An automatic baking mechanism for glue-coated wafer

Abstract

The utility model discloses an automatic baking mechanism of gluing wafer, including the baking oven, the top of baking oven is equipped with through -hole, and the top of through -hole is connected with the first installation box, and the first installation box is fixedly connected with the air -exhaust fan in, and the top sealed insertion of first installation box has the gas pipe, and the other end fixed connection of gas pipe has the connecting pipe, and the outer surface of connecting pipe is sleeved with the installation pipe, and the cavity is established between the inner wall of installation pipe and the outer wall of connecting pipe, and the sealed insertion of one side of installation pipe has the liquid inlet pipe and the back liquid pipe. The utility model discloses through the air -exhaust fan and input the connecting pipe to the gas, then, the low temperature cooling liquid in the cavity is given to the gas through the connecting pipe, thereby the gas heat dissipation cooling, and then make VOCs steam condensation for liquid state, then, the gas passes through multiple activated carbon filter board in proper order, thereby remove the propylene glycol methyl ether acetate solvent, the cyclohexanone solvent in the gas, and then very good to the gas produced during baking is handled.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an automatic baking mechanism for coated wafers. Background Technology

[0002] Automated baking of photoresist-coated wafers is a key process in semiconductor and optical manufacturing. Automated equipment enables precise heating of the photoresist-coated wafers, removes the solvent from the photoresist layer, and cures the photoresist layer, providing a stable photoresist layer base for subsequent exposure, etching and other processes. During the automated baking process, harmful gases are generated due to the evaporation of solvent in the photoresist.

[0003] A search revealed Chinese patent CN220072287U, which discloses a wafer baking mechanism for photoresist-coated wafers. This patent uses a rotating placement plate on both sides of the inner wall of a chamber, with a suction cup structure on the top surface of the placement plate to achieve wider and more uniform baking of the photoresist-coated wafers. However, the chamber is a sealed structure, and harmful gases are generated during the drying process due to the evaporation of solvents from the photoresist. If left untreated, this can contaminate the workpieces and the equipment, and may also affect the health of the operators. Therefore, to better achieve automated wafer baking for photoresist-coated wafers, promote technological progress in the industry, and enhance core technological competitiveness, this application proposes a new implementation scheme for a wafer baking mechanism that differs from existing technologies. Utility Model Content

[0004] The purpose of this invention is to solve the problem that the gas generated during the drying process cannot be treated, and to propose an automatic baking mechanism for coated wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An automatic baking mechanism for coated wafers includes a baking oven. The top of the baking oven has a through hole, and a first mounting box is snapped onto the top of the through hole. An exhaust fan is fixedly connected inside the first mounting box. An exhaust pipe is sealed and inserted into the top of the first mounting box. A connecting pipe is fixedly connected to the other end of the exhaust pipe. The mounting pipe is sleeved on the outer surface of the connecting pipe. A cavity is provided between the inner wall of the mounting pipe and the outer wall of the connecting pipe. An inlet pipe and a return pipe are sealed and inserted into one side of the mounting pipe. One end of the inlet pipe and the return pipe communicates with the cavity. A first exhaust pipe is fixedly connected to the bottom of the connecting pipe. A drain pipe is sealed and inserted into the bottom of the first exhaust pipe. A collection box is sleeved on one end of the drain pipe. A collection container is slidably inserted into one side of the collection box. A second mounting box is snapped onto the other end of the first exhaust pipe. Multiple activated carbon filter plates are snapped into the second mounting box. A second exhaust pipe is sealed and inserted into the other end of the second mounting box. The other end of the second exhaust pipe is sealed and inserted into one side of the baking oven.

[0006] Furthermore, a third mounting box is added to the second exhaust pipe, and a heating coil is fixedly connected inside the third mounting box.

[0007] Furthermore, a sealing door is connected to one side of the baking oven via a hinge, and a handle is fixedly connected to the outer wall of one side of the sealing door.

