A carrier for laser marking of semiconductor package substrates
By designing a carrier for laser marking on semiconductor packaging substrates with a rotating disk and an outer disk structure, the substrate can be flipped on the same clamping surface, solving the problem of substrate position offset caused by the flipping operation, improving the QR code recognition rate and cycle efficiency, and reducing the computational load and maintenance cost of the vision system.
Patent Information
- Application Number
- CN202521985799.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-16
AI Technical Summary
In the current laser marking process for semiconductor packaging substrates, the flipping operation causes the substrate position to shift, affecting the QR code recognition rate and increasing the computational load of the vision system, while also lengthening the cycle time.
A carrier for laser marking on semiconductor packaging substrates is designed. The substrate can be flipped on the same clamping surface by rotating the disk and coaxially sleeved with the outer disk structure. The clamping structure is driven by helical gears and transmission structure to complete 180-degree flipping. Combined with the cylinder to adjust the clamping force, it is ensured that the substrate does not leave the carrier during the flipping process.
Eliminating reference drift, shortening cycle time, reducing the computational load on the vision system, improving the consistency and recognition rate of marker positions, and reducing maintenance costs.
Smart Images
Figure CN224674008U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, specifically to a carrier for laser marking on a semiconductor packaging substrate. Background Technology
[0002] Laser marking on semiconductor packaging substrates involves focusing a high-energy laser beam onto the surface of the packaging substrate (IC carrier board), instantly vaporizing or carbonizing the solder resist layer, copper layer, or ink to form visible letters, numbers, QR codes, or graphic markings. These markings are used to trace batches, identify models, and distinguish polarities, while ensuring that the electrical performance and appearance quality of the substrate are not affected. Therefore, the marking position must be precise, the character edges must be clear, and the heat-affected zone must be small. Laser marking is usually performed on high-speed, automated production lines.
[0003] Laser marking of semiconductor packaging substrates requires a carrier to support and place the substrate. When marking is required on both sides of the substrate, it needs to be flipped. Currently, whether the flipping operation is done manually with tweezers, by vacuum suction cup robotic arms, or by a dual-carrier flipping table, the clamps must be released at the marking station to allow the substrate to leave its original positioning surface before it is transferred to another set of clamping surfaces and re-fixed. This process inevitably introduces (leaving-re-placement) errors: hand tremors during manual placement, displacement of the suction point during suction cup transfer, and wear of the assembly gap and positioning pins between the two carriers during the handover can all cause slight displacement of the substrate edge or positioning hole relative to the laser coordinate system. This displacement is enough to make the edge of the QR code on the same batch of products appear visibly off, resulting in a decrease in recognition rate during downstream visual inspection, or even being judged as defective due to positional errors. More importantly, after each re-placement, the laser marking machine must re-take photos, recalculate the offset, and compensate for the coordinates. This not only lengthens the cycle time but also increases the computational load and maintenance costs of the vision system. Utility Model Content
[0004] This invention provides a carrier for laser marking on semiconductor packaging substrates, which has the advantages of zero reference offset during the flipping process, no need for repeated visual alignment, short cycle time, and high consistency. This solves the common problems of position drift, frequent visual compensation, and long overall cycle time caused by the existing flipping method which requires "releasing-transferring-re-clamping".
[0005] To achieve the above objectives, this utility model provides the following technical solution: a carrier for laser marking on a semiconductor packaging substrate, comprising a rotating disk and an outer disk coaxially sleeved on the outer periphery of the rotating disk; The outer edge of the rotating disk is evenly provided with a plurality of flipping grooves, and the rotating disk at each of the flipping grooves is provided with horizontally symmetrical rotating holes, and a rotating shaft is rotatably supported in each rotating hole. One end of the rotating shaft is provided with a clamping structure for clamping the edge of the semiconductor packaging substrate, and the other end is fitted with a helical gear that rotates on the rotating disk. The outer disk is provided with a transmission structure for driving the helical gear to rotate, so that the helical gear, driven by the transmission structure, drives the rotating shaft and the clamping structure to rotate 180 degrees.
[0006] As a preferred embodiment of this utility model, the rotating disk is provided with a spacing adjustment structure for controlling the applicable clamping range of the clamping structure.
[0007] As a preferred technical solution of this utility model, the rotating shaft is symmetrically provided with vertical grooves parallel to the axial direction, and a rotating wheel is fixedly sleeved on the outer periphery of one end of the rotating shaft near the clamping structure. Symmetrical insertion holes are provided on the rotating shaft located at one end of the rotating wheel. A prismatic column is fixedly connected to the rotating shaft. A limiting groove is provided on the rotating shaft at one end of the prismatic column. The limiting groove is used to limit the axial position of the clamping structure.
