A sensor-activated cooking appliance

Abstract

This utility model relates to the field of induction cooking appliance technology and discloses an induction cooking appliance, including an induction cooktop panel, a shell, and a coil module installed inside the shell. An infrared temperature measuring module is detachably installed in the middle part of the coil module. The coil module includes a coil base, a magnetic conductor, and a coil plate, wherein the coil plate is installed above the coil base. This utility model hides or partially hides the entire infrared temperature measuring module inside the coil module, requiring little or no additional space to install the infrared temperature measuring module, reducing the longitudinal (Y-axis) space occupied by the infrared temperature measuring module. This is beneficial for the application of the infrared temperature measuring module in existing appliances and also for the ultra-thin design of the appliance. At the same time, the infrared temperature measuring module being inside the coil module also reduces the distance between the detector and the target object, reducing the path of interfering light entering the detector and receiving a stronger infrared radiation signal from the cookware.

Description

Technical Field

[0001] This utility model relates to the field of sensor cooking appliances, specifically a sensor cooking appliance. Background Technology

[0002] Currently, the infrared temperature measurement module for induction cooking appliances is generally placed below the lower surface of the coil module. This results in the infrared temperature measurement module occupying vertical space of the entire appliance.

[0003] In current stacked models (where the coil disk is mounted on the circuit board), there are usually high-voltage components under the coil disk module, making it difficult to find space to install the infrared temperature measurement module.

[0004] For the currently popular ultra-thin models, the space under the coil module is the entire casing, which is also very limited.

[0005] Furthermore, if the infrared temperature measurement module is placed in the center of the coil disk module and is on the same plane or partially on the same plane as the coil disk module, the magnetic flux in the center of the coil disk will be large due to the magnetic field of the coil disk, which will cause the shielding shell to overheat severely. Utility Model Content

[0006] To address the aforementioned problems in the existing technology, this utility model provides an induction cooking appliance that has the advantage of shielding the magnetic field at the center of the coil.

[0007] To achieve the above objectives, this utility model provides the following technical solution: including an induction cooker panel, a shell, and a coil module installed inside the shell, wherein an infrared temperature measuring module is detachably installed in the middle part of the coil module;

[0008] The coil disk module includes a coil base, a magnetic conductor, and a coil disk, wherein the coil disk is installed above the coil base, the magnetic conductor is installed on the coil base, and at least two magnetic conductors are provided, which are snapped or glued to the coil base.

[0009] Preferably, the inner side of the magnetic conductor extends upward, and the extended portion is a magnetic block. Multiple magnetic blocks are arranged in a ring-like manner, and the infrared temperature measurement module is installed in the middle of all the magnetic blocks.

[0010] Preferably, an independent annular magnetic block is provided on the inner side of the magnetic conductor body.

[0011] Preferably, the infrared temperature measurement module is installed inside the magnetic conductor, and is wholly or partially located within the coil module.

[0012] Preferably, the infrared temperature measurement module is installed inside the coil module or the housing by a second screw.

[0013] Preferably, the infrared temperature measurement module includes an infrared detector, a signal processing circuit board, and a temperature measurement module housing, wherein the infrared detector is mounted on the signal processing circuit board, the temperature measurement module housing is mounted on the signal processing circuit board by a first screw, and the second screw is used to install the entire infrared temperature measurement module inside the coil module by mounting the temperature measurement module housing or the signal processing circuit board.

[0014] Preferably, the induction cooker panel is fixedly installed together with the outer shell, the coil module is located below the induction cooker panel, and the induction cooker panel is also equipped with a control system and a fan.

[0015] Preferably, a pot is placed on the induction cooker panel, and the pot is located above the coil module.

[0016] Compared with the prior art, the present invention provides a sensor-activated cooking appliance with the following advantages:

[0017] 1. This induction cooking appliance hides or partially conceals the entire infrared temperature measurement module within the coil module, requiring little or no additional space for its installation. This reduces the longitudinal (Y-axis) space occupied by the infrared temperature measurement module, facilitating its application in existing appliances and promoting ultra-thin design. Furthermore, the placement of the infrared temperature measurement module within the coil module reduces the distance between the detector and the target object, minimizing the path of interfering light into the detector and resulting in a stronger infrared radiation signal received from the cookware.

[0018] 2. This induction cooking appliance, through the setting of the magnetic guide block, can greatly reduce the magnetic induction lines in the middle of the coil module, thus reducing the magnetic field at the center of the coil module. Therefore, it can reduce the heat generated by the magnetic field eddy currents on the outer shell of the infrared temperature measuring module, which affects the normal operation of the infrared temperature measuring module, similar to the function of a magnetic field shielding ring.

