Housing and electronic device

Abstract

The application relates to the technical field of electronic equipment, and discloses a shell and an electronic device. The shell comprises a main body and a first circuit board. The main body comprises one or more non-metal layers. A groove is formed in the main body. At least part of the first circuit board is accommodated in the groove. The first circuit board comprises a first surface at one end in the thickness direction of the first circuit board. The first surface faces a first non-metal layer in the one or more non-metal layers. At least part of the first surface is a conductive layer. In this way, the first non-metal layer can serve as a protective layer of the first circuit board. Therefore, the first circuit board does not need to be additionally provided with other protective layers, thereby facilitating the thinning design of the shell and reducing the space occupied by the shell.

Description

[0001] This application claims priority to Chinese Patent Application No. 202422029622.9, filed on August 20, 2024, entitled "House and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic device technology, and more particularly to a housing and an electronic device. Background Technology

[0003] To achieve different functions, electronic devices (such as mobile phones and tablets) have various circuit boards inside. For example, flexible printed circuits (FPCs) used for wireless charging can generate electromagnetic induction with the wireless charger, thereby generating current and enabling the wireless charging function of the electronic device.

[0004] However, current circuit board layouts in electronic devices occupy a significant amount of space, resulting in bulky and heavy devices. Utility Model Content

[0005] To address the aforementioned technical problems, this application provides a housing and an electronic device. The following describes this application from multiple aspects, and the embodiments and beneficial effects of these aspects can be referenced interchangeably.

[0006] A first aspect of this application provides a housing for an electronic device, the housing including a body and a first circuit board. The body includes one or more non-metallic layers, and a groove is formed on the body for receiving the first circuit board. At least a portion of the first circuit board is received in the groove. The first circuit board includes a first surface located at one end in its thickness direction, the first surface facing a first non-metallic layer in the one or more non-metallic layers, and at least a portion of the first surface being a conductive layer.

[0007] In the aforementioned housing, the first non-metallic layer of the main body can serve as a protective layer for the first circuit board. Thus, the first circuit board does not need to be provided with any additional protective layer, which is beneficial for achieving a thinner housing design and reducing the space occupied by the housing.

[0008] In one possible implementation of the first aspect described above, the tank is a closed tank. The first circuit board further includes a second surface located at the other end of the thickness direction of the first circuit board, the second surface facing a second non-metallic layer in one or more non-metallic layers, wherein at least a portion of the second surface is a conductive layer.

[0009] In this way, the second non-metallic layer can also serve as a protective layer for the first circuit board, eliminating the need for additional protective layers on the first circuit board. This makes it easier to thin the casing and further reduces the space occupied by the casing.

[0010] In one possible implementation of the first aspect described above, the first circuit board includes a connecting portion and a through hole is provided on the main body for exposing the connecting portion to the outside.

[0011] In this way, other external devices can be connected to the first circuit board to meet the usage requirements of different application scenarios. These other external devices can be, for example, other circuit boards.

[0012] In one possible implementation of the first aspect described above, the housing includes a conductive element that passes through a through-hole. One end of the conductive element is connected to a connecting portion, and the other end of the conductive element is located outside the through-hole. This allows other external devices to be more easily connected to the first circuit board.

[0013] In one possible implementation of the first aspect described above, the conductive element is a wire, a conductive post, or a flexible circuit board.

[0014] In one possible implementation of the first aspect described above, the ratio between the size of the first circuit board and the size of the main body along the thickness direction of the first circuit board is 0.1 to 0.6, for example, 0.1, 0.2, 0.3, or 0.4. This ensures that the thickness of the first circuit board is appropriate, improving the manufacturability of the housing.

[0015] In one possible implementation of the first aspect described above, the size of the main body along the thickness direction of the first circuit board can be 0.08mm to 1mm, for example, 0.08mm, 0.09mm, 0.1mm or 0.11mm, etc. The main body is relatively thin, which is conducive to realizing the lightweight design of the shell.

[0016] In one possible implementation of the first aspect described above, the size of the first circuit board can be 0.008mm to 0.6mm along the thickness direction of the first circuit board, for example, 0.008mm, 0.01mm or 0.1mm, etc. The first circuit board is relatively thin overall, which is conducive to realizing the lightweight design of the housing.

[0017] In one possible implementation of the first aspect described above, the main body includes at least one of a thermally conductive layer, a heat storage layer, and a heat insulation layer. The thermally conductive layer can transfer the heat generated during the operation of the first circuit board to other areas, contributing to heat dissipation and heat equalization. The heat storage layer can aid in thermal management. For example, the heat generated during the operation of the first circuit board can be absorbed by the heat storage layer, thereby preventing the generation of instantaneous high temperatures. Furthermore, in cold environments, the heat storage layer can release heat, preventing excessively low temperatures from affecting the normal operation of the first circuit board. The heat insulation layer can insulate against the heat generated during the operation of the first circuit board.

[0018] In one possible implementation of the first aspect described above, at least a portion of the non-exterior surface of the body constituting the housing is a thermally conductive layer. Thus, the heat generated during the operation of the first circuit board can be transferred to the non-exterior surface of the housing, rather than to the exterior surface, so that the user will not noticeably feel overheating of the exterior surface when holding the housing.

[0019] In one possible implementation of the first aspect described above, at least a portion of the main body constituting the outer surface of the housing is a heat-insulating layer. This prevents heat generated during the operation of the first circuit board from being transferred to the outer surface of the housing, thereby ensuring that the user does not noticeably feel overheating of the outer surface of the housing when holding it.

[0020] In one possible implementation of the first aspect described above, the material of the thermally conductive layer includes pitch-based carbon fiber, boron nitride, or graphite.

[0021] In one possible implementation of the first aspect described above, the material of the insulation layer includes foamed materials, hollow microspheres, or hollow fibers.

[0022] In one possible implementation of the first aspect described above, the material of the thermal storage layer includes phase change thermal storage materials and composite materials including phase change thermal storage materials.

[0023] In one possible implementation of the first aspect described above, the non-metallic layer may further include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first and third non-metallic layers are both made of continuous glass fiber, and the second non-metallic layer is a thermally conductive layer.

[0024] According to the embodiments of this application, continuous glass fiber has good strength, which helps to improve the mechanical properties of the housing. At the same time, the thermally conductive layer can transfer the heat generated by the first circuit board during operation to other areas, which helps to achieve heat dissipation and heat equalization. Therefore, by setting the materials of the first non-metallic layer and the third non-metallic layer as continuous glass fiber and setting the second non-metallic layer as a thermally conductive layer, it can be ensured that the housing has good mechanical properties, while also having heat dissipation and heat equalization effects.

[0025] In one possible implementation of the first aspect described above, the non-metallic layer may further include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is made of continuous glass fiber, and a portion of the second and third non-metallic layers is a thermally conductive layer.

[0026] This not only ensures that the casing has good mechanical properties, but also further improves heat dissipation and heat distribution.

[0027] In one possible implementation of the first aspect described above, the non-metallic layer may further include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat insulation layer, and the materials of the second and third non-metallic layers are both continuous glass fibers.

[0028] In this way, not only can the housing have good mechanical properties, but the heat insulation layer can also isolate the heat generated by the first circuit board during operation, thereby preventing the housing from overheating.

[0029] In one possible implementation of the first aspect described above, the non-metallic layer may further include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat storage layer, and the materials of the second and third non-metallic layers are both continuous glass fibers.

[0030] In this way, not only can the casing have good mechanical properties, but the heat storage layer can also help with heat management. For example, the heat generated when the first circuit board is working can be absorbed by the heat storage layer, thus preventing the generation of instantaneous high temperatures. Furthermore, in cold environments, the heat storage layer can release heat, preventing excessively low temperatures from affecting the normal operation of the first circuit board.

[0031] In one possible implementation of the first aspect described above, the non-metallic layer may include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a thermal insulation layer, the second non-metallic layer is a thermally conductive layer, and the third non-metallic layer is made of continuous glass fiber.

[0032] In this way, mechanical performance, heat dissipation, heat distribution, and heat insulation can be taken into account at the same time, resulting in better performance of the housing.

[0033] In one possible implementation of the first aspect described above, the non-metallic layer may include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat storage layer, the second non-metallic layer is made of a thermally conductive material, and the third non-metallic layer is made of continuous glass fiber.

[0034] In this way, mechanical performance, heat dissipation, heat dissipation, and thermal management can be taken into account simultaneously, resulting in better performance of the housing.

