Intelligent cockpit host computer with high heat dissipation efficiency

Abstract

The utility model discloses an intelligent cockpit host computer of high heat dissipation efficiency, including metal casing, PCB board and heat conducting adhesive, the cavity has in metal casing, the PCB board sets up in the cavity, and the one end of the inner top wall of cavity is provided with a plurality of chips to the PCB board orientation, and the position of PCB board is close to the detachable connection of the inner top wall of cavity through fastener of chip, heat conducting adhesive sets up between chip and the inner top wall of cavity, the utility model makes the clearance thickness between chip and the inner top wall of cavity keep in the range of design to make the thickness of heat conducting adhesive between chip and the inner top wall of cavity keep in the range of design thickness, and then ensure the heat dissipation efficiency of chip in intelligent cockpit host computer, satisfy the use need of high algorithm.

Description

Technical Field

[0001] This utility model relates to the field of new energy vehicle technology, specifically to a smart cockpit host with high heat dissipation efficiency. Background Technology

[0002] With the rise of new energy vehicles, smart cockpit main units often require high computing power in order to pursue a better experience. This means that the chips on the PCB board inside the smart cockpit main unit will generate a lot of heat, so heat dissipation measures need to be added at the chip location during the design process.

[0003] Currently, a common method for heat dissipation is to apply thermally conductive adhesive between the chip and the metal casing. Specifically, during the assembly of the smart cockpit main unit, thermally conductive adhesive is first applied to the inner top wall of the metal casing corresponding to the chip location. Then, the PCB board with the chip is embedded into the cavity. A cover plate is then installed at the lower opening of the cavity using screws, and its pressing part is used to press it firmly against the outer edge of the PCB board, allowing the chip to adhere to the inner top wall of the cavity through the thermally conductive adhesive. However, because the PCB board is relatively large and thin, the middle section of the PCB board will deform due to its own weight. This results in the thermally conductive adhesive between the chip and the inner top wall of the cavity in the middle area of ​​the PCB board being thicker than designed, leading to unsatisfactory heat conduction efficiency. Utility Model Content

[0004] In view of this, the present invention provides a smart cockpit main unit with high heat dissipation efficiency to solve the problem that the thermal conductive adhesive between the chip and the inner top wall of the cavity of the existing smart cockpit main unit is too thick, resulting in unsatisfactory heat conduction efficiency.

[0005] This utility model provides a smart cockpit main unit with high heat dissipation efficiency, comprising:

[0006] A metal casing with an internal cavity;

[0007] A PCB board is disposed in the cavity. A plurality of chips are disposed on one end of the PCB board facing the inner top wall of the cavity. The position of the PCB board near the chips is detachably connected to the inner top wall of the cavity by fasteners.

[0008] Thermally conductive adhesive is disposed between the chip and the inner top wall of the cavity.

[0009] The intelligent cockpit host with high heat dissipation efficiency according to this utility model has at least the following beneficial effects:

[0010] By setting fasteners near the chip on the PCB board, during the assembly of this smart cockpit main unit, the portion of the PCB board near the chip is connected to the inner top wall of the cavity using fasteners. At this time, the portion of the PCB board with the chip will not deform due to its own weight, so that the gap thickness between the chip and the inner top wall of the cavity remains within the design range. This ensures that the thickness of the thermally conductive adhesive between the chip and the inner top wall of the cavity remains within the design thickness range, thereby ensuring heat dissipation efficiency.

[0011] In one optional embodiment, the fastener is configured as a fastening screw; a through hole is provided on the PCB board corresponding to the position of the fastening screw, and a fastening threaded hole is provided on the inner top wall of the cavity corresponding to the position of the through hole, the fastening threaded hole matching the fastening screw.

[0012] In one optional embodiment, a plurality of elastic members are disposed between the PCB board and the inner top wall of the cavity, the elastic members being disposed close to the chip, and the elastic members having a biasing force that drives the PCB board to move away from the inner top wall of the cavity.

[0013] In one alternative embodiment, the portion of the shank of the fastening screw located between the inner top wall of the cavity and the PCB board is fitted with the elastic element.

[0014] In one alternative implementation, the elastic element is configured as a helical spring.

[0015] In one optional embodiment, the lower end of the cavity is provided with an opening, and a cover plate is detachably connected to the opening. The cover plate is provided with a pressing part facing the PCB board.

