof inductor.
[0026] In one embodiment, a heat dissipation structure for a dustproof inductor includes: a protective housing 100, a capacitor 110 fixedly installed inside the protective housing 100, two connecting wires 200 fixedly installed on one side of the capacitor 110, and the other ends of the two connecting wires 200 extending out of the protective housing 100; a grid heat dissipation mechanism 300, which is disposed on the outside of the protective housing 100 for automatically adjusting the heat dissipation openings according to the temperature; wherein, the grid heat dissipation mechanism 300 includes a heat dissipation shell 310 fixedly installed on the outside of the capacitor 110, a grid assembly 320 disposed on the outside of the protective housing 100, and a heat dissipation assembly 330 disposed on the outside of the connecting wires 200.
[0027] In this embodiment, the grid assembly 320 enables temperature-responsive adjustment of the heat dissipation openings of the protective shell 100 during use. When the operating temperature of the capacitor 110 rises, the deformation components inside the grid assembly 320 automatically deform, driving the grid to open and forming an effective heat dissipation channel. When the temperature drops, the grid automatically closes, effectively preventing dust from entering the capacitor 110 and improving the durability and stability of the device in complex environments. The heat dissipation assembly 330 installed outside the connecting line 200 can simultaneously dissipate heat during conduction, avoiding local overheating of the cable, which is especially suitable for high-current inductor applications.
[0028] It should be noted that the capacitor 110 is a common electronic component, typically consisting of a metal casing, internal electrode plates, a dielectric layer, and lead terminals. It is used to perform functions such as energy storage, filtering, and decoupling in circuits. The grid assembly 320 and the heat dissipation assembly 330 are respectively disposed on the outside of the capacitor 110 or the outer surface of the connecting line 200, and both are non-intrusive structural designs that do not contact or change the internal circuit, electrode arrangement, or dielectric structure of the capacitor 110, and do not interfere with the electrical performance and electrical path of the capacitor 110. The heat dissipation assembly 330 covers or is attached to the outside of the connecting line 200 to assist in heat conduction. It does not affect the electrical connection structure between the connecting line 200 and the capacitor 110, nor does it change the conductive path or insulating coating of the connecting line 200.
[0029] like Figure 2 , Figure 3 and Figure 4 As shown, the grille assembly 320 includes a plurality of connecting frames 321 fixedly installed on the surface of the protective shell 100. The plurality of connecting frames 321 are all connected to the heat dissipation shell 310. A plurality of fixing frames 322 are fixedly installed inside the connecting frames 321. Each fixing frame 322 has a deformation piece 323 inside.
[0030] In this embodiment, when the capacitor 110 is in operation and its temperature rises to a preset threshold, the deformable sheet 323 bends due to heat, opening the ventilation opening of the connecting frame 321, thus forming a heat dissipation channel between the protective shell 100 and the external environment, which helps to release heat quickly. When the temperature drops to a safe range, the deformable sheet 323 returns to its original shape, automatically driving the fixed frame 322 to reset, closing the ventilation opening, effectively preventing external dust from entering the capacitor 110, and improving the applicability and protection level of the whole machine in complex environments.
[0031] The deformable piece 323 is set in an arc shape, and one side of the deformable piece 323 extends out of the outer side of the fixing frame 322.
[0032] In this embodiment, the deformation plate 323 is configured in an arc shape, which gives it better elastic displacement characteristics and response sensitivity during thermal deformation. Through its arc structure, the deformation plate 323 can naturally expand or bend along the inner space of the fixed frame 322 when heated, avoiding structural interference and improving the smoothness and reliability of opening and closing actions.
[0033] It should be noted that the deformation plate 323 is a functional component with thermal response performance. It can be made of thermo-deformable alloy materials such as nickel-titanium shape memory alloys or thermal expansion composite materials such as metal-ceramic laminates or thermosensitive resin composite sheets, and has the physical property of reversible deformation within a specific temperature range. Under normal conditions, it is in a natural bending or preset shape. When the ambient temperature rises to the set response threshold, the deformation plate 323 undergoes structural deformation due to thermal activation, such as bending or stretching, thereby opening or closing the heat dissipation channel.
