Chemical mechanical polishing system

Abstract

This invention provides a chemical mechanical polishing (CMP) system, belonging to the field of CMP technology. It includes a receiving unit and a working unit disposed on one side of the receiving unit along a first path. The working unit includes a polishing module, a transport module, and a cleaning module sequentially distributed along a second path, perpendicular to the first path. The receiving unit is used to receive wafers to be polished and wafers that have completed cleaning. The transport module is used to move the wafers between the polishing module, the cleaning module, and the receiving unit. The CMP system provided by this invention aims to solve the problems of low space utilization, insufficient transport flexibility, and inadequate cleaning efficiency in existing CMP equipment.

Description

Technical Field

[0001] This utility model belongs to the field of chemical mechanical polishing technology, and more specifically, relates to a chemical mechanical polishing system. Background Technology

[0002] Chemical mechanical polishing (CMP) technology is a key process for achieving global planarization of material surfaces in fields such as semiconductor manufacturing and precision optical device processing. The performance of its equipment has a decisive impact on product quality and production efficiency.

[0003] Currently, traditional chemical mechanical polishing (CMP) equipment generally adopts a single-layer working mode in its layout design, with the pre-processing unit, polishing unit, and cleaning unit arranged linearly. This results in a crowded space configuration, a limited number of cleaning modules, and difficulty in breaking through the bottleneck of overall work efficiency. In terms of wafer transfer, it mainly relies on single-axis or fixed-track robots, with fixed transfer paths and extremely limited room for process optimization. It cannot flexibly meet diverse wafer transfer needs, nor can it provide diverse cleaning methods for different polishing requirements.

[0004] Furthermore, existing CMP equipment typically employs a fixed, series-connected layout for polishing and cleaning modules, resulting in a severe lack of modular design. This leads to a closed equipment structure, high upgrade costs, and difficulty in flexibly adjusting to process changes, significantly limiting the equipment's adaptability and scalability. These technical deficiencies result in significant shortcomings in traditional CMP equipment regarding space utilization, transport flexibility, and cleaning efficiency, necessitating the development of novel layout schemes to improve equipment performance and production efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a chemical mechanical polishing system that addresses the problems of low space utilization, insufficient transmission flexibility, and inadequate cleaning efficiency in existing CMP equipment.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A chemical mechanical polishing system is provided, including a storage unit and a working unit disposed on one side of the storage unit along a first path. The working unit includes a polishing module, a transfer module, and a cleaning module sequentially distributed along a second path, the second path being perpendicular to the first path. The storage unit is used to store wafers to be polished and wafers that have been cleaned. The transfer module is used to move the wafers between the polishing module, the cleaning module, and the storage unit.

[0008] The cleaning module includes multiple sets of cleaning components distributed sequentially along the first path, and each set of cleaning components includes:

[0009] The preliminary cleaning unit is used for preliminary cleaning of the wafers;

[0010] Multiple deep cleaning units, some of which are sequentially distributed along the first path on one side of the preliminary cleaning unit, and others of which are sequentially located vertically on one side of the preliminary cleaning unit, are used to perform deep cleaning on the wafers that have completed the preliminary cleaning; and

[0011] A drying unit, located on one side of one of the deep cleaning units along the first path or in a vertical direction, is used to dry the wafers that have undergone deep cleaning.

[0012] In one possible implementation, the transmission module includes:

[0013] A polishing transport assembly includes a polishing robot and a transport track, the transport track extending along a first path and corresponding to the polishing module along a second path. It also includes a transport bracket slidably connected to the transport track and a transport drive mechanism connected to the transport bracket. The transport bracket carries a wafer, the polishing robot moves the wafer between the polishing module, the transport bracket, and the cleaning module, and the transport drive mechanism drives the transport bracket to slide along the first path.

