Circuit board heat dissipation device and laser device

Abstract

This application discloses a circuit board heat dissipation device and a laser device, relating to the field of circuit board heat dissipation technology. The disclosed circuit board heat dissipation device, housed within a sealed device, includes: an insulating heat sink plate, which is attached to the component arrangement surface of the circuit board. Components on the circuit board are arranged on the insulating heat sink plate and connected to the circuit board's wiring surface. The component arrangement surface is the plastic surface of the circuit board, and the wiring surface is the copper wire surface. A chip heat dissipation unit is attached to each chip to be cooled on the circuit board. A heat dissipation control unit has a first end connected to the chip to be cooled and the power input of the circuit board, a second end connected to the first end of the insulating heat sink plate and the first end of the chip heat dissipation unit, and a third end connected to a heat dissipation position on the sealed device. This control unit controls the insulating heat sink plate to dissipate heat from the components and the chip heat dissipation unit to dissipate heat from the chips to be cooled. This application achieves circuit board heat dissipation while ensuring the circuit board's sealing.

Description

Technical Field

[0001] This application relates to the field of circuit board heat dissipation technology, and in particular to a circuit board heat dissipation device and a laser device. Background Technology

[0002] As circuit boards are used more and more widely in various fields, users are also putting forward higher requirements for the heat dissipation methods of circuit boards.

[0003] Traditional circuit board heat dissipation devices directly reduce the sealing of the circuit board and then dissipate heat by opening the sealing. This type of circuit board heat dissipation device has a major drawback: opening the sealing can affect the normal operation of the circuit board, meaning that the precision components on the circuit board are easily corroded or damaged by the external environment. Therefore, there is an urgent need for a new type of circuit board heat dissipation device that can achieve heat dissipation while ensuring the sealing of the circuit board.

[0004] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Utility Model Content

[0005] The main purpose of this application is to provide a circuit board heat dissipation device and a laser device, which aims to solve the technical problem of how to achieve heat dissipation of the circuit board while ensuring the circuit board's sealing.

[0006] To achieve the above objectives, this application provides a circuit board heat dissipation device, which is disposed within a sealing device, and the circuit board heat dissipation device includes: An insulating heat sink is attached to the component arrangement surface of the circuit board, wherein the components on the circuit board are arranged on the insulating heat sink and connected to the circuit arrangement surface of the circuit board, wherein the component arrangement surface is the plastic surface of the circuit board and the circuit arrangement surface is the copper wire surface of the circuit board. A chip heat dissipation unit is attached to each chip to be cooled on the circuit board. A heat dissipation control unit is provided, wherein a first end of the heat dissipation control unit is connected to the power input of the chip to be cooled and the circuit board, a second end of the heat dissipation control unit is connected to the first end of the insulating heat sink and the first end of the chip heat dissipation unit, and a third end of the heat dissipation control unit is connected to the heat dissipation position on the sealing device. The heat dissipation control unit is used to control the insulating heat sink to dissipate heat from the components and to control the chip heat dissipation unit to dissipate heat from the chip to be cooled.

[0007] In one embodiment, the second end of the heat dissipation control unit includes a first power supply terminal, and the insulating heat sink includes: A thermoelectric cooler is provided, wherein the cooling end of the thermoelectric cooler is attached to the device arrangement surface of the circuit board, the power supply end of the thermoelectric cooler is connected to the first power supply end, the heat dissipation end of the thermoelectric cooler is connected to the heat dissipation position on the sealing device, and a plurality of first insulating through holes are provided on the thermoelectric cooler, wherein each pin of the component passes through the first insulating through hole and is connected to the circuit arrangement surface of the circuit board.

[0008] In one embodiment, the second end of the heat dissipation control unit includes a first insulated heat-conducting end of a first winding coil, wherein the first winding coil is a counterclockwise winding and is connected to a power supply, and the insulating heat sink includes: A metal heat-conducting sheet is provided, wherein the first heat-conducting surface of the metal heat-conducting sheet is in contact with the device arrangement surface of the circuit board, and a plurality of second insulating through holes are provided on the metal heat-conducting sheet, wherein each pin of the component passes through the second insulating through hole and is connected to the circuit arrangement surface of the circuit board, and a second coil is wound in a clockwise direction on the second heat-conducting surface of the metal heat-conducting sheet, and when the second coil is connected to the power supply, the second heat-conducting surface of the metal heat-conducting sheet is connected to the first insulating heat-conducting end.

[0009] In one embodiment, the second end of the heat dissipation control unit includes a second power supply terminal and a second insulated heat-conducting terminal of a third coil winding, wherein the third coil is a counterclockwise winding and is connected to the power supply, and the chip heat dissipation unit includes: A top surface cooling chip, wherein the cooling end of the top surface cooling chip is attached to the top surface of the chip to be cooled, the heat dissipation end of the top surface cooling chip is connected to the heat dissipation position on the sealing device, and the power supply end of the top surface cooling chip is connected to the second power supply end. A side heat-conducting sheet is provided, wherein the first heat-conducting surface of the side heat-conducting sheet is attached to the side of the chip to be cooled, and a fourth coil is wound clockwise on the second heat-conducting surface of the side heat-conducting sheet. When the fourth coil is connected to the power supply, the second heat-conducting surface of the side heat-conducting sheet is connected to the second insulated heat-conducting end.

[0010] In one embodiment, the heat dissipation control unit includes a component heat dissipation control subunit, the component heat dissipation control subunit comprising: The first voltage amplifier chip has its input terminal connected to the power input of the circuit board. A first selection chip has its control terminal connected to the output terminal of the first voltage amplifier chip, its input terminal connected to the power supply, its second output terminal left floating, and its first output terminal connected to the first end of the insulating heat sink. When the insulating heat sink is a thermoelectric cooler, the first end of the insulating heat sink is the power supply terminal of the thermoelectric cooler. When the insulating heat sink is a metal heat-conducting sheet, the first end of the insulating heat sink is the second coil wound on the second heat-conducting surface of the metal heat-conducting sheet.

[0011] In one embodiment, the heat dissipation control unit includes a chip heat dissipation control subunit, the chip heat dissipation control subunit comprising: The second voltage amplifier chip has its input terminal connected to the power input of the chip to be cooled. The second selection chip has its control terminal connected to the output terminal of the second voltage amplifier chip, its input terminal connected to the power supply, its second output terminal left floating, and its first output terminal connected to the first end of the chip heat dissipation unit, wherein the first end of the chip heat dissipation unit is the power supply terminal of the top surface cooling chip in the chip heat dissipation unit.