[0016] In one alternative embodiment, the cover plate is connected to the metal housing via a first fastening assembly.

[0017] In one alternative implementation, the first fastening component includes:

[0018] Multiple first threaded holes are provided at one end of the metal housing facing the cover plate, and the multiple first threaded holes are spaced apart along the cross-sectional profile of the cover plate perpendicular to the thickness direction of the cover plate;

[0019] Multiple first through holes are provided at positions on the cover plate corresponding to the first threaded holes;

[0020] A first screw is used to pass through the first through hole and be threaded into the corresponding first threaded hole.

[0021] In one optional embodiment, a heat dissipation section is provided at one end of the metal housing away from the cover plate. The heat dissipation section includes a plurality of spaced heat dissipation fins. A mounting groove is recessed on the end face of the heat dissipation section away from the metal housing. A fan is provided in the mounting groove, and the fan is positioned corresponding to the chip.

[0022] In one alternative embodiment, the fan is mounted on a mounting frame, which is bolted to the mounting slot. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional front view schematic diagram of an intelligent cockpit host in this embodiment;

[0025] Figure 2 This is a cross-sectional front view of another location of a smart cockpit host in this embodiment;

[0026] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0027] Figure 4 This is an exploded structural diagram of an inverted smart cockpit main unit according to this embodiment;

[0028] Figure 5 for Figure 4 Enlarged view of point B in the middle;

[0029] Figure 6 This is an exploded structural diagram of an upright intelligent cockpit host in this embodiment.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100-Metal casing, 110-Cavity, 120-Threaded fastening hole, 130-Heat dissipation section, 131-Mounting slot, 140-Screw post;

[0032] 200-PCB board, 210-chip, 220-fastening screw, 230-through hole, 240-second through hole;

[0033] 300 - Thermal conductive adhesive;

[0034] 400 - Elastic component;

[0035] 500-Cover plate, 510-Pressing part, 511-Counterhead groove;

[0036] 610 - First threaded hole, 620 - First through hole, 630 - First screw;

[0037] 710 - Fan, 720 - Mounting frame, 730 - Bolt. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] In the description of this embodiment, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this embodiment. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of this embodiment, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0041] The following is combined with Figures 1 to 6 The following describes embodiments of the present invention.

[0042] A high-heat-dissipation-efficiency smart cockpit host according to an embodiment of the present invention includes a metal housing 100, a PCB board 200, and thermally conductive adhesive 300. The metal housing 100 has a cavity 110, and the PCB board 200 is disposed in the cavity 110. A plurality of chips 210 are disposed on one end of the PCB board 200 facing the inner top wall of the cavity 110. The PCB board 200 is detachably connected to the inner top wall of the cavity 110 near the chip 210 by fasteners. The thermally conductive adhesive 300 is disposed between the chip 210 and the inner top wall of the cavity 110.

[0043] In this embodiment, the smart cockpit host uses fasteners on the PCB board 200 near the chip 210. During the assembly of the smart cockpit host, the fasteners connect the portion of the PCB board 200 near the chip 210 to the inner top wall of the cavity 110. At this time, the portion of the PCB board 200 with the chip 210 will not deform due to its own weight, so that the gap thickness between the chip 210 and the inner top wall of the cavity 110 is kept within the designed range. This keeps the thickness of the thermally conductive adhesive 300 between the chip 210 and the inner top wall of the cavity 110 within the designed thickness range, thereby ensuring the heat dissipation efficiency of the chip 210 in the smart cockpit host of this embodiment and meeting the needs of high computing power.

[0044] It is understood that the "several" mentioned in the text refers to one, two or more. In this embodiment, it is preferable to provide five chips 210 on the PCB board 200. The five chips 210 are located in the middle of the PCB board 200, and the interval between two adjacent chips 210 is small and will not affect each other's operation. It is preferable to have four fasteners, which are spaced at the four corners of the rectangular outline, and the rectangular outline surrounds the five chips 210.

[0045] like Figures 2 to 5 As shown, specifically, the fastener is a fastening screw 220; the PCB board 200 has through holes 230 corresponding to the positions of the fastening screws 220, and the inner top wall of the cavity 110 has fastening threaded holes 120 corresponding to the positions of the through holes 230, the fastening threaded holes 120 matching the fastening screws 220. During the assembly of the intelligent cockpit host of this embodiment, the PCB board 200 is placed into the cavity 110, and after aligning the through holes 230 with the corresponding fastening threaded holes 120, the fastening screws 220 are passed through the corresponding through holes 230 and tightened into the fastening threaded holes 120. The assembly operation is convenient.

