A ball-planting and feeding device based on vision detection and positioning

Abstract

This utility model relates to the field of chip ball placement and discloses a ball placement and unloading device based on vision detection and positioning. The device includes: a processing table with a ball placement and unloading mechanism mounted on it; the ball placement and unloading mechanism includes a servo motor, a rotating shaft, a fixing plate, a sleeve plate, a BGA material placement rack, a vision camera, a control processing panel, a hydraulic cylinder, a moving frame, a stencil, and a switching component; the servo motor is fixedly installed at the bottom of the processing table, and its output end is fixedly connected to the rotating shaft; the fixing plate is fixedly sleeved on the outside of the rotating shaft, and the sleeve plate is engaged with the fixing plate; the BGA material placement rack is fixedly connected to the sleeve plate; and the hydraulic rod of the hydraulic cylinder is fixedly connected to the moving frame. This utility model has the following advantages and effects: it can automatically identify whether there are missing or excess solder balls after ball placement, saving time and effort; and it is convenient to change solder balls when placing balls for different types of chips.

Description

Technical Field

[0001] This utility model relates to the field of chip ball implantation technology, and in particular to a ball implantation feeding device based on vision detection and positioning. Background Technology

[0002] With advancements in integration technology, equipment improvements, and the use of deep submicron technology, LSI, VLSI, and ULSI have emerged, continuously increasing the integration density of silicon single chips. This has led to more stringent requirements for integrated circuit packaging, a dramatic increase in the number of I / O pins, and consequently, higher power consumption. To meet these evolving needs, Ball Grid Array (BGA) packaging has been added to the existing packaging options. Memory packaged using BGA technology can increase memory capacity by two to three times without changing the overall size. BGA ball placement requires a stencil with circular ball holes corresponding to solder pads. During ball placement, the stencil is positioned on the chip, and solder balls are placed in each hole. The solder balls are melted and fixed to the chip using heating or other soldering techniques. After cooling, the stencil is removed, completing the BGA ball placement process.

[0003] The prior art, with publication number CN221282047U, discloses a BGA ball-planting device, belonging to the field of BGA ball-planting technology. It includes a heating base structure and a ball-planting steel mesh structure used in conjunction with each other. The heating base structure includes a support base, a jig pick-and-place handle is fixedly installed on the side of the support base, a BGA material placement position is fixedly installed on the upper surface of the support base, a BGA pick-up position is provided on the BGA material placement position, and a guide unit is provided on the support base for guiding the ball-planting steel mesh structure.

[0004] After the ball placement is completed, staff need to manually check whether there are missing or extra solder balls, which is time-consuming and labor-intensive. Moreover, it is not convenient to change the balls when placing balls for different types of chips. Therefore, a ball placement device based on vision detection and positioning needs to be designed to solve the above problems.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a ball-planting and feeding device based on visual detection and positioning to solve the above-mentioned problems.

[0007] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a ball-planting and feeding device based on visual detection and positioning, comprising:

[0008] A processing table is provided with a ball-planting and feeding mechanism;

[0009] The ball-planting and feeding mechanism includes a servo motor, a rotating shaft, a fixed plate, a sleeve plate, a BGA material placement rack, a vision camera, a control processing panel, a hydraulic cylinder, a moving frame, a steel mesh, and a switching component;

[0010] The servo motor is fixedly installed at the bottom of the processing table. The output end of the servo motor is fixedly connected to the rotating shaft. The fixing plate is fixedly sleeved on the outside of the rotating shaft. The sleeve is snapped into the fixing plate. The BGA material placement rack is fixedly connected to the sleeve. The hydraulic rod of the hydraulic cylinder is fixedly connected to the moving frame. The top of the steel mesh is in contact with the moving frame.

[0011] The present invention is further configured as follows: the switching assembly includes a square plate, a positioning block, a threaded clamping cylinder, a top frame, an inner plate, a slide, and a powerful magnet. The square plate is slidably sleeved on the outside of the rotating shaft. The side of the positioning block is fixedly connected to the square plate, and the positioning block is engaged with the sleeve plate. The threaded clamping cylinder is threadedly sleeved on the outside of the rotating shaft, and the bottom of the threaded clamping cylinder abuts against the square plate. The top frame is fixedly installed on the top of the processing table. The vision camera, control processing panel, and hydraulic cylinder are all fixedly installed on the top frame. The inner plate and the powerful magnet are both fixedly installed on the movable frame. The bottom of the slide is fixedly connected to the steel mesh, and the slide is engaged with the inner plate. The slide is attracted to the powerful magnet.