[0008] As a preferred embodiment of this utility model, the clamping structure includes: A contact plate, wherein a plug pin is symmetrically fixed on one side of the contact plate and slidably inserted into the plug hole, and a spring is provided at one end of the plug pin, one end of the spring abutting against the plug pin and the other end abutting against the inner wall of the plug hole to provide an adaptive clamping force; An alternating support assembly is disposed on the rotation axis and is used to cooperate with the abutment plate to support the edge of the semiconductor packaging substrate.
[0009] As a preferred embodiment of this utility model, the alternating support component includes: A connecting rod that slides symmetrically within the vertical groove has an abutment fixed to one end and a bearing rod installed at the other end. The bearing rod is used to support the surface of the semiconductor packaging substrate facing the bottom. A limiting ring is provided, wherein a convex ring is fixedly fixed on the inner wall of the limiting ring and rotatably sleeved in the limiting groove, and an abutting sleeve is fixedly connected to the limiting ring. The abutting sleeve has a curved groove that continuously abuts against the abutting head. Two limiting blocks that slide on the rotating disk are symmetrically fixed on the outer wall of the limiting ring to limit the limiting ring to move only horizontally.
[0010] As a preferred embodiment of this utility model, the transmission structure includes: A helical rack that meshes with a helical gear; An electric actuator, one end of which is fixedly connected to the helical rack, is mounted on the outer disk to provide linear driving force and lock the rotation angle of the helical gear.
[0011] As a preferred embodiment of this utility model, the helical gear rotates within an embedded groove adapted to be opened on the rotating disk. The helical gear has a prismatic hole for slidingly fitting onto the prismatic column. The helical gear protrudes from the surface of the rotating disk. The inclined direction of the helical gear's tooth seat is parallel to the circumference of the rotating disk, so that the helical gear can slide into or out of the rack meshing area along the circumference direction when rotating with the rotating disk, maintaining continuous meshing.
[0012] As a preferred embodiment of this utility model, the spacing adjustment structure includes: A cylinder is installed at the center of the rotating disk. The piston rod of the cylinder is fixedly connected to a connecting disk, and several sub-supports are fixedly connected to the outer edge of the connecting disk. A column is mounted on the rotating disk, and a collar is fitted on the column to be fixedly connected to the sub-bracket. A sliding rod, one end of which is rotatably connected to a connecting rod rotatably mounted on the collar, and the sliding rod is slidably inserted into a sliding seat mounted on the rotating disk; The Y-shaped frame is fixed to the other end of the sliding rod and rotates and engages with the rotating wheel to synchronously adjust the opening degree of all clamping structures through the linear motion of the cylinder.
[0013] Compared with the prior art, the present invention provides a carrier for laser marking on a semiconductor packaging substrate, which has the following advantages: 1. The carrier for laser marking of semiconductor packaging substrate integrates the flipping action on the same rotating disk and rotating shaft, so that the substrate is always attached to the same clamping support surface during the entire flipping process. It can achieve 180-degree flipping without leaving the carrier, thereby completely eliminating the reference drift caused by "leaving and re-placing", reducing the error caused by the processing reference offset, ensuring that the original coordinate system of laser marking remains unchanged, and avoiding repeated visual alignment.
[0014] 2. The carrier for laser marking on semiconductor packaging substrates completes flipping, angle locking, and adaptive adjustment of clamping force sequentially by setting the same driving source. This shortens the overall cycle time, reduces the computational load and maintenance cost of the vision system, and ensures the consistency and accuracy of the marking position of products in the same batch. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2This is a structural schematic diagram of the present invention from another angle; Figure 3 This is a schematic diagram of the structure of the present invention, which removes the spacing adjustment structure. Figure 4 This is a schematic diagram of the structure of the rotating disk of this utility model; Figure 5 This is a schematic diagram of the outer disk of this utility model; Figure 6 This is a schematic diagram of the clamping structure of this utility model; Figure 7 This is an exploded structural diagram of the clamping structure of this utility model; Figure 8 This is a partial structural diagram of the clamping structure of this utility model; Figure 9 This is a schematic diagram of the alternating support component of this utility model; Figure 10 This is a schematic diagram of the transmission structure of this utility model; Figure 11 This is a schematic diagram of the spacing adjustment structure of this utility model; Figure 12 This is a partial structural diagram of the spacing adjustment structure of this utility model; Figure 13 This is a schematic diagram of the connecting disc of this utility model.
