A back clamping type external heat dissipation device for automatically monitoring a DTU
By using a back-clamp external heat dissipation device, combined with a cooling chip and a cooling fan assembly, the problem of low heat dissipation efficiency of DTUs in high-temperature environments is solved, achieving efficient heat dissipation and convenient maintenance, and is suitable for various DTU models.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG HEAVY IND CONSTR DESIGN INST
- Filing Date
- 2025-09-15
- Publication Date
- 2026-08-04
AI Technical Summary
Existing automated monitoring DTUs have low heat dissipation efficiency in high-temperature and high-heat environments, and their internal heat dissipation structures occupy space, have complex designs, and are cumbersome to maintain.
It adopts a back clip-type external heat dissipation device, which combines a cooling fin and a cooling fan assembly. It is fixed to the DTU equipment by a flexible back clip assembly, and is equipped with a backup battery and an intelligent temperature control module to achieve active heat dissipation. It can be quickly installed and removed.
It significantly reduces the internal temperature of the DTU in high-temperature environments, improves heat dissipation efficiency, adapts to different DTU specifications, simplifies maintenance operations, reduces energy consumption, and ensures stable equipment operation.
Smart Images
Figure CN224596847U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of DTU monitoring equipment technology, and in particular to a back-clamp type external heat dissipation device for automatic monitoring of DTU. Background Technology
[0002] During tunnel construction and foundation pit excavation, it is often necessary to monitor data such as settlement, slippage, and water level and volume to ensure the safety of the project. Due to data transmission requirements, projects such as automated tunnel monitoring and automated foundation pit monitoring sometimes require the Data Transfer Unit (DTU) to be placed in environments with direct sunlight or other high-temperature environments. During long-term operation on-site, the internal electronic components of the DTU (such as the CPU and power module) are prone to performance degradation or malfunction due to high temperatures, thus requiring appropriate heat dissipation equipment. Existing automated monitoring DTUs mostly use passive cooling methods, such as directly installing heat sinks on the equipment and relying on heat conduction for heat dissipation. This method has the following drawbacks: the heat dissipation efficiency of passive heat sinks drops sharply at high ambient temperatures (>40℃), resulting in poor heat dissipation. Conversely, using a built-in heat dissipation structure within the DTU has the following drawbacks: it occupies internal space, increasing design complexity; it limits the configuration of high-power fans due to space constraints; and after long-term operation, the fans accumulate significant dust, requiring disassembly for maintenance, which is cumbersome. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a back-clamp type external heat dissipation device for automatic monitoring of DTUs that has good heat dissipation, is easy to install and disassemble, and does not change the original structure of the DTU equipment.
[0004] This utility model is achieved through the following technical solution: An external cooling device with a back clip for automatic monitoring of a DTU includes a flexible back clip assembly, a cooling plate, and a cooling fan assembly. The flexible back clip assembly includes a flexible clamping plate and a heat dissipation mounting plate. Two flexible clamping plates are respectively positioned opposite each other on both sides of the heat dissipation mounting plate by springs. The distance and clamping force between the two flexible clamping plates are adjusted by the springs to clamp the DTU device. The flexible back clip assembly is connected and fixed to the DTU device through the flexible clamping plates. A heat transfer window is provided on the heat transfer window, and the cooling plate is installed on the heat transfer window. When the flexible back clip assembly is fixed to the DTU device, the cooling surface of the cooling plate is in close contact with the outer surface of the DTU device. The cooling fan assembly includes a heat dissipation plate, a cooling fan, and a heat dissipation shroud. The heat dissipation plate is made of a metal material with good thermal conductivity, and its bottom surface is in contact with the heating surface of the cooling plate. The heat dissipation shroud covers the heat dissipation plate, and the cooling fan is installed inside the heat dissipation shroud with its airflow surface facing the heat dissipation plate for cooling the heat dissipation plate. The power cords of the cooling plate and the cooling fan are respectively connected to the power module of the DTU device for power supply.
[0005] Furthermore, it also includes a backup battery, with the power cords of the cooling chip and the cooling fan connected to the backup battery respectively, so that the cooling chip and cooling fan assembly can draw power from the backup battery when they cannot be connected to the power module of the DTU equipment.
[0006] Furthermore, a plurality of heat-conducting pillars are provided around the top surface of the heat sink, and the plurality of heat-conducting pillars surround the cooling fan.
[0007] Furthermore, the heat sink is also provided with several heat sink pins protruding from its top surface to increase the heat dissipation area and improve the heat dissipation effect.
[0008] Furthermore, the cooling element is provided in several pieces, and the heat dissipation mounting plate is provided with several heat transfer windows. The cooling elements are respectively installed on the heat transfer windows, and the bottom surface of the heat dissipation plate is in contact with the heating surface of the cooling elements.