[0008] Furthermore, a placement plate is slidably inserted between the inner walls of both sides of the baking oven, and the bottom of the placement plate is provided with a groove.

[0009] Furthermore, an installation plate is fixedly connected between the inner walls of both sides of the baking oven, and a heating rod is fixed to the bottom of the installation plate. The heating rod is located above the placement plate, and the installation plate is provided with multiple ventilation holes.

[0010] Furthermore, the baking oven has multiple buttons and a display screen on one side, which are connected to the heating rod and the exhaust fan via wires.

[0011] Furthermore, the outer wall of the vent pipe is wrapped with a first insulating cotton and a second insulating cotton.

[0012] The beneficial effects of this utility model are as follows: 1. Gas is introduced into the connecting pipe by an exhaust fan. Then, the low temperature of the coolant in the cavity is transferred to the gas through the connecting pipe, thereby dissipating heat and cooling the gas, which in turn causes VOCs vapor to condense into liquid. Then, the gas passes through multiple activated carbon filter plates in sequence, thereby removing propylene glycol methyl ether acetate solvent and cyclohexanone solvent from the gas, thus effectively treating the gas generated during baking.

[0013] 2. The gas is heated by a heating coil to prevent the gas entering the baking oven from lowering the oven temperature and thus increasing costs.

[0014] 3. The placement plate is slidably inserted between the inner walls of both sides of the baking oven, making it easy to pull the placement plate out of the baking oven for convenient and quick handling of the coated wafers. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of an automatic baking mechanism for coated wafers proposed in this utility model; Figure 2 This is a partial bottom view of the automatic baking mechanism for coated wafers proposed in this utility model; Figure 3 This is a partial three-dimensional structural diagram of an automatic baking mechanism for coated wafers proposed in this utility model; Figure 4 This is a cross-sectional view of an automatic baking mechanism for coated wafers proposed in this utility model. Figure 5 This is an enlarged structural diagram of part A of the automatic baking mechanism for coated wafers proposed in this utility model.

[0016] In the diagram: 1. Cabinet; 2. Baking oven; 3. Sealed door; 4. Display screen; 5. Button; 6. Placement plate; 7. Mounting plate; 8. Vent hole; 9. Heating rod; 10. Through hole; 11. First mounting box; 12. Exhaust fan; 13. Exhaust pipe; 14. First insulation cotton; 1401. Second insulation cotton; 15. Connecting pipe; 16. First exhaust pipe; 1601. Second exhaust pipe; 18. Mounting pipe; 1801. Cavity; 19. Liquid inlet pipe; 1901. Liquid return pipe; 20. Drain pipe; 21. Liquid collection box; 22. Second mounting box; 23. Activated carbon filter plate; 24. Third mounting box; 25. Heating coil. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0018] Reference Figures 1-5 An automatic baking mechanism for coated wafers includes a baking oven 2, with a placement plate 6 slidably inserted between the inner walls of both sides of the baking oven 2. The placement plate 6 is made of high-temperature resistant 304 stainless steel plate, and the bottom of the placement plate 6 is provided with a groove, so as to facilitate pulling the placement plate 6 out of the baking oven 2 for the removal and placement of coated wafers. The inner walls of the baking oven 2 are fixed with bolts to the mounting plate 7. The bottom of the mounting plate 7 is fixed with heating rods 9. Each heating rod 9 has a power of 2kW and is evenly distributed at the bottom of the mounting plate 7. The baking temperature of the heating rods 9 is controlled at 90-120℃. The heating rods 9 are electrically connected to a PID temperature controller, which enables precise control. The heating rods 9 are used to bake the coated wafers. The heating rod 9 is located above the placement plate 6, and the mounting plate 7 is provided with multiple vent holes 8 so that the gas generated during heating can rise upward through the vent holes 8.