[0016] In the diagram: 1. Rotating disk; 2. Rotating hole; 3. Embedded groove; 4. Outer disk; 5. Rotating shaft; 6. Vertical groove; 7. Rotating wheel; 8. Insertion hole; 9. Limiting groove; 10. Prism-shaped column; 11. Insertion column; 12. Spring; 13. Abutment plate; 14. Connecting rod; 15. Abutment head; 16. Bearing rod; 17. Abutment sleeve; 18. Limiting ring; 19. Limiting block; 20. Helical gear; 21. Prism-shaped hole; 22. Helical rack; 23. Electric push rod; 24. Cylinder; 25. Connecting disk; 26. Sub-bracket; 27. Column; 28. Collar; 29. Connecting rod; 30. Sliding rod; 31. Sliding seat; 32. Y-shaped frame. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] Please see Figures 1-13This utility model discloses a carrier for laser marking on a semiconductor packaging substrate, including a rotating disk 1 and an outer disk 4 coaxially sleeved on the outer periphery of the rotating disk 1; The outer edge of the rotating disk 1 is evenly provided with a plurality of flipping grooves, and the rotating disk 1 at each of the flipping grooves is provided with horizontally symmetrical rotating holes 2, and a rotating shaft 5 is rotatably supported in each rotating hole 2. One end of the rotating shaft 5 is provided with a clamping structure for clamping the edge of the semiconductor packaging substrate, and the other end is fitted with a helical gear 20 that rotates on the rotating disk 1. The outer disk 4 is provided with a transmission structure for driving the helical gear 20 to rotate, so that the helical gear 20 drives the rotating shaft 5 and the clamping structure to rotate 180 degrees under the drive of the transmission structure.
[0019] In this embodiment, the coaxial arrangement of the rotating disk 1 and the outer disk 4 forms a stable bearing base. The flipping groove extends evenly along the outer edge of the rotating disk 1, providing a horizontally symmetrical support position for each rotating shaft 5. The rotating hole 2 is horizontally arranged at the flipping groove, allowing the rotating shaft 5 to be horizontally mounted and coaxially connected with the helical gear 20, forming a transmission path from the outer disk 4 to the rotating disk 1. When the transmission structure drives the helical gear 20, the helical gear 20 rotates smoothly in the embedded groove 3, causing the rotating shaft 5 and its end clamping structure to rotate synchronously by 180 degrees. The edge of the substrate is always attached to the clamping surface, and the flipping action can be completed without leaving the carrier. The coaxial arrangement ensures that the rotation center of each rotating shaft 5 is consistent, making the flipping process smooth and continuous, and avoiding additional load or impact caused by center offset. Throughout the flipping process, the substrate always remains on the same clamping structure support surface, without any removal and repositioning. Therefore, the original processing benchmark of laser marking is maintained, and there is no need to re-photograph and reposition, which shortens the cycle time and ensures the consistency of the marking position of the same batch of products.
[0020] Please see Figures 6-7 As a preferred technical solution of this utility model, the rotating shaft 5 is provided with vertical grooves 6 symmetrically arranged parallel to the axis direction, and a rotating wheel 7 is sleeved and fixedly connected to the outer periphery of one end of the rotating shaft 5 near the clamping structure. A symmetrical insertion hole 8 is provided on the rotating shaft 5 located at one end of the rotating wheel 7. A prismatic column 10 is fixedly connected to the rotating shaft 5. A limiting groove 9 is provided on the rotating shaft 5 at one end of the prismatic column 10. The limiting groove 9 is used to limit the axial position of the clamping structure.
[0021] In this embodiment, the vertical groove 6 is symmetrically opened along the axial direction of the rotating shaft 5, providing a clear sliding guide for the subsequent alternating support components; the rotating wheel 7 is sleeved and fixed to the outer periphery of the shaft near one end of the clamping structure, forming the outer edge fulcrum of the rotational transmission, so that the supporting force can be evenly transmitted; the insertion hole 8 is symmetrically opened at the same end of the rotating wheel 7, providing a horizontal insertion channel for the insertion post 11 of the contact plate 13, and forming the contact surface of the spring 12 in the hole, thereby realizing the linear adjustment of the clamping opening; the prismatic column 10 is fixed to the outer periphery of the rotating shaft 5; the limiting groove 9 is opened at the end of the prismatic column 10 facing the clamping structure, and its annular groove surface cooperates with the inner convex ring of the limiting ring 18, which not only allows the limiting ring 18 to rotate around the shaft, but also rigidly limits its axial position, ensuring that the support components do not move axially during rotation, so that the clamping structure always maintains a certain clamping reference, thereby maintaining the laser marking processing reference unchanged.
