A welding carriage

Abstract

The application discloses a kind of welding carriers, applied to circuit board welding production line, including pedestal, by the positioning part on pedestal is placed with the circuit board of device to be welded, device to be welded is inserted in circuit board, and the setting direction of device to be welded on circuit board satisfies the pin arrangement direction of device to be welded and the consistent of the furnace direction of welding production line;Prevent tin connection component is provided on pedestal, prevent tin connection component is set corresponding with the pin position of device to be welded, and prevent tin connection component can isolate the pin of adjacent device to be welded, so, in the process that pedestal moves along furnace direction with circuit board, solder will sequentially be welded to the pin of device to be welded, and prevent tin connection component isolates the solder flow between adjacent pin, reduce the phenomenon that solder flow diffuses to adjacent pin, reduce the tin connection phenomenon between the pin of device to be welded in welding process, improve the yield of electronic component.

Description

Technical Field

[0001] This application relates to the field of electronic component welding technology, and more specifically, to a welding carrier. Background Technology

[0002] During the process of soldering electronic components onto a circuit board, the small spacing between the pins of the electronic components can cause solder bridging between the pins due to the flow and diffusion of solder during the soldering process, leading to short circuits and causing the electronic components to fail.

[0003] In summary, how to reduce solder bridging between the pins of electronic components during the soldering process and improve the yield of electronic components is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a welding carrier that reduces solder bridging between the pins of electronic components during the welding process and improves the yield of electronic components.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A welding carrier, applied on a circuit board welding production line, includes a base with a positioning part for placing a circuit board with a component to be welded; the component to be welded is inserted into the circuit board; and the orientation of the component to be welded on the circuit board must satisfy the following: the pin arrangement direction of the component to be welded is consistent with the reflow direction on the welding production line; the base is provided with an anti-solder bridging component, which is positioned corresponding to the pin position of the component to be welded, and is used to isolate adjacent pins of the component to be welded.

[0007] The welding carrier provided in this application is applied to a circuit board welding production line. It includes a base, on which a circuit board with components to be welded is placed. The components to be welded are inserted into the circuit board, and the orientation of the components on the circuit board is such that the pin arrangement direction of the components to be welded is consistent with the reflow direction of the welding production line. The base is provided with anti-solder bridging components, which are positioned corresponding to the pin positions of the components to be welded. The anti-solder bridging components can isolate adjacent pins of the components to be welded. Thus, as the base moves along the reflow direction with the circuit board, solder will be welded to the pins of the components to be welded in sequence. The anti-solder bridging components isolate the solder flow between adjacent pins, reducing the phenomenon of solder flow spreading to adjacent pins and reducing the bridging phenomenon between the pins of the components to be welded during the welding process, thereby improving the yield of electronic components. Attached Figure Description

[0008] The accompanying drawings used in the embodiments of this application will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings. Figure 1 This is a schematic diagram of the welding carrier provided in the embodiments of this application;

[0009] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0010] Explanation of reference numerals in the attached figures:

[0011] 100-Base; 110-Positioning part; 120-Anti-tinning component; 121-Partition part; 130-Positioning pin; 131-Positioning baffle; 132-Rotating shaft; 200-Conveyor belt. Detailed Implementation

[0012] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. The following embodiments are examples used to illustrate the technical solutions of this application, and should not be used to limit the scope of protection of this application. Those skilled in the art will understand that, without conflict, the following embodiments and features can be combined with each other.

[0013] It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, relational terms such as "first," "second," etc., in the description of this application are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus.

[0014] Furthermore, the term "and / or" in this application is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0015] In the description of the technical solutions in this application, unless otherwise expressly specified and limited, the technical term "connection" can refer to a direct connection or an indirect connection through an intermediate medium.

[0016] like Figure 1 As shown in the embodiment of this application, the welding carrier is applied to a circuit board welding production line. The welding carrier includes: a base 100, which is used to mount the welding carrier on the conveyor belt 200 of the welding machine, so that the welding carrier can carry the circuit board and pass through the welding machine with the conveyor belt 200 for welding; the base 100 has a positioning part 110, which is used to place the circuit board with the device to be welded. The device to be welded is inserted into the circuit board, and the orientation of the device to be welded on the circuit board satisfies the following: the arrangement direction of the pins of the device to be welded is consistent with the reflow direction on the welding production line. The components are consistent; and an anti-soldering component 120 is provided on the base 100. The anti-soldering component 120 is set according to the pin position of the device to be soldered, so that the anti-soldering component 120 can isolate adjacent pins of the device to be soldered. In this way, as the base 100 moves along the reflow direction with the circuit board, the solder will be soldered to the pins of the device to be soldered in sequence. The anti-soldering component 120 isolates the solder flow between adjacent pins, reducing the phenomenon of solder flow spreading to adjacent pins, reducing the phenomenon of solder bridging between the pins of the device to be soldered during the soldering process, and improving the yield of electronic components.

