An LED light source

Abstract

The utility model discloses a LED light source is applied to lighting technical field, the utility model discloses a fluorescent cement is set up on the rectangular wafer surface, and makes fluorescent cement cover at least entire rectangular wafer, forms rectangular luminous surface, then pastes circular light medium layer to encapsulate circular luminous surface on the fluorescent cement surface. The non-white light (such as blue light) of wafer light emitting area emission irradiates to the fluorescent cement covered by light emitting area, will excite the fluorescent powder in fluorescent cement, produces white light, simultaneously the non-white light (such as blue light) of wafer light emitting area emission will overflow to all around, and the non-white light overflowed irradiates to the fluorescent cement covered by light emitting area periphery area, also will excite the fluorescent powder in fluorescent cement, produces white light, thereby has solved the problem that the four corners of circular light emission have blue light to emit. In addition, the packaging structure can be realized through ordinary packaging mode, so can encapsulate the LED light source of circular luminous surface with lower packaging cost.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to an LED light source. Background Technology

[0002] End customers require LED (Light Emitting Diode) light sources with effective light emission in a circular shape. Currently, LED chips in the industry are rectangular in shape. Therefore, the existing packaging method for circular light-emitting LEDs involves setting a circular light-emitting area on the surface of a rectangular chip and then encapsulating it with a circular phosphor sheet. However, circular light-emitting LEDs directly encapsulated with circular phosphor sheets suffer from blue light leakage at the four corners of the circular light-emitting area due to the rectangular shape of the chip and the primary use of blue light-emitting chips, thus affecting the light pattern. Moreover, circular phosphor sheets are expensive, resulting in a high cost for the packaged LED light source. Therefore, how to solve the problem of blue light leakage at the four corners of circular light-emitting LED light sources and reduce the cost of circular light-emitting LED light sources are technical problems that need to be solved by those skilled in the art. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide an LED light source to solve the problem of blue light emanating from the four corners of a circular LED light source and to reduce the cost of a circular LED light source.

[0004] To solve the above-mentioned technical problems, this utility model provides an LED light source, including: a substrate; an opaque dielectric layer and a stacked structure are disposed on the surface of the substrate; the opaque dielectric layer surrounds the sidewalls of the stacked structure; the stacked structure includes a wafer, a phosphor, and a light-transmitting dielectric layer arranged sequentially along a direction away from the substrate;

[0005] The wafer is rectangular in shape; a circular light-emitting area is provided on the surface of the wafer; the fluorescent adhesive covers at least the entire wafer; the light-transmitting medium layer is circular in shape; the light-transmitting medium layer corresponds to the light-emitting area.

[0006] Optionally, the fluorescent adhesive is rectangular in shape.

[0007] Optionally, the substrate surface is provided with a stacked structure array, the stacked structure array including at least two stacked structures arranged in an array; the opaque dielectric layer surrounds the sidewalls of each stacked structure.

[0008] Optionally, the diameter of the light-transmitting medium layer is less than or equal to the diameter of the light-emitting area.

[0009] Optionally, the opaque dielectric layer covers all areas of the substrate surface except for the area covered by the stacked structure.

[0010] Optionally, the wafer is eutectic bonded to the surface of the substrate.

[0011] Optionally, the wafer includes a blue LED wafer; the fluorescent adhesive includes a yellow fluorescent adhesive.

[0012] Optionally, the opaque dielectric layer includes a white adhesive layer;

[0013] And / or, the light-transmitting medium layer comprises a transparent glass sheet.

[0014] Optionally, the size of the fluorescent adhesive is greater than or equal to the size of the wafer, but smaller than the size of the substrate.

[0015] Optionally, the vertical distance between the edge of the fluorescent adhesive and the corresponding edge of the wafer is greater than or equal to 0, and less than half the length of the corresponding edge of the wafer.