[0022] Please see Figures 1-8 As a preferred embodiment of this utility model, the clamping structure includes: A contact plate 13 is provided, and a plug post 11 is symmetrically fixed on one side of the contact plate 13 and slidably inserted into the plug hole 8. A spring 12 is provided at one end of the plug post 11. One end of the spring 12 abuts against the plug post 11 and the other end abuts against the inner wall of the plug hole 8 to provide an adaptive clamping force. An alternating support assembly is disposed on the rotation shaft 5 and is used to cooperate with the abutment plate 13 to support the edge of the semiconductor packaging substrate.
[0023] In this embodiment, the abutment plate 13 is horizontally inserted into the insertion hole 8 through the insertion post 11. The outer periphery of the insertion post 11 forms a sliding guide with the hole wall, allowing the abutment plate 13 to move slightly along the axial direction. The two ends of the spring 12 abut against the end face of the insertion post 11 and the bottom wall of the hole, respectively. During the clamping process, it automatically compresses and provides a rebound force, thereby achieving adaptive clamping of substrates of different sizes. The alternating support assembly is set on the rotating shaft 5 and arranged in pairs with the abutment plate 13. The two work together to support the edge of the semiconductor packaging substrate, so that the substrate is always attached to the same support surface during the marking and flipping process, which not only prevents the substrate from leaving the clamping surface, but also ensures that the laser processing reference does not shift.
[0024] Please see Figures 6-9 As a preferred embodiment of this utility model, the alternating support component includes: A connecting rod 14 slides symmetrically within the vertical groove 6. One end of the connecting rod 14 is fixedly connected to an abutment head 15, and the other end is equipped with a bearing rod 16. The bearing rod 16 is used to support the surface of the semiconductor packaging substrate facing the bottom. A limiting ring 18 has a convex ring fixed to its inner wall and rotatably sleeved in the limiting groove 9. An abutting sleeve 17 is fixed to the limiting ring 18. The abutting sleeve 17 has a curved groove that continuously abuts against the abutting head 15. Two limiting blocks 19 are symmetrically fixed to the outer wall of the limiting ring 18 and slide on the rotating disk 1 to limit the limiting ring 18 to move only horizontally.
[0025] In this embodiment, the connecting rod 14 slides up and down along the vertical groove 6, and the contact head 15 fixed at its top continuously abuts against the curved groove of the contact sleeve 17. When the connecting rod 14 rotates synchronously with the rotating shaft 5, the limiting ring 18 is restricted to axial lateral movement and cannot rotate. Therefore, the curved surface of the curved groove pushes the contact head 15 to move, thereby causing the connecting rod 14 and the bearing rod 16 to extend and retract synchronously. During the flipping operation, the connecting rod 14 located above will be in contact with the curved groove at a deeper position due to the contact head 15, thus making the upper bearing rod 16 shorter than the lower bearing rod 16, avoiding When no marking is required, the upper support rod 16 blocks the edge of the substrate; the support rod 16 is located at the other end of the connecting rod 14 and is used to directly support the surface of the semiconductor packaging substrate facing the bottom, forming an upper and lower clamping support relationship with the contact plate 13. The convex ring on the inner wall of the limiting ring 18 is rotated and sleeved in the limiting groove 9, so that it can only rotate around the axis and cannot move axially. The two limiting blocks 19, which are symmetrically fixed on the outer wall, slide on the rotating disk 1, ensuring that the limiting ring 18 can only move horizontally, thereby converting the horizontal thrust into the vertical lifting and lowering motion of the connecting rod 14, realizing the coordinated action of alternating support and clamping.
[0026] Please see Figures 1-10 As a preferred embodiment of this utility model, the transmission structure includes: Helical rack 22, which meshes with helical gear 20; An electric push rod 23 is provided, with one end of its piston rod fixedly connected to the helical rack 22. The electric push rod 23 is mounted on the outer disk 4 to provide linear driving force and lock the rotation angle of the helical gear 20.