[0017] It should be noted that the positioning part 110 in this application can be a cavity opened on the base 100, and the circuit board can be positioned by placing the circuit board in the cavity. Alternatively, other components can be set on the base 100 for positioning the circuit board, such as a frame placed on the base 100. This application embodiment does not limit this.

[0018] It should be noted that the reflow direction is the direction of movement of the conveyor belt 200, that is, the direction in which the welding carrier carries the circuit board through the welding machine. The anti-soldering component 120 spacees the adjacent pins of the devices to be welded, reducing the phenomenon of solder bridging between pins during the welding process.

[0019] It should be noted that the circuit board has pre-set solder holes for inserting the corresponding pins of the device to be soldered. In practice, the devices to be soldered include pins with the same distribution and component module bodies of different sizes. Therefore, when the pin spacing is consistent, the anti-soldering component 120 in this application can be applied to module bodies of different sizes, thus improving the applicability of the anti-soldering component 120.

[0020] In order to make the circuit board move synchronously with the base 100, the base 100 is provided with positioning elements to position the circuit board. There are at least two positioning elements arranged symmetrically.

[0021] like Figure 1 As shown, the positioning component is a positioning pin 130 disposed on the base 100. The positioning pin 130 includes a positioning baffle 131 and a rotating shaft 132. The rotating shaft 132 is fixedly connected to the base 100, and the positioning baffle 131 is rotatably disposed around the rotating shaft 132 so that the substrate of the circuit board is restricted between the positioning baffle 131 and the base 100, so that the circuit board can move synchronously with the base 100 for stable soldering operations.

[0022] like Figures 1-2 As shown, the anti-soldering component 120 includes at least two partitions 121, which are distributed sequentially along the reflow direction, and there is a gap between two adjacent partitions 121 so that a pin of the device to be soldered can be placed in the gap. The gap between adjacent partitions 121 achieves physical isolation between adjacent pins of the device to be soldered, thereby reducing the phenomenon of solder bridging between adjacent pins during the soldering process.

[0023] In some embodiments, the side of the partition 121 used to isolate the pins is a plane to reduce the manufacturing process of the partition 121 and reduce costs.

[0024] In some other embodiments, the side of the partition 121 used to isolate the pins is curved, so that the partition 121 is closer to the device body of the device to be soldered, reducing the gap between the partition 121 and the device body, thereby reducing the flow of solder from the gap between the partition 121 and the device body, further reducing the flow of solder between adjacent pins, and further reducing solder bridging.

[0025] To reduce solder adhesion to the partition portion 121, the side of the partition portion 121 used for isolating the pins has an anti-solder adhesion layer, which reduces solder adhesion on the partition portion 121, thereby reducing the impact of solder adhesion on the spacing effect of the partition portion 121 on the pins of the device to be soldered, and further improving the spacing effect between adjacent pins.

[0026] In some embodiments, the anti-solder adhesion coating can be a polytetrafluoroethylene (PTFE) coating, which achieves the anti-solder adhesion effect through the anti-stick properties and high temperature resistance of PTFE.

[0027] In other embodiments, the anti-solder adhesion coating can be a nanocomposite ceramic coating, which achieves the anti-solder adhesion effect through the high temperature resistance and chemical stability of the nanocomposite ceramic.

[0028] Of course, the anti-solder adhesion coating can also be other high-temperature resistant coatings that can prevent solder adhesion, and the embodiments of this application do not limit this.

[0029] To further reduce solder adhesion to the partition portion 121, in some embodiments, the partition portion 121 is made of high-temperature resistant ceramic material. The high-temperature stability and chemical inertness of the high-temperature resistant ceramic make it difficult for solder to adhere to the high-temperature resistant ceramic, thereby reducing solder adhesion to the partition portion 121.

[0030] In some other embodiments, the partition 121 can be made of titanium alloy. The high temperature resistance, good corrosion resistance and good biocompatibility of titanium alloy can prevent solder adhesion, thereby reducing the adhesion of solder on the partition 121.

