LED double-sided light-emitting structure
By combining a flexible PCB substrate with a double-sided layout and a high-transmittance light guide layer, the problem of single-sided light emission in traditional LED structures is solved, achieving efficient double-sided light emission and stability, improving light output and heat dissipation efficiency, and meeting the needs of high-density displays and ultra-thin lighting.
Patent Information
- Application Number
- CN202522317573.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-10-31
AI Technical Summary
Traditional LED structures emit light from one side only, resulting in complex structures, high costs, and poor light emission consistency. This makes it difficult to meet the demands of high-density displays and ultra-thin lighting scenarios for lightweight, high stability, and uniform light emission. Furthermore, they suffer from high light efficiency loss and low light utilization.
The system employs a double-sided layout on a flexible PCB substrate, combined with a high-transmittance light guide layer and an auxiliary heat dissipation mechanism to achieve double-sided light emission. LED light strips are installed on both the front and back sides of the flexible PCB substrate, and the high-transmittance light guide layer conducts and diffuses light evenly. The auxiliary heat dissipation mechanism monitors and regulates the temperature in real time, forming a multi-channel heat dissipation path.
It achieves high-efficiency light emission from both sides, improves the light emission range and light output, ensures the stability of the light strip, reduces light loss, improves light utilization, and significantly improves heat dissipation efficiency, avoiding accelerated light decay and shortened lifespan due to overheating.
Smart Images
Figure CN224680663U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED technology, specifically to an LED double-sided light-emitting structure. Background Technology
[0002] Currently, LEDs are widely used in displays, lighting and other fields due to their advantages such as energy saving and long lifespan. Traditional LEDs are mostly single-sided light-emitting. When double-sided light emission is required, two LEDs are often packaged in reverse or spliced together, which has problems such as complex structure, high cost and poor light emission consistency. Some improved solutions achieve double-sided light emission by changing the chip arrangement or packaging structure, but they are prone to light efficiency loss and poor heat dissipation, making it difficult to meet the requirements of thinness, high stability and uniform light emission in high-density display, ultra-thin lighting and other scenarios. Therefore, there is an urgent need for a simple structure, high light efficiency and stable double-sided LED light emission structure.
[0003] Traditional single-sided LED structures can only emit light from one side, with a beam angle typically less than 180°. If used in bulb applications, this results in dark areas within a 360° space. While secondary optical design can diffuse the light, expanding the beam angle reduces the light source's efficiency, hindering energy conservation. The overall light-emitting range and output are poor, making it difficult to evenly conduct and diffuse the light emitted by the LED strip, leading to significant light loss, low light utilization, and uneven, soft illumination. Utility Model Content
[0004] The purpose of this invention is to provide an LED double-sided light-emitting structure to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an LED double-sided light-emitting structure, comprising an outer shell, wherein a double-sided light-emitting mechanism is provided on the surface of the outer shell, and an auxiliary heat dissipation mechanism is provided on the surface of the outer shell; The double-sided light-emitting mechanism includes a flexible PCB substrate disposed at the center inside the outer casing. LED light strips are mounted on both the front and back sides of the flexible PCB substrate. Light strip mounting sleeves are mounted on the top and bottom of both the front and back sides of the flexible PCB substrate. Side plates are fixedly connected to the left and right sides of the flexible PCB substrate. Limiting posts are fixedly connected to the surface of the side plates when the substrate rises. A high-transmittance light guide layer is mounted on the front and back sides of the flexible PCB substrate. Mounting seats are fixedly connected to the left and right sides. Limiting nuts are mounted on the surface of the limiting posts. A frosted PET film is mounted on the surface of the high-transmittance light guide layer, and an anti-scratch coating is mounted on the surface of the frosted PET film. The double-sided layout allows for simultaneous light emission from both sides of the substrate. Compared to traditional single-sided LED structures, this significantly improves the light emission range and overall light output, meeting the needs of scenarios requiring double-sided lighting. The light strip mounting sleeves mounted on the top and bottom of the front and back sides of the flexible PCB substrate effectively secure the LED light strips and prevent LED light strips from fading. During use, the LED strip may shift or detach due to factors such as vibration and temperature changes. Ensuring the stability of the LED strip's operation and thus guaranteeing continuous luminous effect is crucial. The high-transmittance light guide layer has high light transmittance, which can evenly conduct and diffuse the light emitted by the LED strip, reducing light loss, improving light utilization, and making the light emission more uniform and soft. The frosted PET film bonded to the surface of the high-transmittance light guide layer with optical adhesive can diffuse light to a certain extent, further optimizing the uniformity of light emission, while also protecting the surface of the high-transmittance light guide layer from minor scratches. The double-sided light-emitting mechanism enables efficient light emission from both sides, and the coordinated use of components ensures stable installation of the LED strip, guaranteeing a stable and efficient light guide layer.