[0014] The cleaning and transfer assembly includes a cleaning robot and a transfer track, the transfer track extending along the first path and corresponding to the cleaning module, and further includes a transfer bracket slidably connected to the transfer track and a transfer drive mechanism connected to the transfer bracket. The transfer bracket is used to transfer the wafers dried by the drying mechanism to the wafers in the storage unit. The cleaning robot is used to move the wafers between the cleaning module and the transfer bracket. The transfer drive mechanism is used to drive the transfer bracket to slide along the first path.

[0015] In one possible implementation, multiple conveying supports are spaced apart along the vertical direction, and each conveying support is slidably connected to the conveying track; multiple transfer supports are spaced apart along the vertical direction, and each transfer support is slidably connected to the transfer track.

[0016] In one possible implementation, the deep cleaning mechanism is provided above the preliminary cleaning mechanism and on one side along the first path, and the drying mechanism is arranged diagonally opposite to the preliminary cleaning mechanism. The preliminary cleaning mechanism, the deep cleaning mechanism, and the drying mechanism are arranged in a rectangular pattern.

[0017] In one possible implementation, the cleaning robot is configured in a one-to-one correspondence with the cleaning components, and the cleaning robot is located along the first path between the preliminary cleaning mechanism and the deep cleaning mechanism.

[0018] In one possible implementation, the polishing module includes a support platform and multiple sets of polishing components sequentially distributed along the first path on the support platform, the polishing components including:

[0019] A polishing support includes a rotating shaft and a plurality of drive arms radially connected to the rotating shaft. The rotating shaft is rotatably connected to the support platform with the vertical direction as the pivot, and the drive arms extend radially along the rotating shaft.

[0020] Multiple polishing heads are arranged one-to-one with the drive arm, and the polishing heads are connected to the drive arm for adsorbing wafers; and

[0021] Multiple polishing discs are distributed at intervals along the first path, and the polishing discs cooperate with the corresponding polishing heads to polish the wafer.

[0022] In one possible implementation, the polishing robot is positioned between two adjacent sets of the polishing components.

[0023] In one possible implementation, the storage unit includes:

[0024] The storage rack has inlets and outlets for moving wafers in and out.

[0025] Wafer case, disposed on the storage rack; and

[0026] A robotic arm is used to place the wafers to be cleaned from the wafer cassette into the transfer module, and to place the cleaned wafers from the transfer module into the wafer cassette.

[0027] The beneficial effects of the chemical mechanical polishing system provided by this utility model are as follows: Compared with the prior art, by arranging the polishing module, transfer module, and cleaning module in the working unit along a second path perpendicular to the storage unit, and simultaneously extending multiple cleaning components of the cleaning module horizontally along the first path and combining them with a multi-layer layout in the vertical direction, a compact and efficient three-dimensional spatial distribution structure is formed. The cleaning components employ a combination of a preliminary cleaning mechanism, multiple deep cleaning mechanisms distributed alternately in the horizontal and vertical directions, and a flexibly configured drying mechanism. This not only significantly increases the number of cleaning stations per unit area but also achieves parallel processing of the cleaning process through multi-dimensional distribution. The coordinated cooperation between the transfer module and the multi-layer cleaning mechanism enables the wafer to flow synchronously in the horizontal and vertical directions, optimizing the integration of the overall equipment layout and breaking through the spatial limitations of the traditional single-layer linear cleaning mode. This significantly improves wafer processing efficiency and reduces the equipment footprint. Furthermore, the modular distribution allows for flexible adjustment of the cleaning station combination according to process requirements, achieving both high throughput and process adaptability. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the structure of the chemical mechanical polishing system provided in this embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the polishing assembly used in an embodiment of the present invention.

