Anti-disengagement polishing device for wafer processing
By using anti-detachment components and purge gas jets during wafer processing, the instability and silicon chip adhesion issues at the wafer edges during polishing were resolved, achieving higher processing accuracy and cleanliness, and improving wafer quality and integrated circuit yield.
Patent Information
- Application Number
- CN202521960581.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-12
AI Technical Summary
In existing technologies, wafer edges are prone to slight displacement or vibration during polishing, which affects processing accuracy and consistency. Furthermore, silicon chips tend to adhere to the wafer surface, reducing the yield of integrated circuits.
The system employs an anti-detachment component and a purge gas jet. The anti-detachment component uses a grinding wheel to limit and polish the wafer edge, while the purge gas jet is used to separate silicon chips. Combined with vacuum adsorption to fix the wafer, this ensures stability and cleanliness.
It improves the stability and precision of the wafer polishing process, reduces silicon chip residue, and enhances wafer processing quality and integrated circuit yield.
Smart Images
Figure CN224674501U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer processing technology, and in particular to a grinding device for preventing detachment during wafer processing. Background Technology
[0002] In the wafer manufacturing process, surface polishing is required. Due to their small size and difficulty in clamping, wafers necessitate the use of appropriate fixtures to achieve the polishing action of the grinding wheel. Edge treatment is a crucial step in this process. Untreated wafer edges are typically sharp and contain defects such as microcracks and chipping. These not only represent potential stress concentration points that could lead to wafer breakage during subsequent high-temperature processing or transport, but are also major sources of particulate contamination, significantly reducing the yield of integrated circuits.
[0003] In existing technologies, wafer edge polishing machines typically use a spindle vacuum adsorption combined with mechanical clamping to fix and rotate the wafer, followed by polishing with a high-speed rotating grinding wheel. However, during the rough grinding and subsequent polishing processes, the wafer, especially ultra-thin wafers, is prone to slight vertical displacement or vibration due to stress. This instability directly affects the edge contour and the processing accuracy and consistency during polishing. Simultaneously, the silicon chips generated during grinding are easily re-adheded to the wafer surface and edges due to static electricity or adhesive forces. Therefore, we propose an anti-detachment grinding device for wafer processing. Utility Model Content
[0004] The present invention aims to solve the technical problems existing in the prior art and provide a grinding device for preventing detachment in wafer processing.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a polishing device for preventing detachment during wafer processing, comprising a processing table, a support base fixedly installed on the upper surface of the processing table, a carrier platform fixedly installed on the upper surface of the support base, a wafer body placed inside the carrier platform, a second electric telescopic rod fixedly installed at the center of the carrier platform on the upper surface of the processing table, a vacuum suction cup fixedly installed at the output end of the second electric telescopic rod, the bottom surface of the wafer body being fixed by the vacuum suction cup, a polishing component fixedly installed on the upper surface of the processing table, and anti-detachment components provided on both sides of the carrier platform; The anti-detachment component includes a first electric telescopic rod fixedly installed on the bottom surface of the support base, a movable block fixedly installed at the output end of the first electric telescopic rod, the movable block being slidably connected to the bottom surface of the support base, an mounting frame fixedly installed on the upper surface of the movable block, a first servo motor fixedly installed at the upper end of the mounting frame, a grinding wheel fixedly installed at the output end of the first servo motor, and the bottom surface of the grinding wheel being rotatably connected to the upper surface of the movable block.
[0006] Preferably, the polishing assembly includes a second electric lifting platform fixed to the upper surface of the processing table, a second auxiliary rod rotatably mounted at the output end of the second electric lifting platform, a polishing pad rotatably mounted on the bottom surface of the end of the second auxiliary rod, extension rods fixedly mounted on both sides of the end of the second auxiliary rod, and a purge gas jet movably mounted at the end of the extension rod.
[0007] Preferably, notches are provided on both sides of the support platform corresponding to the anti-detachment components, and two symmetrically arranged guide plates are fixedly installed on both sides of the outer wall of the support platform, with both guide plates opening outward.
[0008] Preferably, a barrier is fixedly installed on the upper surface of the processing table outside the support table, and a collection box is slidably installed inside the barrier below the guide plate.
