Modular double duct thermoelectric refrigeration unit

Abstract

The utility model discloses modularization double air duct thermoelectric refrigeration unit, refrigeration unit includes shell, the heat insulation board for with the box cover fixed, sets up the hot end assembly above the heat insulation board, sets up the cold end assembly below the heat insulation board, is located the heat exchange channel in between hot end assembly and cold end, and the peltier semiconductor fixed in the middle part of heat insulation board, hot end assembly and cold end assembly are located two sides of peltier semiconductor respectively, the utility model discloses will peltier semiconductor, cold and hot end radiator, fan, independent air duct, heat insulation layer and standard interface etc. Component preassembly is a complete module, forms temperature control black box. User does not need to purchase separate components alone, only needs to complete mechanical fixation, air pipe connection and power supply access three steps, can be integrated to self-made container, such as foam box, waterproof box, shortens from preparation to use's time, reduces integration difficulty.

Description

Technical Field

[0001] This utility model relates to the field of small refrigeration equipment technology, specifically a modular dual-duct thermoelectric refrigeration unit. Background Technology

[0002] In the field of refrigeration technology, Peltier Semiconductor has become an important technical solution for achieving local temperature control in space-constrained scenarios due to its advantages such as no mechanical vibration, precise temperature control, and compact size. It is widely used in small refrigeration equipment, heat dissipation of electronic components, and other fields.

[0003] Currently, most cooling products based on Peltier semiconductors adopt a customized development model, which means that the heat dissipation structure, airflow path, and power supply system are designed separately for specific devices. Under this model, the heat dissipation module, fan selection, and insulation layout of each product need to be re-performed through thermodynamic simulation and physical adaptation. This results in long product development cycles, high R&D costs, and insufficient versatility between components, making it difficult to quickly respond to cooling needs in different scenarios, especially failing to meet the demand for flexible cooling equipment in non-fixed scenarios such as homes, outdoors, and construction sites.

[0004] With the growth of the DIY maker community and the increasing popularity of outdoor work and camping activities, the market demand for ready-to-use portable cooling solutions is becoming increasingly prominent. Existing solutions meeting these needs are mostly in the form of disassembled components, requiring users to purchase individual parts such as Peltier semiconductors, heat sinks, fans, and insulation materials, and then assemble and debug them based on their own experience.

[0005] However, this process requires users to have a high level of thermodynamic knowledge and mechanical assembly skills. Ordinary users find it difficult to accurately control the heat exchange efficiency at the hot and cold ends, the air duct sealing and insulation effect, which can easily lead to problems such as cross-flow of hot and cold air, incomplete heat dissipation and reduced cooling efficiency. Not only can it not guarantee stable cooling performance, but it may also cause Peltier semiconductor overload damage due to improper component matching, making it inconvenient to use. Utility Model Content

[0006] The purpose of this utility model is to provide a modular dual-duct thermoelectric refrigeration unit that, while ensuring refrigeration reliability and efficiency, can lower the barrier to entry for users. Users do not need professional knowledge and can achieve plug-and-play functionality, making it suitable for various portable scenarios.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a modular dual-duct thermoelectric refrigeration unit, including an insulated box, a box cover fixed to the top of the insulated box, and a refrigeration unit installed on the top of the box cover;

[0008] The refrigeration unit includes a housing, a heat insulation plate for fixing to the lid, a hot end assembly disposed above the heat insulation plate, a cold end assembly disposed below the heat insulation plate, a heat exchange channel located between the hot end assembly and the cold end assembly, and a Peltier semiconductor fixed in the middle of the heat insulation plate. The hot end assembly and the cold end assembly are respectively located on both sides of the Peltier semiconductor. The housing has three connection interfaces on its exterior.

[0009] The three connection interfaces include a cold air outlet for outputting cold air, a hot air exhaust outlet for dissipating heat, and a power interface for connecting to electrical power.

[0010] Preferably, the hot end assembly includes a hot end heat sink, which is bonded to the hot end of the Peltier semiconductor via thermal grease, and a hot end fan is mounted on the side of the hot end heat sink away from the Peltier semiconductor.

[0011] Preferably, the heat exchange channel includes a hot-end air duct formed by the inner cavity at the top of the outer shell and the heat insulation plate, one end of the hot-end air duct is located on one side of the hot-end radiator, and the other end of the hot-end air duct is connected to the hot air exhaust port.

[0012] Preferably, the cold end assembly includes a cold end heat sink, which is attached to the lower surface of the Peltier semiconductor via thermal grease. A cold end fan is disposed below the heat insulation plate and is fixed to the side of the cold end heat sink away from the Peltier semiconductor.