[0006] Preferably, the LED light strip is mounted on the surface of the flexible PCB substrate via a light strip mounting sleeve, the limiting post is inserted into the mounting base, and the high-transmittance light guide layer is mounted on the surface of the flexible PCB substrate via the limiting post, the high-transmittance light guide layer, the mounting base, and the limiting nut.
[0007] Preferably, the frosted PET film is bonded to the surface of the high-transmittance light guide layer with optical adhesive, and the scratch-resistant coating is bonded to the surface of the frosted PET film with optical adhesive.
[0008] Preferably, the auxiliary heat dissipation mechanism includes a temperature sensor mounted on the left and right sides of the flexible PCB substrate. The high-transmittance light guide layer has heat dissipation vents on its left and right sides, and the outer casing has heat dissipation vents at the top and bottom of its left and right sides. Dust filters are installed at the top and bottom of the outer casing, and second mounting pins are installed at the four corners of the dust filters. The temperature sensor in the auxiliary heat dissipation mechanism, mounted on the left and right sides of the flexible PCB substrate, can monitor the temperature of the flexible PCB substrate and LED strip in real time and accurately. When the temperature is too high, relevant information can be promptly fed back, facilitating subsequent cooling measures to prevent the performance and lifespan of the LED strip and flexible PCB substrate from being affected by excessive temperature. The heat dissipation vents on the left and right sides of the high-transmittance light guide layer, in conjunction with the heat dissipation vents at the top and bottom of the outer casing, form a multi-channel heat dissipation path. The heat generated by the LED light strip during operation can first be dissipated into the internal space of the housing through the heat dissipation vents of the light guide layer, and then dissipated into the external environment through the heat dissipation vents on the housing. This significantly improves heat dissipation efficiency, effectively controls the temperature inside the LED double-sided light-emitting structure, and avoids problems such as accelerated light decay and shortened lifespan of the LED light strip due to overheating. The auxiliary heat dissipation mechanism can monitor the temperature in real time, making it easy to adjust and achieve efficient heat dissipation through multiple channels.
[0009] Preferably, the heat dissipation vent corresponds to the dust filter, and the dust filter is installed on the surface of the outer casing by a second mounting bolt.
[0010] Preferably, the top and bottom of the left and right sides of the outer shell are fixedly connected to connecting seats, the surface of the connecting seats is equipped with a first connecting bolt, and the surface of the outer shell is equipped with an outer protective film.