[0009] Preferably, a first electric lifting platform is fixedly installed on the upper surface of the processing table, and a first auxiliary rod is rotatably connected to the output end of the first electric lifting platform. An auxiliary pressure roller is rotatably installed on the bottom surface of the end of the first auxiliary rod.
[0010] Preferably, the bottom surface of the support platform is provided with a clearance groove, and the vacuum suction cup is located inside the clearance groove.
[0011] Preferably, the bottom surface of the support base is fixedly equipped with multiple legs, and the other end of the legs is fixedly connected to the upper surface of the processing table. Beneficial effects
[0012] This invention provides an anti-detachment grinding device for wafer processing. It has the following beneficial effects: (1) The anti-detachment grinding device for wafer processing, by setting anti-detachment components on both sides of the wafer body, can grind the edge of the wafer body into a rounded corner by the grinding wheel contained in the anti-detachment component during the rotation of the wafer body. At the same time, the grinding wheel limits the position of the wafer body in the vertical direction, thereby improving the stability of the wafer body during the grinding and polishing process and thus improving the accuracy of the wafer grinding and polishing.
[0013] (2) The anti-detachment grinding device for wafer processing uses a blower gas jet to aim at the rough grinding position between the grinding wheel and the edge of the wafer body. The jet gas can separate the waste generated during the rough grinding process from the wafer body, reduce the waste residue on the wafer, and make it easier to clean the wafer body in the future. Attached Figure Description
[0014] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.
[0015] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the overall structure of this utility model; Figure 3 This is a schematic diagram of another state of the first auxiliary rod of this utility model; Figure 4 This is a schematic cross-sectional view of the overall structure of this utility model; Figure 5 This is a schematic diagram of the anti-detachment component structure of this utility model; Figure 6 This is a schematic diagram of the support platform structure of this utility model; Figure 7 This utility model Figure 4 Enlarged structural diagram at point A in the middle.
[0017] Legend: 1. Processing table; 2. First electric lifting platform; 3. First auxiliary rod; 4. Auxiliary pressure roller; 5. Second electric lifting platform; 6. Second auxiliary rod; 7. Grinding pad; 8. Extension rod; 9. Purging gas injector; 10. Support platform; 11. Wafer body; 12. Guide plate; 13. Movable block; 14. Grinding wheel; 15. Enclosure; 16. Mounting frame; 17. First servo motor; 18. First electric telescopic rod; 19. Second electric telescopic rod; 20. Vacuum suction cup; 21. Support base; 22. Collection box. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] like Figure 1-7 As shown, an anti-detachment polishing device for wafer processing includes a processing table 1, a support base 21 fixedly installed on the upper surface of the processing table 1, a carrier platform 10 fixedly installed on the upper surface of the support base 21, a wafer body 11 placed inside the carrier platform 10, a second electric telescopic rod 19 fixedly installed on the upper surface of the processing table 1 at the center of the carrier platform 10, a vacuum suction cup 20 fixedly installed at the output end of the second electric telescopic rod 19, the bottom surface of the wafer body 11 is fixed by the vacuum suction cup 20, a polishing component is fixedly installed on the upper surface of the processing table 1, and anti-detachment components are provided on both sides of the carrier platform 10. The anti-detachment component includes a first electric telescopic rod 18 fixedly installed on the bottom surface of the support base 21, a movable block 13 fixedly installed at the output end of the first electric telescopic rod 18, the movable block 13 being slidably connected to the bottom surface of the support base 21, a mounting frame 16 fixedly installed on the upper surface of the movable block 13, a first servo motor 17 fixedly installed at the upper end of the mounting frame 16, a grinding wheel 14 fixedly installed at the output end of the first servo motor 17, and the bottom surface of the grinding wheel 14 being rotatably connected to the upper surface of the movable block 13. When the grinding wheel 14 contacts the edge of the wafer body 11, it can perform rough grinding on the edge of the wafer body 11 and grind out the rounded corners. At the same time, the polishing assembly works with the rotating wafer body 11 to polish its upper surface and then continue to polish the edge of the wafer body 11. During the polishing process of the wafer body 11 rotating and working with the polishing assembly, the grinding wheels 14 located on both sides of the wafer body 11 can block the wafer body 11 to prevent it from shifting or detaching from the inside of the support platform 10 during rotation.