[0034] Telescopic plates 324 are fixedly installed on both sides of the deformable plate 323, and the side of the two telescopic plates 324 that is far apart is fixedly connected to the inner wall of the fixed frame 322.
[0035] In this embodiment, when the temperature rises, the deformation plate 323 deforms due to heat, which drives the telescopic plates 324 fixed on both sides to axially extend and retract synchronously, thereby maintaining the seal between the deformation plate 323 and the fixed frame 322 on both sides, and forming an opening only where the deformation plate 323 bends and extends out of the fixed frame 322 to achieve directional heat dissipation.
[0036] A dustproof net 335 is fixedly installed inside the connecting frame 321. The dustproof net 335 is located between the multiple deformable pieces 323 and the protective shell 100.
[0037] In this embodiment, when the heat dissipation channel is open, it can effectively block dust and particulate matter in the air from entering the protective shell 100, further improving the dustproof performance of the device. Even when the grille opening is open for heat dissipation at high temperatures, the dust filter 335 can continue to perform its filtering function, ensuring the cleanliness and stable operation of core components such as the capacitor 110.
[0038] The heat sink 310 is located on one side of multiple connected frames 321, and the multiple connected frames 321 are equidistantly distributed.
[0039] In this embodiment, multiple connected frames 321 are equidistantly distributed on the surface of the protective shell 100, which is conducive to the uniform diffusion and timely release of heat on the heat dissipation shell 310. The equidistant arrangement can improve the overall heat dissipation efficiency.
[0040] like Figure 2 and Figure 5 As shown, the heat dissipation assembly 330 includes a plurality of heat dissipation holes 331 formed on the surface of the heat dissipation shell 310, and the plurality of heat dissipation holes 331 are respectively located on one side of a plurality of corresponding connecting frames 321.
[0041] In this embodiment, by opening multiple heat dissipation holes 331 on the surface of the heat dissipation shell 310, and each heat dissipation hole 331 is respectively arranged on one side of the connecting frame 321, the heat conducted inside the connecting frame 321 can be directly and efficiently discharged through the heat dissipation holes 331, thereby improving the heat dissipation capacity of the capacitor 110 and its connecting wire 200 under high load or high temperature environment.
[0042] A heat pipe 332 is fixedly installed on the outside of the connecting wire 200. The top end of the heat pipe 332 is in contact with the heat sink 310, and the bottom end of the heat pipe 332 extends out of the heat sink 310. Multiple heat dissipation grooves 333 are opened on the surface of the heat pipe 332. A sealing plate 334 is fixedly installed between the heat pipe 332 and the protective shell 100.
[0043] In this embodiment, the top end of the heat pipe 332 is in direct contact with the heat sink 310, enabling efficient heat dissipation from the connecting wire 200 to the heat sink 310. The bottom end of the heat pipe 332 extends out of the heat sink 310, expanding the heat diffusion path, and its surface is provided with multiple heat dissipation grooves 333, further increasing the heat dissipation area and improving air convection and heat exchange efficiency. At the same time, a sealing plate 334 is fixedly installed between the heat pipe 332 and the protective shell 100, effectively preventing external dust or moisture from entering the protective shell 100 through the interface.