[0012] In one embodiment, the chip heat dissipation control subunit further includes: A temperature chip is disposed on the chip to be cooled, wherein the temperature chip is configured to output a high level when the temperature is greater than a preset value, and output a low level when the temperature is less than or equal to the preset value; The third selection chip has its control terminal connected to the output terminal of the temperature chip, its input terminal connected to the power supply, its second output terminal floating, and its first output terminal connected to the first end of the chip heat dissipation unit. The first end of the chip heat dissipation unit is the fourth coil of the winding on the side heat-conducting plate of the chip heat dissipation unit.

[0013] In one embodiment, the circuit board heat dissipation device further includes: A power supply is provided, wherein the control terminal of the power supply is connected to the power input of the chip to be cooled and the power input of the circuit board, the input terminal of the power supply is connected to the power supply, the first output terminal of the power supply is connected to the first coil of the winding on the first insulated heat-conducting end in the heat dissipation control unit, and the second output terminal of the power supply is connected to the fourth coil of the winding on the second insulated heat-conducting end in the heat dissipation control unit.

[0014] In addition, to achieve the above objectives, a laser device is also provided, which includes the above-mentioned circuit board heat dissipation device and sealing device. The sealing device is used to seal the circuit board heat dissipation device, wherein the heat dissipation position on the sealing device includes at least one of the cooling position of the laser device, the heat dissipation position of the laser device, and the ventilation port of the laser device.

[0015] In one embodiment, the laser device further includes: A temperature acquisition device is disposed inside the sealing device and is used to acquire the temperature value inside the sealing device. A cooler, wherein the cooler is disposed on the inner wall of the sealing device; The control chip is connected to a power supply, a temperature sensor's acquisition terminal, and a cooler's control terminal. The control chip is used to provide the power supply to the cooler based on the temperature value, so that the cooler can dissipate heat.

[0016] This application provides a circuit board heat dissipation device disposed within a sealed device, including an insulating heat sink plate that is attached to the component arrangement surface of the circuit board. Components on the circuit board are arranged on the insulating heat sink plate and connected to the circuit layout surface of the circuit board. A chip heat dissipation unit is attached to each chip on the circuit board to be cooled. A heat dissipation control unit has a first end connected to the power inlet of the chip to be cooled and the circuit board, a second end connected to the first end of the insulating heat sink plate and the first end of the chip heat dissipation unit, and a third end connected to a heat dissipation location on the sealed device. The heat dissipation control unit controls the insulating heat sink plate to dissipate heat from the components and controls the chip heat dissipation unit to dissipate heat from the chip to be cooled. This circuit board heat dissipation device is disposed within a sealed device and uses power supply information collected by the heat dissipation control unit based on the power inlet of the circuit board to determine whether the power supply is supplying power to the components, thereby adjusting the heat dissipation of the components. When the device is powered on, an insulating heat sink that is attached to the device placement surface of the circuit board dissipates heat from the components. Based on the chip's operating information collected from the chip to be cooled, i.e., by determining whether the chip is working, a chip cooling unit attached to the chip is controlled to dissipate heat from the chip when it is working. This avoids the phenomenon that external ventilation can affect the normal operation of the circuit board, preventing the delicate components on the circuit board from being easily corroded or damaged by the external environment. This circuit board heat dissipation device can dissipate heat from the components through an insulating heat sink and a chip cooling unit within a sealed device. On the one hand, it ensures targeted heat dissipation, i.e., targeted heat dissipation during operation to ensure heat dissipation effect and prevent heat from being conducted to other non-working chips. On the other hand, it reduces the direct contact between the delicate components on the circuit board and the external environment during heat dissipation, thus achieving circuit board heat dissipation while ensuring the circuit board's sealing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the frame of the first embodiment of the circuit board heat dissipation device of this application; Figure 2 This is a schematic diagram of an insulating heat sink in the circuit board heat dissipation device of this application. Figure 3 This is another schematic diagram of the insulating heat sink in the circuit board heat dissipation device of this application; Figure 4 This is a schematic diagram of a chip heat dissipation unit in the circuit board heat dissipation device of this application. Figure 5 This is a connection diagram of the heat dissipation control unit in the circuit board heat dissipation device of this application; Figure 6 This is another connection diagram of the heat dissipation control unit in the circuit board heat dissipation device of this application; Figure 7 This is a schematic diagram of a scenario according to the first embodiment of this application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0019] Explanation of icon numbers: 200. Sealing device; 210. Heat dissipation location; 110. Circuit board; 111. Component layout surface; 112. Circuit layout surface; 113. Power input of circuit board; 120. Component; 121. Chip to be cooled; 122. Pin; 130. Insulating heat sink; 140. Chip heat dissipation unit; 150. Heat dissipation control unit; 11. First insulating through-hole; 10. Semiconductor cooling chip; 12. Cooling end of semiconductor cooling chip; 13. Heat dissipation end of semiconductor cooling chip; 20. Metal heat-conducting sheet; 21. Second insulating through-hole; 22. Second coil; 41. First movable junction Structure; 42, First coil; 31, Top surface cooling plate; 32, Side heat-conducting plate; 33, Fourth coil; 43, Second movable structure; 44, Third coil; 60, Power supply conductor; 151, First insulated heat-conducting end; 51, First voltage amplifier chip; 52, First selection chip; 152, Second insulated heat-conducting end; 53, Second voltage amplifier chip; 54, Second selection chip; 55, Temperature chip; 56, Third selection chip; 300, Power supply; 400, Temperature acquisition device; 500, Cooler; 600, Control chip; 123, Power input of the chip to be cooled. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0021] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0022] Traditional circuit board heat dissipation devices directly reduce the sealing of the circuit board's enclosure, thereby dissipating heat by opening up ventilation within the enclosure. In other words, current heat dissipation methods create airflow between the circuit board and its components and the external environment, achieving a cooling effect, such as using small air vents. However, in harsh environments where the components on the circuit board are highly sensitive to environmental influences, this can lead to a shorter lifespan for both the circuit board and its components.