[0046] In practical applications, fasteners can also be set to match buckles and slots.

[0047] Considering that the intelligent cockpit host is installed at the rear of the vehicle, in order to ensure the heat dissipation efficiency and reliability of the intelligent cockpit host during vehicle vibration, the mainstream thermal conductive adhesive 300 on the market has strong adhesion, making the chip 210 and the inner top wall of the cavity 110 stick very tightly. If there is a need for repair, the only way to separate the chip 210 from the inner top wall of the cavity 110 is to use a forced removal method. However, since the chip 210 is mounted on the PCB board 200, the forced removal method will cause the PCB board 200 to be subjected to greater stress, which will greatly increase the risk of damage to stress-sensitive components on the PCB board 200, thereby increasing the repair cost. In order to solve the above technical problems, such as Figures 2 to 5 As shown, in some embodiments, a plurality of elastic members 400 are provided between the PCB board 200 and the inner top wall of the cavity 110. The elastic members 400 are located close to the chip 210 and have a biasing force that drives the PCB board 200 to move away from the inner top wall of the cavity 110. When the portion of the PCB board 200 near the chip 210 is connected to the inner top wall of the cavity 110 using fasteners, the elastic element 400 is compressed and stores elastic potential energy. After the fastening screw 220 is unscrewed from the fastening threaded hole 120, the elastic element 400 releases its elastic potential energy, generating a biasing force to overcome the adhesive force of the thermally conductive adhesive 300 and pushing the PCB board 200 to move away from the inner top wall of the cavity 110, so as to separate the PCB board 200 from the inner top wall of the cavity 110. Furthermore, the multiple elastic elements 400 positioned near the chip 210 can ensure the uniformity of the stress experienced by the PCB board 200 as it moves away from the inner top wall of the cavity 110, thereby protecting stress-sensitive components on the PCB board 200 and helping to reduce rework costs.

[0048] In practical applications, the biasing force generated by the elastic potential energy released by the elastic element 400 is greater than the adhesive force of the thermally conductive adhesive 300, so that after the fastening screw 220 is unscrewed from the threaded hole 120, the PCB board 200 automatically separates from the inner top wall of the cavity 110. The biasing force generated by the elastic potential energy released by the elastic element 400 can also be slightly less than the adhesive force of the thermally conductive adhesive 300, so that after the fastening screw 220 is unscrewed from the threaded hole 120, only a small amount of external force is needed to separate the PCB board 200 from the inner top wall of the cavity 110, without the need for forced removal.

[0049] Specifically, the portion of the shank of the fastening screw 220 located between the inner top wall of the cavity 110 and the PCB board 200 is fitted with the elastic member 400. This arrangement helps to improve the uniformity of stress experienced by the PCB board 200 as it moves away from the inner top wall of the cavity 110, thereby protecting stress-sensitive components on the PCB board 200 and reducing rework costs.

[0050] like Figure 3 and Figure 5 As shown, more specifically, a screw post 140 is protruding from the inner top wall of the cavity 110 at the position corresponding to the through hole 230. A fastening threaded hole 120 is provided in the screw post 140, and the elastic element 400 is sleeved on the outside of the screw post 140. Because the outer diameter of the bolt 730 post is larger than the outer diameter of the shank of the fastening screw 220, sleeved on the outside of the screw post 140, it does not affect the tightening of the fastening screw 220 into or out of the fastening threaded hole 120, and also ensures the smoothness of the elastic element 400's axial expansion and contraction.

[0051] Specifically, the elastic element 400 is configured as a helical spring; in other embodiments, the elastic element 400 may also be configured as a sleeve made of an elastic material.

[0052] like Figure 1 , Figure 2 , Figure 4 and Figure 6 As shown, in some embodiments, the lower end of the cavity 110 is provided with an opening, and a cover plate 500 is detachably connected to the opening. The cover plate 500 is provided with a pressing part 510 facing the PCB board 200. By detachably connecting the cover plate 500 and the metal housing 100 into one piece, it is convenient to install the PCB board 200 in the cavity 110 and then install the cover plate 500; it is also convenient to remove the PCB board 200 for rework after removing the cover plate 500.

