Side fingerprint identification component and mobile phone

Abstract

The utility model discloses side edge fingerprint identification component and cell -phone relates to in cell -phone fingerprint module technical field. Side edge fingerprint identification component includes metal ring, apron, circuit board, sensing assembly and filling piece, metal ring is provided with first limit groove, second limit groove, accommodating space and side opening, the top end of accommodating space extends to the bottom wall of first limit groove, and forms first opening, the bottom end of accommodating space extends to the top wall of second limit groove, and forms second opening, apron and the bottom wall of first limit groove abut, and cover is in first opening, one end of circuit board is at least partial and is provided with in side opening, and sets up in second limit groove, circuit board cover is in second opening, filling piece is covered in fingerprint identification chip, connecting wire and capacitor resistance outside. The side edge fingerprint identification component can play the effect of protecting fingerprint identification chip, connecting wire and capacitor resistance, and its thickness size is smaller, and the overall size is smaller, to improve the adaptability.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone fingerprint module technology, and in particular to a side fingerprint recognition component and a mobile phone. Background Technology

[0002] Fingerprint recognition technology is a common biometric identification technology with wide applications, and it can be found in electronic devices such as mobile phones and small smart wearable devices.

[0003] During assembly, the fingerprint recognition chip is directly exposed to the outside world, making it susceptible to physical damage, moisture, dust, and other external factors. Therefore, after unpacking, protective measures need to be added to the process, such as production in a cleanroom or storage in a nitrogen cabinet. Alternatively, the fingerprint recognition chip can be plastic-encapsulated. However, after plastic encapsulation, the overall size of the fingerprint recognition chip is larger and thicker than the bare chip. In some space-constrained applications, such as ultra-thin mobile phones and small smart wearable devices, this can impose certain limitations on product design and space layout, resulting in lower adaptability. Utility Model Content

[0004] The purpose of this utility model is to overcome the above-mentioned defects in the prior art and provide a side fingerprint recognition component and mobile phone, which can protect the fingerprint recognition chip, connecting wires and capacitors and resistors, and has a small thickness and overall size, and high adaptability.

[0005] To achieve the above objectives, a first aspect of this utility model provides a side-mounted fingerprint recognition component, comprising a metal ring, a cover plate, a circuit board, a sensing component, and a filler; the metal ring is provided with a first limiting groove, a second limiting groove, a receiving space, and a side opening; the first limiting groove is disposed at the top of the metal ring and above the receiving space, the top end of the receiving space extending to the bottom wall of the first limiting groove and forming a first opening; the second limiting groove is disposed at the bottom of the metal ring and below the receiving space, the bottom end of the receiving space extending to the top wall of the second limiting groove and forming a second opening; the side opening is disposed on the side of the metal ring and communicates with the side end of the second limiting groove; the cover plate is disposed within the first limiting groove; The cover plate abuts against the bottom wall of the first limiting groove and covers the first opening; at least one end of the circuit board passes through the side opening and is disposed within the second limiting groove; the portion of the circuit board located within the second limiting groove abuts against the top wall of the second limiting groove and covers the second opening; the sensing component is located within the accommodating space; the sensing component includes a fingerprint recognition chip, connecting wires, and a capacitor / resistor; the fingerprint recognition chip and the capacitor / resistor are both disposed on the circuit board, with the fingerprint recognition chip and the capacitor / resistor spaced apart; both ends of the connecting wire are respectively connected to the fingerprint recognition chip and the circuit board; a filler is disposed within the accommodating space; the filler covers the fingerprint recognition chip, the connecting wires, and the capacitor / resistor.

[0006] Furthermore, it also includes a first annular layer; the first annular layer is disposed between the cover plate and the bottom wall of the first limiting groove.

[0007] Furthermore, it also includes a second annular layer; the second annular layer is disposed between the circuit board and the top wall of the second limiting groove.

[0008] Furthermore, it also includes a first reinforcing plate; the first reinforcing plate is connected to the end of the circuit board away from the fingerprint recognition chip and is located below the fingerprint recognition chip; the first reinforcing plate is at least partially located within the second limiting groove.