[0020] like Figure 1 As shown, the polishing assembly includes a second electric lifting platform 5 fixed to the upper surface of the processing table 1. A second auxiliary rod 6 is rotatably mounted on the output end of the second electric lifting platform 5. A polishing pad 7 is rotatably mounted on the bottom surface of the end of the second auxiliary rod 6. Extension rods 8 are fixedly mounted on both sides of the end of the second auxiliary rod 6. A purge gas jet 9 is movably mounted on the end of the extension rod 8. By adjusting the tilt angle of the purge gas jet 9 so that its end is aligned with the contact position between the grinding wheel 14 and the edge of the wafer body 11, the airflow ejected from the end of the purge gas jet 9 can discharge the waste chips generated when the grinding wheel 14 rough grinds the edge of the wafer body 11.
[0021] like Figure 2 As shown, notches are provided on both sides of the support platform 10 corresponding to the anti-detachment components. Two symmetrically arranged guide plates 12 are fixedly installed on both sides of the outer wall of the support platform 10. Both guide plates 12 are set to open outward. The notches facilitate the discharge of waste generated during the rough grinding of the wafer body 11 edge, and the guide plates 12 can block the waste and prevent the waste generated during the rough grinding of the wafer body 11 edge from splashing.
[0022] like Figure 3 As shown, a barrier 15 is fixedly installed on the upper surface of the processing table 1 outside the support table 10, and a collection box 22 is slidably installed inside the barrier 15 below the guide plate 12; the inside of the collection box 22 is used to collect the waste chips generated during the rough grinding of the edge of the wafer body 11.
[0023] like Figure 3 As shown, a first electric lifting platform 2 is also fixedly installed on the upper surface of the processing table 1. The output end of the first electric lifting platform 2 is rotatably connected to a first auxiliary rod 3. An auxiliary pressure roller 4 is rotatably installed on the bottom surface of the end of the first auxiliary rod 3. By driving the first auxiliary rod 3 to rotate through the first electric lifting platform 2, the relative position of the first auxiliary rod 3 and the support platform 10 is adjusted. During the polishing process of the wafer body 11, the wafer body 11 can be assisted in being limited by the auxiliary pressure roller 4 located at the end of the first auxiliary rod 3.
[0024] like Figure 4 As shown, the bottom surface of the support platform 10 is provided with a clearance groove, and the vacuum suction cup 20 is located inside the clearance groove. When the vacuum suction cup 20 is inside the clearance groove, the upper surface of the vacuum suction cup 20 is flush with the bottom surface of the support platform 10. When the wafer body 11 is placed inside the support platform 10, the bottom surface of the wafer body 11 can be adsorbed and fixed by the vacuum suction cup 20. The height of the wafer body 11 is adjusted by controlling the height of the vacuum suction cup 20 by the second electric telescopic rod 19. A second servo motor is fixedly installed at the end of the second electric telescopic rod 19, and the vacuum suction cup 20 is fixedly connected to the output end of the second servo motor.
[0025] like Figure 4 As shown, multiple legs are fixedly installed on the bottom surface of the support base 21, and the other end of the legs is fixedly connected to the upper surface of the processing table 1; the legs raise the height of the support base 21, making it easier to install the second electric telescopic rod 19 below the support base 21.
[0026] The working principle of this utility model is as follows: In use, the wafer body 11 is placed inside the support stage 10. A vacuum chuck 20 is installed inside the clearance groove on the bottom surface of the support stage 10. The vacuum chuck 20 can adsorb and fix the bottom surface of the wafer body 11. The adsorption and fixation of the wafer body 11 by the vacuum chuck 20 is existing technology and will not be described in detail here. The vacuum chuck 20 can refer to products from SMC and Thorlabs. The second servo motor at the end of the second electric telescopic rod 19 drives the wafer body 11 to rotate, which, together with the polishing assembly, fixes the wafer body. Polishing is performed on the wafer body 11. When the wafer body 11 is placed inside the support stage 10, the position of the movable block 13 is adjusted by the first electric telescopic rod 18. The grinding wheel 14, located on the upper surface of the movable block 13, gradually approaches the edge of the wafer body 11. The grinding wheel 14 rotates under the drive of the first servo motor 17. When the grinding wheel 14 contacts the edge of the wafer body 11, it can perform rough grinding on the edge of the wafer body 11, creating a rounded corner. At the same time, the polishing assembly, in conjunction with the rotating wafer body 11, can polish the upper surface of the wafer body 11. After polishing, the edge of the wafer body 11 is continuously polished. During the polishing process of the wafer body 11 rotating in conjunction with the polishing assembly, the grinding wheels 14 located on both sides of the wafer body 11 can block the wafer body 11 to prevent it from shifting or detaching from the support platform 10 during rotation. Extension rods 8 are fixedly installed on both outer walls of the second auxiliary rod 6. The ends of the extension rods 8 are rotatably connected to a rotating seat, and a purge gas injector 9 is rotatably connected to the rotating seat. The rotating seat and the purge gas injector 9 can respectively perform horizontal polishing. The rotating seat rotates vertically, and the rotating seat, extension rod 8, and the end of the purge gas jet 9 are all connected to the rotating seat via a damping shaft, which allows the purge gas jet 9 to be suspended at any position. When the end of the purge gas jet 9 is aligned with the contact position between the grinding wheel 14 and the wafer body 11, the airflow can separate the waste generated during the rough grinding of the edge of the wafer body 11 from the wafer body 11. The separated waste is collected inside the collection box 22 under the guidance of the guide plate 12. The user can clean the waste by pulling the collection box 22 outward.