[0016] As can be seen, the LED light source provided by this utility model forms a rectangular light-emitting surface by placing fluorescent adhesive on the surface of a rectangular chip, ensuring that the fluorescent adhesive covers at least the entire rectangular chip; then, a circular light-transmitting dielectric layer is attached to the surface of the fluorescent adhesive to encapsulate a circular light-emitting surface. Non-white light (such as blue light) emitted from the chip's light-emitting area shines on the fluorescent adhesive covering the light-emitting area, exciting the phosphors in the fluorescent adhesive and producing white light. Simultaneously, the non-white light (such as blue light) emitted from the chip's light-emitting area overflows in all directions. This overflowing non-white light shines on the fluorescent adhesive covering the outer area of ​​the light-emitting area, also exciting the phosphors in the fluorescent adhesive and producing white light, thus solving the problem of blue light escaping from the four corners of the circular light-emitting surface. Furthermore, this encapsulation structure can be implemented using ordinary encapsulation methods, thus allowing for the encapsulation of a circular light-emitting LED light source at a relatively low cost. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an LED light source provided in an embodiment of the present utility model;

[0019] Figures 2 to 6 This is a flowchart illustrating an LED light source packaging method provided in an embodiment of the present invention.

[0020] The annotations in the attached figures are explained as follows:

[0021] 1-Substrate; 2-Opaque dielectric layer; 3-Chip; 4-Fluorescent adhesive; 5-Transparent dielectric layer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] Please refer to Figure 1 , Figure 1 This is a schematic diagram of an LED light source provided in an embodiment of the present invention. The LED light source may include: a substrate 1; an opaque dielectric layer 2 and a stacked structure are disposed on the surface of the substrate 1; the opaque dielectric layer 2 surrounds the sidewalls of the stacked structure; the stacked structure includes a wafer 3, a phosphor 4 and a light-transmitting dielectric layer 5 arranged sequentially along a direction away from the substrate 1.

[0024] The wafer 3 is rectangular in shape; a circular light-emitting area is provided on the surface of the wafer 3; the phosphor 4 covers at least the entire wafer 3; the light-transmitting dielectric layer 5 is circular in shape; the light-transmitting dielectric layer 5 corresponds to the light-emitting area.

[0025] This embodiment does not limit the specific type of substrate 1; any type of substrate 1 can be used as long as it can support the laminated structure and the opaque dielectric layer 2. This embodiment does not limit the specific size of substrate 1; it can be determined based on the specific size and quantity of the laminated structure.

[0026] This embodiment does not limit the specific size of the stacked structure, which can be determined according to actual conditions. This embodiment does not limit the specific number of stacked structures; for example, a single stacked structure can be provided on the surface of substrate 1; or, an array of stacked structures can be provided on the surface of substrate 1, the array including at least two stacked structures arranged in an array; the opaque dielectric layer 2 surrounds the sidewalls of each stacked structure. When an array of stacked structures is provided on the surface of substrate 1, adjacent stacked structures can be independent, connected in series, or connected in parallel. When at least two independent stacked structures are provided on the surface of substrate 1, at least two LED light sources are integrated on substrate 1, which can be cut into single LED light sources according to actual needs. When at least two stacked structures are provided on the surface of substrate 1, and adjacent stacked structures are connected in series or parallel, substrate 1, the opaque dielectric layer 2 on the surface of substrate 1, and the stacked structures together constitute a single LED light source.

[0027] It should be noted that, in this embodiment, when a stacked structure is provided on the surface of substrate 1, the size of substrate 1 is larger than the size of a stacked structure; when a stacked structure array is provided on the surface of substrate 1, the size of substrate 1 is larger than the size of the stacked structure array.

[0028] In this embodiment, the opaque dielectric layer 2 can prevent light from passing through. The opaque dielectric layer 2 is disposed on the surface of the substrate 1, surrounding the sidewalls of the chip 3, the sidewalls of the phosphor 4, and the sidewalls of the light-transmitting dielectric layer 5. The height of the opaque dielectric layer 2 does not exceed the height of the light-transmitting dielectric layer 5. On the one hand, it can improve the problem of light emanating from the light-emitting area of ​​the chip 3 overflowing to all sides, resulting in low light quality. On the other hand, it can limit the light-emitting surface of the LED light source to the area covered by the circular light-transmitting dielectric layer 5.