[0023] Therefore, based on the shortcomings of the above-mentioned circuit board heat dissipation devices, this application proposes a circuit board heat dissipation device, primarily for scenarios requiring strong sealing and operating in harsh environments: It is installed within a sealed device and uses a heat dissipation control unit to collect power supply information from the circuit board's power inlet, determining whether the power supply is providing power to the components. When power is being supplied to the components, the control unit controls an insulating heat sink, which is attached to the component placement surface of the circuit board, to dissipate heat from the components. Additionally, it uses chip operating information collected from the chip to be cooled, determining whether the chip is operating, and controlling a chip heat dissipation unit attached to the chip to cool the chip when the chip is operating. This heat dissipation device avoids the problem of external ventilation affecting the normal operation of the circuit board, preventing the delicate components on the circuit board from being corroded or damaged by the external environment. This circuit board heat dissipation device can dissipate heat from the components through an insulating heat sink and a chip heat dissipation unit within a sealed device. On the one hand, it can ensure targeted heat dissipation, that is, targeted heat dissipation during operation to ensure heat dissipation effect and prevent heat from being conducted to other unused chips. On the other hand, it can reduce the direct contact between the delicate components on the circuit board and the external environment during heat dissipation, thus achieving heat dissipation of the circuit board while ensuring the sealing of the circuit board.

[0024] Based on this, embodiments of this application provide a circuit board heat dissipation device, referring to... Figure 1 , Figure 1 This is a schematic diagram of the frame of the first embodiment of the heat dissipation device for the circuit board of this application.

[0025] Reference Figure 1 This application provides a circuit board heat dissipation device disposed within a sealing device 200. The circuit board heat dissipation device includes: An insulating heat sink 130 is attached to the component arrangement surface 111 of the circuit board 110. Components 120 on the circuit board 110 are arranged on the insulating heat sink 130 and connected to the circuit arrangement surface 112 of the circuit board 110. Component arrangement surface 111 is the plastic surface of the circuit board 110, and circuit arrangement surface 112 is the copper wire surface of the circuit board 110. Chip heat dissipation unit 140, chip heat dissipation unit 140 is attached to each chip 121 to be heat dissipated on circuit board 110; The heat dissipation control unit 150 has its first end connected to the power input 113 of the chip 121 to be cooled and the circuit board 110, its second end connected to the first end of the insulating heat sink 130 and the first end of the chip heat dissipation unit 140, and its third end connected to the heat dissipation position 210 on the sealing device 200. The heat dissipation control unit 150 is used to control the insulating heat sink 130 to dissipate heat from the component 120 and to control the chip heat dissipation unit 140 to dissipate heat from the chip 121 to be cooled.

[0026] In this embodiment, by placing the circuit board heat dissipation device inside the sealing device 200, and then achieving temperature reduction within the sealing device 200 through the structural design of the circuit board heat dissipation device, the sealing device 200 can be a sealed box, enclosure, or plastic, etc., and is not limited thereto. An insulating heat dissipation plate 130 is provided inside the circuit board heat dissipation device, and the insulating heat dissipation plate 130 is attached to the component arrangement surface 111 of the circuit board 110. This allows the insulating heat dissipation plate 130 to dissipate heat from the components 120 on the component arrangement surface 111 of the circuit board 110, i.e., it is directly attached to the bottom surface of the components 120 to achieve heat dissipation. Components 120 can be resistors, capacitors, and various chips, etc. Thus, heat dissipation of components 120 on the circuit board 110 in a sealed environment can be achieved based on the insulating heat dissipation plate 130. Simultaneously, to prevent chip overheating, such as when chip overheating causes the circuit board 110 to overheat... 10 requires heat dissipation, so the chip heat dissipation unit 140 is attached to each chip 121 to be cooled on the circuit board 110, rather than the bottom surface of the chip 121 to be cooled. This allows for simultaneous heat dissipation based on both the bottom and non-bottom surfaces to ensure heat dissipation effect. The chip 121 to be cooled can be any chip on the circuit board 110, or a chip that is prone to heat generation. By combining the chip heat dissipation unit 140 and the insulating heat sink 130, the heat dissipation effect of the chip 121 to be cooled in a sealed environment can be guaranteed, so as to achieve heat dissipation of the circuit board while ensuring the sealing of the circuit board.

[0027] In one embodiment, to precisely dissipate heat from the component 120 and the chip 121 to be cooled, a heat dissipation control unit 150 can be provided. The first end of the heat dissipation control unit 150 is connected to the power inlet 113 of the chip 121 and the circuit board 110; the second end of the heat dissipation control unit 150 is connected to the first end of the insulating heat sink 130 and the first end of the chip heat dissipation unit 140; and the third end of the heat dissipation control unit 150 is connected to the heat dissipation location 210 on the sealing device 200. For example, a cooling water device or heat sink fins can be used. By collecting various information from the power inlet 113 of the chip 121 and the circuit board 110, such as current and voltage, and by collecting various information from both locations, the heat dissipation unit 140 and the insulating heat sink 130 can be used to dissipate heat from the component 120 and the chip 121 to be cooled, thereby ensuring effective heat dissipation in a sealed environment. It is worth noting that the heat dissipation control unit 150 can determine whether the chip 121 to be cooled and the circuit board 110 are working. For example, if current or voltage is detected flowing through the power input 113 of the circuit board 110, the first terminal of the heat dissipation control unit 150 is at a high level, thereby controlling the opening of the insulating heat sink 130 to cool the component 120. If current or voltage flows through the chip 121 to be cooled, the first terminal of the heat dissipation control unit 150 is at a high level, thereby controlling the chip heat dissipation unit 140 to cool the chip 121 to be cooled. Because the chip 121 to be cooled has a base during normal soldering, the circuit board is directly attached to the base, and the insulating heat sink 130 cannot cool the chip 121 to be cooled. Therefore, the chip heat dissipation unit 140 is needed to specifically cool the chip. The opening and heat dissipation process of the insulating heat sink 130 and the chip heat dissipation unit 140 can be controlled by the heat dissipation control unit 150 and the heat dissipation position 210 on the sealing device 200 to precisely dissipate heat from the components 120 and the chip 121 to be cooled, thereby achieving precise heat dissipation. This avoids the continuous connection or continuous power supply of components that do not require heat dissipation, and avoids the heat dissipation position 210 on the sealing device 200 from contacting the environment and having a reverse impact on the circuit board 110. For example, when using metal heat dissipation, there may be a phenomenon of reverse current transmission affecting the components 120 on the circuit board 110, and the phenomenon of the power supply heat dissipation instrument continuously supplying power. This greatly improves the safety of the entire circuit board heat dissipation device and reduces energy consumption.