[0027] In this embodiment, the helical rack 22 is arranged radially along the outer disk 4, and its inclined tooth surface fully meshes with the helical teeth of the helical gear 20 to form a unidirectional rotational transmission. The piston rod of the electric push rod 23 is fixedly connected to the helical rack 22. When the push rod extends or retracts, the helical rack 22 moves in a straight line, driving the helical gear 20 and its coaxial rotating shaft 5 to achieve a predetermined angle of forward or reverse rotation, thereby driving the clamping structure to complete a 180-degree flipping action. After the push rod reaches the end of its stroke, the self-locking function of the piston rod keeps the helical rack 22 in its current position, and the rotation angle of the helical gear 20 is locked in time. No additional braking mechanism is required, ensuring that the flipping angle is stable and reliable, and also providing a fixed processing benchmark for laser marking.
[0028] Please see Figures 6-10 As a preferred technical solution of this utility model, the helical gear 20 rotates within the embedded groove 3 adapted to be opened on the rotating disk 1. The helical gear 20 is provided with a prismatic hole 21 for slidingly sleeved on the prismatic column 10. The helical gear 20 protrudes from the surface of the rotating disk 1. The inclined direction of the tooth seat of the helical gear 20 is parallel to the circumference of the rotating disk 1, so that the helical gear 20 can slide into or out of the rack meshing area along the circumference direction when rotating with the rotating disk 1, maintaining the meshing continuity.
[0029] In this embodiment, the embedding groove 3 is opened along the circumferential direction of the rotating disk 1, and the tooth seat inclination angle of the helical gear 20 is parallel to the circumferential line of the rotating disk 1. This allows the tooth surface of the helical gear 20 to smoothly slide into or out of the rack meshing area along the circumferential direction when it moves with the rotating disk 1. This parallel arrangement maintains the continuous meshing of the helical gear 20 and the helical rack 22, avoiding meshing interruption or jamming, and at the same time reducing the transmission clearance. When the helical gear 20 rotates inside the embedding groove 3, there will be a large frictional damping. Therefore, when the helical rack 22 drives the helical gear 20 to rotate and disengages, the helical gear 20 will not rotate randomly inside the embedding groove 3, which can achieve angle locking, ensure smooth flipping action and accurate angle, and thus maintain the consistency of the laser marking processing benchmark.
[0030] Please see Figures 1-13 As a preferred embodiment of this utility model, the rotating disk 1 is provided with a spacing adjustment structure for controlling the applicable clamping range of the clamping structure. The spacing adjustment structure includes: Cylinder 24 is installed at the center of the rotating disk 1. The piston rod of cylinder 24 is fixedly connected to a connecting disk 25. Several sub-supports 26 are fixedly connected to the outer edge of the connecting disk 25. The column 27 is mounted on the rotating disk 1, and a collar 28 is fitted on the column 27 and fixedly connected to the sub-bracket 26; A sliding rod 30, one end of which is rotatably connected to a connecting rod 29 rotatably mounted on the collar 28, and the sliding rod 30 is slidably inserted into a sliding seat 31 mounted on the rotating disk 1; Y-shaped frame 32 is fixed to the other end of the sliding rod 30. The Y-shaped frame 32 is rotatably engaged with the rotating wheel 7 so as to synchronously adjust the opening degree of all clamping structures through the linear motion of the cylinder 24.
[0031] In this embodiment, the piston rod of cylinder 24 extends and retracts along the axial direction of rotating disk 1, and transmits linear motion synchronously to each sub-support 26 through connecting disk 25; collar 28 is sleeved on the outer periphery of column 27 and fixed to sub-support 26, slides axially as piston rod moves, and pushes and pulls sliding rod 30 through connecting rod 29, so that sliding rod 30 moves radially and linearly in sliding seat 31; Y-shaped frame 32 is fixed to the outer end of sliding rod 30, and its fork is rotated and engaged on the outer edge of rotating wheel 7. When sliding rod 30 is pushed inward, Y-shaped frame 32 synchronously pushes rotating wheel 7 and drives the entire rotating shaft 5 to slide axially. The prismatic hole 21 opened on helical gear 20 is slidably sleeved on prismatic column 10. Therefore, when rotating shaft 5 is sliding, helical gear 20 can still drive rotating shaft 5 to rotate.
[0032] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A carrier for laser marking on a semiconductor packaging substrate, comprising a rotating disk (1) and an outer disk (4) coaxially sleeved on the outer periphery of the rotating disk (1), characterized in that: The outer edge of the rotating disk (1) is evenly provided with a number of flipping grooves, and the rotating disk (1) at each flipping groove is provided with a horizontally symmetrical rotating hole (2), and a rotating shaft (5) is rotatably supported in each rotating hole (2). One end of the rotating shaft (5) is provided with a clamping structure for clamping the edge of the semiconductor packaging substrate, and the other end is provided with a helical gear (20) that rotates on the rotating disk (1). The outer disk (4) is provided with a transmission structure for driving the helical gear (20) to rotate, so that the helical gear (20) drives the rotating shaft (5) and the clamping structure to rotate 180 degrees under the drive of the transmission structure.