[0019] The top of the baking oven 2 is provided with a through hole 10, and the top of the through hole 10 is snapped with a first mounting box 11. An exhaust fan 12 is fixed inside the first mounting box 11 by bolts. The exhaust fan 12 is a DF-750W model with a rated air volume of 30m³ / h, so as to draw the gas in the baking oven 2 out of the first mounting box 11. like Figure 4 and Figure 5As shown, the top of the first mounting box 11 is sealed with an exhaust pipe 13, and the other end of the exhaust pipe 13 is welded with a connecting pipe 15. The connecting pipe 15 is a copper pipe, and the outer surface of the connecting pipe 15 is sealed with an installation pipe 18. A cavity 1801 is provided between the inner wall of the installation pipe 18 and the outer wall of the connecting pipe 15. One side of the installation pipe 18 is sealed with an inlet pipe 19 and a return pipe 1901. One end of the inlet pipe 19 and the return pipe 1901 are connected to the cavity 1801. The coolant is pumped into the cavity 1801 through the inlet pipe 19. The coolant is an ethylene glycol aqueous solution with a working temperature range of 5-15℃. Then, the low temperature of the coolant in the cavity 1801 is transferred to the gas through the connecting pipe 15, thereby dissipating heat and cooling the gas, and causing the VOCs vapor to condense into liquid. A first exhaust pipe 16 is welded to the bottom of the connecting pipe 15. A drain pipe 20 is sealed and inserted into the bottom of the first exhaust pipe 16. A collection box is sleeved on one end of the drain pipe 20. A collection box 21 is slidably inserted into one side of the collection box so that liquid VOCs can be entered into the collection box 21 for collection through the first exhaust pipe 16 and the drain pipe 20. The collection box 21 is cleaned every 4-8 hours. A gas concentration sensor, model MQ-135, is installed on one side of the drain pipe 20. It can detect the concentration of VOCs in the pipe. When the concentration exceeds the set value, the sensor will sound an alarm to notify the staff. like Figure 4 As shown, the other end of the first exhaust pipe 16 is snapped with a second mounting box 22. Multiple activated carbon filter plates 23 are snapped into the second mounting box 22. The activated carbon filter plates 23 have a honeycomb structure, a mesh size of 100-200 mesh, and a thickness of 50mm. The gas passes through multiple activated carbon filter plates 23 in sequence, thereby removing propylene glycol methyl ether acetate solvent and cyclohexanone solvent from the gas. The top of the second mounting box 22 is equipped with a maintenance cover, and the other end of the second mounting box 22 is sealed and inserted with a second exhaust pipe 1601. The other end of the second exhaust pipe 1601 is sealed and inserted with one side of the baking oven 2. The activated carbon filter plates 23 need to be replaced every 100-150 hours of operation. like Figure 3 and Figure 4 As shown, the outer wall of the vent pipe 13 is wrapped with a first insulation cotton 14 and a second insulation cotton 1401, thereby reducing the loss of gas heat and maintaining the high efficiency of the baking environment. A third mounting box 24 is added to the second exhaust pipe 1601. A heating coil 25 is fixed inside the third mounting box 24 by bolts. The heating coil 25 heats the gas to prevent the gas entering the baking oven 2 from lowering the temperature inside the baking oven 2.

[0020] A sealing door 3 is connected to one side of the oven 2 via a hinge, thereby improving the sealing performance of the oven 2. A handle is fixed to one side of the outer wall of the sealing door 3 by bolts.

[0021] The baking oven 2 has multiple buttons 5 and a display screen 4 on one side, and the buttons 5 and the display screen 4 are connected to the heating rod 9 and the exhaust fan 12 by wires.