[0029] This embodiment does not limit the specific type of the opaque dielectric layer 2; it can be any dielectric layer capable of blocking light transmission. For example, the opaque dielectric layer 2 may include a white adhesive layer. It should be noted that white adhesive is a common material in the prior art. This embodiment does not limit the internal composition of the opaque dielectric layer 2, but directly uses a white adhesive layer made of existing materials.

[0030] This embodiment does not limit the specific connection method between the opaque dielectric layer 2 and the substrate 1, as long as the opaque dielectric layer 2 can be fixed on the substrate 1. For example, when the opaque dielectric layer 2 is a white adhesive layer, the opaque dielectric layer 2 can be pasted on the surface of the substrate 1.

[0031] This embodiment does not limit the specific coverage area or thickness of the opaque dielectric layer 2. Preferably, the opaque dielectric layer 2 can cover all areas of the substrate 1 surface except for the area covered by the laminated structure, that is, the thickness of the opaque dielectric layer 2 can be the distance from the sidewall of the laminated structure to the edge of the substrate 1. It should be noted that in this embodiment, the opaque dielectric layer 2 is covered in all areas of the substrate 1 surface except for the area covered by the laminated structure, which can ensure the consistency of the appearance color.

[0032] In this embodiment, the wafer 3 is rectangular in shape, and a circular light-emitting area is provided on the surface of the rectangular wafer 3. Preferably, the light-emitting area can be concentric with the wafer 3, and the diameter of the light-emitting area is smaller than the width of the wafer 3. The wafer 3 is rectangular in shape, including a long side and a short side. The width of the wafer 3 refers to the length of the short side of the wafer 3, and the length of the wafer 3 refers to the length of the long side of the wafer 3. This embodiment does not limit the specific values ​​of the length of the wafer 3, the width of the wafer 3, and the diameter of the light-emitting area, and can determine them according to the actual situation.

[0033] This embodiment does not limit the specific type of chip 3; it can be any chip 3 capable of emitting a single color of light. For example, chip 3 may include a blue light chip. It should be noted that blue light chips are common materials in the prior art. This embodiment does not limit the internal composition of chip 3, but directly uses a blue light chip made of existing materials.

[0034] This embodiment does not limit the specific connection method between the chip 3 and the substrate 1, as long as the chip 3 can be fixed on the substrate 1. For example, the chip 3 can be eutectic bonded to the surface of the substrate 1.

[0035] This embodiment does not limit the specific shape of the fluorescent adhesive 4; it can be any shape as long as it can cover the entire wafer 3. For example, the shape of the fluorescent adhesive 4 can be rectangular. Preferably, the fluorescent adhesive 4 can be concentric with the wafer 3. It should be noted that the rectangular shape of the fluorescent adhesive 4 used in this embodiment is easier to prepare; for example, the shape of the fluorescent adhesive 4 can be made rectangular by cutting.

[0036] In this embodiment, the fluorescent adhesive 4 is a colloid formed by mixing phosphor and glue. Both phosphor and glue are common materials in the prior art, and this embodiment directly uses fluorescent adhesive 4 made from these two existing materials. In this embodiment, the light emitted from the light-emitting area of ​​the chip 3 shines on the fluorescent adhesive 4 covering the light-emitting area, which excites the phosphor in the fluorescent adhesive 4 to produce light. Different colored chips 3 require matching phosphors of different colors to produce white light after the phosphor is excited. This embodiment does not limit the specific type of fluorescent adhesive 4, and it can be determined according to the specific type of chip 3. For example, when the chip 3 is a blue light chip, the fluorescent adhesive 4 may include yellow fluorescent adhesive. It should be noted that the yellow fluorescent adhesive is a colloid formed by mixing yellow phosphor and glue. Both yellow phosphor and glue are common materials in the prior art, and this embodiment does not limit the internal components of the fluorescent adhesive 4, but directly uses yellow fluorescent adhesive made from these two existing materials. The light-emitting area of ​​the blue light chip emits blue light, and when the blue light shines on the yellow fluorescent adhesive, it excites the yellow phosphor in the yellow fluorescent adhesive, thereby producing white light.