[0013] Preferably, the heat exchange channel further includes a cold end air duct formed by the inner cavity at the bottom of the outer shell and the heat insulation plate, one end of the cold end air duct is located on one side of the cold end heat sink, and the other end of the cold end air duct is connected to the cold air outlet.

[0014] Preferably, both the hot-end radiator and the cold-end radiator are finned radiators made of aluminum or copper, and the number and area of ​​the fins of the hot-end radiator are greater than the number and area of ​​the fins of the cold-end radiator.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model pre-assembles components such as a Peltier semiconductor, hot and cold end heat sink, fan, independent air duct, insulation layer, and standard interface into a complete module, forming a temperature control black box. Users do not need to purchase individual parts separately; they only need to complete three steps: mechanical fixing, air duct connection, and power connection. This allows for rapid integration into a self-made container, such as a foam box or waterproof box, shortening the time from preparation to use and reducing integration difficulty. Compared to traditional assembly of individual parts, even users without technical background can achieve professional-grade cooling effects, improving ease of use.

[0017] 2. The module of this utility model is physically separated to form completely independent cold-end air ducts and hot-end air ducts. The cold-end air duct is a closed loop, ensuring that the cold air only flows within the user's cooling space, reducing cooling loss. The hot-end air duct is directly connected to the external environment. With the hot-end heat sink and high-pressure fan, the heat generated by the Peltier semiconductor can be quickly discharged outside the device, avoiding cross-flow of cold and hot air, which is conducive to improving the cooling effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model applied to the top of the insulated box;

[0019] Figure 2 This is an isometric drawing of this utility model;

[0020] Figure 3 This is an exploded view of this utility model.

[0021] In the diagram: 1. Insulated box; 2. Box lid; 3. Outer shell; 4. Insulation plate; 5. Hot end assembly; 6. Cold end assembly; 8. Peltier semiconductor; 9. Cold air outlet; 10. Hot air exhaust port; 11. Power interface;

[0022] 501. Hot-end heat sink; 502. Hot-end fan; 601. Cold-end heat sink; 602. Cold-end fan. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-3 This utility model provides a technical solution: a modular dual-duct thermoelectric refrigeration unit, including an insulated box 1, a box cover 2 fixed on the top of the insulated box 1, and a refrigeration unit installed on the top of the box cover 2; the box cover 2 serves to seal the insulated box 1 and support the refrigeration unit, stably fixing the refrigeration unit on the top of the insulated box 1, ensuring that the cold air generated by the refrigeration unit can be delivered to the inside of the insulated box 1, providing a continuous supply of cooling for the insulated box 1.

[0025] The refrigeration unit includes a housing 3, a heat insulation plate 4 for fixing to the cover 2, a hot end assembly 5 disposed above the heat insulation plate 4, a cold end assembly 6 disposed below the heat insulation plate 4, a heat exchange channel located between the hot end assembly 5 and the cold end, and a Peltier semiconductor 8 fixed in the middle of the heat insulation plate 4. The hot end assembly 5 and the cold end assembly 6 are respectively located on both sides of the Peltier semiconductor 8. The housing 3 has three connection interfaces on its exterior.

[0026] The heat insulation plate 4 serves both as insulation and installation, dividing the refrigeration unit into two independent spaces, one above the other, which respectively house the hot-end component 5 and the other below the cold-end component 6, preventing heat transfer from the hot end to the cold end. When the Peltier semiconductor 8 is energized, it enables directional heat transfer, transferring heat from the cold end to the hot end. The hot-end component 5 is responsible for dissipating the heat from the hot end of the Peltier semiconductor 8, while the cold-end component 6 creates a low-temperature environment through heat transfer, providing cooling for the insulation box 1. The heat exchange channel provides a path for the flow of hot and cold air.

[0027] The three connection interfaces include a cold air outlet 9 for outputting cold air, a hot air exhaust outlet 10 for dissipating heat, and a power interface 11 for connecting to electrical power.

[0028] The hot end assembly 5 includes a hot end heat sink 501, which is attached to the hot end of the Peltier semiconductor 8 by thermal grease. A hot end fan 502 is installed on the side of the hot end heat sink 501 away from the Peltier semiconductor.

[0029] The heat generated by the Peltier Semiconductor 8 hot end is quickly transferred to the hot end heat sink 501 through the thermal grease between the hot end heat sink 501 and the hot end heat sink 501. The hot end heat sink 501 disperses the heat into the surrounding air by increasing the heat dissipation area. When the hot end fan 502 is running, it will accelerate the air flow speed around the hot end heat sink 501, so that the heat on the hot end heat sink 501 can be carried away by the air more quickly, thereby achieving rapid heat dissipation from the hot end.