[0009] Furthermore, it also includes an injection-molded support component; the injection-molded support component is disposed at the lower end of the first reinforcing plate.

[0010] Furthermore, the sensing component also includes a connection layer; the connection layer is disposed between the circuit board and the fingerprint recognition chip.

[0011] Furthermore, the filler abuts against the peripheral wall of the accommodating space, and also abuts against the top wall of the circuit board and the bottom wall of the cover plate.

[0012] Furthermore, the cross-section of the accommodating space is smaller than the cross-section of the first limiting groove and the cross-section of the second limiting groove.

[0013] Furthermore, it also includes a second reinforcing plate and a board-to-board connector; the second reinforcing plate and the board-to-board connector are both disposed at the end of the circuit board away from the metal ring, and are respectively disposed on opposite sides of the circuit board.

[0014] According to a second aspect embodiment of the present invention, the mobile phone includes a side fingerprint recognition component as described in the first aspect embodiment.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] 1. The fingerprint recognition chip is mounted on the circuit board, allowing it to be directly attached to the board. This reduces the need for intermediate adapter boards or other packaging methods, achieving a high degree of integration. This helps to reduce the overall size of the fingerprint recognition component on this side, improving adaptability. Furthermore, the connection between the fingerprint recognition chip and the circuit board via connecting wires shortens the signal transmission path, reducing signal loss and interference during transmission. This ensures that the fingerprint signal collected by the fingerprint recognition chip is transmitted accurately and quickly, thereby achieving fast and accurate fingerprint recognition and enhancing the user experience.

[0017] 2. A cover plate is disposed within a first limiting groove. The first limiting groove defines the position of the cover plate. The cover plate covers the first opening, preventing external impurities from entering the receiving space and protecting the filler within the receiving space. At least one end of the circuit board passes through the side opening and extends into a second limiting groove. The second limiting groove defines the position of the circuit board within the second limiting groove. The circuit board covers the second opening, preventing external impurities from entering the receiving space and protecting the filler within the receiving space. The filler is located within the receiving space and covers the fingerprint recognition chip, connecting wires, and capacitors / resistors, thus protecting the fingerprint recognition chip. The design of the chip, connecting wires, and capacitors / resistors avoids exposing the fingerprint recognition chip to the environment during production and subsequent use, and prevents it from being affected by physical damage, moisture, dust, and other external factors. It also reduces the degree of movement of the fingerprint recognition chip, connecting wires, and capacitors / resistors within the housing space, improving operational stability. Furthermore, by setting a first limiting groove to accommodate the cover plate, a side opening, and a second limiting groove to accommodate the circuit board portion, and by setting a housing space to accommodate the sensing components and filler, the thickness of the side fingerprint recognition component can be further reduced, thereby reducing the overall size of the side fingerprint recognition component and improving adaptability. Attached Figure Description

[0018] To more clearly illustrate the technology in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the side fingerprint recognition component of this utility model;

[0020] Figure 2 for Figure 1 A structural schematic diagram of the side fingerprint recognition component of this utility model from another perspective;

[0021] Figure 3 This is a schematic diagram of the metal ring structure of the side fingerprint recognition component of this utility model;

[0022] Figure 4 for Figure 3 A schematic diagram of the metal ring of the side fingerprint recognition component of this utility model from another perspective;

[0023] Figure 5 This is a cross-sectional view of the metal ring of the side fingerprint recognition component of this utility model;

[0024] Figure 6 This is a cross-sectional view of the side fingerprint recognition component of this utility model;

[0025] Figure 7 for Figure 6 Another cross-sectional view of the side fingerprint recognition component of this utility model.

[0026] Figure label:

[0027] Metal ring 100; first limiting groove 101; second limiting groove 102; accommodating space 103; side opening 104; first opening 105; second opening 106; cover plate 200; circuit board 300; fingerprint recognition chip 410; connecting wire 420; capacitor and resistor 430; connecting layer 440; filler 500; first annular layer 610; second annular layer 620; first reinforcing plate 710; second reinforcing plate 720; injection molded support 800; board-to-board connector 900. Detailed Implementation

[0028] The technology of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second", such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0031] Please see Figures 1 to 7 The present invention provides a side fingerprint recognition component and a mobile phone.