[0035] In one possible implementation of the first aspect described above, the non-metallic layer may include a second non-metallic layer and a third non-metallic layer. The first non-metallic layer, the third non-metallic layer, and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a thermal insulation layer, the second non-metallic layer is a thermally conductive layer, and the third non-metallic layer is a heat storage layer.

[0036] In this way, heat insulation, heat dissipation, heat equalization, and thermal management can be taken into account simultaneously, resulting in better performance of the casing.

[0037] In one possible implementation of the first aspect described above, the non-metallic layer may include a second non-metallic layer and a third non-metallic layer. The first, third, and second non-metallic layers are stacked along the thickness direction of the first circuit board. The first, second, and third non-metallic layers are all made of continuous glass fiber. Continuous glass fiber has good strength, which helps to improve the mechanical properties of the housing.

[0038] In one possible implementation of the first aspect described above, the first non-metallic layer is used to form the exterior surface of the housing, and the second non-metallic layer is used to form the non-exterior surface of the housing.

[0039] In one possible implementation of the first aspect described above, the first circuit board includes a base film and a conductive layer covering the base film, wherein the material of the base film is the same as the material of the non-metallic layer.

[0040] In this way, problems such as poor appearance and decreased mechanical properties caused by the difference in material properties between the base film and the main body can be reduced, resulting in a smoother and more aesthetically pleasing shell with better mechanical strength.

[0041] In one possible implementation of the first aspect described above, the first circuit board is a wireless charging circuit board.

[0042] A second aspect of this application provides an electronic device including a second circuit board and a housing as described in the first aspect and any possible implementation thereof. The first circuit board within the housing is electrically connected to the second circuit board.

[0043] It should be understood that the beneficial effects of the second aspect mentioned above can be referred to the description of the first aspect mentioned above, and will not be repeated here.

[0044] In one possible implementation of the second aspect above, the tank is a closed tank, the first circuit board includes a connecting part, and a through hole is provided on the main body for exposing the connecting part to the outside.

[0045] In this way, other external devices (such as a second circuit board) can be connected to the first circuit board to meet the usage requirements of different application scenarios.

[0046] In one possible implementation of the second aspect described above, the electronic device includes a spring that passes through a through hole, one end of which is connected to a connecting portion, and the other end of which is located outside the through hole and connected to a second circuit board.

[0047] In this way, the first circuit board and the second circuit board can be detachably electrically connected, so that the second circuit board can be disassembled and assembled without damaging the original structure, making the operation simple and convenient.

[0048] In one possible implementation of the second aspect described above, the through-hole is filled with conductive adhesive, and the connection portion is connected to the second circuit board via the conductive adhesive. Attached Figure Description

[0049] Figure 1 The present application shows schematic diagrams of the structure of a mobile phone in some embodiments;

[0050] Figure 2A Exemplary structures of wireless charging FPCs in some technical solutions are shown;

[0051] Figure 2B The setup of the wireless charging FPC is shown in some other technical solutions;

[0052] Figure 3 A top view of the spiral top conductive layer in some embodiments of this application is shown;

[0053] Figure 4A An exemplary structure of the battery cover in a mobile phone according to an embodiment of this application is shown;

[0054] Figure 4B according to Figure 4A An exemplary structure of the subject in an embodiment of this application is shown;

[0055] Figure 5A Exemplary structures of the tanks in other embodiments of this application are shown;

[0056] Figure 5B Exemplary structures of the tank are shown in some embodiments of this application;

[0057] Figure 5C Exemplary structures of the tanks in other embodiments of this application are shown;

[0058] Figure 6A This illustrates one exemplary configuration of the heat-conducting layer in the main body according to an embodiment of this application;

[0059] Figure 6B This application illustrates a second exemplary configuration of the heat-conducting layer in the main body.

[0060] Figure 7 This application illustrates an exemplary configuration of the thermal insulation layer in the main body.

[0061] Figure 8 This application illustrates an exemplary configuration of the thermal storage layer in the main body.

[0062] Figure 9A This application illustrates a combination scheme of the thermally conductive layer and the thermally insulating layer in the main body of an embodiment;

[0063] Figure 9B This application illustrates a combination scheme of the heat-conducting layer and the heat storage layer in the main body of an embodiment;

[0064] Figure 9C This application illustrates a combination scheme of the heat-conducting layer, heat-insulating layer, and heat-storing layer in the main body of an embodiment;

[0065] Figure 10A An exemplary structure of the wireless charging FPC in an embodiment of this application is shown;

[0066] Figure 10B An exemplary structure two of the wireless charging FPC in the embodiments of this application is shown;

[0067] Figure 10C An exemplary structure three of the wireless charging FPC in this application embodiment is shown;

[0068] Figure 10D An exemplary structure four of the wireless charging FPC in this application embodiment is shown;

[0069] Figure 10E This application illustrates an exemplary structure five of the wireless charging FPC in an embodiment of the present application;

[0070] Figure 11 This invention provides a schematic diagram illustrating the electrical connection between the wireless charging FPC and the motherboard via spring contacts in other embodiments of this application.

[0071] Figure 12 A schematic diagram of the bonding between the wireless charging FPC and the motherboard in an embodiment of this application is shown;

[0072] Figure 13An exemplary structure of the open slot in an embodiment of this application is shown;

[0073] Figure 14 The setup of the wireless charging FPC in other embodiments of this application is shown. Detailed Implementation

[0074] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0075] This application provides a housing that can be applied to an electronic device. Specifically, the electronic device includes, but is not limited to, any one of the following: mobile phones, tablets, laptops, cameras, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices (e.g., watches), virtual reality devices, smart vehicles, smart robots, industrial equipment, etc. This application does not limit the scope of the application. For ease of description, a mobile phone is used as an example below.

[0076] Figure 1 Schematic diagrams of the structure of a mobile phone 1 in some embodiments of this application are shown. In the figures, the X direction is the width direction of the mobile phone 1, the Y direction is the length direction of the mobile phone 1, and the Z direction is the thickness direction of the mobile phone 1. Exemplarily, the X, Y, and Z directions can be perpendicular to each other. Reference Figure 1 The dimensions of mobile phone 1 in both the length and width directions are greater than its dimensions in the thickness direction. In other words, mobile phone 1 has the smallest dimension in its thickness direction.

[0077] It is understood that the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., an angle of 89.9° between two structural features) is also within the scope of mutual perpendicularity in this application. Similarly, the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., an angle of 0.1° between two structural features) is also within the scope of mutual parallelism in this application. The definitions of mutual parallelism and mutual perpendicularity will not be repeated below.

[0078] Additionally, it should be noted that the directional terms such as "up," "down," "left," "right," "front," "back," "top," and "bottom" used in this document are exemplary orientations of the mobile phone 1, and do not indicate or imply that the components referred to must have a specific orientation. These orientations may vary depending on actual use and should not be construed as limitations on this application.

[0079] refer to Figure 1 The mobile phone 1 includes a battery cover 10, a mid-frame 20, and a screen 30. The battery cover 10 and the mid-frame 20 are supporting components of the mobile phone 1. In some embodiments, the battery cover 10 and the mid-frame 20 can be a one-piece molded structure, for example, the battery cover 10 and the mid-frame 20 can be formed into a single structure by injection molding. In other embodiments, the battery cover 10 and the mid-frame 20 can also be formed separately and then assembled together to form a one-piece structure. Along the Z direction, the battery cover 10 and the screen 30 are located on opposite sides of the mid-frame 20. As mentioned above, the interior of the mobile phone 1 can also be provided with various circuit boards, such as a flexible circuit board for wireless charging, to realize the wireless charging function of the mobile phone 1. For the sake of brevity, the flexible circuit board for wireless charging will be referred to as wireless charging FPC below.

[0080] Figure 2A An exemplary structure of the wireless charging FPC11' in some technical solutions is shown. (Reference) Figure 2A The wireless charging FPC11' has a layered structure, including a wiring layer 100, a first protective layer 101, and a second protective layer 102. The first protective layer 101 and the second protective layer 102 respectively cover two surfaces of the wiring layer 100 that are arranged opposite to each other along the Z direction.

[0081] The trace layer 100 includes a flexible copper clad laminate (FCCL) 110. The FCCL 110 can be a double-sided flexible copper clad laminate, including a base film 111 and two first conductive layers 112 (e.g., copper foil). The two first conductive layers 112 respectively cover two surfaces of the base film 111 that are disposed opposite to each other along the Z direction.