[0012] A further feature of this invention is that the bottom of the BGA material placement rack is in contact with the processing table.

[0013] The above technical solution is used to support the BGA material placement rack.

[0014] A further feature of this invention is that a fixing groove is provided on the side of the sleeve plate, and the fixing plate is engaged with the fixing groove.

[0015] A further feature of this invention is that a positioning groove is provided on the top of the sleeve plate, and the positioning block is engaged with the positioning groove.

[0016] By adopting the above technical solution, the sleeve plate can be limited.

[0017] A further feature of this invention is that a rectangular hole is provided at the top of the inner plate, and the slide is engaged with the rectangular hole.

[0018] By adopting the above technical solution, the carriage can be limited.

[0019] A further feature of this invention is that a support frame is fixedly installed at the bottom of the processing table.

[0020] A further feature of this invention is that a guide member is fixedly provided on the top of the movable frame, and the guide member is slidably mounted on the top frame.

[0021] The beneficial effects of this utility model are:

[0022] This invention utilizes a ball-mounting and unloading mechanism that employs a vision camera to capture high-definition images of the chip after ball mounting. These images are then transmitted to a control processing panel for automatic comparison and analysis with preset standard images. This allows for rapid and accurate identification of defects such as missing, excess, or misaligned solder balls, eliminating the need for manual intervention and significantly reducing labor costs. It also improves detection efficiency and accuracy, avoiding misjudgments caused by human error. When replacing the BGA material placement rack, simply unscrew the threaded clamping cylinder, pull the square plate to disengage the positioning block from the sleeve plate, and the sleeve plate can be removed for replacement. The reverse operation secures the new placement rack. When replacing the stencil, simply pull the stencil to disengage the carriage from the inner plate and the strong magnet, then insert and attract the new stencil's carriage. This rapid switching structure simplifies the replacement process, shortens changeover time, and enables the equipment to quickly adapt to the ball-mounting requirements of different chip models, improving the equipment's versatility and production flexibility. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a ball-planting and feeding device based on vision detection and positioning proposed in this utility model. Figure 1 .

[0025] Figure 2 This is a schematic diagram of the structure of a ball-planting and feeding device based on vision detection and positioning proposed in this utility model. Figure 2 .

[0026] Figure 3 yes Figure 2 A schematic diagram of part A in the diagram.

[0027] Figure 4 yes Figure 2 A schematic diagram of part B in the diagram.

[0028] In the diagram, 1. Processing table; 2. Servo motor; 3. Rotary shaft; 4. Fixing plate; 5. Sleeve plate; 6. BGA material placement rack; 7. Square plate; 8. Positioning block; 9. Threaded clamping cylinder; 10. Top frame; 11. Vision camera; 12. Control processing panel; 13. Hydraulic cylinder; 14. Moving frame; 15. Inner plate; 16. Slide; 17. Steel mesh; 18. Strong magnet. Detailed Implementation

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood through the specific circumstances.

[0030] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0031] See Figure 1 , Figure 2 , Figure 3 and Figure 4 This utility model provides a ball-planting and feeding device based on vision detection and positioning, comprising:

[0032] Processing table 1 is equipped with a ball-planting and unloading mechanism. It should be noted that after the ball-planting and unloading is completed, it can automatically identify whether there are missing or extra solder balls after the ball-planting, which saves time and effort. Moreover, it is convenient to replace the balls when planting different types of chips.

[0033] The ball-planting and feeding mechanism includes a servo motor 2, a rotating shaft 3, a fixed plate 4, a sleeve plate 5, a BGA material placement rack 6, a vision camera 11, a control processing panel 12, a hydraulic cylinder 13, a moving frame 14, a steel mesh 17, and a switching component;

[0034] Servo motor 2 is fixedly installed at the bottom of processing table 1. The output end of servo motor 2 is fixedly connected to rotating shaft 3. Fixed plate 4 is fixedly sleeved on the outside of rotating shaft 3. Sleeve plate 5 is clamped to fixed plate 4. BGA material placement rack 6 is fixedly connected to sleeve plate 5. Hydraulic rod of hydraulic cylinder 13 is fixedly connected to moving frame 14. Top of steel mesh 17 is in contact with moving frame 14.