[0032] According to a first aspect embodiment of the present invention, a side fingerprint recognition component includes a metal ring 100, a cover plate 200, a circuit board 300, a sensing component, and a filler 500. The metal ring 100 is provided with a first limiting groove 101, a second limiting groove 102, a receiving space 103, and a side opening 104. The first limiting groove 101 is located at the top of the metal ring 100 and above the receiving space 103. The top end of the receiving space 103 extends to the bottom wall of the first limiting groove 101, forming a first opening 105. The second limiting groove 102 is located at the bottom of the metal ring 100 and below the receiving space 103. The bottom end of the receiving space 103 extends to the top wall of the second limiting groove 102, forming a second opening 106. The side opening 104 is located on the side of the metal ring 100 and communicates with the side end of the second limiting groove 102. The cover plate 200 is located in the first limiting groove 101. Inside the first opening 105, a cover plate 200 abuts against the bottom wall of the first limiting groove 101 and covers the first opening 105; at least one end of the circuit board 300 passes through the side opening 104 and is disposed in the second limiting groove 102; the portion of the circuit board 300 located in the second limiting groove 102 abuts against the top wall of the second limiting groove 102 and covers the second opening 106; the sensing component is located in the receiving space 103; the sensing component includes a fingerprint recognition chip 410, a connecting wire 420, and a capacitor resistor 430; the fingerprint recognition chip 410 and the capacitor resistor 430 are both disposed on the circuit board 300, and the fingerprint recognition chip 410 and the capacitor resistor 430 are spaced apart; the two ends of the connecting wire 420 are respectively connected to the fingerprint recognition chip 410 and the circuit board 300; the filler 500 is disposed in the receiving space 103; the filler 500 covers the fingerprint recognition chip 410, the connecting wire 420, and the capacitor resistor 430.

[0033] The fingerprint recognition chip 410 is mounted on the circuit board 300, allowing it to be directly attached to the circuit board 300. This reduces the need for intermediate adapter boards or other packaging forms, achieving a high degree of integration. This helps to reduce the overall size of the side fingerprint recognition component, improves adaptability, and allows the fingerprint recognition chip 410 and the circuit board 300 to be electrically connected via connecting wires 420. This shortens the signal transmission path, reduces signal loss and interference during transmission, and ensures that the fingerprint signal collected by the fingerprint recognition chip 410 is transmitted accurately and quickly. This enables fast and accurate fingerprint recognition and improves the user experience.

[0034] A cover plate 200 is disposed within the first limiting groove 101. The first limiting groove 101 limits the position of the cover plate 200. The cover plate 200 covers the first opening 105, preventing external impurities from entering the receiving space 103 and protecting the filler 500 located within the receiving space 103. One end of the circuit board 300 passes through at least part of the side opening 104 and extends into the second limiting groove 102. The second limiting groove 102 limits the position of the circuit board 300 within the second limiting groove 102. The circuit board 300 covers the second opening 106, preventing external impurities from entering the receiving space 103 and protecting the filler 500 located within the receiving space 103. The filler 500 is located within the receiving space 103 and covers the fingerprint recognition chip 410, the connecting wire 420, and the capacitor / resistor 430. This design effectively protects the fingerprint recognition chip 410, connecting wires 420, and capacitors / resistors 430, preventing the fingerprint recognition chip 410 from being exposed to the environment during production and subsequent use. It also prevents the fingerprint recognition chip 410 from being affected by external factors such as physical damage, moisture, and dust. Furthermore, it reduces the degree of shaking of the fingerprint recognition chip 410, connecting wires 420, and capacitors / resistors 430 within the accommodating space 103, improving operational stability. By providing a first limiting groove 101 to accommodate the cover plate 200, a side opening 104 to accommodate a portion of the circuit board 300, and an accommodating space 103 to accommodate the sensing components and filler 500, the thickness of the side fingerprint recognition component can be further reduced, thereby reducing the overall size of the side fingerprint recognition component and improving adaptability.

[0035] Reference Figure 5 and Figure 6 It is understood that the side fingerprint recognition component also includes a first annular layer 610; the first annular layer 610 is disposed between the cover plate 200 and the bottom wall of the first limiting groove 101.