[0009] Furthermore, the heat sink is a hollow frame structure with raised edges around the bottom of the frame. A cushioning pad is located at the bottom of each raised edge. When the heat sink is placed over the heat sink plate, its bottom is fixed to the heat sink mounting plate via the cushioning pad on the raised edge, reducing the impact of the cooling fan operation on the DTU equipment. It can be fixed by adhesive, double-sided tape, or screws. Foam tape is preferred as it further improves shock absorption and cushioning, and is easy to disassemble and maintain.
[0010] Furthermore, the bottom surface of the heat sink is attached to the heating surface of the cooling chip with thermally conductive silicone grease, and the heat sink mounting plate is made of a metal material with good thermal conductivity to facilitate heat dissipation.
[0011] Furthermore, it also includes an intelligent control module, which includes a temperature sensor and a temperature controller. The temperature controller is mounted on a heat dissipation mounting plate, and the temperature sensor is located inside the DTU device or in the monitoring environment. The temperature sensor is electrically connected to the temperature controller, and the temperature controller is connected to the power module or backup battery of the DTU device to draw power. The temperature controller is also electrically connected to the cooling chip and the cooling fan assembly to control the switching of the cooling chip and the cooling fan assembly.
[0012] Furthermore, thermally conductive silicone grease is filled between the cooling surface of the cooling chip and the outer surface of the DTU device.
[0013] Furthermore, mounting holes are provided on both sides of the heat dissipation mounting plate, and a telescopic rod is installed in the mounting hole by a spring. The telescopic rod is also connected to the elastic clamping plate, thereby realizing the elastic connection between the elastic clamping plate and the heat dissipation mounting plate, so as to adjust the distance and clamping force between the two elastic clamping plates to clamp the DTU device.
[0014] This invention utilizes a cooling coil and a cooling fan assembly external to the DTU device for active cooling. Compared to a fan-only cooling method, this approach offers superior heat dissipation and greater adaptability to high-temperature environments. At an ambient temperature of 40℃, it significantly reduces the internal temperature of the DTU, effectively addressing performance degradation or malfunctions caused by excessively high ambient temperatures, prolonged use, and insufficient heat dissipation capacity in various automated monitoring projects. The entire cooling system is secured to the DTU device using a flexible back clamp assembly. This elastic back clamp assembly features a telescopic structure, adaptable to different DTU specifications, with adaptive clamping force, compatible with over 90% of standard DTU models, and allows for quick installation and removal. The positive and negative terminals can be directly connected to the DTU interface. The heat sink is attached to the cooling chip, and the heat sink is equipped with heat-conducting pillars and heat dissipation fins. Combined with the cooling fan on the heat sink shroud of the frame structure, it can achieve rapid and efficient cooling. The damping pad is set between the heat sink shroud and the heat sink mounting plate to ensure that the vibration of the heat dissipation device will not affect the normal operation of the DTU. It is also equipped with a backup power supply to ensure normal use in special circumstances. A high-power fan can be configured as needed. It is not limited by the internal space of the DTU and can be applied to various types of DTUs, including DTUs that are inconvenient to connect directly to relays. The intelligent temperature control unit ensures that the cooling chip and fan are activated only when the DTU temperature reaches the set threshold, which can save unnecessary energy consumption. Attached Figure Description
[0015] Figure 1 This is an exploded view of the structure of an embodiment of the present utility model.
[0016] Figure 2 This is a structural schematic diagram of an embodiment of the present utility model.
[0017] Figure 3 for Figure 2 A magnified schematic diagram of the structure at point A in the middle.
[0018] Figure 4 This is an exploded view of another embodiment of the present invention.
[0019] Figure 5 This is a structural diagram of the intelligent control module in an embodiment of the present invention.