[0011] Compared with the prior art, this utility model provides an LED double-sided light-emitting structure, which has the following beneficial effects: 1. This double-sided LED light-emitting structure features a double-sided light-emitting mechanism. LED strips are mounted on both the front and back sides of the flexible PCB substrate. This double-sided layout allows for simultaneous light emission from both sides of the substrate. Compared to traditional single-sided LED structures, this significantly increases the light-emitting range and overall light output, meeting the needs of scenarios requiring double-sided lighting. The LED strip mounting sleeves installed at the top and bottom of the front and back sides of the flexible PCB substrate effectively secure the LED strips, preventing displacement or detachment due to vibration, temperature changes, or other factors during use. This ensures the stability of the LED strip operation and the continuity of the light emission effect. The high-transmittance light guide layer has high light transmittance, which evenly conducts and diffuses the light emitted by the LED strip, reducing light loss, improving light utilization, and making the light emission more uniform and soft. The surface of the high-transmittance light guide layer is bonded with frosted PET using optical adhesive. The thin film can diffuse light to a certain extent, further optimizing the uniformity of light emission. At the same time, it can protect the surface of the high-transmittance light guide layer from minor scratches. The double-sided light emission mechanism can achieve efficient light emission from both sides. Meanwhile, the coordinated use of components can ensure the stable installation of the light strip and ensure that the light guide layer is stable and efficient in guiding light.
[0012] 2. This double-sided LED light-emitting structure is equipped with an auxiliary heat dissipation mechanism. Temperature sensors within this mechanism are installed on both sides of the flexible PCB substrate surface, enabling real-time and accurate monitoring of the temperature of the flexible PCB substrate and the LED strip during operation. When the temperature is too high, relevant information can be promptly fed back, facilitating subsequent cooling measures and preventing damage to the performance and lifespan of the LED strip and flexible PCB substrate due to excessive temperature. The heat dissipation vents on both sides of the high-transmittance light guide layer, in conjunction with the heat dissipation vents on the top and bottom of the left and right sides of the outer casing, form a multi-channel heat dissipation path. The heat generated by the LED strip during operation is first dissipated into the internal space of the outer casing through the heat dissipation vents in the light guide layer, and then dissipated into the external environment through the heat dissipation vents on the outer casing. This significantly improves heat dissipation efficiency, effectively controls the internal temperature of the double-sided LED light-emitting structure, and avoids problems such as accelerated light decay and shortened lifespan of the LED strip due to overheating. The auxiliary heat dissipation mechanism allows for real-time temperature monitoring and timely adjustment, achieving efficient multi-channel heat dissipation. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the outer protective film of the present invention. Figure 3 This is a schematic diagram of the high-transmittance light guide layer of this utility model. Figure 4 This is a schematic diagram of the flexible PCB substrate structure of this utility model; Figure 5 This is a schematic diagram of the frosted PET film structure of this utility model; Figure 6 This is a schematic diagram of the heat dissipation port of this utility model.
[0014] In the diagram: 1. Outer shell; 2. Connecting seat; 3. First connecting bolt; 4. Outer protective film; 5. Double-sided light-emitting mechanism; 51. Flexible PCB substrate; 52. LED light strip; 53. Light strip mounting sleeve; 54. Side plate; 55. Limiting post; 56. High-transmittance light guide layer; 57. Mounting seat; 58. Limiting nut; 59. Frosted PET film; 501. Scratch-resistant coating; 6. Auxiliary heat dissipation mechanism; 61. Temperature sensor; 62. Light guide layer heat dissipation port; 63. Heat dissipation port; 64. Dust filter; 65. Second mounting bolt. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0016] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0017] This utility model provides the following technical solution: Example 1 Please see Figure 1-6 An LED double-sided light-emitting structure includes an outer shell 1, a double-sided light-emitting mechanism 5 disposed on the surface of the outer shell 1, and an auxiliary heat dissipation mechanism 6 disposed on the surface of the outer shell 1. The double-sided light-emitting mechanism 5 includes a flexible PCB substrate 51, which is located at the center inside the outer shell 1. LED light strips 52 are installed on both the front and back sides of the flexible PCB substrate 51. Light strip mounting sleeves 53 are installed on the top and bottom of both the front and back sides of the flexible PCB substrate 51. Side plates 54 are fixedly connected