[0027] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A grinding device for preventing detachment during wafer processing, comprising a processing table (1), characterized in that: A support base (21) is fixedly installed on the upper surface of the processing table (1), and a carrier platform (10) is fixedly installed on the upper surface of the support base (21). A wafer body (11) is placed inside the carrier platform (10). A second electric telescopic rod (19) is fixedly installed on the upper surface of the processing table (1) at the center of the carrier platform (10). A vacuum chuck (20) is fixedly installed at the output end of the second electric telescopic rod (19). The bottom surface of the wafer body (11) is fixed by the vacuum chuck (20). A polishing component is fixedly installed on the upper surface of the processing table (1), and anti-detachment components are provided on both sides of the carrier platform (10). The anti-detachment component includes a first electric telescopic rod (18) fixedly installed on the bottom surface of the support base (21). A movable block (13) is fixedly installed at the output end of the first electric telescopic rod (18). The movable block (13) is slidably connected to the bottom surface of the support base (21). A mounting frame (16) is fixedly installed on the upper surface of the movable block (13). A first servo motor (17) is fixedly installed at the upper end of the mounting frame (16). A grinding wheel (14) is fixedly installed at the output end of the first servo motor (17). The bottom surface of the grinding wheel (14) is rotatably connected to the upper surface of the movable block (13).
2. The anti-detachment grinding device for wafer processing according to claim 1, characterized in that: The polishing assembly includes a second electric lifting platform (5) fixed on the upper surface of the processing table (1). A second auxiliary rod (6) is rotatably installed at the output end of the second electric lifting platform (5). A polishing pad (7) is rotatably installed on the bottom surface of the end of the second auxiliary rod (6). Extension rods (8) are fixedly installed on both sides of the end of the second auxiliary rod (6). A purge gas injector (9) is movably installed at the end of the extension rod (8).
3. The anti-detachment grinding device for wafer processing according to claim 2, characterized in that: The support platform (10) has notches on both sides corresponding to the anti-detachment components. Two symmetrically arranged guide plates (12) are fixedly installed on both sides of the outer wall of the support platform (10), and both guide plates (12) are set to open outward.
4. The anti-detachment grinding device for wafer processing according to claim 3, characterized in that: The upper surface of the processing table (1) is fixedly installed with a fence (15) on the outside of the bearing table (10), and a collection box (22) is slidably installed inside the fence (15) below the guide plate (12).
5. The anti-detachment grinding device for wafer processing according to claim 4, characterized in that: The upper surface of the processing table (1) is also fixedly installed with a first electric lifting table (2), the output end of the first electric lifting table (2) is rotatably connected to a first auxiliary rod (3), and the bottom surface of the end of the first auxiliary rod (3) is rotatably installed with an auxiliary pressure roller (4).
6. The anti-detachment grinding device for wafer processing according to claim 5, characterized in that: The bottom surface of the support platform (10) is provided with a clearance groove, and the vacuum suction cup (20) is located inside the clearance groove.
7. The anti-detachment grinding device for wafer processing according to claim 6, characterized in that: The bottom surface of the support base (21) is fixedly equipped with multiple legs, and the other end of the legs is fixedly connected to the upper surface of the processing table (1).