[0028] In this embodiment, a circuit board heat dissipation device disposed within a sealing device 200 is provided, including an insulating heat sink 130, which is attached to the component arrangement surface 111 of a circuit board 110. Components 120 on the circuit board 110 are arranged on the insulating heat sink 130 and connected to the circuit arrangement surface 112 of the circuit board 110. The component arrangement surface 111 is the plastic surface of the circuit board 110, and the circuit arrangement surface 112 is the copper wire surface of the circuit board 110. A chip heat dissipation unit 140 is attached to each chip 121 to be cooled on the circuit board 110. A heat dissipation control unit 150 is also provided. The first end of the heat dissipation control unit 150 is connected to the power inlet 113 of the chip 121 to be cooled and the circuit board 110. The second end of the heat dissipation control unit 150 is connected to the first end of the insulating heat sink 130 and the first end of the chip heat dissipation unit 140. The third end of the heat dissipation control unit 150 is connected to the heat dissipation position 210 on the sealing device 200. The heat dissipation control unit 150 controls the insulating heat sink 130 to dissipate heat from the component 120 based on the power supply information collected from the power inlet 113 of the circuit board 110, and controls the chip heat dissipation unit 140 to dissipate heat from the chip 121 to be cooled based on the chip operating information collected from the chip 121 to be cooled. This circuit board heat dissipation device is installed on... Within the sealing device 200, the heat dissipation control unit 150 collects power supply information from the power inlet 113 of the circuit board 110. This determines whether the power supply is providing power to the component 120. When power is being supplied to the component 120, the control unit 150 controls the insulating heat sink 130, which is attached to the component placement surface of the circuit board 110, to dissipate heat from the component 120. Additionally, based on chip operating information collected from the chip 121 to be cooled, the control unit 140, which is attached to the chip 121, controls the chip heat dissipation unit 140 to dissipate heat from the chip 121 when it is operating. This avoids the need for external packaging. Ventilation can affect the normal operation of circuit boards, meaning that precision components on the circuit board are easily corroded or damaged by the external environment. This circuit board heat dissipation device can dissipate heat from the components 120 through the insulating heat sink 130 and the chip heat dissipation unit 140 within the sealed device 200 to dissipate heat from the chip 121 to be cooled. On the one hand, it can ensure targeted heat dissipation, that is, targeted heat dissipation during operation to ensure heat dissipation effect and prevent heat from being conducted to other unused chips 121 to be cooled. On the other hand, it can reduce the direct contact between the precision components on the circuit board and the external environment during heat dissipation, thereby achieving heat dissipation of the circuit board while ensuring the sealing of the circuit board.

[0029] Furthermore, based on the first embodiment of this application described above, a second embodiment of the circuit board heat dissipation device of this application is proposed, referring to... Figure 2 , Figure 2This is a schematic diagram of an insulating heat sink in the circuit board heat dissipation device of this application. The second end of the heat dissipation control unit 150 includes a first power supply terminal, and the insulating heat sink 130 includes: The semiconductor refrigeration chip 10 has a cooling end 12 that is attached to the device arrangement surface 111 of the circuit board. The power supply end of the semiconductor refrigeration chip 10 is connected to the first power supply end. The heat dissipation end 13 of the semiconductor refrigeration chip 10 is connected to the heat dissipation position 210 on the sealing device 200. The semiconductor refrigeration chip 10 is provided with a plurality of first insulating through holes 11, wherein each pin 122 of the component 120 passes through the first insulating through hole 11 and is connected to the line arrangement surface 112 of the circuit board 110.

[0030] In one embodiment, reference is made to Figure 3 , Figure 3 This is another schematic diagram of the insulating heat sink in the circuit board heat dissipation device of this application. The second end of the heat dissipation control unit 150 includes a first insulating heat-conducting end 151 of the first winding coil 42, wherein the first winding coil 42 is a counterclockwise winding and is connected to the power supply 300. The insulating heat sink 130 includes: The metal heat-conducting sheet 20 has a first heat-conducting surface that is attached to the device arrangement surface 111 of the circuit board 110. The metal heat-conducting sheet 20 is provided with a plurality of second insulating through holes 21, wherein each pin 122 of the component 120 passes through the second insulating through hole 21 and is connected to the line arrangement surface 112 of the circuit board 110. A second coil 22 is wound clockwise on the second heat-conducting surface of the metal heat-conducting sheet 20, and when the second coil 22 is connected to the power supply 300, the second heat-conducting surface of the metal heat-conducting sheet 20 is connected to the first insulating heat-conducting end 151.

[0031] In this embodiment, the second end of the heat dissipation control unit 150 includes a first power supply terminal, the insulating heat sink 130 includes a thermoelectric cooler 10, the cooling end 12 of the thermoelectric cooler 10 is attached to the device arrangement surface 111 of the circuit board, the power supply terminal of the thermoelectric cooler 10 is connected to the first power supply terminal, and the heat dissipation end 13 of the thermoelectric cooler 10 is connected to the heat dissipation position 210 on the sealing device 200. At the same time, a plurality of first insulating through holes 11 are provided on the thermoelectric cooler 10 to pass through the pins 122 of each component 120, which can avoid the thermoelectric cooler 10 causing short circuits in the components 120 and short circuits in the circuit on the entire circuit board 110. The thermoelectric cooler 10 can be formed by alternating P-type and N-type semiconductor elements on a ceramic substrate to create electrical couples. Internally, it includes P-type and N-type semiconductor elements (core functional components of the cooler, fabricated through doping processes), a ceramic substrate (providing mechanical support and electrical insulation, typically made of alumina ceramic), copper connecting pieces (connecting the P-type and N-type semiconductors to form a current loop), and electrodes (for connecting to an external power source, serving as the power supply terminals of the thermoelectric cooler 10). The current direction can be controlled to achieve heat dissipation from the thermoelectric cooler 10. The advantage of using the thermoelectric cooler 10 here is that the current flow method at the power supply terminal can be selected according to actual conditions, thereby achieving heat dissipation or heating of component 120. A heat dissipation selector can be directly connected to the positive and negative electrodes to control the first power supply terminal to connect to the negative electrode for heating and to connect to the positive electrode for heat dissipation, thus expanding the functionality of the entire circuit board heat dissipation device and simultaneously achieving heat dissipation of component 120 on the circuit board 110 in a sealed environment.