[0019] 3. This induction cooking appliance has an infrared temperature measurement module located at the center of the coil module, making it difficult for ambient light to shine onto the detector from the side, thereby reducing the interference of ambient light on the infrared temperature measurement module. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the coil disk module and infrared temperature measurement module of this utility model;

[0022] Figure 3 This is a schematic diagram of the coil disk module and infrared temperature measurement module of this utility model;

[0023] Figure 4 This is a schematic diagram of the half-section structure of this utility model;

[0024] Figure 5 This utility model Figure 4 Enlarged structural diagram at point A;

[0025] Figure 6 This is a schematic diagram of the exploded structure of the coil disk module of this utility model;

[0026] Figure 7 This is a schematic diagram of the second embodiment of the magnetic conductor of this utility model;

[0027] Figure 8 This is a schematic diagram of the infrared temperature measurement module structure of this utility model;

[0028] Figure 9 This is a schematic diagram of the exploded structure of the infrared temperature measurement module of this utility model.

[0029] In the diagram: 10, induction cooker panel; 20, outer casing; 30, infrared temperature measurement module; 301, infrared detector; 302, signal processing circuit board; 303, temperature measurement module casing; 304, first screw; 31, second screw; 40, control system; 50, coil module; 501, coil base; 502, magnetic conductor; 5021, magnetic block; 503, coil; 60, fan; 70, cookware. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1:

[0031] like Figure 1-9As shown, the device includes an induction cooktop panel 10, a housing 20, and a coil module 50 installed inside the housing 20. The induction cooktop panel 10 and the housing 20 are fixedly installed together. The coil module 50 is located below the induction cooktop panel 10. The control system 40 and the fan 60 are also installed inside the induction cooktop panel 10. A pot 70 is placed on the induction cooktop panel 10, and the pot 70 is located above the coil module 50. An infrared temperature measuring module 30 is detachably installed in the middle part of the coil module 50. The infrared temperature measuring module 30 is installed by a second screw 31. Within the coil module 50, the infrared temperature measurement module 30 includes an infrared detector 301, a signal processing circuit board 302, and a temperature measurement module housing 303. The infrared detector 301 is mounted on the signal processing circuit board 302. The temperature measurement module housing 303 is mounted on the signal processing circuit board 302 by a first screw 304. A second screw 31 secures the entire infrared temperature measurement module 30 within the coil module 50 by mounting the temperature measurement module housing 303 or the signal processing circuit board 302. The infrared temperature measurement module 30 is located within the coil module 50. At the center, it can be used to detect infrared rays from the bottom of the cookware. Even if the cookware is partially offset, it is still above the infrared temperature measuring module 30. At this time, the infrared temperature measuring module 30 can also detect the infrared rays from the bottom of the cookware. The infrared detector 301 is used to receive the infrared rays emitted by the cookware above the cooking heating area of ​​the glass panel of the induction cooker, and then generate and output an electrical signal. Moreover, the photosensitive material of the infrared detector 301 is indium gallium arsenide, which, compared with the traditional pyroelectric infrared detector, has the characteristics of being able to measure temperature through glass and having strong resistance to water, water vapor, soft tissue and other objects. The signal processing circuit board 302 is used to amplify and process the weak electrical signal output by the infrared detector 301, convert it into an analog signal that can be recognized by the microcontroller, or directly convert it into a digital temperature signal. The processed signal is transmitted to the induction cooking appliance control system through wires, and the current temperature can be displayed on the display. Moreover, the housing 303 of the temperature measuring module can be made of a metal material with low magnetic permeability, such as aluminum, aluminum alloy, copper, copper alloy, etc., which can be used to shield the signal interference caused by the alternating magnetic field generated by the coil module 50 during the operation of the cooking appliance.

[0032] The infrared temperature measurement module 30 is installed inside the magnetic conductor 502, and is wholly or partially located within the coil disk module 50. The infrared temperature measurement module 30 is installed at the center of the coil disk module 50, and the horizontal axes of the two overlap or partially overlap. That is, the infrared temperature measurement module 30 is at least partially located within the coil disk module 50, so that the infrared temperature measurement module 30 is hidden or partially located within the coil disk module 50. No additional space is needed or only a small amount of additional space is required to install the infrared temperature measurement module 30, which reduces the longitudinal (Y-axis) space occupied by the infrared temperature measurement module 30. This is beneficial for the application of the infrared temperature measurement module 30 in existing complete machines and also for the ultra-thin design of the complete machine. At the same time, the fact that the infrared temperature measurement module 30 is located inside the coil disk module 50 also reduces the distance between the detector and the target object. On the one hand, it reduces the path of interfering light entering the detector, and on the other hand, it receives a stronger infrared radiation signal from the cookware.

[0033] In addition, the infrared temperature measurement module 30 can also be installed on the housing 20; for stacked models, the infrared temperature measurement module 30 can also be installed on the control system 40.

