Light-emitting diode lamp bead, light bar and backlight module
By employing a cup-shaped structure and a filling layer to protect the quantum dot film in LED chips, the problem of high cost of quantum dot films has been solved, achieving cost reduction while maintaining performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI HUAHUI INTELLIGENT MFG SEMICON CO LTD
- Filing Date
- 2025-08-08
- Publication Date
- 2026-08-04
AI Technical Summary
The complex fabrication process of quantum dot nanomaterials leads to high costs for quantum dot films, which affects the economic viability of backlight modules.
The LED chip design employs a cup-shaped structure, with the quantum dot film positioned between the first and second filler layers at a distance of 3/2. This avoids direct contact with the light-emitting chip, reduces the amount of quantum dot film used, and provides protection through the filler layers.
The amount of quantum dot film used was reduced, which lowered the manufacturing cost, while maintaining the performance and reliability of the LED chips and improving the color gamut performance of the backlight module.
Smart Images
Figure CN224596892U_ABST
Abstract
Description
Technical Field
[0001] This disclosure belongs to the field of semiconductor technology, and specifically relates to a light-emitting diode (LED) chip, LED strip, and backlight module. Background Technology
[0002] The backlight module is an important component of a display, providing a backlight source for the display.
[0003] In related technologies, the backlight module includes a light strip with multiple LEDs. The LEDs are covered with a quantum dot film. The quantum dot emission spectrum has a narrow half-peak width and very little stray light, which makes the color purity of the display far exceed that of conventional displays that use phosphor backlight technology.
[0004] However, the fabrication process of quantum dot nanomaterials is complex, resulting in high costs for quantum dot films. Utility Model Content
[0005] This disclosure provides a light-emitting diode (LED) chip, LED strip, and backlight module, which can reduce manufacturing costs while ensuring display quality. The technical solution is as follows:
[0006] In a first aspect, embodiments of this disclosure provide a light-emitting diode (LED) chip, including a bowl, a light-emitting chip, a quantum dot film, a first filling layer, and a second filling layer;
[0007] The light-emitting chip is located inside the bowl / cup and at the bottom of the bowl / cup;
[0008] The first filling layer covers the outside of the light-emitting chip;
[0009] The quantum dot film is located on the side of the first filling layer facing away from the light-emitting chip, and the ratio of the distance between the quantum dot film and the bottom of the bowl to the distance between the quantum dot film and the rim of the bowl is 3 / 2.
[0010] The second filling layer covers the side of the quantum dot film opposite to the first filling layer.
[0011] In one implementation of this disclosure, the thickness of the quantum dot film is 10–50 μm.
[0012] In another implementation of this disclosure, the side of the first filling layer facing away from the light-emitting chip is the first contact surface, and the first contact surface is parallel to the bottom of the bowl / cup.
[0013] The side of the second filling layer facing the first filling layer is the second contact surface, and the second contact surface is parallel to the bottom of the bowl / cup;
[0014] The quantum dot film is sandwiched between the first contact surface and the second contact surface, and is parallel to the bottom of the bowl.
[0015] In another implementation of this disclosure, the orthographic projection of the quantum dot film onto the plane where the bottom of the bowl / cup is located lies within the orthographic projection of the second contact surface onto the plane where the bottom of the bowl / cup is located.
[0016] In another implementation of this disclosure, the side of the second filling layer facing away from the first filling layer is the sealing surface, and there is a gap between the sealing surface and the rim of the bowl / cup.
[0017] In another implementation of this disclosure, the distance between the sealing surface and the plane where the rim of the bowl / cup is located is 30–50 μm.
[0018] In another implementation of this disclosure, the light-emitting diode (LED) chip further includes a sealing layer;
[0019] The sealing layer is located on the side of the second filling layer opposite to the first filling layer, and covers the mouth of the bowl / cup.
[0020] In another implementation of this disclosure, the light-emitting diode (LED) chip further includes conductive wires;
[0021] One end of the conductive wire is connected to the electrode of the light-emitting chip, and the other end of the conductive wire is connected to the conductive part of the bowl.
[0022] The portion between the two ends of the conductive wire is curved toward the rim of the bowl / cup to form an arc-shaped structure, and the distance between the apex of the arc and the bottom of the bowl / cup is 110–135 μm.