[0031] In the diagram: 1. Storage unit; 2. Polishing module; 201. Support platform; 202. Polishing disc; 203. Polishing bracket; 2031. Rotating shaft; 2032. Drive arm; 204. Polishing head; 3. Transmission module; 301. Polishing transmission component; 3011. Conveying track; 3012. Conveying bracket; 3013. Polishing robot; 302. Cleaning and transfer component; 3021. Transfer track; 3022. Transfer bracket; 3023. Cleaning robot; 4. Cleaning module; 401. Preliminary cleaning mechanism; 402. Deep cleaning mechanism; 403. Drying mechanism. Detailed Implementation

[0032] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0033] In the claims, description, and accompanying drawings of this utility model, unless otherwise expressly defined, the terms "first," "second," or "third," etc., are used to distinguish different objects, not to describe a specific order. Unless otherwise stated, other directional terms, such as "vertical," "clockwise," and "counterclockwise," indicate orientation or positional relationships based on the orientation and positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, not to indicate or imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this utility model. In the claims, description, and accompanying drawings of this utility model, unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" should be interpreted broadly, that is, any connection method in which there is no displacement relationship or relative rotation relationship between the two, that is, including non-removable fixed connection, detachable fixed connection, integral connection, and fixed connection through other devices or elements. In the claims, description, and accompanying drawings of this utility model, the terms "comprising," "having," and their variations are intended to mean "including but not limited to."

[0034] Please refer to the following: Figure 1 and Figure 2 The chemical mechanical polishing system provided by this utility model will now be described. A chemical mechanical polishing (CMP) system includes a receiving unit 1 and a working unit located on one side of the receiving unit 1 along a first path. The working unit includes a polishing module 2, a transport module 3, and a cleaning module 4 arranged sequentially along a second path, which is perpendicular to the first path. The receiving unit 1 is used to receive wafers to be polished and wafers that have been cleaned. The transport module 3 is used to move the wafers between the polishing module 2, the cleaning module 4, and the receiving unit 1. The cleaning module 4 includes multiple sets of cleaning components arranged sequentially along the first path. Each set of cleaning components includes a preliminary cleaning mechanism 401, a drying mechanism 403, and multiple deep cleaning mechanisms 402. The preliminary cleaning mechanism 401 is used to perform preliminary cleaning on the wafer. Some of the deep cleaning mechanisms 402 are arranged sequentially along the first path on one side of the preliminary cleaning mechanism 401, and another part of the deep cleaning mechanisms 402 are arranged sequentially in the vertical direction on one side of the preliminary cleaning mechanism 401, for performing deep cleaning on the wafers that have been preliminarily cleaned. The drying mechanism 403 is located along the first path or in the vertical direction on one side of one set of deep cleaning mechanisms 402, for drying the wafers that have been deep cleaned.

[0035] The chemical mechanical polishing system provided by this utility model, compared with the prior art, arranges the polishing module 2, the transfer module 3, and the cleaning module 4 in the working unit along a second path perpendicular to the storage unit 1, while simultaneously extending multiple cleaning components of the cleaning module 4 horizontally along the first path and combining them with a multi-layer layout in the vertical direction, forming a compact and efficient three-dimensional spatial distribution structure. The cleaning components employ a combination of a preliminary cleaning mechanism 401, multiple depth cleaning mechanisms 402 distributed alternately in the horizontal and vertical directions, and a flexibly configured drying mechanism 403. This not only significantly increases the number of cleaning stations per unit area but also achieves parallel processing of the cleaning process through multi-dimensional distribution. The coordinated cooperation between the transfer module 3 and the multi-layer cleaning mechanism enables the wafer to flow synchronously in the horizontal and vertical directions, optimizing the integration of the overall equipment layout and breaking through the spatial limitations of the traditional single-layer linear cleaning mode. This significantly improves wafer processing efficiency and reduces the equipment footprint. Furthermore, the modular distribution allows for flexible adjustment of the cleaning station combination according to process requirements, achieving both high throughput and process adaptability.

[0036] It should be noted that the storage unit 1 has a wafer box for storing wafers and a wafer pick-and-place robot for picking up and placing wafers. The wafer pick-and-place robot is used to remove or place wafers from the wafer box.