[0082] It is understood that the aforementioned wireless charging FPC 11' is a double-sided FPC. In order to achieve electrical conduction between the top and bottom conductive layers of the double-sided wireless charging FPC 11', in some embodiments, a through hole penetrating the flexible copper-clad laminate 110 along the Z direction can be first processed on the flexible copper-clad laminate 110, and then vertical continuous plating (VCP) can be performed, that is, a copper plating layer can be formed on the hole wall of the through hole and on the surface of the two first conductive layers 112 of the flexible copper-clad laminate 110 facing away from the base film 111 by electroplating. In this way, two second conductive layers 120 and a plated through hole (PTH) (not shown) can be obtained. The top and bottom conductive layers of the trace layer 100 each include a first conductive layer 112 and a second conductive layer 120, respectively. The plated through hole can achieve electrical conduction between the top and bottom conductive layers of the trace layer 100.

[0083] Since the top conductive layer and bottom conductive layer of the trace layer 100 each include a first conductive layer 112 and a second conductive layer 120, respectively, the thickness of the top and bottom conductive layers of the trace layer 100 can be increased, thereby further improving electrical performance and signal transmission quality. For example, the top and bottom conductive layers of the trace layer 100 can be spiral-shaped, for example... Figure 3 As shown, Figure 3 A top view of a spiral top conductive layer in some embodiments of this application is shown, wherein the second conductive layer 120 in the top conductive layer can spirally unfold around the center point O. The top and bottom conductive layers of the wiring layer 100 are used to generate an induced magnetic field when energized, thereby realizing the wireless charging function of the mobile phone 1.

[0084] The first protective layer 101 includes a cover film 1011 and an adhesive layer 1012. The cover film 1011 is bonded to the wiring layer 100 through the adhesive layer 1012. The cover film 1011 protects the wiring layer 100, providing electrical insulation, preventing mechanical damage and chemical corrosion, etc. The cover film 1011 is a polyimide (PI) film. The structure and function of the second protective layer 102 are essentially the same as those of the first protective layer 101, and will not be described further here.

[0085] Table 1 below schematically shows the thickness of each layer in the wireless charging FPC 11', in micrometers. The thickness of each layer in the wireless charging FPC 11' refers to the dimension of each layer along the Z-direction.

[0086] Table 1

[0087]

[0088] Combining Table 1 above and Figure 2A It can be seen that in the wireless charging FPC11', the thickness of the cover film 1011 and the cover film 1021 can both be 5μm to 10μm, for example, 5μm, 6μm, 7μm or 7.5μm, etc.; the thickness of the adhesive layer 1012 and the adhesive layer 1022 can both be 2μm to 8μm, for example, 2μm, 3μm, 4μm or 5μm, etc.; the thickness of the second conductive layer 120 can be 10μm to 20μm, for example, 10μm, 11μm, 12μm or 15μm, etc.; the thickness of the first conductive layer 112 can be 40μm to 60μm, for example, 40μm, 45μm or 50μm, etc.; the thickness of the base film 111 can be 10μm to 15μm, for example, 10μm, 11μm or 12.5μm, etc. The total thickness of the stacked layers in the wireless charging FPC11' is 0.124mm to 0.211mm.

[0089] Continue to refer to Figure 2AThe phone 1 also contains a motherboard 40 and a battery 50. Along the Z-direction, a wireless charging FPC 11' is positioned between the battery cover 10' and the motherboard 40, and is electrically connected to the motherboard 40. The motherboard 40 is electrically connected to the battery 50.

[0090] In this way, wireless charging can be achieved. For example, the wireless charger can generate an alternating electromagnetic field. When the mobile phone 1 is placed on the wireless charger, the wireless charging FPC 11' senses the magnetic field emitted by the wireless charger and generates an induced current. The current is transmitted to the motherboard 40, and then through the charging management circuit on the motherboard 40, the current is transmitted to the battery 50, ultimately charging the battery 50.

[0091] It is worth noting that the stacked thickness of each layer of the aforementioned wireless charging FPC11' is relatively large, occupying a thickness space of approximately 0.124mm to 0.211mm, which results in the phone 1 being relatively thick and heavy.

[0092] Therefore, in some other technical solutions, the wireless charging FPC11' is embedded in the battery cover 10'. Figure 2B The setup of the wireless charging FPC11' in other technical solutions is shown. (Reference) Figure 2B A slot (not shown) is provided on the side of the battery cover 10' facing the motherboard 11, and the wireless charging FPC 11 is located in the slot.

[0093] The battery cover 10' serves as a supporting component for the mobile phone 1, and its material strength is typically high; for example, the material of the battery cover 10' can be glass fiber. However, both the first protective layer 101 and the second protective layer 102 are composed of a cover film (e.g., a polyimide film) and an adhesive layer. Therefore, the elastic modulus of the materials of the first protective layer 101 and the second protective layer 102 is much lower than that of the material of the battery cover 10', resulting in a significant decrease in the mechanical properties of the section in the battery cover 10' used to embed the wireless charging FPC 11'. Secondly, the stacking thickness of each layer of the wireless charging FPC 11' is also relatively large, which is not conducive to the thinning of the battery cover 10', and consequently, to further thinning of the mobile phone 1. Furthermore, there is a significant difference in thermal deformation between the materials of the first protective layer 101 and the second protective layer 102 and the material of the battery cover 10'. For example, the coefficient of thermal expansion of the materials of the first protective layer 101 and the second protective layer 102 differs greatly from that of the material of the battery cover 10'. Therefore, the battery cover 10' is prone to problems such as bulging and poor imprinting during the molding process or in actual use, resulting in a poor appearance.

[0094] To address the aforementioned technical problems, this application provides a battery cover (as an example of a housing). Compared to the solutions described above, which separate the wireless charging FPC and the battery cover, or directly embed the wireless charging FPC into the battery cover, the battery cover of this application includes a non-metallic layer. This non-metallic layer replaces at least a portion of the original protective layer of the wireless charging FPC (e.g., ...). Figure 2A and Figure 2B The wireless charging FPC 11' in the illustrated scheme has a first protective layer 101. Thus, the wireless charging FPC housed in the slot (as an example of a first circuit board) does not require additional protective layers (e.g., Figure 2A and Figure 2B The first protective layer 101 in the scheme shown can alleviate the above-mentioned problems such as loss of mechanical performance and poor appearance, and can effectively reduce the thickness of the mobile phone, or provide more space for the battery and increase the battery capacity.

[0095] The technical solution of this application will be described in detail below with reference to the accompanying drawings.

[0096] Figure 4A An exemplary structure of the battery cover 10 in the mobile phone 1 in this application embodiment is shown. Figure 4B according to Figure 4A An exemplary structure of the body 12 in an embodiment of this application is shown. (See reference...) Figure 4A and combined Figure 4B The battery cover 10 includes a wireless charging FPC 11 and a main body 12.

[0097] The main body 12 includes one or more non-metallic layers. For example, Figure 4A and Figure 4B In the example shown, the main body 12 includes three non-metallic layers: a first non-metallic layer 210, a second non-metallic layer 220, and a third non-metallic layer 230. The first non-metallic layer 210, the third non-metallic layer 230, and the second non-metallic layer 220 are arranged sequentially along the Z-direction to form a sandwich structure.

[0098] The surface of the first non-metallic layer 210 constitutes the outer surface, or appearance surface, of the battery cover 10. Once the phone 1 is assembled, the user can observe and touch the first non-metallic layer 210 from the outside of the phone 1. The surface of the second non-metallic layer 220 constitutes the inner surface, or non-appearance surface, of the battery cover 10, for example, the surface of the battery cover 10 facing the motherboard 40 and the battery 50. Once the phone 1 is assembled, the user cannot observe or touch the second non-metallic layer 220 from the outside of the phone 1. The third non-metallic layer 230 is the inner layer structure of the battery cover 10, and the user cannot observe or touch the third non-metallic layer 230 from the outside of the battery cover 10.

[0099] A groove 200 is formed on the main body 12. The wireless charging FPC 11 is at least partially housed in the groove 200 of the main body 12. The wireless charging FPC 11 includes an upper surface F1 (as an example of a first surface) located at one end in its thickness direction (e.g., the Z direction). The upper surface F1 of the wireless charging FPC 11 faces the first non-metallic layer 210, and at least a portion of the upper surface F1 of the wireless charging FPC 11 is a conductive layer.