[0023] Secondly, embodiments of this disclosure provide a light strip, the light strip including the light-emitting diode beads described in the first aspect.
[0024] Thirdly, embodiments of this disclosure provide a backlight module including the light strip described in the second aspect.
[0025] The beneficial effects of the technical solutions provided in this disclosure are:
[0026] In the LED chip provided in this embodiment, a bowl provides mounting space for the light-emitting chip, quantum dot film, first filling layer, and second filling layer. The light-emitting chip is located at the bottom of the bowl and covered by the first filling layer, thus protecting it. The quantum dot film is disposed between the first and second filling layers, receiving protection from both layers. Furthermore, since the ratio of the distance between the quantum dot film and the bottom of the bowl to the distance between the quantum dot film and the rim of the bowl is 3 / 2, the quantum dot film can be kept away from the light-emitting chip, thereby avoiding thermal degradation issues.
[0027] In other words, the LED chips provided in this embodiment have a quantum dot film, eliminating the need to cover each LED chip with a quantum dot film when they are arranged in a light strip. The amount of quantum dot film used in the LED chips is much less than the amount required to cover each LED chip with a quantum dot film. This ensures the performance of the LED chips while saving on the amount of quantum dot film used, thus reducing manufacturing costs. Attached Figure Description
[0028] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0029] Figure 1 This is a schematic diagram of the structure of a light-emitting diode (LED) chip provided in an embodiment of this disclosure;
[0030] Figure 2 This is a partial structural schematic diagram of a light-emitting diode (LED) chip provided in an embodiment of this disclosure;
[0031] Figure 3 This is a schematic diagram of the structure of the light strip provided in the embodiments of this disclosure;
[0032] Figure 4 This is a schematic diagram of the structure of the backlight module provided in the embodiments of this disclosure.
[0033] The symbols in the diagram represent the following meanings:
[0034] 10. Bowls and cups;
[0035] 20. Light-emitting chip;
[0036] 30. Quantum dot film;
[0037] 40. First filler layer;
[0038] 410. First contact surface;
[0039] 50. Second filler layer;
[0040] 510. Second contact surface; 520. Sealing surface;
[0041] 60. Sealing layer;
[0042] 70. Conductive wire;
[0043] 100, substrate; 200, connector; 300, LED chip;
[0044] 1000, LED strip.
[0045] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0046] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.
[0047] Figure 1 This is a schematic diagram of the structure of a light-emitting diode (LED) chip provided in an embodiment of this disclosure. See also: Figure 1 In this embodiment, the light-emitting diode (LED) chip includes a bowl 10, a light-emitting chip 20, a quantum dot film 30, a first filling layer 40, and a second filling layer 50. The light-emitting chip 20 is located inside the bowl 10 and at the bottom of the bowl 10. The first filling layer 40 covers the light-emitting chip 20. The quantum dot film 30 is located on the side of the first filling layer 40 facing away from the light-emitting chip 20. The ratio of the distance 'a' between the quantum dot film 30 and the bottom of the bowl 10 to the distance 'b' between the quantum dot film 30 and the rim of the bowl 10 is 3 / 2. The second filling layer 50 covers the side of the quantum dot film 30 facing away from the first filling layer 40.
[0048] In the LED chip provided in this embodiment, the bowl 10 provides mounting space for the light-emitting chip 20, the quantum dot film 30, the first filling layer 40, and the second filling layer 50. The light-emitting chip 20 is located at the bottom of the bowl 10 and is covered by the first filling layer 40, thus protecting the light-emitting chip 20. The quantum dot film 30 is disposed between the first filling layer 40 and the second filling layer 50, thereby being protected by both layers. Furthermore, since the ratio of the distance between the quantum dot film 30 and the bottom of the bowl 10 to the distance between the quantum dot film 30 and the rim of the bowl 10 is 3 / 2, the quantum dot film 30 can be kept away from the light-emitting chip 20, thereby avoiding the problem of thermal degradation of the quantum dot film 30.
[0049] In other words, the LED chips provided in this embodiment have a quantum dot film 30, so when they are arranged in a light strip, it is unnecessary to cover each LED chip with a quantum dot film 30. The amount of quantum dot film 30 used in the LED chip is much less than the amount of quantum dot film 30 required to cover each LED chip. In this way, the performance of the LED chip is guaranteed, while the amount of quantum dot film 30 is saved, reducing manufacturing costs.