[0044] Working principle: When capacitor 110 operates under high load or high temperature, its internal temperature gradually rises. The deformation plate 323 inside the grille assembly 320 on the outside of the protective shell 100 bends due to heat, driving the connecting frame 321 to form a heat dissipation opening. At this time, the connecting frame 321 is connected to the internal heat dissipation shell 310. The internal heat can be quickly transferred to the surface of the heat dissipation shell 310 through the equidistantly distributed connecting frames 321 and the corresponding heat dissipation holes 331, and then efficiently released to the outside through the heat dissipation holes 331, achieving rapid cooling of both local and overall components. At the grille opening, the dustproof mesh 335 continuously plays a filtering role, effectively preventing external dust and particles from entering the interior of the protective shell 100 even when the heat dissipation channel is fully open, ensuring the clean operation of components such as capacitor 110. When the temperature drops to a safe range, the deformation plate 323 returns to its original shape, causing the telescopic plate 324 to close the heat dissipation opening, restoring the seal and further enhancing the dustproof protection effect. In addition, the connecting wire 200 is covered with a heat-conducting pipe 332, which directly contacts the heat sink 310 through its top, achieving efficient heat dissipation from the cable to the heat sink 310. Heat dissipation grooves 333 are formed on the surface of the heat-conducting pipe 332 to increase the heat dissipation area and improve air convection, effectively assisting in the cooling of the connecting wire 200. At the same time, a sealing plate 334 is set between the heat-conducting pipe 332 and the protective shell 100 to effectively prevent the intrusion of external moisture or dust.
[0045] It should be noted that the capacitors and other components mentioned above are all devices with relatively mature existing technologies. Specific models can be selected according to actual needs. In addition, the capacitors can be powered by an internal power supply. The specific power supply method can be selected according to the situation, which will not be elaborated here.
[0046] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A heat dissipation structure for a dustproof inductor, characterized in that, include: A protective shell (100) is provided, inside which a capacitor (110) is fixedly installed. Two connecting wires (200) are fixedly installed on one side of the capacitor (110), and the other ends of the two connecting wires (200) extend out of the protective shell (100). A grid heat dissipation mechanism (300) for automatically adjusting the heat dissipation openings according to the temperature is disposed on the outside of the protective shell (100); The grid heat dissipation mechanism (300) includes a heat dissipation shell (310) fixedly installed on the outside of the capacitor (110), a grid assembly (320) is provided on the outside of the protective shell (100), and a heat dissipation assembly (330) is provided on the outside of the connecting line (200).
2. The heat dissipation structure for a dustproof inductor according to claim 1, characterized in that, The grille assembly (320) includes a plurality of connecting frames (321) fixedly installed on the surface of the protective shell (100). The plurality of connecting frames (321) are all connected to the heat dissipation shell (310). A plurality of fixing frames (322) are fixedly installed inside the connecting frames (321), and each fixing frame (322) is provided with a deformation plate (323).
3. The heat dissipation structure for a dustproof inductor according to claim 2, characterized in that, The deformable piece (323) is configured in an arc shape, and one side of the deformable piece (323) extends out of the outer side of the fixing frame (322).
4. The heat dissipation structure for a dustproof inductor according to claim 3, characterized in that, Both sides of the deformable piece (323) are fixedly installed with telescopic plates (324), and the two telescopic plates (324) are fixedly connected to the inner wall of the fixed frame (322) on the side that is far apart.
5. The heat dissipation structure for a dustproof inductor according to claim 4, characterized in that, A dustproof net (335) is fixedly installed inside the connecting frame (321), and the dustproof net (335) is located between the multiple deformable pieces (323) and the protective shell (100).
6. The heat dissipation structure for a dustproof inductor according to claim 1, characterized in that, The heat dissipation shell (310) is located on one side of a plurality of connecting frames (321), and the plurality of connecting frames (321) are equidistantly distributed.
7. The heat dissipation structure for a dustproof inductor according to claim 1, characterized in that, The heat dissipation assembly (330) includes a plurality of heat dissipation holes (331) formed on the surface of the heat dissipation shell (310), and the plurality of heat dissipation holes (331) are respectively located on one side of a plurality of corresponding connecting frames (321).
8. The heat dissipation structure for a dustproof inductor according to claim 1, characterized in that, A heat-conducting pipe (332) is fixedly installed on the outside of the connecting line (200). The top end of the heat-conducting pipe (332) is in contact with the heat sink (310), and the bottom end of the heat-conducting pipe (332) extends out of the heat sink (310). Multiple heat dissipation grooves (333) are opened on the surface of the heat-conducting pipe (332). A sealing plate (334) is fixedly installed between the heat-conducting pipe (332) and the protective shell (100).