[0032] In one embodiment, the second end of the heat dissipation control unit 150 includes a first insulated heat-conducting end 151 of the first coil 42, wherein the first coil 42 is a counterclockwise winding and is connected to the power supply 300. The insulating heat sink 130 includes a metal heat-conducting sheet 20, such as copper or aluminum. The metal heat-conducting sheet 20 is configured in the same way as the semiconductor cooling chip 10 described above, that is, it is attached to and designed with the second insulating through hole 21. The second insulating through hole 21 is used to avoid short circuits. However, the metal heat-conducting sheet 20 is not directly connected to the heat dissipation position 210 on the sealing device 200, but is controlled by the heat dissipation control unit 150 to connect to the heat dissipation position 210 on the sealing device 200, so as to achieve selective heat dissipation and improve the functionality of the entire circuit board heat dissipation device. The second coil 22, which is wound clockwise on the second heat-conducting surface of the metal heat-conducting sheet 20, can be a long strip-shaped metal heat-conducting sheet, described here as the first metal heat-conducting body, with the second coil 22 wound on it. Meanwhile, because the first insulating heat-conducting end 151 is set at a certain distance above the second heat-conducting surface of the metal heat-conducting sheet 20, and the first coil 42 on the first insulating heat-conducting end 151 is wound counterclockwise and connected to the power supply 300, and the first insulating heat-conducting end 151 is fixed by the first movable structure 41, as shown in the figure, the first insulating heat-conducting end 151 can be made of heat-conducting materials such as copper and aluminum, and is fixed by the first movable structure 41, but can move downward. Normally, when the second coil 22 is not connected to the power supply 300, the first metal heat conductor and the first insulating heat conductor 151 are spaced a certain distance apart, and a magnetic force is generated. However, the first metal heat conductor is fixed by the first movable structure 41, and there is a distance between it and the first insulating heat conductor 151, so the metal heat conductor 20 does not dissipate heat. When the second coil 22 is connected to the power supply 300, the first metal heat conductor and the first insulating heat conductor 151 are attracted to each other, that is, a magnetic force is generated. Since the coil windings are attracted to each other due to different directions, the metal heat conductor 20 dissipates heat. That is, heat dissipation is achieved by connecting and dissipating heat through electromagnetism. Of course, the first metal heat conductor can also be placed on the first insulating heat conductor 151. In this case, two coils with the same direction are designed, and then the two are separated when energized. At this time, it is necessary to keep energized when not working. Based on the above control, heat dissipation can be controlled to improve the functionality of the circuit board heat dissipation device.

[0033] Furthermore, based on the first and / or second embodiments of this application described above, a third embodiment of the circuit board heat dissipation device of this application is proposed, referring to... Figure 4 , Figure 4This is a schematic diagram of a chip heat dissipation unit in the circuit board heat dissipation device of this application. The second end of the heat dissipation control unit 150 includes a second power supply terminal. It is worth noting that the second power supply terminal can be powered by the same power supply as the first power supply terminal, that is, directly supplied to the power supply 300. The only difference is whether it is used; that is, whether it is connected to the corresponding power supply terminal is selected through a corresponding selector. The second end of the heat dissipation control unit 150 also includes a second insulated heat-conducting end 152 of the third coil 44, wherein the third coil 44 is a counterclockwise winding and is connected to the power supply 300. The chip heat dissipation unit 140 includes: The top surface cooling chip 31 has its cooling end attached to the top surface of the chip 121 to be cooled, and its heat dissipation end is connected to the heat dissipation position 210 on the sealing device 200. The power supply end of the top surface cooling chip 31 is connected to the second power supply end. The side heat-conducting sheet 32 ​​has a first heat-conducting surface attached to the side of the chip 121 to be cooled. A fourth coil 33 is wound clockwise on the second heat-conducting surface of the side heat-conducting sheet 32. When the fourth coil 33 is connected to the power supply 300, the second heat-conducting surface of the side heat-conducting sheet 32 ​​is connected to the second insulated heat-conducting end 152.

[0034] In this embodiment, the chip heat dissipation unit 140 includes a top surface cooling chip 31 on the top surface of the chip 121 to be cooled, and a side heat-conducting sheet 32 ​​disposed on the side of the chip 121 to adapt to different situations for heat dissipation of the chip 121. The top surface cooling chip 31 can be a semiconductor cooling chip, and the current direction can be controlled to achieve heat dissipation from the top surface cooling chip 31. The advantage of using the top surface cooling chip 31 is that the current flow method at the power supply terminal of the top surface cooling chip 31 can be selected according to the actual situation, thereby achieving heat dissipation or heating of the chip 121 to be cooled. A heat dissipation selector can be directly connected to the positive and negative electrodes to control the first power supply terminal to connect to the negative electrode for heating, and to connect to the positive electrode for heat dissipation, thus expanding the functionality of the entire circuit board heat dissipation device and achieving heat dissipation of the chip 121 on the circuit board 110 in a sealed environment. The side heat-conducting sheet 32 ​​can be a metal heat-conducting sheet. A fourth coil 33 is wound clockwise on the second heat-conducting surface of the side heat-conducting sheet 32. For example, the second heat-conducting surface can be a long strip of metal heat-conducting sheet, described here as a second metal heat-conducting body, and the fourth coil 33 is wound on it. At the same time, because the second insulating heat-conducting end 152 is set at a certain distance above the second heat-conducting surface of the side heat-conducting sheet 32, and the side heat-conducting sheet 32 ​​on the second insulating heat-conducting end 152 is wound counterclockwise and connected to the power supply 300, and the second insulating heat-conducting end 152 is fixed by the second movable structure 43, as shown in the figure, the second insulating heat-conducting end 152 can be made of heat-conducting materials such as copper and aluminum, and is fixed by the second movable structure 43, but can move downward. Normally, when the fourth coil 33 is not connected to the power supply 300, the second metal heat conductor and the second insulating heat conductor 152 are spaced a certain distance apart, i.e., a magnetic force is generated. However, the second metal heat conductor is fixed by the second movable structure 43, and there is a distance between it and the second insulating heat conductor 152, so the side heat conductor 32 does not dissipate heat. When the fourth coil 33 is connected to the power supply 300, the second metal heat conductor and the second insulating heat conductor 152 are attracted to each other, i.e., a magnetic force is generated. And because the coil winding directions are different, the side heat conductor 32 dissipates heat, i.e., heat dissipation is achieved by connecting and dissipating heat through electromagnetism. Of course, the second metal heat conductor can also be placed on the second insulating heat conductor 152. In this case, two coils with the same direction are designed, and then the two are separated by energizing. At this time, it is necessary to keep energized when not working. Thus, the heat dissipation can be controlled based on the above control, thereby improving the functionality of the circuit board heat dissipation device.

[0035] It is worth noting that the design structure of the top cooling plate 31, the side heat conduction plate 32, the metal heat conduction plate 20, and the semiconductor cooling plate 10 can be adaptively selected according to the actual situation. For example, if an L-shaped method is selected, the fixing point can use relevant fixing screws or be a whole, or other methods, such as directly connecting a small part of copper or semiconductor cooling plate from the idle position to the heat dissipation position 210 on the whole sealing device 200. This is not limited here.