to the left and right sides of the flexible PCB substrate 51. Limiting posts 55 are fixedly connected to the surface of the side plates 54 when the substrate rises. High-transmittance light guide layers 56 are installed on the front and back sides of the flexible PCB substrate 51. Mounting seats 57 are fixedly connected to the left and right sides. Limiting nuts 58 are installed on the surface of the limiting posts 55. A frosted PET film 59 is installed on the surface of the high-transmittance light guide layer 56, and an anti-scratch coating 501 is installed on the surface of the frosted PET film 59. The double-sided light-emitting mechanism 5 allows for simultaneous light emission from both sides of the substrate. Compared to traditional single-sided LED structures, this significantly improves the light emission range and overall light output, meeting the needs of scenarios requiring double-sided lighting. The LED strip mounting sleeves 53 installed on the front and back top and bottom of the substrate 51 can effectively fix the LED strip 52, preventing it from shifting or falling off due to vibration, temperature changes, or other factors during use. This ensures the stability of the LED strip 52 and the continuity of the light emission effect. The high-transmittance light guide layer 56 has high light transmittance, which can evenly conduct and diffuse the light emitted by the LED strip 52, reduce light loss, improve light utilization, and make the light emission more uniform and soft. The frosted PET film 59 bonded to the surface of the high-transmittance light guide layer 56 with optical adhesive can play a certain role in diffuse reflection of light, further optimizing the uniformity of light emission. At the same time, it can also protect the surface of the high-transmittance light guide layer 56 from minor scratches. The double-sided light emission mechanism 5 can achieve efficient light emission from both sides. At the same time, the coordinated use of the components can ensure the stable installation of the light strip and ensure that the light guide layer is stable and efficiently guides light. LED light strip 52 is mounted on the surface of flexible PCB substrate 51 through light strip mounting sleeve 53, limiting post 55 is inserted into the mounting base 57, and high light transmittance light guide layer 56 is mounted on the surface of flexible PCB substrate 51 through limiting post 55, high light transmittance light guide layer 56, mounting base 57 and limiting nut 58. The frosted PET film 59 is bonded to the surface of the high-transmittance light guide layer 56 with optical adhesive, and the anti-scratch coating 501 is bonded to the surface of the frosted PET film 59 with optical adhesive.
[0018] Example 2 Please see Figure 1-6Based on Embodiment 1, the auxiliary heat dissipation mechanism 6 further includes a temperature sensor 61, which is installed on the left and right sides of the flexible PCB substrate 51. The high-transmittance light guide layer 56 has light guide layer heat dissipation vents 62 on its left and right sides, and the outer casing 1 has heat dissipation vents 63 on its top and bottom sides. Dust filters 64 are installed on the top and bottom sides of the outer casing 1, and second mounting pins 65 are installed at the four corners of the dust filters 64. The temperature sensor 61 in the auxiliary heat dissipation mechanism 6, installed on the left and right sides of the flexible PCB substrate 51, can monitor the temperature of the flexible PCB substrate 51 and the LED strip 52 in real time and accurately. When the temperature is too high, relevant information can be fed back in a timely manner, facilitating subsequent cooling measures to prevent the high temperature from affecting the performance and lifespan of the LED strip 52 and the flexible PCB substrate 51. The light guide layer heat dissipation vents 62 on the left and right sides of the high-transmittance light guide layer 56, together with the heat dissipation vents 63 on the top and bottom sides of the outer casing 1, form a multi-channel heat dissipation path. The heat generated by the LED strip 52 during operation can first be dissipated into the internal space of the housing 1 through the heat dissipation vent 62 of the light guide layer, and then dissipated into the external environment through the heat dissipation vent 63 on the housing 1. This significantly improves the heat dissipation efficiency and effectively controls the temperature inside the LED double-sided light-emitting structure, avoiding problems such as accelerated light decay and shortened lifespan of the LED strip 52 due to overheating. The auxiliary heat dissipation mechanism 6 can monitor the temperature in real time, making it easy to adjust and achieve multi-channel efficient heat dissipation. The temperature sensor 61 used is model DS18B20. The heat dissipation vent 63 corresponds to the dust filter 64, and the dust filter 64 is installed on the surface of the outer casing 1 by the second mounting bolt 65. Connecting seats 2 are fixedly connected to the top and bottom of the left and right sides of the outer shell 1. First connecting bolts 3 are installed on the surface of the connecting seats 2. The outer protective film 4 is installed on the surface of the outer shell 1.