[0020] Reference numerals: 1-Elastic back clip assembly; 2-Cooling chip; 3-Cooling fan assembly; 4-Temperature controller; 5-Spare battery; 6-DTU equipment; 11-Cooling mounting plate; 12-Elastic clamping plate; 13-Telescopic rod; 14-Mounting hole; 15-Spring; 16-Heat transfer window; 31-Cooling plate; 32-Heat conduction column; 33-Cooling pin; 34-Cooling cover; 341-Raised edge; 35-Cooling fan; 36-Buffer pad. Detailed Implementation
[0021] A back-clip type external heat dissipation device for automatic monitoring of DTU, such as Figure 1 , Figure 2 As shown, the device includes a flexible back clamp assembly 1, a cooling plate 2, and a cooling fan assembly 35. The flexible back clamp assembly 1 includes a flexible clamping plate 12 and a heat dissipation mounting plate 11. The two flexible clamping plates 12 are respectively positioned opposite each other on both sides of the heat dissipation mounting plate 11 by springs 15. The distance and clamping force between the two flexible clamping plates 12 are adjusted by the springs 15 to clamp the DTU device 6. The flexible back clamp assembly 1 is connected and fixed to the DTU device 6 through the flexible clamping plates 12. The heat dissipation mounting plate 11 has a heat transfer window 16, and the cooling plate 2 is installed on the heat transfer window 16. It can be fixed by adhesive. When the back clip assembly 1 is fixed on the DTU device, the cooling surface of the cooling chip 2 is in close contact with the outer surface of the DTU device 6. The cooling fan assembly 35 includes a heat sink 31, a cooling fan 35, and a heat sink cover 34. The heat sink 31 is made of a metal material with good thermal conductivity, such as aluminum or aluminum alloy, and its bottom surface is in contact with the heating surface of the cooling chip 2. The heat sink cover 34 covers the heat sink 31, and the cooling fan 35 is installed inside the heat sink cover 34 with its airflow surface facing the heat sink 31 to dissipate heat and cool the heat sink 31. The power cords of the cooling chip 2 and the cooling fan 35 are respectively connected to the power module of the DTU device 6 to draw power.
[0022] To achieve optimal heat dissipation, the heat dissipation device is best installed on the DTU device 6 with the cooler 2 directly facing the CPU and power supply inside the DTU. The bottom surface of the heat sink 31 is bonded to the heating surface of the cooler 2 with thermally conductive silicone grease to prevent air residue and improve thermal conductivity. Both the heat sink 31 and the heat dissipation mounting plate 11 are made of metal with good thermal conductivity to facilitate heat dissipation. The cooling fan 35 can be a 40mm diameter fan.
[0023] To improve the applicability of the device, this embodiment also includes a backup battery 5. The power cords of the cooling chip 2 and the cooling fan 35 are simultaneously connected to the backup battery 5, so that when the power module of the DTU device 6 cannot be connected, the cooling chip 2 and the cooling fan 35 assembly can draw power from the backup battery 5. The backup battery 5 can be placed in a backup battery box, from which the power connection cord extends.
[0024] In one embodiment, the heat sink 34 is a hollow frame structure, which can be made of aluminum alloy. The bottom of the frame of the heat sink 34 has raised edges 341 around its perimeter, and a buffer pad 36 is provided at the bottom of the raised edges 341. When the heat sink 34 covers the heat sink plate 31, its bottom is fixed to the heat sink mounting plate 11 by the buffer pad 36 on the raised edges 341, reducing the impact of the cooling fan 35 on the DTU device 6. The buffer pad 36 can be fixed by adhesive, double-sided tape, or screws. Foam tape is preferred as it further improves shock absorption and is easy to disassemble and maintain.
[0025] To further improve heat dissipation, several heat-conducting pillars 32 are arranged around the top surface of the heat sink 31, and these pillars surround the cooling fan 35. Several heat dissipation pins 33 protruding from the top surface of the heat sink 31 are also provided to increase the heat dissipation area and improve the heat dissipation effect. The heat dissipation pins 33 can be welded, and their shape and size can be customized according to actual design, such as herringbone, cross, or triangular prism shapes. Their height does not affect the operation of the cooling fan 35. Thermal grease can also be filled between the cooling surface of the cooling chip 2 and the outer surface of the DTU device 6. The thermal grease is easy to remove and does not affect the disassembly of the heat dissipation device.
[0026] As another implementation method, such as Figure 4 The cooling chip 2 is provided in several pieces. In this embodiment, two pieces are provided. The heat dissipation mounting plate 11 also has two heat transfer windows 16. The two cooling chips 2 are respectively installed on the two heat transfer windows 16. The bottom surface of the heat dissipation plate 31 is in contact with the heating surface of the two cooling chips 2.
[0027] As one implementation method, such as Figure 3The elastic clamping plate 12 and the heat dissipation mounting plate 11 can be connected by a spring 15 telescopic connection structure. Specifically, the heat dissipation mounting plate 11 has mounting holes 14 on both sides. A telescopic rod 13 is installed in the mounting holes 14 through the spring 15. The telescopic rod 13 is also connected to the elastic clamping plate 12, thereby realizing the elastic connection between the elastic clamping plate 12 and the heat dissipation mounting plate 11, so as to adjust the distance and clamping force between the two elastic clamping plates 12 to clamp the DTU device 6.