[0050] For example, the thickness of the quantum dot film 30 is 10–50 μm.
[0051] In this embodiment, the thickness of the quantum dot film 30 is 30 μm.
[0052] Figure 2 This is a partial structural diagram of a light-emitting diode (LED) chip, combined with... Figure 2 In this embodiment, the side of the first filling layer 40 facing away from the light-emitting chip 20 is the first contact surface 410, which is parallel to the bottom of the bowl 10. The side of the second filling layer 50 facing the first filling layer 40 is the second contact surface 510, which is also parallel to the bottom of the bowl 10. The quantum dot film 30 is sandwiched between the first contact surface 410 and the second contact surface 510, and is parallel to the bottom of the bowl 10.
[0053] In the above implementation, the quantum dot film 30 is sandwiched between the first filling layer 40 and the second filling layer 50, which can better protect the quantum dot film 30, thereby blocking oxygen and moisture permeation and effectively improving the reliability of the light-emitting diode lamp bead.
[0054] Furthermore, the quantum dot film 30 is ensured to be parallel to the bottom of the cup 10 by the first filling layer 40 and the second filling layer 50, so that the light-emitting chip 20 located at the bottom of the cup 10 can better transmit the emitted light through the quantum dot film 30, thereby ensuring the performance of the light-emitting diode lamp bead.
[0055] For example, the first filler layer 40 and the second filler layer 50 are transparent silicone.
[0056] See also Figure 2 In this embodiment, the orthographic projection of the quantum dot film 30 onto the plane where the bottom of the bowl 10 is located is within the orthographic projection of the second contact surface 510 onto the plane where the bottom of the bowl 10 is located.
[0057] This design of the relationship between the quantum dot film 30 and the second contact surface 510 ensures that the second contact surface 510 completely covers the quantum dot film 30, thereby guaranteeing the barrier against oxygen and moisture permeation and effectively improving the reliability of the light-emitting diode chip.
[0058] See you again Figure 1 In this embodiment, the side of the second filling layer 50 facing away from the first filling layer 40 is the sealing surface 520, and there is a gap between the sealing surface 520 and the mouth of the bowl 10.
[0059] In the above implementation, the second filling layer 50 does not exceed the rim of the bowl 10, thereby effectively preventing the second filling layer 50 from overflowing the bowl 10.
[0060] For example, the distance between the sealing surface 520 and the plane where the rim of the bowl 10 is located is 30 to 50 μm.
[0061] In this embodiment, the distance between the sealing surface 520 and the plane where the rim of the bowl 10 is located is 40 μm.
[0062] Of course, the distance between the sealing surface 520 and the plane where the rim of the bowl 10 is located can be adjusted within the above-mentioned numerical range according to actual needs, and this disclosure does not limit it.
[0063] See also Figure 1 In this embodiment, the light-emitting diode (LED) chip further includes a sealing layer 60. The sealing layer 60 is located on the side of the second filling layer 50 opposite to the first filling layer 40, and seals the mouth of the bowl / cup 10.
[0064] In the above implementation, the sealing layer 60 is used to seal the mouth of the cup 10, thereby further improving the light-emitting diode lamp beads' barrier effect against oxygen and moisture permeation.
[0065] For example, the sealing layer 60 is aluminum oxide, which can effectively prevent water and sulfur.
[0066] See also Figure 1 In this embodiment, the light-emitting diode (LED) chip further includes a conductive wire 70. One end of the conductive wire 70 is connected to the electrode of the light-emitting chip 20, and the other end of the conductive wire 70 is connected to the conductive part of the bowl 10. The portion between the two ends of the conductive wire 70 is curved toward the rim of the bowl 10 to form an arc-shaped structure, and the distance between the apex of the arc of the conductive wire 70 and the bottom of the bowl 10 is 110–135 μm.
[0067] In the above implementation, the conductive wire 70 adopts the BBOS (Bond Ball On Stitch) bonding mode, which makes the soldering of the conductive wire 70 very stable and able to adapt to harsh environments such as high stress or high frequency vibration. Furthermore, the distance between the arc apex of the conductive wire 70 and the bottom of the cup 10 is 110–135 μm, ensuring circuit reliability while providing ample soldering space.