[0036] Furthermore, based on the first, second, and / or third embodiments of this application described above, a fourth embodiment of the circuit board heat dissipation device of this application is proposed, with reference to... Figure 5 , Figure 5 This is a connection diagram of the heat dissipation control unit in the circuit board heat dissipation device of this application. The heat dissipation control unit 150 includes a component heat dissipation control subunit, which includes: The first voltage amplifier chip 51 has its input terminal connected to the power input 113 of the circuit board 110. The first selection chip 52, such as a commonly used digital 2-to-1 multiplexer chip, has its control terminal connected to the output terminal of the first voltage amplifier chip 51, its input terminal connected to the power supply 300, its second output terminal left floating, and its first output terminal connected to the first end of the insulating heat sink 130. When the insulating heat sink 130 is a semiconductor cooling chip 10, its first end is the power supply terminal of the semiconductor cooling chip 10. When the insulating heat sink 130 is a metal heat-conducting sheet 20, its first end is the second coil 22 wound on the second heat-conducting surface of the metal heat-conducting sheet 20.

[0037] In this embodiment, to achieve heat dissipation control of component 120, a first voltage amplifier chip 51 can be connected to the power input 113 of circuit board 110. The first voltage amplifier chip 51 can be a commonly used amplifier chip, which amplifies the voltage. Alternatively, a voltage detector can be used directly. When there is voltage, that is, when the circuit board 110 starts to work, it outputs a high level. When there is no voltage, it outputs a low level. Finally, the conduction state of the first selection chip 52 can be controlled based on the high and low levels. When the control terminal of the first selection chip 52 is connected to a low level, it controls the input terminal and the second output terminal of the first selection chip 52. At this time, when the insulating heat sink 130 is a semiconductor cooling chip 10, the power supply terminal of the semiconductor cooling chip 10 is not powered, and the semiconductor cooling chip 10 does not dissipate heat. When the insulating heat sink 130 is a metal heat-conducting sheet 20, the second coil 22 wound on the second heat-conducting surface of the metal heat-conducting sheet 20 is not powered. The first metal heat-conducting body is separated from the first insulating heat-conducting end 151 by a certain distance. That is, a magnetic force is generated at this time, but the first metal heat-conducting body is fixed by the first movable structure 41 and there is a distance between it and the first insulating heat-conducting end 151. The entire metal heat-conducting sheet 20 does not dissipate heat. When the control terminal of the first selection chip 52 is connected to a high level, it controls the input terminal and the second output terminal of the first selection chip 52. At this time, when the insulating heat sink 130 is a semiconductor cooling chip 10, the power supply terminal of the semiconductor cooling chip 10 is powered, and the semiconductor cooling chip 10 dissipates heat. When the insulating heat sink 130 is a metal heat-conducting sheet 20, the second coil 22 wound on the second heat-conducting surface of the metal heat-conducting sheet 20 is powered, the first metal heat conductor and the first insulating heat-conducting end 151 are attracted to each other, that is, a magnetic force is generated. Since the coil windings are attracted to each other due to different directions, the metal heat-conducting sheet 20 dissipates heat. Then, by determining whether the circuit board 110 is working, it is determined whether the insulating heat sink 130 needs to dissipate heat, so as to ensure the intelligence and accuracy of the insulating heat sink 130 in dissipating heat.

[0038] In one embodiment, reference is made to Figure 6 , Figure 6 This is another connection diagram of the heat dissipation control unit in the circuit board heat dissipation device of this application. The heat dissipation control unit 150 includes a chip heat dissipation control subunit, which includes: The second voltage amplifier chip 53 has its input terminal connected to the power input 123 of the chip 121 to be cooled. The second selection chip 54 has its control terminal connected to the output terminal of the second voltage amplifier chip 53, its input terminal connected to the power supply 300, its second output terminal left floating, and its first output terminal connected to the first end of the chip heat dissipation unit 140, wherein the first end of the chip heat dissipation unit 140 is the power supply terminal of the top surface cooling chip in the chip heat dissipation unit 140.

[0039] Furthermore, the chip heat dissipation control subunit also includes: Temperature chip 55 is disposed on the chip 121 to be cooled. Temperature chip 55 is configured to output a high level when the temperature is greater than a preset value and to output a low level when the temperature is less than or equal to the preset value. The third selection chip 56 has its control terminal connected to the output terminal of the temperature chip 55, its input terminal connected to the power supply 300, its second output terminal unconnected, and its first output terminal connected to the first end of the chip heat dissipation unit 140. The first end of the chip heat dissipation unit 140 is the fourth coil 33 wound on the side heat-conducting sheet of the chip heat dissipation unit 140.

[0040] In this embodiment, to achieve heat dissipation control of the chip 121 to be cooled, a second voltage amplifier chip 53 can be connected to the power input 123 of the chip 121. The second voltage amplifier chip 53 can be a commonly used amplifier chip, which amplifies the voltage. Alternatively, a voltage detector can be used. When there is voltage, the chip 121 to be cooled starts working and outputs a high level; when there is no voltage, it outputs a low level. Ultimately, the conduction state of the second selection chip 54 can be controlled based on the high and low levels. When the control terminal of the second selection chip 54 is connected to a low level, the input terminal and the second output terminal of the second selection chip 54 are controlled. At this time, the power supply terminal of the top surface cooling pad in the chip heat dissipation unit 140 is not powered, and the half-top surface cooling pad does not dissipate heat. When the control terminal of the second selection chip 54 is connected to a high level, the input terminal and the second output terminal of the second selection chip 54 are controlled. At this time, the power supply terminal of the top surface cooling pad in the chip heat dissipation unit 140 is powered, and the half-top surface cooling pad dissipates heat.

[0041] In one embodiment, the chip heat dissipation control subunit further includes a temperature chip 55 for detecting the temperature. If the temperature of the chip 121 to be cooled is greater than a preset value, a high-level output is defined in the temperature chip beforehand. When the temperature is less than or equal to the preset value, a low-level output is given. This can be directly improved based on existing temperature alarms, i.e., the alarm output mode is changed to a high / low level output mode. Ultimately, the conduction state of the third selection chip 56 can be controlled based on the high / low level. When the control terminal of the third selection chip 56 is connected to a low level, and the insulating heat sink 130 is a metal heat-conducting sheet 20, the fourth coil 33 wound on the side heat-conducting sheet is not powered. The second metal heat-conducting body is spaced a certain distance from the second insulating heat-conducting end 152. At this time, a magnetic force is generated, but the second metal heat-conducting body is fixed by the second movable structure 43, maintaining a distance from the second insulating heat-conducting end 152. Therefore, the entire side heat-conducting sheet does not dissipate heat. When the control terminal of the third selection chip 56 is connected to a high level, the fourth coil 33 of the winding on the side heat-conducting sheet is powered, and the second metal heat conductor attracts the second insulated heat-conducting end 152, thus generating a magnetic force. Since the coil windings attract each other due to their different directions, the side heat-conducting sheet dissipates heat. This allows the system to determine whether the chip 121 to be cooled is overheated, thus ensuring the intelligence and accuracy of the heat dissipation unit 140. Simultaneously, combining the heat dissipation at two locations for hierarchical control improves the heat dissipation effect on the chip 121, preventing excessive or inadequate heat dissipation and protecting the chip 121.