[0030] The heat exchange channel includes a hot-end air duct formed by the inner cavity at the top of the outer shell 3 and the heat insulation plate 4. One end of the hot-end air duct is located on one side of the hot-end radiator 501, and the other end of the hot-end air duct is connected to the hot air exhaust port 10. When the hot-end fan 502 operates, it pushes air to flow in the hot-end air duct. When the air flows through the hot-end radiator 501, it absorbs the heat on the hot-end radiator 501 and becomes hot air. Then, driven by the hot-end fan 502, the hot air flows along the hot-end air duct to the hot air exhaust port 10, and is finally discharged into the external environment through the hot air exhaust port 10, completing the process of dissipating the heat at the hot end.

[0031] The cold end assembly 6 includes a cold end heat sink 601, which is attached to the lower surface of the Peltier semiconductor 8 via thermally conductive silicone grease. A cold end fan 602 is disposed below the heat insulation plate 4 and is fixed to the side of the cold end heat sink 601 away from the Peltier semiconductor. When the Peltier semiconductor 8 is powered on, it transfers heat from the cold end to the hot end, lowering the temperature of the cold end. The cold end heat sink 601, tightly attached to the lower surface of the Peltier semiconductor 8 via thermally conductive silicone grease, can quickly absorb the cold energy from the cold end of the Peltier semiconductor 8, thus lowering its own temperature. When the cold end fan 602 operates, it pushes the air inside the insulation box 1 through the cold end heat sink 601. The air exchanges heat with the low-temperature cold end heat sink 601, lowering its temperature and forming cold air, which provides cooling for the insulation box 1.

[0032] The heat exchange channel also includes a cold-end air duct formed by the bottom inner cavity of the outer shell 3 and the heat insulation plate 4. One end of the cold-end air duct is located on one side of the cold-end radiator 601, and the other end of the cold-end air duct is connected to the cold air outlet 9. When the cold-end fan 602 is running, it drives air into the cold-end air duct. When the air flows through the cold-end radiator 601 in the cold-end air duct, it exchanges heat with the cold-end radiator 601, and the temperature drops to form cold air. Then, driven by the cold-end fan 602, the cold air flows along the cold-end air duct to the cold air outlet 9, and finally enters the interior of the insulation box 1 through the cold air outlet 9, providing cooling capacity to the insulation box 1 and achieving a cooling effect.

[0033] The cold air outlet 9 is connected to the heat exchange channel of the cold end component 6. The cold air generated by the cold end component 6 is delivered to the interior of the insulation box 1 through the cold air outlet 9 to provide cooling for the insulation box 1. The hot air exhaust port 10 is connected to the heat exchange channel of the hot end component 5. The hot air emitted by the hot end component 5 is discharged to the external environment through the hot air exhaust port 10 to prevent heat from accumulating inside the refrigeration unit. After the power interface 11 is connected to an external power source, it provides power to electrical components such as the Peltier semiconductor 8, the hot end fan 502, and the cold end fan 602 to ensure the normal operation of each component of the refrigeration unit.

[0034] Both the hot-end radiator 501 and the cold-end radiator 601 are finned radiators made of aluminum or copper. The number and area of ​​the fins in the hot-end radiator 501 are greater than those in the cold-end radiator 601. The heat that the hot-end radiator 501 needs to dissipate is much greater than the heat that the cold-end radiator 601 needs to transfer. The greater number of fins and the larger fin area can further increase the heat dissipation area of ​​the hot-end radiator 501, improve heat dissipation efficiency, and ensure that the heat at the hot end can be dissipated in a timely manner.

[0035] When in use, the user connects an external power source, such as a household power source, a vehicle power source, or an outdoor mobile power source, to the standard power interface 11 on the cooling unit housing 3 to power the entire system. After power is applied, the Peltier semiconductor 8, the hot end fan 502, and the cold end fan 602 start up simultaneously and enter the working state.

[0036] When Peltier Semiconductor 8 is powered on, its cold end, that is, the side in contact with the cold end component 6 below the heat insulation plate 4, experiences a rapid temperature drop. The cold end heat sink 601, through the pre-applied thermal grease, adheres tightly to the lower surface of Peltier Semiconductor 8, efficiently transferring the low temperature of the cold end to its own fins.

[0037] When the cold end fan 602 operates, it drives the air in the insulation box 1 into the cold end air duct formed by the bottom inner cavity of the outer shell 3 and the heat insulation plate 4. When the airflow flows along the cold end air duct and passes through the fins of the cold end heat sink 601, it exchanges heat with the low temperature fins, the air temperature drops, and cold air is formed.