[0100] Thus, the aforementioned first non-metallic layer 210 can replace the original protective layer of the wireless charging FPC, providing electrical insulation, preventing mechanical damage and chemical corrosion, etc. For example, Figure 4A and Figure 4B In the illustrated embodiment, the first non-metallic layer 210 can replace the above-described... Figure 2A and Figure 2B The first protective layer 101 of the wireless charging FPC11' in the scheme shown.

[0101] Therefore, the wireless charging FPC11 does not require an additional protective layer (e.g., the one mentioned above). Figure 2A and Figure 2B The first protective layer 101 in the illustrated scheme. Therefore, without increasing the thickness of the phone 1, a thicker main body 12 can be provided to enhance the strength of the battery cover 10 and improve its mechanical properties. Furthermore, it reduces the appearance defects caused by differences in thermal deformation between different materials, helping to improve the molding yield of the battery cover 10 and the overall appearance of the phone 1. Secondly, the overall thickness of the phone 1 can be reduced, which is beneficial for a thinner and lighter design, or provides more space for the battery 50 to increase its capacity.

[0102] Continue reading Figure 4A In some embodiments of this application, the ratio between the dimension H2 of the wireless charging FPC11 and the dimension H1 of the body 12 along the thickness direction (e.g., the Z direction) can be 0.1 to 0.6, for example, 0.1, 0.2, 0.3, or 0.4. This ensures that the thickness of the wireless charging FPC11 is moderate, improving the manufacturability of the battery cover 10.

[0103] In some embodiments of this application, the dimension H1 of the main body 12 along the Z direction can be 0.08mm to 1mm, for example, 0.08mm, 0.09mm, 0.1mm, 0.11mm, etc. The main body 12 is relatively thin overall, which is beneficial to realizing the lightweight design of the mobile phone 1.

[0104] In some embodiments of this application, the dimension H2 of the wireless charging FPC11 along the Z direction can be 0.008mm to 0.6mm, for example, 0.008mm, 0.01mm, or 0.1mm. The wireless charging FPC11 is relatively thin overall, which is beneficial for achieving a slim and lightweight design of the mobile phone 1.

[0105] For example, compared to the above Figure 2A The wireless charging FPC11' in the illustrated embodiment, Figure 4A In the illustrated embodiment, the wireless charging FPC 11 does not require a first protective layer 101 and a second protective layer 102. Therefore, it can have a smaller thickness. For example, the dimension H2 of the wireless charging FPC 11 along the Z direction can be 0.11 mm to 0.175 mm. The minimum thickness of the wireless charging FPC 11 (0.11 mm) is less than the minimum thickness of the wireless charging FPC 11' (0.124 mm), and the maximum thickness of the wireless charging FPC 11 (0.175 mm) is less than the maximum thickness of the wireless charging FPC 11' (0.211 mm).

[0106] It is worth noting that the groove 200 opened on the main body 11 can be a closed groove or an open groove. This application does not limit this, and the following is an example description.

[0107] Continue reading Figure 4B and combined Figure 4A In some feasible solutions, the tank 200 can be a closed tank. In this case, the wireless charging FPC 11 is entirely housed within the closed tank 200. The wireless charging FPC 11 also includes a lower surface F2 (as an example of a second surface) located at its opposite end in the thickness direction (e.g., the Z direction). The upper surface F1 and the lower surface F2 are positioned opposite each other along the Z direction. The lower surface F2 faces the second non-metallic layer 220, and at least a portion of the lower surface F2 is a conductive layer. This conductive layer, together with the conductive layer of the upper surface F1, generates an induced magnetic field when energized, thereby enabling the wireless charging FPC 11 to perform wireless charging for the mobile phone 1.

[0108] Thus, the second non-metallic layer 220 can replace the original protective layer of the wireless charging FPC, providing electrical insulation, protection against mechanical damage and chemical corrosion, etc. For example, Figure 4A and Figure 4B In the illustrated embodiment, the second non-metallic layer 220 can replace the above-described... Figure 2A and Figure 2B The second protective layer 102 of the wireless charging FPC11' in the illustrated scheme.

[0109] The following section continues to use the main body 10, which includes three layers of non-metallic layers, as an example to introduce several exemplary ways of forming a closed groove 200.

[0110] Continue reading Figure 4B In some embodiments of this application, a groove 211 is formed on the first non-metallic layer 210. The groove 211 may be, for example, a... Figure 4B The rectangular area enclosed by the dotted line at the top. A groove 221 is formed on the second non-metallic layer 220. The groove 221 can be, for example, […]. Figure 4B The rectangular area enclosed by the dotted line at the top. The openings of grooves 211 and 221 face the third non-metallic layer 230. A through hole 231 is provided on the third non-metallic layer 230, and the through hole 231 penetrates the third non-metallic layer 230 along the Z direction. The through hole 231 can be, for example, Figure 4B The rectangular area enclosed by the dotted line in the middle section. Through hole 231 connects to grooves 211 and 221, thus, the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 together form a closed groove 200. Specifically, the first non-metallic layer 210 constitutes the top wall and the first portion of the four side walls of the groove 200; the second non-metallic layer 220 constitutes the bottom wall and the second portion of the four side walls of the groove 200; and the third non-metallic layer 230 constitutes the third portion of the four side walls of the groove 200. Along the Z-direction, the size of the groove 200 is larger than the size of the third non-metallic layer 230 but smaller than the size of the main body 12.

[0111] Based on this, a groove 211 can be formed on the first non-metallic layer 210, a groove 221 can be formed on the second non-metallic layer 220, and a through hole 231 can be formed on the third non-metallic layer 230. Then, the pre-fabricated wireless charging FPC 11 is placed into the through hole 231, with both ends of the wireless charging FPC 11 along the Z direction partially exposed from the through hole 231. Then, the first non-metallic layer 210 and the second non-metallic layer 220 are provided on opposite sides of the third non-metallic layer 230, so that both ends of the wireless charging FPC 11 along the Z direction can be embedded in the grooves 211 and 221. The battery cover 10 is finally obtained. Alternatively, in other alternative embodiments, the wireless charging FPC 11 can be formed in the through hole 221, and then the first non-metallic layer 210 and the second non-metallic layer 220 can be provided to finally obtain the battery cover 10.

[0112] Figure 5A Exemplary structures of the tank 200 in other embodiments of this application are shown. References Figure 5AIn some other embodiments of this application, a through hole 231 is formed on the third non-metallic layer 230, and the through hole 231 penetrates the third non-metallic layer 230 along the Z direction. The first non-metallic layer 210 and the second non-metallic layer 220 respectively cover the two openings of the through hole 231, so that the first non-metallic layer 210, the second non-metallic layer 220 and the third non-metallic layer 230 together form a closed groove 200. The first non-metallic layer 210 forms the top wall of the groove 200, the second non-metallic layer 220 forms the bottom wall of the groove 200, and the third non-metallic layer 230 forms the four side walls of the groove 200. Along the Z direction, the size of the groove 200 is equal to the size of the third non-metallic layer 230.

[0113] Based on this, a through hole 231 can be first formed on the third non-metallic layer 230, and then the pre-fabricated wireless charging FPC 11 can be placed into the through hole. Then, a first non-metallic layer 210 and a second non-metallic layer 220 can be formed on opposite sides of the third non-metallic layer 230 to finally obtain the battery cover 10. Alternatively, in other alternative embodiments, the wireless charging FPC 11 can be formed in the through hole 221, and then the first non-metallic layer 210 and the second non-metallic layer 220 can be formed to finally obtain the battery cover 10.

[0114] Figure 5B Exemplary structures of the tank 200 in some embodiments of this application are shown. References Figure 5B In other embodiments of this application, a groove 232 is formed on the third non-metallic layer 230, with the opening of the groove 232 facing the second non-metallic layer 220. The second non-metallic layer 220 covers the opening of the groove, thereby forming a closed groove 200 together with the third non-metallic layer 230. The second non-metallic layer 220 constitutes the bottom wall of the groove 200, and the third non-metallic layer 230 constitutes the top wall and surrounding side walls of the groove 200. Along the Z-direction, the size of the groove 200 is smaller than the size of the third non-metallic layer 230.