[0036] By setting the first annular layer 610, the cover plate 200 and the bottom wall of the first limiting groove 101 can be connected, so that the cover plate 200 can be fixed in the first limiting groove 101 and can prevent external impurities from entering the accommodating space 103; specifically, the first annular layer 610 is arranged around the first opening 105; the first annular layer 610 is formed by curing glue.

[0037] Reference Figure 5 and Figure 6 It is understood that the side fingerprint recognition component also includes a second annular layer 620; the second annular layer 620 is disposed between the circuit board 300 and the top wall of the second limiting groove 102.

[0038] By setting the second annular layer 620, the top wall of the circuit board 300 and the second limiting groove 102 can be connected, so that the circuit board 300 can be fixed in the second limiting groove 102 and can prevent external impurities from entering the accommodating space 103; specifically, the second annular layer 620 is arranged around the second opening 106; the second annular layer 620 is formed by curing adhesive.

[0039] Reference Figure 2 , Figure 6 and Figure 7 It is understood that the side fingerprint recognition component also includes a first reinforcing plate 710; the first reinforcing plate 710 is connected to the end of the circuit board 300 away from the fingerprint recognition chip 410 and is located below the fingerprint recognition chip 410; the first reinforcing plate 710 is at least partially located within the second limiting groove 102.

[0040] By setting the first reinforcing plate 710, the strength of the portion of the circuit board 300 located within the second limiting groove 102 can be improved, reducing the possibility of excessive bending of the circuit board 300 and improving the stability of use. Specifically, the first reinforcing plate 710 is at least partially located within the second limiting groove 102, so as to reduce the thickness of the side fingerprint recognition component, thereby reducing the overall size of the side fingerprint recognition component.

[0041] Reference Figure 2 , Figure 6 and Figure 7 It is understandable that the side fingerprint recognition component also includes an injection-molded support 800; the injection-molded support 800 is located at the lower end of the first reinforcing plate 710.

[0042] The injection-molded support component 800 can support the tactile comfort of pressing the fingerprint recognition chip 410.

[0043] Reference Figure 6 and Figure 7 It is understood that the sensing component also includes a connection layer 440; the connection layer 440 is disposed between the circuit board 300 and the fingerprint recognition chip 410.

[0044] By setting the connection layer 440, the fingerprint recognition chip 410 can be prepositioned and installed on the circuit board 300, and the stability of the fingerprint recognition chip 410 installed on the circuit board 300 can be improved; specifically, the connection layer 440 can be formed by curing adhesive.

[0045] Reference Figure 6 It is understandable that the filler 500 abuts against the peripheral wall of the accommodating space 103, and against the top wall of the circuit board 300 and the bottom wall of the cover plate 200.

[0046] The filler 500 can be formed by curing adhesive. Specifically, after the circuit board 300 is abutted against the second opening 106, adhesive can be poured into the receiving space 103 from the first opening 105, so that the adhesive covers the fingerprint recognition chip 410, capacitor resistor 430 and connecting wire 420. Then, the cover plate 200 is placed on the first opening 105. After the adhesive in the receiving space 103 is cured, the filler 500 is formed. The filler 500 abuts against the peripheral wall of the receiving space 103, and also abuts against the top wall of the circuit board 300 and the bottom wall of the cover plate 200, so that the overall structure has good stability. The position of the filler 500 can be defined by the cover plate 200 and the circuit board 300.

[0047] Reference Figures 3 to 5 It is understood that the cross-section of the accommodating space 103 is smaller than the cross-section of the first limiting groove 101 and the second limiting groove 102, so that the cover plate 200 can abut against the bottom wall of the first limiting groove 101 and cover the first opening 105, and the circuit board 300 can abut against the top wall of the second limiting groove 102 and cover the second opening 106.

[0048] Reference Figure 1 and Figure 2 It is understood that it also includes a second reinforcing plate 720 and a board-to-board connector 900; the second reinforcing plate 720 and the board-to-board connector 900 are both disposed at the end of the circuit board 300 away from the metal ring 100, and are respectively disposed on opposite sides of the circuit board 300.