[0037] It should be noted that the fluorescent adhesive 4 in this embodiment can be adhered to the surface of the wafer 3.

[0038] This embodiment does not limit the specific size of the phosphor adhesive 4, as long as it can cover the entire wafer 3. For example, the size of the phosphor adhesive 4 can be greater than or equal to the size of the wafer 3, but less than the size of the substrate 1. Preferably, the perpendicular distance between the edge of the phosphor adhesive 4 and the corresponding edge of the wafer 3 is greater than or equal to 0, and less than half the length of the corresponding edge of the wafer 3. It should be noted that in this embodiment, the size of the phosphor adhesive 4 being greater than or equal to the size of the wafer 3 ensures that the phosphor adhesive 4 can cover the entire wafer 3. When the size of the phosphor adhesive 4 is less than the size of the substrate 1, the sidewalls of the stacked structure will form a continuous opaque dielectric layer 2, which can prevent the phosphor adhesive 4 from cutting off the opaque dielectric layer 2, thus avoiding delamination of the LED light source during use and improving the reliability of the LED light source structure.

[0039] In this embodiment, the light-transmitting medium layer 5 allows light to pass through. The light-transmitting medium layer 5 is disposed on the surface of the phosphor adhesive 4 and defines the light-emitting surface of the LED light source. This embodiment does not limit the specific type of the light-transmitting medium layer 5; it can be any medium layer that allows light to pass through. For example, the light-transmitting medium layer 5 may include a transparent glass sheet. It should be noted that transparent glass sheets are common materials in the prior art. This embodiment does not limit the internal composition of the light-transmitting medium layer 5, but directly uses a transparent glass sheet made of existing materials.

[0040] It should be noted that the light-transmitting medium layer 5 in this embodiment can be adhered to the surface of the fluorescent adhesive 4.

[0041] This embodiment does not limit the specific size of the light-transmitting medium layer 5, which can be determined according to the specific size of the light-emitting area. For example, the diameter of the light-transmitting medium layer 5 can be less than or equal to the diameter of the light-emitting area. Preferably, the light-transmitting medium layer 5 can be concentric with the light-emitting area.

[0042] Based on the above embodiments, this invention forms a rectangular light-emitting surface by applying fluorescent adhesive to the surface of a rectangular wafer, ensuring the adhesive covers at least the entire wafer; then, a circular light-transmitting dielectric layer is attached to the fluorescent adhesive surface to encapsulate a circular light-emitting surface. Non-white light (such as blue light) emitted from the wafer's light-emitting area illuminates the fluorescent adhesive covering the area, exciting the phosphors within and producing white light. Simultaneously, the non-white light (such as blue light) emitted from the wafer's light-emitting area spills outwards. This spilled non-white light illuminates the fluorescent adhesive covering the outer area of ​​the light-emitting area, also exciting the phosphors and producing white light. This solves the problem of blue light escaping from the four corners of the circular light-emitting surface. Furthermore, this encapsulation structure can be implemented using conventional encapsulation methods, thus enabling the encapsulation of a circular light-emitting LED light source at a lower cost.

[0043] To facilitate understanding of this invention, this embodiment also provides a packaging method for an LED light source. Please refer to... Figures 2 to 6 , Figures 2 to 6 This is a flowchart illustrating an LED light source packaging method according to an embodiment of the present invention. The process may include:

[0044] 1. Crystal bonding: such as Figure 2 As shown, multiple wafers 3 (the wafers 3 are rectangular in shape and have circular light-emitting areas on their surfaces, i.e., circular light-emitting wafers 3) are temporarily attached to the substrate 1 using flux.