[0115] Figure 5C Exemplary structures of the tank 200 in other embodiments of this application are shown. (See reference...) Figure 5C In some other embodiments of this application, a groove 221 is formed on the second non-metallic layer 220, and a groove 232 is formed on the third non-metallic layer 230. Furthermore, the groove 221 of the second non-metallic layer 220 and the groove 232 of the third non-metallic layer 230 are connected, thereby forming a closed groove 200 together. The second non-metallic layer 220 constitutes the bottom wall and a portion of the surrounding side walls of the groove 200, and the third non-metallic layer 230 constitutes the top wall and another portion of the surrounding side walls of the groove 200. In some implementations, the size of the groove 200 along the Z-direction can be larger than the size of the third non-metallic layer 230.

[0116] It should be noted that the above embodiments only introduce some structural forms of the closed tank 200 and do not constitute a specific limitation on the implementation of this application.

[0117] Continue reading Figure 4A and Figure 4B In some embodiments of this application, the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may include polyimide fibers, aramid fibers, liquid crystal polymer fibers (LCP), glass fibers, poly-p-phenylenebenzobisoxazole (PBO) fibers, fiber-reinforced resin-based composite materials, thermally conductive materials, thermal insulation materials, or thermal storage materials. The materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may be the same or not entirely the same. In other embodiments, the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may also be other non-metallic materials; this application does not limit this.

[0118] In some of these implementations, the fibers in the fiber-reinforced resin matrix composite may include Kevlar fibers, polyimide fibers, poly(p-phenylenebenzodioxazole) fibers, ceramic fibers, or carbon fibers.

[0119] In some implementations, the resin in the fiber-reinforced resin matrix composite can be a thermosetting resin or a thermoplastic resin. Thermosetting resins can be, for example, epoxy resins, phenolic resins, vinyl resins, maleimide resins, etc. Thermoplastic resins can be, for example, polycarbonate (PC), polyamide (PA), liquid crystal polymers (LCP), etc.

[0120] In some of these implementations, the aforementioned fibers can be continuous fibers, i.e., long fibers. Examples include continuous glass fibers and continuous poly(p-phenylenebenzodioxazole) fibers. Long fibers have better strength, which helps improve the mechanical properties of the battery cover 10.

[0121] It is understandable that the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can be reasonably set according to actual needs to achieve different functions. An example is provided below.

[0122] In some embodiments of this application, a portion of the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can be low-density materials, while another portion of the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can be high-mechanical-performance materials. This allows the battery cover 10 to combine the advantages of lightweight design and high protective performance, thereby improving the grip experience and reliability of the mobile phone 1.

[0123] However, this application is not limited to this. In other embodiments of this application, the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can all be low-density materials to further reduce the weight of the battery cover 10, thereby improving the grip experience of the mobile phone 1. In other embodiments of this application, the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can also all be materials with high mechanical properties to further improve the protective effect of the battery cover 10.

[0124] In some embodiments of this application, at least a portion of the materials in the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 can be thermally conductive materials, thereby forming a thermally conductive path. The heat generated during the operation of the wireless charging FPC 11 can be dissipated through this thermally conductive path, preventing localized overheating of the phone 1. That is, the main body 12 includes a thermally conductive layer.

[0125] In some implementations, at least a portion of the non-exterior surface of the body 12 constituting the battery cover 10 is a thermally conductive layer. Thus, the heat generated during the operation of the wireless charging FPC 11 can be transferred to other areas inside the phone 1 via the non-exterior surface of the battery cover 10, rather than to the outside of the phone 1 via the exterior surface of the battery cover 10, thereby ensuring that the user does not noticeably feel overheating of the exterior surface of the battery cover 10 when holding the phone 1.

[0126] For example, Figure 6A This illustration shows an exemplary configuration of the thermally conductive layer in the main body 12 according to an embodiment of this application. For ease of distinction, in the figures herein, areas filled with dots indicate that the material in that area is a thermally conductive material.

[0127] refer to Figure 6A The second non-metallic layer 220 is made of a thermally conductive material, meaning it functions as a heat-conducting layer. Heat generated during wireless charging FPC 11 operation can be transferred to the second non-metallic layer 220 and then diffused through it to other areas inside the phone 1, for example, along the Y-direction. This prevents heat buildup in the area where the wireless charging FPC 11 is located, ensuring a uniform overall temperature of the phone 1. Users will not noticeably feel overheating on the surface of the battery cover 10 when holding the phone 1.

[0128] For example, Figure 6B This illustrates a second exemplary configuration of the heat-conducting layer in the main body 12 according to an embodiment of this application. (See reference...) Figure 6B The materials in region S1 of the third non-metallic layer 230 and the materials in the second non-metallic layer 220 are both thermally conductive. That is, both region S1 of the third non-metallic layer 230 and the second non-metallic layer 220 are thermally conductive layers. Thus, the heat generated during the operation of the wireless charging FPC 11 can be transferred through region S1 of the third non-metallic layer 230 and the second non-metallic layer 220. Then, some of the heat travels through region S1 of the third non-metallic layer 230 along the negative Y direction (e.g., ...). Figure 6B As shown in the Y1 direction, some heat diffuses, while another portion diffuses along the Y direction through the second non-metallic layer 220. In this way, heat can be avoided in the area where the wireless charging FPC 11 is located, thereby ensuring that the overall temperature of the phone 1 is uniform, and the user will not feel that the outer surface of the battery cover 10 is overheating when holding the phone 1.

[0129] In some cases, along the negative Y direction (e.g., Figure 6B As shown in the Y1 direction, the number of electronic components in mobile phone 1 can be gradually reduced. That is, along the Y1 direction, the heat generated by mobile phone 1 gradually decreases. Therefore, these areas with relatively low heat generation are called low-temperature regions. Based on this, by setting the material in region S1 of the third non-metallic layer 230 and the material of the second non-metallic layer 220 as thermally conductive materials, more of the heat generated by the wireless charging FPC 11 can be transferred along the Y1 direction to the low-temperature regions in mobile phone 1, thereby making the temperature of various regions in mobile phone 1 more uniform.

[0130] In summary, the heat-conducting layer can be reasonably set according to the actual application scenario to form a specific heat conduction path, realize the directional conduction of heat, and obtain a better heat distribution effect.

[0131] It should be noted that the above Figure 6A and Figure 6B This illustration only shows a partial arrangement of the thermally conductive layer and does not constitute a limitation on this application. For example, in other implementations, the material of the first non-metallic layer 210 may also be a thermally conductive material.

[0132] The aforementioned thermally conductive layer can be a structure with thermally conductive properties prepared from a thermally conductive material. In some implementations, the thermally conductive material can be thermally conductive fibers, such as pitch-based carbon fibers, boron nitride fibers, etc. Exemplarily, the thermally conductive layer can be a sheet structure woven or laminated from thermally conductive fibers. In other implementations, the thermally conductive material can also be a thermally conductive filler. For example, the thermally conductive filler can be graphite, and the thermally conductive layer can be a graphite sheet formed by pressing graphite powder. Alternatively, the thermally conductive filler can also be boron nitride powder, and the thermally conductive layer can be a sheet structure formed by pressing boron nitride powder.

[0133] In some embodiments of this application, at least a portion of the materials in the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may be heat-insulating materials to isolate the heat generated during the operation of the wireless charging FPC 11. That is, the body 12 includes a heat-insulating layer.

[0134] In some implementations, at least a portion of the outer surface of the main body 12 that forms the battery cover 10 is a heat-insulating layer. This prevents heat generated during the operation of the wireless charging FPC 11 from being transferred to the outside of the phone 1 via the outer surface of the battery cover 10, thus ensuring that the user does not noticeably feel overheating of the outer surface of the battery cover 10 when holding the phone 1.

[0135] For example, Figure 7 An exemplary arrangement of the thermal insulation layer in the main body 12 of this application embodiment is shown. For ease of distinction, in the figures herein, areas filled with horizontal lines indicate that the material in that portion is thermal insulation material. Reference Figure 7 The first non-metallic layer 210 is made of a heat-insulating material. In other words, the first non-metallic layer 210 is a heat-insulating layer. This prevents the heat generated during the operation of the wireless charging FPC 11 from being transferred to the outside of the mobile phone 1 through the first non-metallic layer 210.

[0136] It should be noted that the above Figure 7 This illustration only shows a partial arrangement of the insulation layer and does not constitute a limitation of this application. In other implementations, more or less of the material may be insulation material. For example, both the first non-metallic layer 210 and the third non-metallic layer 230 may be made of insulation material, meaning that both the first non-metallic layer 210 and the third non-metallic layer 230 are insulation layers to further improve the insulation effect. Alternatively, a portion of the material in the first non-metallic layer 210 may be insulation material.