[0037] In some embodiments, please refer to Figure 1 The transfer module 3 includes a polishing transfer assembly 301 and a cleaning transfer assembly 302. The polishing transfer assembly 301 includes a polishing robot 3013 and a transport track 3011. The transport track 3011 extends along a first path and corresponds to the polishing module 2 along a second path. It also includes a transport bracket 3012 slidably connected to the transport track 3011 and a transport drive mechanism connected to the transport bracket 3012. The transport bracket 3012 is used to carry the wafer. The polishing robot 3013 is used to move the wafer between the polishing module 2, the transport bracket 3012, and the cleaning module 4. The transport drive mechanism is used to drive the transport bracket 3012. 12 Slides along the first path; the cleaning and transfer assembly 302 includes a cleaning robot 3023 and a transfer track 3021. The transfer track 3021 extends along the first path and corresponds to the cleaning module 4. It also includes a transfer bracket 3022 slidably connected to the transfer track 3021 and a transfer drive mechanism connected to the transfer bracket 3022. The transfer bracket 3022 is used to transfer the wafers that have completed the drying process of the drying mechanism to the wafers in the storage unit. The cleaning robot 3023 is used to move the wafers between the cleaning module 4 and the transfer bracket 3022. The transfer drive mechanism is used to drive the transfer bracket 3022 to slide along the first path.

[0038] In this embodiment, the polishing transfer component 301 and the cleaning transfer component 302 work together. The polishing transfer component 301 uses a conveyor track 3011 extending along a first path in conjunction with a sliding conveyor bracket 3012, enabling the polishing robot 3013 to efficiently and flexibly transfer wafers between the polishing module 2, the conveyor bracket 3012, and the cleaning module 4. Simultaneously, the cleaning transfer component 302, through a transfer track 3021 arranged along the first path and a movable transfer bracket 3022, enables the cleaning robot 3023 to quickly transfer wafers between the cleaning module 4 and the transfer bracket 3022. This transfer method not only achieves automated docking between the polishing and cleaning processes but also, through precise control of the conveying and transfer drive mechanisms, allows the wafers to slide smoothly in the horizontal direction, significantly improving the efficiency and positioning accuracy of wafer transfer while reducing the robot's travel distance and lowering equipment operating energy consumption. Furthermore, the optimized layout of the track-type transfer mechanism improves the utilization of the internal space of the equipment, making the overall structure more compact.

[0039] Optionally, both the conveying drive mechanism and the transfer drive mechanism are telescopic components, and both extend and retract along the first path.

[0040] It should be noted that when the wafer is placed from the storage unit 1 onto the transport bracket 3012 and moves with the transport bracket 3012 to the designated polishing module 2, the transport robot transfers the wafer from the transport bracket 3012 to the polishing module 2. After the polishing operation is completed, the transport robot transfers the wafer to the preliminary cleaning mechanism 401. After the wafer completes the preliminary cleaning, the transport robot transfers the wafer from the preliminary cleaning mechanism 401 to the deep cleaning mechanism 402, and after the wafer completes the deep cleaning, it is transferred to the transport bracket 3022, from which it is sent back to the storage unit 1.

[0041] In some embodiments, please refer to Figure 1 Multiple conveying supports 3012 are spaced apart along the vertical direction, and each conveying support 3012 is slidably connected to the conveying track 3011; multiple transfer supports 3022 are spaced apart along the vertical direction, and each transfer support 3022 is slidably connected to the transfer track 3021.

[0042] This embodiment achieves multi-layer parallel transport of wafers in the vertical direction by setting multiple vertically spaced transport supports 3012 and 3022 on the transport track 3011 and transfer track 3021, respectively. This allows multiple wafers to be carried asynchronously on the same transport track simultaneously, significantly improving the wafer cleaning efficiency per unit time. This three-dimensional transport architecture not only effectively utilizes the height space of the equipment, making the overall layout more compact, but also reduces wafer waiting time through a hierarchical scheduling mechanism, making the connection between the polishing module 2 and the cleaning module 4 smoother. The multi-support collaborative working scheme maintains the positioning accuracy of traditional single-layer transport while significantly improving the parallel processing capability of the system through vertical expansion. At the same time, the independent sliding control of each support ensures the flexibility and reliability of wafer transport.