[0053] It should be noted that, compared to pressing the entire cover plate 500 against the PCB board 200, this embodiment only presses a portion of the PCB board 200 against the cover plate 500 through the pressing part 510, so that there is a gap between the PCB board 200 and the cover plate 500, which is beneficial for heat dissipation.

[0054] In specific applications, such as Figure 6 As shown, eight pressing parts 510 are provided. The eight pressing parts 510 are arranged at intervals along the outer edge of the cover plate 500 perpendicular to the thickness direction of the cover plate 500. Of course, this is only a preferred number of pressing parts 510. In other embodiments, the pressing parts 510 can be set to one, two, three or four, etc.

[0055] Specifically, the cover plate 500 is connected to the metal housing 100 via a first fastening assembly. By separating the cover plate 500 and the metal housing 100 and then detachably connecting them into one unit via the first fastening assembly, the PCB board 200 can be installed in the cavity 110 before the cover plate 500 is installed, thus improving the convenience of assembly.

[0056] like Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, specifically, the first fastening assembly includes a plurality of first threaded holes 610 and a number of first screws 630 equal to the number of first threaded holes 610. Preferably, there are eight first threaded holes 610. The first threaded holes 610 are disposed at one end of the metal housing 100 facing the cover plate 500. The eight first threaded holes 610 are spaced apart along the cross-sectional profile of the cover plate 500 perpendicular to the thickness direction of the cover plate 500. The cover plate 500 is provided with first through holes 620 corresponding to the positions of the first threaded holes 610. The first screws 630 are used to pass through the first through holes 620 and are threadedly connected to the corresponding first threaded holes 610. With this configuration, after the PCB board 200 is installed in the cavity 110 and initially connected to the inner top wall of the cavity 110 by fasteners, the cover plate 500 is then placed at the opening, with the first threaded hole 610 aligned with the corresponding first through hole 620. Subsequently, eight first screws 630 are passed through the first through hole 620 and tightened into the corresponding first threaded hole 610. This ensures both the connection strength between the cover plate 500 and the metal housing 100 and the pressing part 510 abuts and presses against the outer edge of the PCB board 200, ensuring the connection strength between the PCB board 200 and the metal housing 100.

[0057] In specific applications, the number of first through holes 620 can be reasonably increased or decreased according to the cross-sectional area of ​​the cover plate 500 perpendicular to the thickness direction of the cover plate 500 and the connection and fit strength. For example, in other embodiments, the cover plate 500 is provided with two, three, five or other numbers of first through holes 620.

[0058] The above embodiments are merely illustrative examples of the structure of the first fastening assembly, and are not intended to limit the specific structure of the first fastening assembly. In other embodiments, the first fastening assembly may include multiple first buckles and multiple first slots. The first buckles are disposed on one of the cover plate 500 and the metal housing 100, and the first slots are disposed on the other of the cover plate 500 and the metal housing 100. The cover plate 500 and the metal housing 100 are connected and assembled into a whole by engaging with the corresponding first slots through the first buckles.

[0059] like Figure 1 , Figure 4 and Figure 6As shown, specifically, the cover plate 500 has a recessed countersunk groove 511 corresponding to the pressing part 510, and the first through hole 620 is disposed through the pressing part 510. With this arrangement, after aligning the first threaded hole 610 with the corresponding first through hole 620, the first screw 630 can be passed through the countersunk groove 511 and the first through hole 620 in sequence, and then tightened into the corresponding first threaded hole 610. On the one hand, the screw head of the first screw 630 can be hidden in the countersunk groove 511 to avoid scratching people; on the other hand, the length of the shank of the first screw 630 can be shortened while ensuring the connection is tight.

[0060] like Figure 4 As shown, more specifically, the PCB board 200 is provided with a second through hole 240 at the position corresponding to the first through hole 620, and the second through hole 240 is used for the first screw 630 to pass through.