[0034] The coil disk module 50 includes a coil base 501, a magnetic conductor 502, and a coil disk 503. The coil disk 503 is snapped or bonded to the top of the coil base 501. The magnetic conductors 502 are mounted on the coil base 501. At least two magnetic conductors 502 are provided, preferably six to ten, which are evenly distributed circumferentially and snapped or bonded to the coil base 501. The inner side of the magnetic conductors 502 extends upward, and the extended part is a magnetic block 5021. Multiple magnetic blocks 5021 are arranged in a ring-like manner. The infrared temperature measuring module 30 is mounted on the magnetic blocks 502. In the middle, the material of the magnetic guide block 5021 is composed of a high magnetic permeability material, and its magnetic resistance is much lower than that of air and the infrared temperature measuring module 30. At this time, the magnetic induction lines generated by the electromagnetic coil will preferentially pass through the high magnetic permeability magnetic guide block 5021 and be guided to the pot. Therefore, the magnetic induction lines of the low magnetic permeability infrared temperature measuring module 30 will be greatly reduced. Thus, the magnetic field at the center of the coil module 50 can be reduced, which can reduce the heat generated by the magnetic field eddy currents on the outer shell of the infrared temperature measuring module 30, thus affecting the normal operation of the infrared temperature measuring module 30, similar to the function of a magnetic field shielding ring.

[0035] Furthermore, the infrared temperature measurement module 30 is located at the center of the coil module 50, making it difficult for ambient light to shine onto the detector from the side, thereby reducing the interference of ambient light on the infrared temperature measurement module. Example 2:

[0036] like Figure 7As shown, based on Embodiment 1, an independent annular magnetic block 5021 is provided on the inner side of the magnetic conductor 502. It is snapped or adhered to the coil module 50. The annular magnetic block 5021 forms a complete closed loop inside, which has a stronger magnetic conduction effect and can better guide the magnetic field generated by the coil along the magnetic conductor to the cookware, thereby further reducing the magnetic field inside the magnetic block 5021.

[0037] In summary, this infrared temperature measurement module, coil assembly, and induction cooking appliance, by concealing or partially concealing the entire infrared temperature measurement module 30 within the coil module 50, require little or no additional space for its installation. This reduces the longitudinal (Y-axis) space occupied by the infrared temperature measurement module 30, facilitating its application in existing appliances and promoting ultra-thin design. Furthermore, the location of the infrared temperature measurement module 30 within the coil module 50 reduces the distance between the detector and the target object, minimizing the path of interfering light entering the detector. The infrared radiation signal received from the cookware is stronger. By setting the magnetic block 5021, the magnetic induction lines in the middle of the coil module 50 can be greatly reduced, thus reducing the magnetic field at the center of the coil module 50. This reduces the heat generated by the magnetic field eddy currents on the outer shell of the infrared temperature measuring module 30, which affects the normal operation of the infrared temperature measuring module 30, similar to the function of a magnetic shielding ring. Moreover, since the infrared temperature measuring module 30 is located at the center of the coil module 50, it is difficult for ambient light to shine on the detector from the side, thereby reducing the interference of ambient light on the infrared temperature measuring module.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An induction cooking appliance comprising an electromagnetic cooktop panel (10), a housing (20) and a coil disc module (50) mounted within the housing (20), characterized in that: An infrared temperature measurement module (30) can be detachably installed in the middle part of the coil module (50). The coil disk module (50) includes a coil base (501), a magnetic conductor (502), and a coil disk (503), wherein the coil disk (503) is mounted above the coil base (501), the magnetic conductor (502) is mounted on the coil base (501), and at least two magnetic conductors (502) are provided, which are snapped or glued to the coil base (501).

2. An induction cooking appliance according to claim 1, characterized in that: The magnetic conductor (502) extends upward on its inner side, and its extended part is a magnetic block (5021). Multiple magnetic blocks (5021) are arranged in a ring-like manner, and the infrared temperature measurement module (30) is installed in the middle of the magnetic block (5021).

3. The induction cooking appliance of claim 1, wherein: An independent annular magnetic block (5021) is provided on the inner side of the magnetic conductor (502).

4. The induction cooking appliance of claim 1, wherein: The infrared temperature measurement module (30) is installed inside the magnetic conductor (502), and is located entirely or partially inside the coil disk module (50).

5. The induction cooking appliance of claim 1, wherein: The infrared temperature measurement module (30) is installed inside the coil module (50) or the outer casing (20) by a second screw (31).

6. An induction cooking appliance according to claim 5, characterized in that: The infrared temperature measurement module (30) includes an infrared detector (301), a signal processing circuit board (302), and a temperature measurement module housing (303). The infrared detector (301) is mounted on the signal processing circuit board (302), and the temperature measurement module housing (303) is mounted on the signal processing circuit board (302) by a first screw (304). The second screw (31) is used to install the entire infrared temperature measurement module (30) inside the coil module (50) by mounting the temperature measurement module housing (303) or the signal processing circuit board (302).

7. The induction cooking appliance of claim 1, wherein: The induction cooker panel (10) is fixedly installed together with the outer shell (20). The coil module (50) is located below the induction cooker panel (10). The control system (40) and the fan (60) are also provided inside the induction cooker panel (10).

8. The induction cooking appliance of claim 1, wherein: A pot (70) is placed on the induction cooker panel (10), and the pot (70) is located above the coil module (50).

Images