[0137] The aforementioned insulation layer can be a structure with insulation properties prepared from insulation materials. In some implementations, the insulation material can be a foamed material, and correspondingly, the insulation layer can be a foamed layer. Alternatively, the insulation material can also be hollow microspheres, and correspondingly, the insulation layer is a hollow microsphere-filled layer. Or, the insulation material can also be hollow fibers, and correspondingly, the insulation layer is a hollow fiber layer.

[0138] In some embodiments of this application, at least a portion of the materials in the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may be thermal storage materials to facilitate heat management. That is, the body 12 includes a thermal storage layer.

[0139] For example, Figure 8 An exemplary arrangement of the heat storage layer in the main body 12 of this application embodiment is shown. For ease of distinction, in the figures herein, areas filled with vertical lines indicate that the material in that part is heat storage material.

[0140] refer to Figure 8 The first non-metallic layer 210 is made of a heat storage material. In other words, the first non-metallic layer 210 is a heat storage layer. The heat generated when the wireless charging FPC 11 is working can be absorbed by the first non-metallic layer 210, preventing instantaneous high temperatures and ensuring a stable and balanced overall temperature for the phone 1. Furthermore, in cold environments, the first non-metallic layer 210 can release heat to raise the temperature of the phone 1, preventing excessively low temperatures from affecting the normal operation of the wireless charging FPC 11.

[0141] It should be noted that the above Figure 8 This illustration only shows a partial arrangement of the heat storage layer and does not constitute a limitation of this application. In other implementations, more or less of the material may be heat storage material. For example, the materials of the first non-metallic layer 210, the second non-metallic layer 220, and the third non-metallic layer 230 may all be heat storage materials to improve heat storage performance. Alternatively, a portion of the material of the first non-metallic layer 210 may be heat storage material.

[0142] The aforementioned heat storage layer can be a structure with heat storage properties prepared from a heat storage material. In some implementations, the heat storage material can be a phase change heat storage material, such as paraffin wax. In other implementations, the heat storage material can also be other materials including phase change heat storage materials, such as resins that include phase change heat storage materials.

[0143] It is understood that the aforementioned heat-conducting layer, heat-insulating layer, and heat-storing layer can be combined arbitrarily to meet the usage requirements of various application scenarios. Several combination methods are illustrated below with reference to the attached diagrams.

[0144] Figure 9AThis illustration shows one combination of the thermally conductive layer and the thermally insulating layer in the main body 12 of this application embodiment. (Reference) Figure 9A The first non-metallic layer 210 is a heat insulation layer, and the second non-metallic layer 220 is a heat-conducting layer. In this way, the heat generated during the operation of the wireless charging FPC 11 can be better dissipated to other areas inside the phone 1 through the second non-metallic layer 220, rather than being transferred to the outside of the phone 1 through the first non-metallic layer 210. This results in a more even temperature distribution throughout the phone 1, and the user will not noticeably feel that the phone 1 is overheating when holding it.

[0145] Figure 9B This illustration shows a combination of the heat-conducting layer and the heat-storing layer in the main body 12 of this application embodiment. (Reference) Figure 9B The first non-metallic layer 210 serves as a heat storage layer, and the second non-metallic layer 220 serves as a heat-conducting layer. Thus, some of the heat generated during the operation of the wireless charging FPC 11 can be absorbed by the first non-metallic layer 210, while the rest is diffused to other areas inside the phone 1 via the second non-metallic layer 220, ensuring a balanced and stable overall temperature for the phone 1. Furthermore, in cold environments, the first non-metallic layer 210 can release heat to raise the temperature of the phone 1, preventing excessively low temperatures from affecting the normal operation of the wireless charging FPC 11.

[0146] Figure 9C This illustration shows one combination of the heat-conducting layer, heat-insulating layer, and heat-storing layer in the main body 12 of this application embodiment. (Reference) Figure 9C The first non-metallic layer 210 is a heat insulation layer, the second non-metallic layer 220 is a heat-conducting layer, and the third non-metallic layer 230 is a heat storage layer. This further reduces the impact of the heat generated by the wireless charging FPC11 on the mobile phone 1, achieving heat management for the mobile phone 1.

[0147] It should be noted that the above Figures 9A to 9C This only shows a partial combination of the heat-conducting layer, heat-insulating layer and heat-storing layer in the main body 12, and does not constitute a specific limitation on the implementation of this application.

[0148] As mentioned above, the materials of the first non-metallic layer 210, the second non-metallic layer 220 and the third non-metallic layer 230 may be the same or not completely the same, in order to meet the usage requirements under different application scenarios. The following describes several exemplary combination schemes in conjunction with specific embodiments.

[0149] exist Figure 4A and Figure 4B In the embodiment shown, the materials of the first non-metallic layer 210, the second non-metallic layer 220 and the third non-metallic layer 230 can all be continuous glass fibers. Continuous glass fibers have good strength, which helps to improve the mechanical properties of the battery cover 10.

[0150] exist Figure 6A In the illustrated embodiment, the first non-metallic layer 210 and the third non-metallic layer 230 can both be made of continuous glass fiber, and the second non-metallic layer 220 is made of a thermally conductive material; that is, the second non-metallic layer 220 is a thermally conductive layer. The continuous glass fiber ensures that the battery cover 10 has good mechanical properties. Simultaneously, the thermally conductive layer helps to dissipate heat and evenly distribute heat, preventing heat accumulation in the area where the wireless charging FPC 11 is located. This ensures that the overall temperature of the phone 1 is uniform, and the user will not noticeably feel that the surface of the battery cover 10 is overheating when holding the phone 1.

[0151] exist Figure 6B In the illustrated embodiment, the materials in the first non-metallic layer 210 and the third non-metallic layer 230, except for the S1 region, can all be continuous glass fibers. The materials in the S1 region of the third non-metallic layer 230 and the materials in the second non-metallic layer 220 are both thermally conductive materials. That is, the S1 region of the third non-metallic layer 230 and the second non-metallic layer 220 are both thermally conductive layers. This not only ensures that the battery cover 10 has good mechanical properties but also further improves heat dissipation and heat equalization.

[0152] exist Figure 7 In the illustrated embodiment, the first non-metallic layer 210 can be made of a heat-insulating material. That is, the first non-metallic layer 210 is a heat-insulating layer. The second non-metallic layer 220 and the third non-metallic layer 230 can both be made of continuous glass fiber. This not only ensures that the battery cover 10 has good mechanical properties, but also that the heat-insulating layer provides insulation, thereby preventing the heat generated during the operation of the wireless charging FPC 11 from being transferred to the outside of the mobile phone 1.

[0153] exist Figure 8 In the illustrated embodiment, the first non-metallic layer 210 can be made of a heat storage material, meaning it serves as a heat storage layer. The second non-metallic layer 220 and the third non-metallic layer 230 can both be made of continuous glass fiber. This not only ensures the battery cover 10 has good mechanical properties, but also allows the heat storage layer to manage heat. For example, the heat generated during the operation of the wireless charging FPC 11 can be absorbed by the first non-metallic layer 210, preventing instantaneous high temperatures and ensuring a stable and balanced overall temperature for the battery cover 10. Furthermore, in cold environments, the first non-metallic layer 210 can release heat, causing the temperature of the battery cover 10 to rise and preventing excessively low temperatures from affecting the normal operation of the wireless charging FPC 11.

[0154] exist Figure 9AIn the illustrated embodiment, the first non-metallic layer 210 is a heat insulation layer, the second non-metallic layer 220 is a heat-conducting layer, and the third non-metallic layer 230 is made of continuous glass fiber. This design simultaneously achieves good mechanical properties, heat dissipation, heat equalization, and heat insulation, resulting in better performance of the battery cover 10.

[0155] exist Figure 9B In the illustrated embodiment, the first non-metallic layer 210 is a heat storage layer, the second non-metallic layer 220 is a heat-conducting layer, and the third non-metallic layer 230 is made of continuous glass fiber. This design simultaneously achieves good mechanical performance, heat dissipation, heat equalization, and thermal management, resulting in better performance of the battery cover 10.

[0156] It should be noted that the above embodiments only illustrate some combination schemes of the materials of the first non-metallic layer 210, the second non-metallic layer 220 and the third non-metallic layer 230, and do not constitute a specific limitation on the implementation of this application.

[0157] In some embodiments of this application, the first non-metallic layer 210, the second non-metallic layer 220 and the third non-metallic layer 230 can be stacked and fixedly connected to each other by processes such as hot pressing or bonding.