[0043] Optionally, the conveying bracket 3012 is connected to the conveying drive mechanism in a one-to-one correspondence, and the transfer bracket 3022 is connected to the transfer drive mechanism in a one-to-one correspondence.

[0044] In some embodiments, please refer to Figure 1 The conveying drive mechanism includes a conveying screw and a conveying driver. The conveying screw is rotatably connected to the conveying track 3011 and is parallel to the conveying track 3011. The conveying bracket 3012 is screwed to the conveying screw. The conveying driver is connected to the conveying screw and is used to drive the conveying screw to rotate around its own axis.

[0045] Driven by a conveyor driver, the conveyor screw rotates, converting this rotational motion into linear displacement of the conveyor bracket 3012 along the track. This drive method offers advantages such as high transmission precision, smooth operation, and accurate positioning. It effectively avoids slippage and vibration issues that may occur with traditional belt or chain drives, ensuring the stability and positional repeatability of the wafer during transport. Furthermore, the screw drive mechanism is compact and rigid, making it particularly suitable for long-term reliable operation in cleanroom environments. It not only meets the high precision requirements of semiconductor manufacturing for wafer transport equipment but also achieves precise stopping of the conveyor bracket 3012 through its mechanical self-locking characteristic, eliminating the need for additional braking devices. This simplifies the system structure and improves the reliability of equipment operation.

[0046] Optionally, the drive for the feed is a motor.

[0047] In some embodiments, please refer to Figure 1 The transfer drive mechanism includes a transfer screw and a transfer driver. The transfer screw is rotatably connected to the transfer track 3021 and is parallel to the transfer track 3021. The transfer bracket 3022 is screwed to the transfer screw. The transfer driver is connected to the transfer screw and is used to drive the transfer screw to rotate around its own axis.

[0048] By employing a screw drive mechanism to drive the transfer bracket 3022, where the transfer screw is arranged parallel to the transfer track 3021 and forms a precision thread engagement with the transfer bracket 3022, precise rotational-linear motion conversion is achieved under the control of the transfer driver. The high rigidity of the screw drive ensures smoothness and positioning accuracy during wafer transfer. The self-locking characteristic of the thread engagement eliminates the backlash that may occur in traditional transmission methods, allowing the transfer bracket 3022 to stop precisely at any position, avoiding vibration or offset of the wafer at the end of the transfer process.

[0049] Optionally, the transfer drive is a motor.

[0050] In some embodiments, please refer to Figure 1 A deep cleaning mechanism 402 is provided above the preliminary cleaning mechanism 401 and along one side of the first path, and a drying mechanism 403 is provided diagonally opposite to the preliminary cleaning mechanism 401. The preliminary cleaning mechanism 401, the deep cleaning mechanism 402 and the drying mechanism 403 are arranged in a rectangular shape.

[0051] This embodiment employs a rectangular layout for the preliminary cleaning mechanism 401, deep cleaning mechanism 402, and drying mechanism 403. The deep cleaning mechanism 402 is positioned above the preliminary cleaning mechanism 401 and along one side of the first path, while the drying mechanism 403 is arranged diagonally opposite to the preliminary cleaning mechanism 401. This arrangement fully utilizes both horizontal and vertical space, achieving high-density integration of multiple workstations within a limited footprint and significantly improving the space utilization efficiency of the cleaning unit. The diagonally positioned drying mechanism 403 forms the shortest path loop with the preliminary cleaning mechanism 401. Combined with the three-dimensional layout of the upper and lower deep cleaning mechanisms 402, this allows the wafer to complete the entire "preliminary cleaning-deep cleaning-drying" process within a compact space, significantly shortening the wafer transfer path.