[0028] This embodiment also includes an intelligent control module, such as... Figure 5 The intelligent control module includes a temperature sensor and a temperature controller 4. The temperature controller 4 is mounted on the heat dissipation mounting plate 11. The temperature sensor is located inside the DTU device 6 or in the monitoring environment. The temperature sensor can be an NTC temperature sensor. The temperature sensor is electrically connected to the temperature controller 4. The temperature controller 4 is connected to the power module or backup battery 5 of the DTU device 6 to draw power. The temperature controller 4 is also electrically connected to the cooling chip 2 and the cooling fan 35 assembly 3 to control the switching of the cooling chip 2 and the cooling fan 35 assembly 3. The cooling chip 2 and the cooling fan 35 assembly 3 are turned on only when the temperature reaches the set value.
[0029] This utility model's heat dissipation device adopts a split, quick-connect structure, allowing for rapid installation and removal from the DTU device 6. The positive and negative terminals extending from the bottom of the device can be easily and directly connected to the DTU's power module without interface limitations. It also includes a spare battery box 5, ensuring direct connection even when a direct connection to the power module is not possible. This design, while maintaining the integrity of the original DTU structure, activates when the device's continuous operating temperature reaches above 30°C, significantly increasing heat dissipation efficiency, and keeping operating noise below 28dB(A), significantly improving the stability and ease of maintenance of equipment in industrial settings.
[0030] The above detailed description is a specific description of a feasible embodiment of the present utility model. This embodiment is not intended to limit the patent scope of the present utility model. All equivalent implementations or modifications that do not depart from the present utility model should be included in the patent scope of this case.
Claims
1. A back-clamp type external heat dissipation device for automatic monitoring of DTU, characterized in that, The device includes a flexible back clamp assembly, a cooling plate, and a cooling fan assembly. The flexible back clamp assembly comprises a flexible clamping plate and a heat dissipation mounting plate. Two flexible clamping plates are respectively positioned opposite each other on both sides of the heat dissipation mounting plate by springs. The distance and clamping force between the two flexible clamping plates are adjusted by the springs to clamp the DTU device. The flexible back clamp assembly is connected and fixed to the DTU device through the flexible clamping plates. The heat dissipation mounting plate has a heat transfer window, and the cooling plate is installed on the heat transfer window. When the flexible back clamp assembly is fixed to the DTU device, the cooling surface of the cooling plate is in close contact with the outer surface of the DTU device. The cooling fan assembly comprises a heat sink, a cooling fan, and a heat sink cover. The heat sink is made of metal, and its bottom surface is in contact with the heating surface of the cooling plate. The heat sink cover is placed over the heat sink, and the cooling fan is installed inside the heat sink cover with its airflow surface facing the heat sink to dissipate heat and cool the heat sink. The power cords of the cooling plate and the cooling fan are respectively connected to the power module of the DTU device to obtain power.
2. The back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, It also includes a backup battery, and the power cords of the cooling chip and the cooling fan are connected to the backup battery respectively, so that when the power module of the DTU equipment cannot be connected, the cooling chip and the cooling fan assembly can draw power from the backup battery.
3. The back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, A plurality of heat-conducting pillars are provided around the top surface of the heat sink, and the plurality of heat-conducting pillars surround the cooling fan.
4. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, The heat sink is also provided with several heat sink pins protruding from its top surface to increase the heat dissipation area and improve the heat dissipation effect.
5. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, The cooling element is provided in several pieces, and the heat dissipation mounting plate is provided with several heat transfer windows. The cooling element is installed on the heat transfer windows respectively, and the bottom surface of the heat dissipation plate is in contact with the heating surface of the cooling element.
6. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, The heat sink is a hollow frame structure. The bottom of the frame of the heat sink has raised edges around the perimeter, and the bottom of the raised edges has a buffer pad. When the heat sink is placed over the heat sink plate, its bottom is fixed to the heat sink mounting plate by the buffer pad on the raised edges.
7. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, The bottom surface of the heat sink is attached to the heating surface of the cooling chip with thermally conductive silicone grease, and the heat sink mounting plate is made of metal.
8. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, It also includes an intelligent control module, which includes a temperature sensor and a temperature controller. The temperature controller is mounted on a heat dissipation mounting plate, and the temperature sensor is located inside the DTU device or in the monitoring environment. The temperature sensor is electrically connected to the temperature controller, and the temperature controller is connected to the power module of the DTU device to draw power. The temperature controller is also electrically connected to the cooling chip and the cooling fan assembly to control the switching of the cooling chip and the cooling fan assembly.
9. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, Thermally conductive silicone grease is filled between the cooling surface of the cooling chip and the outer surface of the DTU device.
10. A back-clamp type external heat dissipation device for automatic monitoring of DTU according to claim 1, characterized in that, The heat dissipation mounting plate has mounting holes on both sides. A telescopic rod is installed in the mounting hole by a spring. The telescopic rod is also connected to the elastic clamping plate, thereby realizing the elastic connection between the elastic clamping plate and the heat dissipation mounting plate, so as to adjust the distance and clamping force between the two elastic clamping plates to clamp the DTU device.