[0031] Of course, the partition 121 can also be made of other non-tin-adhesive materials, and this application embodiment does not limit this.

[0032] In this application, in order to ensure that all adjacent pins of the device to be soldered can be separated by the partition 121, the number of partitions 121 satisfies the following condition: the number of partitions 121 is greater than or equal to the number of pins of the device to be soldered placed in the gap of the partition 121 plus 1, so that adjacent pins of the device to be soldered can be separated by the partition 121, thereby reducing the flow of solder between adjacent pins.

[0033] In this application, the anti-bridging component 120 is a detachable component. Specifically, the partition 121 can be detachably connected to the base 100 via a threaded component or a pin, allowing the partition 121 to be adjusted according to different pin pitches. This makes the anti-bridging component 120 suitable for soldering devices of different specifications, improving its applicability. Of course, other components with the same working principle as threaded components or pins can also be used to achieve the detachable connection of the partition. Here, threaded components or pins are merely examples of implementation methods and do not constitute a limitation.

[0034] In this application, the thickness of the partition portion 121 is less than or equal to 0.2 mm, so that there is a space for solder flow between the pins of the device to be soldered and the circuit board substrate, thereby improving the soldering strength between the device to be soldered and the circuit board substrate and further improving the yield of electronic components.

[0035] In the operation of the welding carrier provided in this application embodiment, the circuit board with the device to be welded is first positioned in the positioning part 110 of the base 100 by the positioning pin 130, and the pins of the device to be welded are spaced apart from the partition part 121 so that during the welding process, the partition part 121 forms a physical isolation between adjacent pins of the device to be welded, so that the solder only flows between adjacent partition parts 121, reducing the phenomenon of solder flow spreading to adjacent pins, reducing the phenomenon of solder bridging between the pins of electronic components during the welding process, and improving the yield of electronic components.

[0036] For the same or similar parts among the various embodiments in this specification, please refer to each other.

[0037] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0038] The above specific examples illustrate the principles and implementation methods of the present invention. The descriptions of these embodiments are merely for the purpose of helping to understand the technical solutions and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A welding carrier, said welding carrier being used in a circuit board welding production line, characterized in that, Includes a base (100), the base (100) having a positioning part (110) for placing a circuit board with a device to be soldered; the device to be soldered is inserted into the circuit board; and the setting direction of the device to be soldered on the circuit board satisfies: the arrangement direction of the pins of the device to be soldered is consistent with the reflow direction on the welding production line; The base (100) is provided with an anti-soldering component (120), which is provided corresponding to the pin position of the device to be soldered, and the anti-soldering component (120) is used to isolate adjacent pins of the device to be soldered.

2. The welding carrier according to claim 1, characterized in that, The anti-tin bridging component (120) includes at least two partitions (121), which are distributed sequentially along the reflow direction. There is a gap between two adjacent partitions (121), which is used to place one pin of the device to be soldered.

3. The welding carrier according to claim 2, characterized in that, The partition (121) is used to isolate the pin. One side of the partition is either flat or curved.

4. The welding carrier according to any one of claims 2-3, characterized in that, The partition (121) has an anti-soldering layer on the side used to isolate the pin.

5. The welding carrier according to claim 4, characterized in that, The partition (121) is made of high-temperature ceramic material or titanium alloy material.

6. The welding carrier according to claim 5, characterized in that, The number of the partitions (121) is greater than or equal to the number of pins of the device to be soldered placed in the gap of the partitions (121) plus 1.

7. The welding carrier according to claim 6, characterized in that, The base (100) is provided with positioning elements for positioning the circuit board. There are at least two positioning elements, which are arranged symmetrically.

8. The welding carrier according to claim 7, characterized in that, The positioning element is a positioning pin (130) disposed on the base (100). The positioning pin (130) includes a positioning baffle (131) and a rotating shaft (132). The rotating shaft (132) is fixedly connected to the base (100). The positioning baffle (131) is rotatably disposed around the rotating shaft (132), and the substrate of the circuit board is constrained between the positioning baffle (131) and the base (100).

9. The welding carrier according to any one of claims 5 to 8, characterized in that, The anti-tin bridging component (120) is a detachable component.

10. The welding carrier according to claim 9, characterized in that, The anti-tinning component (120) is detachably connected to the base via a threaded part or a pin.

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