[0022] Coolant concentration should be checked monthly. The working principle of this embodiment is as follows: During use, the inlet pipe 19 and the return pipe 1901 are connected to the external coolant tank through the pump body. First, open the sealing door 3, place the coated wafer on the placement plate 6, then close the sealing door 3. Next, start the heating rod 9 and the exhaust fan 12 to bake the coated wafer through the heating rod 9, and control the heating temperature at 90-120℃. The gas generated during baking is drawn into the first mounting box 11 by the exhaust fan 12, and then enters the connecting pipe 15 through the exhaust pipe 13. Then, the coolant is pumped into the cavity 1801 through the inlet pipe 19 by the pump body. Next, the low temperature of the coolant in the cavity 1801 is transferred to the gas through the connecting pipe 15, thereby dissipating heat and cooling the gas, which causes the VOCs vapor to condense into liquid. The liquid is then collected in the collection box 21 through the first exhaust pipe 16 and the drain pipe 20. Then, the heated coolant is discharged from the return pipe 1901, and after being cooled down, it returns to the coolant tank for collection. A gas concentration sensor is used to detect the concentration of unliquefied VOCs in the drain pipe 20. When the concentration exceeds the set value, the sensor will issue an alarm to notify the staff to start the baking process. The cooled gas is introduced into the second mounting box 22 through the first exhaust pipe 16. Then, the gas passes through multiple activated carbon filter plates 23 in sequence to remove propylene glycol methyl ether acetate solvent and cyclohexanone solvent from the gas. Then, the gas is introduced into the third mounting box 24 through the second exhaust pipe 1601. In the third mounting box 24, the gas is heated by the heating coil 25. Then, the heated gas is discharged into the baking oven 2 through the second exhaust pipe 1601 for use.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An automatic baking mechanism for coated wafers, comprising a baking oven (2), characterized in that, The top of the baking oven (2) is provided with a through hole (10), and a first mounting box (11) is snapped into the top of the through hole (10). An exhaust fan (12) is fixedly connected inside the first mounting box (11). An exhaust pipe (13) is sealed and inserted into the top of the first mounting box (11). A connecting pipe (15) is fixedly connected to the other end of the exhaust pipe (13). An installation pipe (18) is sleeved on the outer surface of the connecting pipe (15). A cavity (1801) is provided between the inner wall of the installation pipe (18) and the outer wall of the connecting pipe (15). An inlet pipe (19) and a return pipe (1901) are sealed and inserted into one side of the installation pipe (18). The inlet pipe (19) and the return pipe (1901) are connected to each other. 1) One end is connected to the cavity (1801), the bottom end of the connecting pipe (15) is fixedly connected to the first exhaust pipe (16), the bottom of the first exhaust pipe (16) is sealed and inserted with the drain pipe (20), one end of the drain pipe (20) is sleeved with the collection box, one side of the collection box is slidably inserted with the liquid collection box (21), the other end of the first exhaust pipe (16) is snapped with the second mounting box (22), the second mounting box (22) is snapped with multiple activated carbon filter plates (23), the other end of the second mounting box (22) is sealed and inserted with the second exhaust pipe (1601), the other end of the second exhaust pipe (1601) is sealed and inserted with one side of the baking oven (2).

2. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, A third mounting box (24) is added to the second exhaust pipe (1601), and a heating coil (25) is fixedly connected inside the third mounting box (24).

3. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, The baking oven (2) has a sealing door (3) connected to one side by a hinge, and a handle is fixedly connected to the outer wall of one side of the sealing door (3).

4. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, A placement plate (6) is slidably inserted between the inner walls of both sides of the baking oven (2), and the bottom of the placement plate (6) is provided with a groove.

5. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, An installation plate (7) is fixedly connected between the inner walls of the two sides of the baking oven (2). A heating rod (9) is fixed at the bottom of the installation plate (7). The heating rod (9) is located above the placement plate (6). The installation plate (7) is provided with multiple ventilation holes (8).

6. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, The baking oven (2) has multiple buttons (5) and a display screen (4) on one side. The buttons (5) and the display screen (4) are connected to the heating rod (9) and the exhaust fan (12) by wires.

7. The automatic baking mechanism for coated wafers according to claim 1, characterized in that, The outer wall of the vent pipe (13) is wrapped with a first insulation cotton (14) and a second insulation cotton (1401).

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