[0042] In one embodiment, the circuit board heat dissipation device further includes: The power supply 60 has its control terminal connected to the power input of the chip 121 to be cooled and the power input 113 of the circuit board 110, respectively. The input terminal of the power supply 60 is connected to the power supply 300. The first output terminal of the power supply 60 is connected to the first coil 42 of the winding on the first insulated heat-conducting end 151 in the heat dissipation control unit 150. The second output terminal of the power supply 60 is connected to the fourth coil 33 of the winding on the second insulated heat-conducting end 152 in the heat dissipation control unit 150.

[0043] In this embodiment, the circuit board heat dissipation device also includes a power switch 60. The power switch 60 is a control selection chip, which can control one path, two paths, or neither path to be turned on. Because the voltage values ​​of the power input of the chip 121 to be cooled and the power input 113 of the circuit board 110 can be directly collected, an amplifier can be directly connected to the two connection points to amplify the signals for easy control of the power switch 60. When the entire circuit board is not working, the power input of the chip 121 to be cooled outputs a low level, and the power input 113 of the circuit board 110 outputs a low level. The power switch 60 is in standby mode, that is, the input terminal of the power switch 60 is not connected to either the first output terminal or the second output terminal of the power switch 60, thereby reducing the energy consumption of the entire circuit board heat dissipation device. When components 120 on the entire circuit board 110 are working and the heat sink chip 121 is not working, the power input of the heat sink chip 121 outputs a low level, and the power input 113 of the circuit board 110 outputs a high level. The power conductor 60 is in a working state, meaning its input terminal is connected to its first output terminal, thereby achieving heat dissipation for the insulating heat sink 130. When components 120 on the entire circuit board 110 are working and the heat sink chip 121 is working, the power input of the heat sink chip 121 outputs a high level, and the power input 113 of the circuit board 110 outputs a high level. The power conductor 60 is in a working state, meaning its input terminal is connected to both its first and second output terminals, thereby achieving heat dissipation for the insulating heat sink 130 and the chip heat dissipation unit 140. Subsequently, the first selection chip 52 is used again to control the insulating heat sink 130, and the second selection chip 54 and the third selection chip 56 are used to control the heat dissipation of the chip heat dissipation unit 140. This can reduce the energy consumption of the entire circuit board heat dissipation device when heat dissipation is not required, and enable precise control of different heat dissipation units.

[0044] This application also provides a laser device, which includes the above-described circuit board heat dissipation device.

[0045] It is worth noting that, because the laser device includes the aforementioned circuit board heat dissipation device, it can be housed within the sealed device 200. The heat dissipation control unit 150, based on power supply information collected from the power inlet 113 of the circuit board 110, determines whether the power supply is supplying power to the component 120. When power is supplied to the component 120, the control unit 150, which is in contact with the component arrangement surface of the circuit board 110, controls the insulating heat dissipation plate 130 to dissipate heat from the component 120. Furthermore, based on chip operating information collected from the chip 121 to be cooled, the control unit 140, which is in contact with the chip 121 to cool the chip 121, determines whether the chip 121 is operating. When the chip 121 is operating, the control unit 150 controls the chip heat dissipation unit 140 to cool the chip 121. This heat dissipation device achieves heat dissipation, thus avoiding the impact of external enclosure ventilation on the normal operation of the circuit board, which is to prevent the precision components on the circuit board from being easily corroded or damaged by the external environment. This circuit board heat dissipation device can dissipate heat from the components 120 through the insulating heat dissipation plate 130 and the chip heat dissipation unit 140 within the sealed device 200. On the one hand, it can ensure targeted heat dissipation, that is, targeted heat dissipation during operation to ensure heat dissipation effect and prevent heat from being conducted to other non-operating chips 121 to be cooled. On the other hand, it can reduce the direct contact between the precision components on the circuit board and the external environment when dissipating heat, thereby achieving heat dissipation of the circuit board while ensuring the sealing of the circuit board.

[0046] In one embodiment, reference is made to Figure 7 , Figure 7 This is a schematic diagram of a first embodiment of the laser device of this application. The laser device includes, wherein, the laser device can be a laser marking machine: Temperature acquisition device 400 is installed inside the sealing device 200 and is used to acquire the temperature value inside the sealing device 200. The cooler 500 is installed on the inner wall of the sealing device 200; The control chip 600 is connected to the power supply 300, the acquisition terminal of the temperature acquisition device 400, and the control terminal of the cooler 500. The control chip 600 is used to provide power supply 300 to the cooler 500 based on the temperature value so that the cooler 500 can dissipate heat.

[0047] In this embodiment, the laser device includes a temperature acquisition unit 400, which acquires the temperature of the entire sealing device. The control chip 600 obtains the temperature value acquired by the temperature acquisition unit 400, and then controls the cooler 500 to cool the sealing device. Of course, the temperature acquisition unit 400 can directly output high and low levels based on high and low temperatures, and then directly control the power supply to the cooler 500 based on the high and low levels to achieve heat dissipation of the entire sealing device. The cooler 500 is located on the inner wall of the sealing device 200, or it can be located on the top of the sealing device 200. It is not limited here. The cooler 500 can be a small fan, an air conditioner, or a liquid cooling pipe wrapped around the inner wall of the sealing device. It is not limited here.

[0048] It is worth noting that other hardware may also be included in the laser equipment, which will not be described in detail here. The heat dissipation device for the entire circuit board can be set on the laser equipment or on other products, which is not limited here.

[0049] The device provided in this application can solve the technical problem of high cost of circuit board heat dissipation devices. Compared with the prior art, the beneficial effects of the laser device provided in this application are the same as those of the circuit board heat dissipation device provided in the above embodiments, and will not be repeated here.

[0050] The above-described laser devices are only some embodiments of this application and do not limit the scope of this patent application. All equivalent structural transformations made based on the technical concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of this application.