[0158] It is understood that this application does not specifically limit the structural form of the wireless charging FPC11, and any wireless charging FPC11 whose upper surface F1 is at least partly a conductive layer is within the protection scope of this application.

[0159] Figures 10A to 10E Exemplary structures of several wireless charging FPC11 embodiments of this application are shown. (Reference) Figure 10A In some implementations, the wireless charging FPC 11 includes a double-sided flexible copper-clad laminate 110 and a second conductive layer 120 covering opposite surfaces of the double-sided flexible copper-clad laminate 110. The position, structure, and function of the flexible copper-clad laminate 110 and the second conductive layer 120 can be referred to above. Figure 2A and Figure 2B The relevant descriptions in the illustrated embodiments will not be repeated here. In this case, the upper surface F1 and the lower surface F2 of the wireless charging FPC11 can each be formed by the surfaces of two layers of the second conductive layer 120.

[0160] refer to Figure 10BIn some other implementations, the flexible copper-clad laminate 110 of the wireless charging FPC 11 can also be a single-sided flexible copper-clad laminate, that is, the flexible copper-clad laminate 110 includes a base film 111 and a first conductive layer 112 covering one side surface of the base film 111. A second conductive layer 120 covers the surface of the first conductive layer 112 facing away from the base film 111. In this case, the upper surface F1 of the wireless charging FPC 11 can be formed by the surface of the second conductive layer 120, and the lower surface F2 of the wireless charging FPC 11 can be formed by the surface of the base film 111.

[0161] refer to Figure 10C In some other implementations, the wireless charging FPC 11 may also include a double-sided flexible copper-clad laminate 110 and a second conductive layer 120 covering one side surface of the double-sided flexible copper-clad laminate 110. In this case, the upper surface F1 of the wireless charging FPC 11 may be formed by the surface of the second conductive layer 120, and the lower surface F2 of the wireless charging FPC 11 may be formed by the first conductive layer 112.

[0162] refer to Figure 10D In some implementations, the wireless charging FPC 11 may also include a double-sided flexible copper-clad laminate 110, but exclude the second conductive layer 120. In this case, the upper surface F1 and the lower surface F2 of the wireless charging FPC 11 may each be formed by the surfaces of the two first conductive layers 112.

[0163] refer to Figure 10E In some further implementations, the wireless charging FPC 11 may also include a single-sided flexible copper-clad laminate 110, excluding the second conductive layer 120. In this case, the upper surface F1 of the wireless charging FPC 11 may be formed by the surface of the first conductive layer 112, and the lower surface F2 of the wireless charging FPC 11 may be formed by the surface of the base film 111.

[0164] It should be noted that the above Figures 10A to 10E This only shows a partial structure of the wireless charging FPC11 and does not constitute a specific limitation on the implementation of this application.

[0165] In some embodiments of this application, the material of the base film 111 of the wireless charging FPC 11 can be the same as the material of the main body 12. In this way, problems such as poor appearance and decreased mechanical properties caused by the difference in material properties between the base film 111 and the main body 12 can be reduced, thereby making the battery cover 10 have a smoother and more aesthetically pleasing appearance and better mechanical strength.

[0166] In some embodiments of this application, the base film 111 of the wireless charging FPC11 may be made of polyimide, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), glass fiber, poly(p-phenylene benzodioxazole) fiber, fiber-reinforced resin matrix composite material, thermally conductive material, thermal insulation material, or thermal storage material.

[0167] In some embodiments of this application, the wireless charging FPC 11 can be electrically connected to the motherboard 40 (as an example of a second circuit board). Several schemes for the electrical connection between the wireless charging FPC 11 and the motherboard 40 are described below with reference to the accompanying drawings.

[0168] In some feasible solutions, the wireless charging FPC11 and the motherboard 40 can be detachably electrically connected via spring contacts. This allows for the assembly and disassembly of the motherboard 40 without damaging the original structure, making the operation simple and convenient.

[0169] In some embodiments of this application, the spring can be directly electrically connected to the wireless charging FPC11. For details, please refer to the following documentation. Figure 4A and combined Figure 4B The wireless charging FPC 11 includes a connector (or "PAD"). A through-hole 240 is provided on the main body 12. The through-hole 240 connects the interior and exterior of the slot 200, exposing the connector 130 to the outside. A spring tab 13 passes through the through-hole 240, with one end of the spring tab 13 located outside the through-hole 240 and electrically connected to the motherboard 40, and the other end of the spring tab 13 extending into the through-hole 240 and electrically connected to the connector 130 of the wireless charging FPC 11, thereby achieving an electrical connection between the wireless charging FPC 11 and the motherboard 40.

[0170] In some implementations, the number of through holes 240 and the number of spring pieces 13 can be the same as the number of connecting parts 130. For example, there are two connecting parts 130, and two through holes 240 and two spring pieces 13. The through holes 240, spring pieces 13, and connecting parts 130 correspond one-to-one. Each spring piece 13 can be electrically connected to the corresponding connecting part 130 via the corresponding through hole 240.

[0171] In some implementations, the positions of a corresponding set of through holes 240 and connecting portions 130 also correspond. For example, the through holes 240 are in the XY plane (e.g., Figure 4A and Figure 4B The orthographic projection area of ​​the plane perpendicular to the Z direction (in the middle) at least partially overlaps with the orthographic projection area of ​​the connecting part 130 in the XY plane.

[0172] In other embodiments of this application, the spring 13 may also be indirectly electrically connected to the wireless charging FPC 11 through other devices.

[0173] Figure 11 This diagram illustrates a further embodiment of the wireless charging FPC 11 and motherboard 12 electrically connected via a spring contact 13. (See reference...) Figure 11 The battery cover 10 also includes a conductive element 14. The conductive element 14 passes through the through hole 240, wherein one end of the conductive element 14 is located inside the through hole 240 and is electrically connected to the connection part 130 of the wireless charging FPC 11, and the other end of the conductive element 14 passes out of the through hole 240 and is electrically connected to the motherboard 40 through the spring contact 13.

[0174] In some implementations, the conductive element 14 can be a conductive structure such as a wire, a conductive post, or a flexible circuit board.

[0175] In other feasible solutions, the wireless charging FPC11 and the motherboard 40 can also be detachably electrically connected via a board-to-board (BTB) connector. This allows for the assembly and disassembly of the motherboard 40 without damaging the original structure, making the operation simple and convenient. For example, the other end of the conductive component 14 protrudes through the through-hole 240 and is electrically connected to the motherboard 40 via a board-to-board connector, thereby achieving an electrical connection between the wireless charging FPC11 and the motherboard 40.

[0176] In other feasible solutions, the wireless charging FPC 11 and the motherboard 40 can also be electrically connected by soldering. For example, the other end of the conductive element 14 extends through the through-hole 240 and is electrically connected to the motherboard 40 by soldering, thereby achieving an electrical connection between the wireless charging FPC 11 and the motherboard 40.

[0177] In other feasible solutions, the wireless charging FPC11 and the motherboard 40 can also be electrically connected using conductive adhesive. For example, Figure 12 A schematic diagram showing the bonding of the wireless charging FPC11 and the motherboard 40 in an embodiment of this application is shown. (Reference) Figure 12 Conductive adhesive 15 is filled in the through hole 240 and between the through hole 240 and the motherboard 40, thereby realizing the electrical connection between the wireless charging FPC11 and the motherboard 40.

[0178] Alternatively, in some alternative implementations, the battery cover 10 includes a conductive element 14 (e.g., the one described above). Figure 11 In the embodiment shown, when the conductive element 14 is used, the conductive adhesive 15 can be disposed between the conductive element 14 and the motherboard 40 to realize the electrical connection between the conductive element 14 and the motherboard 40, thereby realizing the electrical connection between the wireless charging FPC 11 and the motherboard 40.

[0179] It is understood that the tanks 200 in the embodiments shown in the above figures are all closed tanks, but this application is not limited to this. For example, in some other feasible solutions, the tank 200 can also be an open tank.

[0180] For example, Figure 13 An exemplary structure of the open groove 200 in an embodiment of this application is shown. (Reference) Figure 13 A through hole 222 is formed on the second non-metallic layer 220, penetrating the second non-metallic layer 220 along the Z direction. A third non-metallic layer 230 covers one end opening of the through hole 232, so that the second non-metallic layer 220 and the third non-metallic layer 230 together constitute an open tank 200. The second non-metallic layer 220 forms the four side walls of the tank 200, and the third non-metallic layer 230 forms the top wall of the tank 200.