[0068] For example, conductive wire 70 is gold wire.
[0069] Figure 3 This is a schematic diagram of the structure of a light strip provided in an embodiment of the present disclosure, combined with... Figure 3 In this embodiment, the light strip includes a substrate 100, a connector 200, and multiple [other components]. Figure 1 The LED chip 300 is shown. Both the connector 200 and the LED chip 300 are connected to the substrate 100, which is a printed circuit board.
[0070] Figure 4 This is a schematic diagram of the structure of a backlight module provided in an embodiment of the present disclosure, combined with... Figure 4 In this embodiment, the backlight module includes multiple Figure 3 The light strip shown is 1000.
[0071] The backlight modules in related technologies and the backlight modules provided in the embodiments of this disclosure were compared and tested, and the test results shown in Table 1 were obtained.
[0072]
[0073] Table 1
[0074] Therefore, it can be seen that the backlight module provided in this embodiment has an NTSC color gamut of 105.99% after being applied to a display, which is greater than 100% of the standard NTSC color gamut and higher than the NTSC color gamut of 72.29% of the backlight module in the related art after being applied to a display.
[0075] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.
[0076] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.
Claims
1. A light-emitting diode (LED) chip, characterized in that, It includes a bowl (10), a light-emitting chip (20), a quantum dot film (30), a first filling layer (40), and a second filling layer (50); The light-emitting chip (20) is located inside the bowl (10) and at the bottom of the bowl (10); The first filling layer (40) covers the outside of the light-emitting chip (20); The quantum dot film (30) is located on the side of the first filling layer (40) facing away from the light-emitting chip (20). The ratio of the distance between the quantum dot film (30) and the bottom of the bowl (10) to the distance between the quantum dot film (30) and the mouth of the bowl (10) is 3 / 2. The second filling layer (50) covers the side of the quantum dot film (30) opposite to the first filling layer (40).
2. The light-emitting diode (LED) chip according to claim 1, characterized in that, The thickness of the quantum dot film (30) is 10–50 μm.
3. The light-emitting diode (LED) chip according to claim 1, characterized in that, The side of the first filling layer (40) facing away from the light-emitting chip (20) is the first contact surface (410), and the first contact surface (410) is parallel to the bottom of the bowl (10); The side of the second filling layer (50) facing the first filling layer (40) is the second contact surface (510), and the second contact surface (510) is parallel to the bottom of the bowl (10); The quantum dot film (30) is sandwiched between the first contact surface (410) and the second contact surface (510) and is parallel to the bottom of the bowl (10).
4. The light-emitting diode (LED) chip according to claim 3, characterized in that, The orthographic projection of the quantum dot film (30) onto the plane where the bottom of the bowl (10) is located is within the orthographic projection of the second contact surface (510) onto the plane where the bottom of the bowl (10) is located.
5. The light-emitting diode (LED) chip according to claim 1, characterized in that, The side of the second filling layer (50) facing away from the first filling layer (40) is a sealing surface (520), and there is a gap between the sealing surface (520) and the mouth of the bowl (10).
6. The light-emitting diode (LED) chip according to claim 5, characterized in that, The distance between the sealing surface (520) and the plane where the rim of the bowl (10) is located is 30-50 μm.
7. The light-emitting diode (LED) chip according to claim 1, characterized in that, The light-emitting diode lamp bead also includes a sealing layer (60); The sealing layer (60) is located on the side of the second filling layer (50) facing away from the first filling layer (40) and covers the mouth of the bowl (10).
8. The light-emitting diode (LED) chip according to claim 1, characterized in that, The light-emitting diode lamp bead also includes a conductive wire (70); One end of the conductive wire (70) is connected to the electrode of the light-emitting chip (20), and the other end of the conductive wire (70) is connected to the conductive part of the bowl (10). The portion between the two ends of the conductive wire (70) is curved toward the mouth of the bowl (10) to form an arc-shaped structure. The distance between the top of the arc of the conductive wire (70) and the bottom of the bowl (10) is 110 to 135 μm.
9. A light strip, characterized in that, The light strip includes the light-emitting diode (LED) beads as described in any one of claims 1 to 8.
10. A backlight module, characterized in that, Includes the light strip as described in claim 9.