2. The carrier for laser marking on a semiconductor packaging substrate according to claim 1, characterized in that: The rotating disk (1) is provided with a spacing adjustment structure for controlling the applicable clamping range of the clamping structure.
3. The carrier for laser marking on a semiconductor packaging substrate according to claim 2, characterized in that: The rotating shaft (5) is symmetrically provided with vertical grooves (6) parallel to the axis direction, and a rotating wheel (7) is fixedly connected to the outer periphery of one end of the rotating shaft (5) near the clamping structure. A symmetrical insertion hole (8) is provided on the rotating shaft (5) located at one end of the rotating wheel (7). A prismatic column (10) is fixed on the rotating shaft (5). A limiting groove (9) is provided on the rotating shaft (5) at one end of the prismatic column (10). The limiting groove (9) is used to limit the axial position of the clamping structure.
4. The carrier for laser marking on a semiconductor packaging substrate according to claim 3, characterized in that: The clamping structure includes: A contact plate (13) is provided with a symmetrically fixed plug post (11) on one side of the contact plate (13) that is slidably inserted into the plug hole (8). A spring (12) is provided at one end of the plug post (11). One end of the spring (12) abuts against the plug post (11) and the other end abuts against the inner wall of the plug hole (8) to provide an adaptive clamping force. An alternating support assembly is disposed on the rotating shaft (5) for cooperating with the abutment plate (13) to support the edge of the semiconductor packaging substrate.
5. The carrier for laser marking on a semiconductor packaging substrate according to claim 4, characterized in that: The alternating support assembly includes: A connecting rod (14) slides symmetrically within the vertical groove (6). One end of the connecting rod (14) is fixed with an abutment (15), and the other end is equipped with a bearing rod (16). The bearing rod (16) is used to support the surface of the semiconductor packaging substrate facing the bottom. The limiting ring (18) has a convex ring fixed on its inner wall and rotated within the limiting groove (9). A contact sleeve (17) is fixed on the limiting ring (18). A curved groove is formed on the contact sleeve (17) to continuously contact the contact head (15). Two limiting blocks (19) are symmetrically fixed on the outer wall of the limiting ring (18) and slide on the rotating disk (1) to limit the limiting ring (18) to move only horizontally.
6. The carrier for laser marking on a semiconductor packaging substrate according to claim 1, characterized in that: The transmission structure includes: A helical rack (22) meshes with the helical gear (20); An electric push rod (23) has one end of its piston rod fixedly connected to the helical rack (22). The electric push rod (23) is mounted on the outer disk (4) to provide linear driving force and lock the rotation angle of the helical gear (20).
7. The carrier for laser marking on a semiconductor packaging substrate according to claim 3, characterized in that: The helical gear (20) rotates in the embedded groove (3) adapted to be opened on the rotating disk (1). The helical gear (20) has a prismatic hole (21) for sliding on the prismatic column (10). The helical gear (20) protrudes from the surface of the rotating disk (1). The inclined direction of the tooth seat of the helical gear (20) is parallel to the circumference of the rotating disk (1) so that the helical gear (20) can slide into or out of the rack meshing area along the circumference when rotating with the rotating disk (1), so as to maintain the meshing continuity.
8. The carrier for laser marking on a semiconductor packaging substrate according to claim 3, characterized in that: The spacing adjustment structure includes: Cylinder (24), the cylinder (24) is installed at the center of the rotating disk (1), the piston rod of the cylinder (24) is fixedly connected to the connecting disk (25), and a number of sub-supports (26) are fixedly connected to the outer edge of the connecting disk (25). The column (27) is mounted on the rotating disk (1), and the column (27) is fitted with a collar (28) that is fixedly connected to the sub-bracket (26). A sliding rod (30) is provided, one end of which is rotatably connected to a connecting rod (29) rotatably mounted on the collar (28). The sliding rod (30) is slidably inserted into a sliding seat (31) mounted on the rotating disk (1). Y-shaped frame (32), which is fixed to the other end of the sliding rod (30), and the Y-shaped frame (32) is rotated and engaged on the rotating wheel (7) so as to synchronously adjust the opening degree of all clamping structures through the linear motion of the cylinder (24).