[0181] In some implementations, the wireless charging FPC (not shown) can be entirely housed within an open groove 200. For example, the upper surface of the wireless charging FPC faces the first non-metallic layer 210, at least a portion of which is a conductive layer; the lower surface of the wireless charging FPC is at least partially exposed to the outside through an opening in the open groove 200. The lower surface of the wireless charging FPC can be flush with the lower surface of the second non-metallic layer 220, or it can be recessed into the groove 200 relative to the body 12 along the positive Z-direction.

[0182] In other implementations, the wireless charging FPC may be partially housed within the open slot 200, with another portion located outside the open slot 200. For example, the upper surface of the wireless charging FPC faces the first non-metallic layer 210, at least a portion of which is a conductive layer; the lower surface of the wireless charging FPC is at least partially exposed to the outside through an opening in the open slot 200. Furthermore, the wireless charging FPC protrudes outward from the slot 200 relative to the body 12 along the negative Z-direction.

[0183] It is understandable that when the slot 200 is an open slot, the connection part of the wireless charging FPC can be exposed to the outside through the opening of the open slot 200, so as to realize the electrical connection between the wireless charging FPC and other devices (e.g., motherboard).

[0184] The technical solution of this embodiment has been described above. It should be noted that this embodiment is an exemplary description of the technical solution of this application, and those skilled in the art can make other modifications.

[0185] For example, in this embodiment, the wireless charging FPC 11 is placed flat inside the mobile phone 1, meaning that the thickness direction of the wireless charging FPC 11 is parallel to the thickness direction of the mobile phone 1 (e.g., the Z direction). In other embodiments, the wireless charging FPC 11 may have other mounting orientations. For example, Figure 14 The following are examples of the wireless charging FPC11 configuration in other embodiments of this application, wherein... Figure 14 The structural features of the wireless charging FPC11 that are obscured are shown in dashed lines. (Reference) Figure 14 The mid-frame 20 (another example of a housing) of the tablet 2 (as yet another example of an electronic device) includes a wireless charging FPC 11 and a main body 12. The wireless charging FPC 11 is embedded in the main body 12 to enable wireless charging of the stylus 21 of the tablet 2. The wireless charging FPC 11 is positioned sideways within the tablet 2, meaning its thickness direction is perpendicular to the thickness direction of the tablet 2. For example, the thickness direction of the wireless charging FPC 11 is the X-direction, and the thickness direction of the tablet 1 is the Z-direction. Figure 14 (The direction perpendicular to the paper).

[0186] For example, in this embodiment, a wireless charging FPC11 for wireless charging is used as an example of the first circuit board. However, this application is not limited to this; in other embodiments, the first circuit board can be other circuit boards. In some implementations, the first circuit board can be a near-field communication (NFC) FPC, and the conductive layer in the first circuit board can be spiral-shaped to form an NFC coil.

[0187] For example, in this embodiment, the first circuit board is a flexible circuit board. In other embodiments, the first circuit board may also be a printed circuit board (PCB).

[0188] For example, in this embodiment, the first circuit board is electrically connected to the motherboard. In other embodiments, the first circuit board may also be connected to other circuit boards. For instance, the first circuit board may also be electrically connected to circuit boards such as a screen circuit board, a microphone circuit board, or an antenna board (as another example of a second circuit board).

[0189] For example, in this embodiment, there is one first circuit board. In other embodiments, in some implementations, the multiple first circuit boards may have the same or different uses. For example, one of the two first circuit boards may be used to implement wireless charging, and the other may be used to implement near-field communication.

[0190] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0191] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0192] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0193] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A housing for an electronic device, characterized in that, include: The main body includes one or more non-metallic layers, and the main body has grooves formed thereon; A first circuit board, at least a portion of which is housed in the groove, the first circuit board including a first surface located at one end of the thickness direction of the first circuit board, the first surface facing a first non-metallic layer in one or more non-metallic layers, wherein at least a portion of the first surface is a conductive layer.

2. The housing according to claim 1, characterized in that, The tank is a closed tank; The first circuit board further includes a second surface located at the other end of the thickness direction of the first circuit board, the second surface facing the second non-metallic layer in the one or more non-metallic layers, wherein at least a portion of the second surface is a conductive layer.

3. The housing according to claim 2, characterized in that, The first circuit board includes a connecting portion, and the main body has a through hole for exposing the connecting portion to the outside.

4. The housing according to claim 3, characterized in that, The housing includes a conductive element that passes through the through hole. One end of the conductive element is connected to the connecting portion, and the other end of the conductive element is located outside the through hole.

5. The housing according to claim 4, characterized in that, The conductive component is a wire, a conductive post, or a flexible circuit board.

6. The housing according to claim 1, characterized in that, Along the thickness direction of the first circuit board, the ratio between the size of the first circuit board and the size of the main body is 0.1 to 0.

6.

7. The housing according to claim 6, characterized in that, Along the thickness direction of the first circuit board, the dimensions of the main body are 0.08mm to 1mm.

8. The housing according to claim 6, characterized in that, Along the thickness direction of the first circuit board, the size of the first circuit board is 0.008mm to 0.6mm.

9. The housing according to claim 1, characterized in that, The main body includes at least one of a heat-conducting layer, a heat-storing layer, and a heat-insulating layer.

10. The housing according to claim 9, characterized in that, At least a portion of the non-appearance surface of the main body constituting the shell is a thermally conductive layer.

11. The housing according to claim 10, characterized in that, At least a portion of the main body that forms the outer surface of the housing is a heat insulation layer.

12. The housing according to claim 9, characterized in that, The thermally conductive layer is made of materials including pitch-based carbon fiber, boron nitride, or graphite.

13. The housing according to claim 9, characterized in that, The insulation layer is made of foamed materials, hollow microspheres, or hollow fibers.

14. The housing according to claim 9, characterized in that, The materials of the thermal storage layer include phase change thermal storage materials and composite materials including phase change thermal storage materials.

15. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer and the third non-metallic layer are both made of continuous glass fiber, and the second non-metallic layer is a thermally conductive layer.

16. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The material of the first non-metallic layer and a portion of the material of the third non-metallic layer are both continuous glass fibers, and the other portion of the second non-metallic layer and the third non-metallic layer are thermally conductive layers.

17. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat insulation layer, and the materials of the second non-metallic layer and the third non-metallic layer are both continuous glass fibers.

18. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat storage layer, and the materials of the second non-metallic layer and the third non-metallic layer are both continuous glass fibers.

19. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat insulation layer, the second non-metallic layer is a thermally conductive layer, and the third non-metallic layer is made of continuous glass fiber.

20. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat storage layer, the second non-metallic layer is a heat-conducting layer, and the third non-metallic layer is made of continuous glass fiber.

21. The housing according to claim 9, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer is a heat insulation layer, the second non-metallic layer is a heat-conducting layer, and the third non-metallic layer is a heat storage layer.

22. The housing according to claim 1, characterized in that, The non-metallic layer includes a second non-metallic layer and a third non-metallic layer, and the first non-metallic layer, the third non-metallic layer and the second non-metallic layer are stacked along the thickness direction of the first circuit board. The first non-metallic layer, the second non-metallic layer, and the third non-metallic layer are all made of continuous glass fiber.

23. The housing according to any one of claims 15 to 22, characterized in that, The first non-metallic layer is used to form the outer surface of the housing, and the second non-metallic layer is used to form the non-outer surface of the housing.

24. The housing according to any one of claims 1 to 22, characterized in that, The first circuit board includes a base film and a conductive layer covering the base film, wherein the material of the base film is the same as the material of the non-metallic layer.

25. The housing according to claim 1, characterized in that, The first circuit board is a wireless charging circuit board.

26. An electronic device, characterized in that, It includes a second circuit board and a housing according to any one of claims 1 to 25, wherein the first circuit board is electrically connected to the second circuit board.

27. The electronic device according to claim 26, characterized in that, The groove is a closed groove, the first circuit board includes a connecting part, and the main body has a through hole for exposing the connecting part to the outside.

28. The electronic device according to claim 27, characterized in that, The electronic device includes a spring sheet that passes through the through hole. One end of the spring sheet is connected to the connecting part, and the other end of the spring sheet is located outside the through hole and connected to the second circuit board.

29. The electronic device according to claim 27, characterized in that, The through hole is filled with conductive adhesive, and the connecting part is connected to the second circuit board through the conductive adhesive.

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