[0045] 2. Eutectic bonding (reflow soldering): High temperature causes the wafer 3 attached to the substrate 1 and the substrate 1 to be eutectic bonded together;

[0046] 3. Clean the flux: Remove excess flux;

[0047] 4. Fill with an opaque dielectric layer 2 (this opaque dielectric layer 2 is a white adhesive layer 2): For example... Figure 3 As shown, white glue is filled around the wafer 3 to form a white glue layer 2 surrounding the sidewalls of the wafer 3;

[0048] 5. Spraying fluorescent adhesive 4: such as Figure 4 As shown, phosphor 4 of the corresponding light-emitting color is sprayed onto the front side of the chip 3;

[0049] 6. Cut a rectangular light-emitting surface: such as Figure 5 As shown, based on the size of chip 3, excess phosphor 4 is cut off, and the size of the remaining phosphor 4 is equal to the size of chip 3, forming a rectangular light-emitting surface;

[0050] 7. Solid circular light-transmitting medium layer 5 (this light-transmitting medium layer 5 is a transparent glass sheet 5): such as Figure 6 As shown, a transparent glass sheet 5 (the transparent glass sheet 5 is circular in shape) is attached to the rectangular light-emitting surface;

[0051] 8. Secondary white glue filling: White glue is filled around the fluorescent glue 4 and the transparent glass plate 5 to form a white glue layer 2 surrounding the sidewalls of the fluorescent glue 4 and the transparent glass plate 5.

[0052] 9. Overall cutting: Cutting the continuous LED light source into individual LED light sources;

[0053] 10. Testing and Packaging: Perform photoelectric testing and sorting on LED light sources and package them in tape form.

[0054] Traditional circular phosphor sheets are expensive, resulting in high costs for the encapsulated LED light sources. Furthermore, circular phosphor sheets have poor color concentration, leading to inconsistent light emission colors. The encapsulation method provided in this embodiment, which involves spraying fluorescent adhesive 4, cutting a rectangular light-emitting surface, and then attaching a transparent glass sheet 5 to encapsulate the circular light-emitting surface, reduces the cost of the circular LED light source by using conventional manufacturing processes. This process also results in more concentrated light emission colors.

[0055] The above provides a detailed description of an LED light source provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. An LED light source, characterized in that, include: Substrate; the surface of the substrate is provided with an opaque dielectric layer and a laminated structure; The opaque dielectric layer surrounds the sidewalls of the stacked structure; the stacked structure includes a wafer, a phosphor, and a transparent dielectric layer arranged sequentially in a direction away from the substrate. The wafer is rectangular in shape; a circular light-emitting area is provided on the surface of the wafer; the fluorescent adhesive covers at least the entire wafer; the light-transmitting medium layer is circular in shape; the light-transmitting medium layer corresponds to the light-emitting area.

2. The LED light source according to claim 1, characterized in that, The fluorescent adhesive is rectangular in shape.

3. The LED light source according to claim 1, characterized in that, The substrate surface is provided with a stacked structure array, the stacked structure array including at least two stacked structures arranged in an array; the opaque dielectric layer surrounds the sidewalls of each stacked structure.

4. The LED light source according to claim 1, characterized in that, The diameter of the light-transmitting medium layer is less than or equal to the diameter of the light-emitting area.

5. The LED light source according to claim 1, characterized in that, The opaque dielectric layer covers all areas of the substrate surface except for the area covered by the stacked structure.

6. The LED light source according to claim 1, characterized in that, The wafer is eutectic bonded to the surface of the substrate.

7. The LED light source according to claim 1, characterized in that, The wafer includes a blue LED wafer; the fluorescent adhesive includes a yellow fluorescent adhesive.

8. The LED light source according to claim 1, characterized in that, The opaque dielectric layer includes a white adhesive layer; And / or, the light-transmitting medium layer comprises a transparent glass sheet.

9. The LED light source according to any one of claims 1 to 8, characterized in that, The size of the fluorescent adhesive is greater than or equal to the size of the wafer, but smaller than the size of the substrate.

10. The LED light source according to claim 9, characterized in that, The vertical distance between the edge of the fluorescent adhesive and the corresponding edge of the wafer is greater than or equal to 0, and less than half the length of the corresponding edge of the wafer.

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