[0019] In actual operation, when this device is used, the LED light strip 52 is installed on the surface of the flexible PCB substrate 51 through the light strip mounting sleeve 53. Then, the high light transmittance light guide layer 56 is installed on the surface of the flexible PCB substrate 51 and fixed by the limiting nut 58. The frosted PET film 59 and the anti-scratch coating 501 are installed on the surface of the high light transmittance light guide layer 56 using optical adhesive. Then, the double-sided light-emitting mechanism 5 can be installed inside the outer shell 1. The outer shell 1 is fixed by the first connecting bolt 3 to complete the overall assembly. In the double-sided light-emitting mechanism 5, LED light strips 52 are installed on both the front and back sides of the flexible PCB substrate 51. This double-sided layout allows light to be emitted from both sides of the substrate simultaneously. Compared with the traditional single-sided light-emitting LED structure, this greatly improves the light-emitting range and overall light output, meeting the needs of scenarios requiring double-sided lighting. The light strip mounting sleeves 53 installed on the top and bottom of the front and back sides of the flexible PCB substrate 51 provide good fixation for the LED light strips 52, effectively preventing the LED light strips 52 from shifting or falling off due to vibration, temperature changes, or other factors during use. This ensures the stability of the LED light strips 52 and thus the continuity of the light-emitting effect. The limiting posts 55 connected to the left and right sides of the flexible PCB substrate 51 via side plates 54 cooperate with the mounting base 57 and limiting nuts 58 to firmly install the high-transmittance light guide layer 56 on the surface of the flexible PCB substrate 51, preventing the high-transmittance light guide layer 56 from loosening and affecting the light guiding effect. The high-transmittance light guide layer 56 has high light transmittance, allowing the LEDs to pass through easily. The light emitted by the LED strip 52 is evenly conducted and diffused, reducing light loss and improving light utilization, making the light emission more uniform and soft. The frosted PET film 59, which is bonded to the surface of the high-transmittance light guide layer 56 with optical adhesive, can play a certain role in diffuse reflection of light, further optimizing the uniformity of light emission. At the same time, it can also protect the surface of the high-transmittance light guide layer 56 from minor scratches. The double-sided light emission mechanism 5 can achieve efficient light emission from both sides. At the same time, the coordinated use of components can ensure the stable installation of the LED strip and ensure that the light guide layer is stable and efficient in guiding light. The anti-scratch coating 501 bonded to the surface of the frosted PET film 59 greatly enhances the wear resistance and scratch resistance of the entire light emission structure surface, effectively extending the service life of the LED double-sided light emission structure and reducing the probability of the light emission effect being affected by surface scratches. Temperature sensors 61 in the auxiliary heat dissipation mechanism 6 are installed on the left and right sides of the flexible PCB substrate 51. They can monitor the temperature of the flexible PCB substrate 51 and LED strip 52 in real time and accurately. When the temperature is too high, they can provide timely feedback to facilitate subsequent cooling measures and prevent the performance and lifespan of the LED strip 52 and flexible PCB substrate 51 from being affected by excessive temperature. The heat dissipation vents 62 on the left and right sides of the high-transmittance light guide layer 56, together with the heat dissipation vents 63 on the top and bottom of the left and right sides of the outer casing 1, form a multi-channel heat dissipation path. The heat generated by the LED strip 52 during operation can first be dissipated into the internal space of the outer casing 1 through the heat dissipation vents 62, and then dissipated into the external environment through the heat dissipation vents 63 on the outer casing 1. This significantly improves heat dissipation efficiency, effectively controls the internal temperature of the LED double-sided light-emitting structure, and avoids the LED from overheating. Issues such as accelerated light decay and shortened lifespan of the LED strip 52 can be addressed by the auxiliary heat dissipation mechanism 6, which allows for real-time temperature monitoring and timely adjustment, achieving efficient multi-channel heat dissipation. The dust filters 64 installed on the top and bottom of the left and right sides of the housing 1 effectively prevent dust and impurities from the external environment from entering the housing 1 without affecting the heat dissipation function of the heat dissipation port 63. If dust and other impurities enter the interior and adhere to the surface of the LED strip 52, flexible PCB substrate 51, or high-transmittance light guide layer 56, they will affect the heat dissipation effect and light emission performance. The dust filters 64 can prevent this from happening, maintaining good heat dissipation and light emission performance for a long time. At the same time, the dust filters 64 are installed on the surface of the housing 1 through the second mounting bolt 65. When there is a lot of dust on the surface of the dust filters 64, they are easy to disassemble, clean, or replace, making the operation simple and convenient.