[0035] Using the above structure, the chip is placed on the BGA material placement rack 6. The servo motor 2 is started, causing the BGA material placement rack 6 to move under the stencil 17. Then, the hydraulic cylinder 13 is started, causing the bottom of the stencil 17 to adhere to the chip. Next, solder scraping and heating treatment is performed on the stencil 17. Then, the hydraulic cylinder 13 is started to separate the stencil 17 from the chip. The chip is then rotated back to its original position. The vision camera 11 records the chip and compares the captured image with the stored image to automatically identify whether there are missing or excess solder balls after ball placement. No manual judgment is required, which is more time-saving and labor-saving.

[0036] Specifically, the switching components include a square plate 7, a positioning block 8, a threaded clamping cylinder 9, a top frame 10, an inner plate 15, a slide 16, and a powerful magnet 18. The square plate 7 is slidably sleeved on the outside of the rotating shaft 3. The side of the positioning block 8 is fixedly connected to the square plate 7, and the positioning block 8 is engaged with the sleeve plate 5. The threaded clamping cylinder 9 is threadedly sleeved on the outside of the rotating shaft 3, and the bottom of the threaded clamping cylinder 9 abuts against the square plate 7. The top frame 10 is fixedly installed on the top of the processing table 1. The vision camera 11, the control processing panel 12, and the hydraulic cylinder 13 are all fixedly installed on the top frame 10. The inner plate 15 and the powerful magnet 18 are both fixedly installed on the moving frame 14. The bottom of the slide 16 is fixedly connected to the steel mesh 17. The slide 16 is engaged with the inner plate 15, and the slide 16 is attracted to the powerful magnet 18.

[0037] With the above structure, when ball-planting different types of chips, the threaded clamping cylinder 9 is rotated to remove it, and then the square plate 7 is pulled to separate the positioning block 8 from the sleeve plate 5. Then, the sleeve plate 5 can be removed by pulling it, which facilitates the replacement of the BGA material placement rack 6. The dimensions of each BGA material placement rack 6 are the same, the difference lies in the placement slot at the top of the BGA material placement rack 6. This makes it convenient to ball-plant different types of chips. In addition, the stencil 17 is pulled down to separate the carriage 16 from the strong magnet 18, and the stencil 17 is replaced. The dimensions of each stencil 17 are the same, the difference lies in the ball-planting mesh in the middle of the stencil 17. This makes it convenient to replace the stencil when ball-planting different types of chips.

[0038] Specifically, the bottom of the BGA material placement rack 6 is in contact with the processing table 1. It should be noted that the BGA material placement rack 6 is supported.

[0039] Specifically, a fixing groove is provided on the side of the sleeve plate 5, and the fixing plate 4 is engaged with the fixing groove. A positioning groove is provided on the top of the sleeve plate 5, and the positioning block 8 is engaged with the positioning groove. It should be noted that the sleeve plate 5 is subject to a limiting treatment.

[0040] Specifically, a rectangular hole is provided at the top of the inner plate 15, and the slide 16 is engaged with the rectangular hole. It should be noted that the slide 16 can be limited.

[0041] Specifically, a support frame is fixedly installed at the bottom of the processing table 1, and a guide is fixedly installed at the top of the movable frame 14. The guide is slidably installed on the top frame 10. It should be noted that this allows the movable frame 14 to move stably in the vertical direction.

[0042] Working principle:

[0043] S1: In the ball placement process, the chip is first placed and positioned. The staff puts the chip to be placed into the BGA material placement rack 6. The BGA material placement rack 6 is fixed by the sleeve plate 5 and the fixing plate 4. The sleeve plate 5 is also double-limited by the positioning block 8 and the threaded clamping cylinder 9 to ensure the chip is placed stably. The servo motor 2 is started, and its output end drives the rotating shaft 3 to rotate. Then, through the fixing plate 4 and the sleeve plate 5, the BGA material placement rack 6 is rotated, which transports the chip to the ball placement station directly below the stencil 17, completing the precise positioning of the chip.

[0044] S2: Start the hydraulic cylinder 13 on the top frame 10. The hydraulic rod extends and pushes the moving frame 14 to move vertically downward along the guide, driving the stencil 17 to descend synchronously until the bottom of the stencil 17 is in contact with the chip surface. At this time, the ball-planting holes on the stencil 17 correspond one by one with the chip pads. The staff fills the ball-planting holes with solder balls through an external solder scraping device. Then, heating is performed to melt the solder balls and initially fix them on the pads. After the ball-planting is completed, the hydraulic cylinder 13 drives the moving frame 14 to move upward, the stencil 17 separates from the chip, and the servo motor 2 starts again to rotate the chip after ball-planting to the vision inspection station.