[0052] Specifically, this embodiment includes two sets of deep cleaning mechanisms 402, one set of preliminary cleaning mechanism 401, and one set of drying mechanism 403.

[0053] In some embodiments, please refer to Figure 1 The cleaning robot 3023 is set up in a one-to-one correspondence with the cleaning components, and the cleaning robot 3023 is located between the preliminary cleaning mechanism 401 and the deep cleaning mechanism 402 along the first path.

[0054] The cleaning robot 3023 is configured in a one-to-one correspondence with each cleaning component, enabling the cleaning robot 3023 to flexibly transfer the wafers flowing within each cleaning component, thus improving the wafer transfer efficiency. Simultaneously, the modular layout allows multiple sets of cleaning robots 3023 to operate in parallel, resulting in a linear increase in system throughput with the number of cleaning stations, while also facilitating the implementation of differentiated cleaning process solutions.

[0055] In some embodiments, please refer to Figure 2 The polishing module 2 includes a support platform 201 and multiple polishing components distributed sequentially along a first path on the support platform 201. Each polishing component includes a polishing bracket 203, a polishing disc 202, and multiple polishing heads 204. The polishing bracket 203 includes a rotating shaft 2031 and multiple drive arms 2032 radially connected to the rotating shaft 2031. The rotating shaft 2031 is rotatably connected to the support platform 201 with the vertical direction as the pivot. The drive arms 2032 extend radially along the rotating shaft 2031. The multiple polishing heads 204 are arranged one-to-one with the drive arms 2032 and are connected to the drive arms 2032 for adsorbing wafers. Multiple polishing discs 202 are distributed at intervals along the first path. The polishing discs 202 cooperate with the corresponding polishing heads 204 to polish the wafers.

[0056] The multiple polishing components distributed along the first path on the support platform 201 adopt a radial drive arm 2032 structure. Each polishing bracket 203 drives multiple radially extending drive arms 2032 to move synchronously via a rotating shaft 2031, enabling the corresponding polishing head 204 to perform precise polishing operations. This radial multi-polishing head 204 layout achieves parallel processing capability for multiple wafers within a single polishing component. Combined with multiple polishing disks 202 spaced apart along the first path, it forms a highly efficient space-reuse polishing system, effectively increasing the wafer processing capacity per unit time. The rigid connection structure between the rotating shaft 2031 and the drive arm 2032 ensures the stability of the polishing process, while the vertical shaft design optimizes the equipment space utilization. The coordinated cooperation of the multiple polishing heads 204 and the polishing disks 202 not only improves polishing uniformity and surface quality but also enables flexible configuration of the process flow through modular distribution.

[0057] In some embodiments, please refer to Figure 1 and Figure 2 A polishing robot 3013 is provided between two adjacent polishing components.

[0058] This embodiment enables parallel transmission and processing of wafers within the polishing module 2, allowing for free switching of wafers between various polishing components. The number of polishing passes can be determined according to actual needs, thus flexibly delivering the wafers to the appropriate polishing components.

[0059] In some embodiments, please refer to Figure 1 The storage unit 1 includes a storage rack, a wafer box, and a pick-and-place robot. The storage rack has an inlet and an outlet for wafers to enter and exit. The wafer box is located on the storage rack. The pick-and-place robot is used to place the wafers to be cleaned in the wafer box into the transfer module 3, and to place the wafers that have been cleaned on the transfer module 3 into the wafer box.

[0060] The robotic arm removes the wafers to be cleaned from the wafer cassette and places them into the transfer module 3. After being cleaned by the polishing module 2 and the cleaning module 4, the wafers are transported by the transfer module 3 to the inlet of the storage rack. The robotic arm then places the cleaned wafers into the corresponding wafer cassettes. This embodiment achieves automatic wafer handling, optimizing wafer storage and organization.