[0020] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
Claims
1. An LED double-sided light-emitting structure, comprising a housing (1), characterized in that: The outer shell (1) is provided with a double-sided light-emitting mechanism (5), and the outer shell (1) is provided with an auxiliary heat dissipation mechanism (6). The double-sided light-emitting mechanism (5) includes a flexible PCB substrate (51), which is located in the center of the outer shell (1). LED light strips (52) are installed on both the front and back sides of the flexible PCB substrate (51). Light strip mounting sleeves (53) are installed on the top and bottom of both the front and back sides of the flexible PCB substrate (51). Side plates (54) are fixedly connected to the left and right sides of the flexible PCB substrate (51). When rising, a limiting post (55) is fixedly connected to the surface of the side plate (54). A high-transmittance light guide layer (56) is installed on the front and back sides of the flexible PCB substrate (51). Mounting bases (57) are fixedly connected to the left and right sides. A limiting nut (58) is installed on the surface of the limiting post (55). A frosted PET film (59) is installed on the surface of the high-transmittance light guide layer (56). An anti-scratch coating (501) is installed on the surface of the frosted PET film (59).
2. The LED double-sided light-emitting structure according to claim 1, characterized in that: The LED light strip (52) is mounted on the surface of the flexible PCB substrate (51) through the light strip mounting sleeve (53), the limiting post (55) is inserted into the mounting base (57), and the high light transmittance light guide layer (56) is mounted on the surface of the flexible PCB substrate (51) through the limiting post (55), the high light transmittance light guide layer (56), the mounting base (57) and the limiting nut (58).
3. The LED double-sided light-emitting structure according to claim 1, characterized in that: The frosted PET film (59) is bonded to the surface of the high-transmittance light guide layer (56) with optical adhesive, and the anti-scratch coating (501) is bonded to the surface of the frosted PET film (59) with optical adhesive.
4. The LED double-sided light-emitting structure according to claim 1, characterized in that: The auxiliary heat dissipation mechanism (6) includes a temperature sensor (61), which is installed on the left and right sides of the surface of the flexible PCB substrate (51). The high light transmittance light guide layer (56) has heat dissipation vents (62) on the left and right sides. The outer shell (1) has heat dissipation vents (63) on the top and bottom of the left and right sides. The outer shell (1) has dust filters (64) installed on the top and bottom of the left and right sides. The dust filters (64) have second mounting bolts (65) installed at the four corners of the surface of the dust filters (64).
5. The LED double-sided light-emitting structure according to claim 4, characterized in that: The heat dissipation vent (63) corresponds to the dust filter (64), and the dust filter (64) is installed on the surface of the outer casing (1) by the second mounting bolt (65).
6. The LED double-sided light-emitting structure according to claim 1, characterized in that: The top and bottom of the left and right sides of the outer shell (1) are fixedly connected to the connecting seats (2), the surface of the connecting seats (2) is equipped with the first connecting bolt (3), and the surface of the outer shell (1) is equipped with the outer protective film (4).