Claims

1. A circuit board heat dissipation device, characterized in that, The circuit board heat dissipation device is disposed within the sealing device, and the circuit board heat dissipation device includes: An insulating heat sink is attached to the component arrangement surface of the circuit board, wherein the components on the circuit board are arranged on the insulating heat sink and connected to the circuit arrangement surface of the circuit board, wherein the component arrangement surface is the plastic surface of the circuit board and the circuit arrangement surface is the copper wire surface of the circuit board. A chip heat dissipation unit is attached to each chip to be cooled on the circuit board. A heat dissipation control unit is provided, wherein a first end of the heat dissipation control unit is connected to the power input of the chip to be cooled and the circuit board, a second end of the heat dissipation control unit is connected to the first end of the insulating heat sink and the first end of the chip heat dissipation unit, and a third end of the heat dissipation control unit is connected to the heat dissipation position on the sealing device. The heat dissipation control unit is used to control the insulating heat sink to dissipate heat from the components and to control the chip heat dissipation unit to dissipate heat from the chip to be cooled.

2. The circuit board heat dissipation device as described in claim 1, characterized in that, The second end of the heat dissipation control unit includes a first power supply terminal, and the insulating heat sink includes: A thermoelectric cooler is provided, wherein the cooling end of the thermoelectric cooler is attached to the device arrangement surface of the circuit board, the power supply end of the thermoelectric cooler is connected to the first power supply end, the heat dissipation end of the thermoelectric cooler is connected to the heat dissipation position on the sealing device, and a plurality of first insulating through holes are provided on the thermoelectric cooler, wherein each pin of the component passes through the first insulating through hole and is connected to the circuit arrangement surface of the circuit board.

3. The circuit board heat dissipation device as described in claim 1, characterized in that, The second end of the heat dissipation control unit includes a first insulated heat-conducting end of a first winding coil, wherein the first winding coil is a counterclockwise winding and is connected to a power supply; the insulating heat sink includes: A metal heat-conducting sheet is provided, wherein the first heat-conducting surface of the metal heat-conducting sheet is in contact with the device arrangement surface of the circuit board, and a plurality of second insulating through holes are provided on the metal heat-conducting sheet, wherein each pin of the component passes through the second insulating through hole and is connected to the circuit arrangement surface of the circuit board, and a second coil is wound in a clockwise direction on the second heat-conducting surface of the metal heat-conducting sheet, and when the second coil is connected to the power supply, the second heat-conducting surface of the metal heat-conducting sheet is connected to the first insulating heat-conducting end.

4. The circuit board heat dissipation device as described in claim 1, characterized in that, The second end of the heat dissipation control unit includes a second power supply terminal and a second insulated heat-conducting terminal of a third coil winding, wherein the third coil is a counterclockwise winding and is connected to the power supply. The chip heat dissipation unit includes: A top surface cooling chip, wherein the cooling end of the top surface cooling chip is attached to the top surface of the chip to be cooled, the heat dissipation end of the top surface cooling chip is connected to the heat dissipation position on the sealing device, and the power supply end of the top surface cooling chip is connected to the second power supply end. A side heat-conducting sheet is provided, wherein the first heat-conducting surface of the side heat-conducting sheet is attached to the side of the chip to be cooled, and a fourth coil is wound clockwise on the second heat-conducting surface of the side heat-conducting sheet. When the fourth coil is connected to the power supply, the second heat-conducting surface of the side heat-conducting sheet is connected to the second insulated heat-conducting end.

5. The circuit board heat dissipation device as described in claim 1, characterized in that, The heat dissipation control unit includes a component heat dissipation control subunit, which includes: The first voltage amplifier chip has its input terminal connected to the power input of the circuit board. A first selection chip has its control terminal connected to the output terminal of the first voltage amplifier chip, its input terminal connected to the power supply, its second output terminal left floating, and its first output terminal connected to the first end of the insulating heat sink. When the insulating heat sink is a thermoelectric cooler, the first end of the insulating heat sink is the power supply terminal of the thermoelectric cooler. When the insulating heat sink is a metal heat-conducting sheet, the first end of the insulating heat sink is the second coil wound on the second heat-conducting surface of the metal heat-conducting sheet.

6. The circuit board heat dissipation device as described in claim 1, characterized in that, The heat dissipation control unit includes a chip heat dissipation control subunit, which includes: The second voltage amplifier chip has its input terminal connected to the power input of the chip to be cooled. The second selection chip has its control terminal connected to the output terminal of the second voltage amplifier chip, its input terminal connected to the power supply, its second output terminal left floating, and its first output terminal connected to the first end of the chip heat dissipation unit, wherein the first end of the chip heat dissipation unit is the power supply terminal of the top surface cooling chip in the chip heat dissipation unit.

7. The circuit board heat dissipation device as described in claim 6, characterized in that, The chip heat dissipation control subunit also includes: A temperature chip is disposed on the chip to be cooled, wherein the temperature chip is configured to output a high level when the temperature is greater than a preset value, and output a low level when the temperature is less than or equal to the preset value; The third selection chip has its control terminal connected to the output terminal of the temperature chip, its input terminal connected to the power supply, its second output terminal floating, and its first output terminal connected to the first end of the chip heat dissipation unit. The first end of the chip heat dissipation unit is the fourth coil of the winding on the side heat-conducting plate of the chip heat dissipation unit.

8. The circuit board heat dissipation device according to any one of claims 1 to 7, characterized in that, The circuit board heat dissipation device also includes: A power supply is provided, wherein the control terminal of the power supply is connected to the power input of the chip to be cooled and the power input of the circuit board, the input terminal of the power supply is connected to the power supply, the first output terminal of the power supply is connected to the first coil of the winding on the first insulated heat-conducting end in the heat dissipation control unit, and the second output terminal of the power supply is connected to the fourth coil of the winding on the second insulated heat-conducting end in the heat dissipation control unit.

9. A laser device, characterized in that, The laser device includes a circuit board heat dissipation device and a sealing device as described in any one of claims 1 to 8, wherein the sealing device is used to seal the circuit board heat dissipation device, and the heat dissipation position on the sealing device includes at least one of the cooling position of the laser device, the heat dissipation position of the laser device, and the ventilation port of the laser device.

10. The laser device as described in claim 9, characterized in that, The laser device also includes: A temperature acquisition device is disposed inside the sealing device and is used to acquire the temperature value inside the sealing device. A cooler, wherein the cooler is disposed on the inner wall of the sealing device; The control chip is connected to a power supply, a temperature sensor's acquisition terminal, and a cooler's control terminal. The control chip is used to provide the power supply to the cooler based on the temperature value, so that the cooler can dissipate heat.

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