[0061] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chemical mechanical polishing system, characterized in that, The device includes a storage unit and a working unit disposed on one side of the storage unit along a first path. The working unit includes a polishing module, a transfer module, and a cleaning module sequentially distributed along a second path, which is perpendicular to the first path. The storage unit is used to store wafers to be polished and wafers that have been cleaned. The transfer module is used to move the wafers between the polishing module, the cleaning module, and the storage unit. The cleaning module includes multiple sets of cleaning components distributed sequentially along the first path, and each set of cleaning components includes: The preliminary cleaning unit is used for preliminary cleaning of the wafers; Multiple deep cleaning units, some of which are sequentially distributed along the first path on one side of the preliminary cleaning unit, and others of which are sequentially located vertically on one side of the preliminary cleaning unit, are used to perform deep cleaning on the wafers that have completed the preliminary cleaning; and A drying unit, located on one side of one group of deep cleaning units along the first path or in a vertical direction, is used to dry the wafers that have undergone deep cleaning.

2. The chemical mechanical polishing system as described in claim 1, characterized in that, The transmission module includes: A polishing transport assembly includes a polishing robot and a transport track, the transport track extending along a first path and corresponding to the polishing module along a second path. It also includes a transport bracket slidably connected to the transport track and a transport drive mechanism connected to the transport bracket. The transport bracket carries a wafer, the polishing robot moves the wafer between the polishing module, the transport bracket, and the cleaning module, and the transport drive mechanism drives the transport bracket to slide along the first path. The cleaning and transfer assembly includes a cleaning robot and a transfer track, the transfer track extending along the first path and corresponding to the cleaning module, and further includes a transfer bracket slidably connected to the transfer track and a transfer drive mechanism connected to the transfer bracket. The transfer bracket is used to transfer the wafers dried by the drying mechanism to the wafers in the storage unit. The cleaning robot is used to move the wafers between the cleaning module and the transfer bracket. The transfer drive mechanism is used to drive the transfer bracket to slide along the first path.

3. The chemical mechanical polishing system as described in claim 2, characterized in that, The conveying brackets are arranged in multiple intervals along the vertical direction, and each conveying bracket is slidably connected to the conveying track; the transfer brackets are arranged in multiple intervals along the vertical direction, and each transfer bracket is slidably connected to the transfer track.

4. The chemical mechanical polishing system as described in claim 1, characterized in that, The deep cleaning mechanism is provided above the preliminary cleaning mechanism and along one side of the first path, and the drying mechanism is arranged diagonally opposite the preliminary cleaning mechanism. The preliminary cleaning mechanism, the deep cleaning mechanism and the drying mechanism are arranged in a rectangular pattern.

5. The chemical mechanical polishing system as described in claim 2, characterized in that, The cleaning robot is configured in a one-to-one correspondence with the cleaning components, and the cleaning robot is located between the preliminary cleaning mechanism and the deep cleaning mechanism along the first path.

6. The chemical mechanical polishing system as described in claim 2, characterized in that, The polishing module includes a support platform and multiple polishing components sequentially distributed along the first path on the support platform. The polishing components include: A polishing support includes a rotating shaft and a plurality of drive arms radially connected to the rotating shaft. The rotating shaft is rotatably connected to the support platform with the vertical direction as the pivot, and the drive arms extend radially along the rotating shaft. Multiple polishing heads are arranged one-to-one with the drive arm, and the polishing heads are connected to the drive arm for adsorbing wafers; and Multiple polishing discs are distributed at intervals along the first path, and the polishing discs cooperate with the corresponding polishing heads to polish the wafer.

7. The chemical mechanical polishing system as described in claim 6, characterized in that, The polishing robot is provided between two adjacent sets of polishing components.

8. The chemical mechanical polishing system as described in claim 1, characterized in that, The storage unit includes: The storage rack has inlets and outlets for moving wafers in and out. Wafer case, disposed on the storage rack; and A robotic arm is used to place the wafers to be cleaned from the wafer cassette into the transfer module, and to place the cleaned wafers from the transfer module into the wafer cassette.

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