[0061] like Figure 1 , Figure 2 , Figure 4 and Figure 6 As shown, in some embodiments, a heat dissipation section 130 is provided at the end of the metal housing 100 away from the cover plate 500. The heat dissipation section 130 includes a plurality of spaced-apart heat dissipation fins. A mounting groove 131 is recessed on the end face of the heat dissipation section 130 away from the metal housing 100, and a fan 710 is disposed in the mounting groove 131. By providing a heat dissipation section 130 on the end face of the metal housing 100 away from the cover plate 500, after the heat generated by the chip 210 through the thermally conductive adhesive 300 is transferred to the metal housing 100, the metal housing 100 utilizes the larger heat dissipation area formed by the plurality of spaced-apart heat dissipation fins to dissipate heat, further improving the heat dissipation effect. At the same time, the fan 710 is disposed in the mounting groove 131, and when the fan 710 is activated, it blows air onto the heat dissipation section 130, improving the heat dissipation efficiency of the heat dissipation section 130, thereby effectively preventing the chip 210 from being damaged due to excessive temperature.

[0062] To achieve better heat dissipation, specifically, the fan 710 is configured to correspond to the chip 210.

[0063] Specifically, the fan 710 is mounted on the mounting frame 720, which is connected to the mounting slot 131 by bolts 730. The fan 710 and the heat dissipation unit 130 are detachably connected as one unit by the bolts 730, which facilitates both assembly and disassembly for maintenance.

[0064] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A smart cockpit main unit with high heat dissipation efficiency, characterized in that, include: A metal casing (100) with an internal cavity (110); A PCB board (200) is disposed in the cavity (110). A plurality of chips (210) are disposed on one end of the PCB board (200) facing the inner top wall of the cavity (110). The position of the PCB board (200) near the chips (210) is detachably connected to the inner top wall of the cavity (110) by fasteners. Thermally conductive adhesive (300) is disposed between the chip (210) and the inner top wall of the cavity (110).

2. The intelligent cockpit main unit with high heat dissipation efficiency according to claim 1, characterized in that, The fastener is configured as a fastening screw (220); the PCB board (200) has a through hole (230) at the position corresponding to the fastening screw (220), and the inner top wall of the cavity (110) is provided with a fastening threaded hole (120) at the position corresponding to the through hole (230), and the fastening threaded hole (120) matches the fastening screw (220).

3. The intelligent cockpit main unit with high heat dissipation efficiency according to claim 2, characterized in that, A plurality of elastic elements (400) are provided between the PCB board (200) and the inner top wall of the cavity (110). The elastic elements (400) are located close to the chip (210) and have a biasing force that drives the PCB board (200) to move away from the inner top wall of the cavity (110).

4. The intelligent cockpit main unit with high heat dissipation efficiency according to claim 3, characterized in that, The portion of the shank of the fastening screw (220) located between the inner top wall of the cavity (110) and the PCB board (200) is fitted with the elastic element (400).

5. A high-heat-dissipation-efficiency intelligent cockpit main unit according to claim 3 or 4, characterized in that, The elastic element (400) is configured as a helical spring.

6. A high-heat-dissipation-efficiency intelligent cockpit main unit according to any one of claims 1 to 4, characterized in that, An opening is formed through the lower end of the cavity (110), and a cover plate (500) is detachably connected to the opening. A pressing part (510) is provided on the cover plate (500) facing the PCB board (200).

7. A high-heat-dissipation-efficiency intelligent cockpit main unit according to claim 6, characterized in that, The cover plate (500) is connected to the metal housing (100) by a first fastening assembly.

8. The intelligent cockpit main unit with high heat dissipation efficiency according to claim 7, characterized in that, The first fastening assembly includes: A plurality of first threaded holes (610) are provided at one end of the metal housing (100) facing the cover plate (500), and the plurality of first threaded holes (610) are spaced apart along the cross-sectional profile of the cover plate (500) perpendicular to the thickness direction of the cover plate (500); Multiple first through holes (620) are provided on the cover plate (500) at positions corresponding to the first threaded holes (610); A first screw (630) is used to pass through the first through hole (620) and be threaded into the corresponding first threaded hole (610).

9. A high-heat-dissipation-efficiency intelligent cockpit main unit according to claim 6, characterized in that, The metal housing (100) has a heat dissipation part (130) at one end away from the cover plate (500). The heat dissipation part (130) includes a plurality of spaced heat dissipation fins. The end face of the heat dissipation part (130) away from the metal housing (100) is recessed with a mounting groove (131). A fan (710) is provided in the mounting groove (131). The fan (710) is provided corresponding to the chip (210).

10. A high-heat-dissipation-efficiency intelligent cockpit main unit according to claim 9, characterized in that, The fan (710) is mounted on a mounting frame (720), which is connected to the mounting slot (131) by bolts (730).

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