[0045] S3: The vision camera 11 on the top frame 10 takes high-definition pictures of the chip ball surface and transmits the pictures to the control processing panel 12 in real time. The control processing panel 12 compares and analyzes the pictures with the preset standard ball images, automatically identifies whether there are defects such as missing, extra or offset solder balls, and feeds back the detection results to the staff. No manual visual inspection is required, which greatly improves the detection efficiency and accuracy.

[0046] S4: When it is necessary to implant balls for different types of chips, the switching component comes into play. When replacing the BGA material placement rack 6, first unscrew the threaded clamping cylinder 9, pull the square plate 7 upward to make the positioning block 8 disengage from the positioning groove of the sleeve plate 5, and then pull the sleeve plate 5 out of the fixing groove of the fixing plate 4 to remove the old BGA material placement rack 6. When replacing the new BGA material placement rack 6, the operation is reversed to complete the fixing. When replacing the stencil 17, pull the stencil 17 downward to make the carriage 16 disengage from the rectangular hole of the inner plate 15 and separate from the strong magnet 18, and remove the old stencil 17. When installing the new stencil 17, insert the carriage 16 into the rectangular hole and fix it with the strong magnet 18. Through this quick switching structure, it can adapt to the ball implantation needs of different types of chips, and the operation is convenient and efficient.

[0047] The present invention provides a detailed description of a ball-planting and feeding device based on visual detection and positioning. Specific embodiments have been used to illustrate the principle and implementation of the present invention. These embodiments are merely illustrative and are intended to aid in understanding the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A ball positioning and dispensing device based on visual detection, characterized in that, include: A processing table (1) is provided with a ball-planting and feeding mechanism; The ball-planting and feeding mechanism includes a servo motor (2), a rotating shaft (3), a fixed plate (4), a sleeve plate (5), a BGA material placement rack (6), a vision camera (11), a control processing panel (12), a hydraulic cylinder (13), a moving frame (14), a steel mesh (17), and a switching component; The servo motor (2) is fixedly installed at the bottom of the processing table (1). The output end of the servo motor (2) is fixedly connected to the rotating shaft (3). The fixing plate (4) is fixedly sleeved on the outside of the rotating shaft (3). The sleeve plate (5) is clamped to the fixing plate (4). The BGA material placement rack (6) is fixedly connected to the sleeve plate (5). The hydraulic rod of the hydraulic cylinder (13) is fixedly connected to the moving frame (14). The top of the steel mesh (17) is in contact with the moving frame (14).

2. The ball positioning and dispensing device based on visual detection according to claim 1, characterized in that, The switching assembly includes a square plate (7), a positioning block (8), a threaded clamping cylinder (9), a top frame (10), an inner plate (15), a slide (16), and a powerful magnet (18). The square plate (7) is slidably sleeved on the outside of the rotating shaft (3). The side of the positioning block (8) is fixedly connected to the square plate (7). The positioning block (8) is engaged with the sleeve plate (5). The threaded clamping cylinder (9) is threadedly sleeved on the outside of the rotating shaft (3). The bottom of the threaded clamping cylinder (9) is engaged with the square plate (7). The top frame (10) is fixedly installed on the top of the processing table (1). The vision camera (11), control processing panel (12) and hydraulic cylinder (13) are all fixedly installed on the top frame (10). The inner plate (15) and the strong magnet (18) are all fixedly installed on the moving frame (14). The bottom of the slide (16) is fixedly connected to the steel mesh (17). The slide (16) is engaged with the inner plate (15). The slide (16) is attracted to the strong magnet (18).

3. The ball positioning and dispensing device based on visual detection according to claim 1, characterized in that, The bottom of the BGA material placement rack (6) is in contact with the processing table (1).

4. The ball-planting and feeding device based on vision detection and positioning according to claim 1, characterized in that, The side of the sleeve (5) is provided with a fixing groove, and the fixing plate (4) is engaged with the fixing groove.

5. The ball positioning and dispensing device based on visual detection according to claim 2, characterized in that, The top of the sleeve plate (5) is provided with a positioning groove, and the positioning block (8) is engaged with the positioning groove.

6. The ball positioning and dispensing device based on visual detection according to claim 2, wherein, The inner plate (15) has a rectangular hole at the top, and the slide (16) is engaged with the rectangular hole.

7. The ball positioning and dispensing device based on visual detection according to claim 1, wherein, The bottom of the processing table (1) is fixedly equipped with a support frame.

8. The ball positioning and dispensing device based on visual detection according to claim 2, wherein, The top of the movable frame (14) is fixedly provided with a guide, which is slidably installed on the top frame (10).

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