[0038] The cold air that has completed heat exchange continues to flow along the cold end air duct under the continuous push of the cold end fan 602, and finally enters the interior of the insulation box 1 through the cold air outlet 9 on the outer shell 3, gradually reducing the overall temperature inside the insulation box 1 and realizing the cooling function. At the same time, the cold end air duct is sealed to the inner wall of the insulation box 1 through the partition, ensuring that the cold air only circulates in the cold end air duct and the insulation box 1, reducing the loss of cooling capacity.

[0039] Peltier Semiconductor 8 transfers heat from the cold end to the hot end, i.e., the side in contact with the hot end component 5 above the heat insulation plate 4, causing the temperature of the hot end to rise. The hot end heat sink 501 is attached to the hot end of Peltier Semiconductor 8 through thermal grease, quickly absorbing the heat from the hot end and transferring it to its own fins. Since the hot end needs to dissipate the heat transferred from the cold end and the additional heat generated by the work done by the semiconductor current at the same time, the hot end heat sink 501 is designed with a structure with more fins and a larger area to improve heat dissipation capacity.

[0040] When the hot-end fan 502 starts, it pushes outside air or air outside the cooling unit into the hot-end air duct formed by the inner cavity at the top of the outer casing 3 and the heat insulation plate 4. When the airflow flows through the fins of the hot-end heat sink 501, it exchanges heat with the high-temperature fins and absorbs heat to form hot airflow.

[0041] Driven by the hot-end fan 502, the hot air carrying heat flows along the hot-end air duct to the hot air exhaust port 10 on the outer casing 3, and is finally discharged to the external environment of the cooling unit through the hot air exhaust port 10, thus preventing heat from accumulating inside the cooling unit. The hot-end air duct and the cold-end air duct are completely independent and separated by the heat insulation plate 4, which can prevent the crossflow of hot and cold air and ensure heat dissipation efficiency and cooling effect.

[0042] With continuous power supply, the cold end continuously generates cold air and delivers it to the insulated box 1, while the hot end continuously discharges heat to the outside, keeping the temperature inside the insulated box 1 in a stable low-temperature range. This meets the cooling needs of scenarios such as home refrigeration and outdoor camping storage. The modular design lowers the barrier to entry for users and enables plug-and-play functionality.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular dual-duct thermoelectric refrigeration unit, characterized in that: It includes an insulated box (1), a box cover (2) fixed to the top of the insulated box (1), and a refrigeration unit installed on the top of the box cover (2); The refrigeration unit includes a housing (3), a heat insulation plate (4) for fixing to the cover (2), a hot end assembly (5) disposed above the heat insulation plate (4), a cold end assembly (6) disposed below the heat insulation plate (4), a heat exchange channel located between the hot end assembly (5) and the cold end, and a Peltier semiconductor (8) fixed in the middle of the heat insulation plate (4). The hot end assembly (5) and the cold end assembly (6) are respectively located on both sides of the Peltier semiconductor (8). The housing (3) has three connection interfaces on its exterior. The three connection interfaces include a cold air outlet (9) for outputting cold air, a hot air exhaust outlet (10) for dissipating heat, and a power interface (11) for connecting to electrical power.

2. The modular dual-duct thermoelectric refrigeration unit according to claim 1, characterized in that: The hot end assembly (5) includes a hot end heat sink (501), which is attached to the hot end of the Peltier semiconductor (8) by thermal grease, and a hot end fan (502) is installed on the side of the hot end heat sink (501) away from the Peltier semiconductor.

3. The modular dual-duct thermoelectric refrigeration unit according to claim 2, characterized in that: The heat exchange channel includes a hot-end air duct formed by the inner cavity at the top of the outer shell (3) and the heat insulation plate (4). One end of the hot-end air duct is located on one side of the hot-end radiator (501), and the other end of the hot-end air duct is connected to the hot air exhaust port (10).

4. The modular dual-duct thermoelectric refrigeration unit according to claim 3, characterized in that: The cold end assembly (6) includes a cold end heat sink (601), which is attached to the lower surface of the Peltier semiconductor (8) by thermal grease. A cold end fan (602) is provided below the heat insulation plate (4), and the cold end fan (602) is fixed to the side of the cold end heat sink (601) away from the Peltier semiconductor.

5. The modular dual-duct thermoelectric refrigeration unit according to claim 4, characterized in that: The heat exchange channel also includes a cold end air duct formed by the bottom inner cavity of the outer shell (3) and the heat insulation plate (4). One end of the cold end air duct is located on one side of the cold end radiator (601), and the other end of the cold end air duct is connected to the cold air outlet (9).

6. The modular dual-duct thermoelectric refrigeration unit according to claim 4, characterized in that: Both the hot-end radiator (501) and the cold-end radiator (601) are finned radiators made of aluminum or copper. The number and area of ​​the fins of the hot-end radiator (501) are greater than those of the fins of the cold-end radiator (601).

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