[0049] The circuit board 300 can be electrically connected to other board structures through the board-to-board connector 900 to transmit the information recognized by the fingerprint recognition chip 410 to other board structures; by setting the second reinforcing plate 720, the strength of the part of the circuit board 300 where the board-to-board connector 900 is set can be protected.

[0050] Reference Figures 1 to 7 According to a second aspect embodiment of the present invention, the mobile phone includes a side fingerprint recognition component as described in the first aspect embodiment.

[0051] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A side-mounted fingerprint recognition component, characterized in that, include: A metal ring (100) is provided with a first limiting groove (101), a second limiting groove (102), a receiving space (103), and a side opening (104); the first limiting groove (101) is provided at the top of the metal ring (100) and above the receiving space (103), the top end of the receiving space (103) extends to the bottom wall of the first limiting groove (101) and forms a first opening (105); the second limiting groove (102) is provided at the bottom of the metal ring (100) and below the receiving space (103), the bottom end of the receiving space (103) extends to the top wall of the second limiting groove (102) and forms a second opening (106); the side opening (104) is provided on the side of the metal ring (100) and communicates with the side end of the second limiting groove (102); A cover plate (200) is disposed in the first limiting groove (101); the cover plate (200) abuts against the bottom wall of the first limiting groove (101) and covers the first opening (105). A circuit board (300) has at least one end of which passes through the side opening (104) and is disposed in the second limiting groove (102); the portion of the circuit board (300) located in the second limiting groove (102) abuts against the top wall of the second limiting groove (102) and covers the second opening (106). A sensing component is located within the accommodating space (103); the sensing component includes a fingerprint recognition chip (410), a connecting wire (420), and a capacitor / resistor (430); the fingerprint recognition chip (410) and the capacitor / resistor (430) are both disposed on the circuit board (300), with the fingerprint recognition chip (410) and the capacitor / resistor (430) spaced apart; the two ends of the connecting wire (420) are respectively connected to the fingerprint recognition chip (410) and the circuit board (300); A filler (500) is disposed within the receiving space (103); the filler (500) covers the fingerprint recognition chip (410), the connecting wire (420) and the capacitor resistor (430).

2. The side fingerprint recognition component according to claim 1, characterized in that, It also includes a first annular layer (610); the first annular layer (610) is disposed between the cover plate (200) and the bottom wall of the first limiting groove (101).

3. The side fingerprint recognition component according to claim 1, characterized in that, It also includes a second annular layer (620); the second annular layer (620) is disposed between the circuit board (300) and the top wall of the second limiting groove (102).

4. The side fingerprint recognition component according to claim 1, characterized in that, It also includes a first reinforcing plate (710); the first reinforcing plate (710) is connected to the end of the circuit board (300) away from the fingerprint recognition chip (410) and is located below the fingerprint recognition chip (410); the first reinforcing plate (710) is at least partially located in the second limiting groove (102).

5. The side fingerprint recognition component according to claim 4, characterized in that, It also includes an injection-molded support (800); the injection-molded support (800) is disposed at the lower end of the first reinforcing plate (710).

6. The side fingerprint recognition component according to claim 1, characterized in that, The sensing component also includes a connection layer (440); the connection layer (440) is disposed between the circuit board (300) and the fingerprint recognition chip (410).

7. The side fingerprint recognition component according to claim 1, characterized in that, The filler (500) abuts against the peripheral wall of the accommodating space (103) and against the top wall of the circuit board (300) and the bottom wall of the cover plate (200).

8. The side fingerprint recognition component according to claim 1, characterized in that, The cross-section of the accommodating space (103) is smaller than the cross-section of the first limiting groove (101) and the cross-section of the second limiting groove (102).

9. The side fingerprint recognition component according to claim 1, characterized in that, It also includes a second reinforcing plate (720) and a board-to-board connector (900); the second reinforcing plate (720) and the board-to-board connector (900) are both disposed at one end of the circuit board (300) away from the metal ring (100), and are respectively disposed on opposite sides of the circuit board (300).

10. A mobile phone, characterized in that, include: The side fingerprint recognition component according to any one of claims 1 to 9.

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