Optical assembly and wafer detection device therefor

Abstract

The utility model discloses a kind of optical assembly and wafer detection device thereof, belong to wafer detection technical field, optical assembly is from top to bottom in turn installed photographic unit, zoom lens barrel, optical barrel mirror and objective unit, multi-channel light source and laser automatic focusing unit are respectively installed in the both sides of optical barrel mirror.Wafer detection device can include one or more groups of adjusting assembly and optical assembly, adjusting assembly is installed on support assembly, optical assembly is installed on adjusting assembly by mounting bracket, to-be-measured wafer is placed below optical assembly, optical assembly scans to-be-measured wafer.The optical assembly of the utility model can realize more accurate magnification adjustment, so that the image scanned is more clear.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to an optical component and a wafer inspection device thereof. Background Technology

[0002] A wafer is a piece of wafer used to fabricate silicon semiconductor circuits, and its raw material is usually silicon. Wafers are the foundational material for the semiconductor and new display industries, and their manufacturing, testing, and packaging processes directly affect the performance of subsequent devices.

[0003] During wafer fabrication, a series of processes, including single crystal pulling, slicing, grinding, polishing, layer addition, photolithography, doping, heat treatment, and dicing, can introduce defects onto the wafer surface. Wafer defect detection is a crucial step in semiconductor manufacturing. These defects can affect chip functionality and performance, and even lead to chip failure. Therefore, effective detection and analysis of wafer defects are essential.

[0004] Existing wafer inspection devices typically use optical components for scanning, and the scanned images are processed by image detection algorithms. Because wafer defect detection requires a high degree of precision, the magnification and accuracy of the optical components are adjusted first, which may result in inaccurate detection. Utility Model Content

[0005] The present invention aims to provide an optical component and a wafer inspection device thereof to improve the clarity of scanned images.

[0006] To achieve the above objectives, the present invention provides an optical component comprising, from top to bottom, a photographic unit, a zoom lens barrel, an optical tube lens, and an objective lens unit, wherein one side of the optical tube lens is connected to a laser autofocus unit; the zoom lens barrel changes magnification to enable the optical tube lens to achieve different resolution detection capabilities; the objective lens unit comprises a mounting plate, an objective lens switching unit, and a pitch adjustment unit, wherein the mounting plate is fixed to the lower end of the optical tube lens, the objective lens switching unit and two pitch adjustment units are respectively mounted on the lower end face of the mounting plate, and the two pitch adjustment units are mounted on the objective lens switching unit. In a preferred embodiment of the present invention, the objective lens unit further comprises a first objective lens, a second objective lens, a second objective lens, and an objective lens locator, wherein the first objective lens and the second objective lens are respectively connected to the pitch adjustment unit, and the objective lens locator is respectively fitted on the outer side of the first objective lens and the second objective lens, and each objective lens locator is correspondingly mounted on the pitch adjustment unit.

[0007] In a preferred embodiment of the present invention, the optical component further includes a multi-channel light source, which is installed on the other side of the optical tube lens and provides different light sources for use at different resolutions.

[0008] In a preferred embodiment of the present invention, the optical component further includes a photographic calibration unit, which is connected to the photographic unit.

[0009] This utility model also provides a wafer inspection device, including one or more sets of optical components as described in any one of the above, with the wafer to be inspected located below the optical components.

[0010] In a preferred embodiment of the present invention, the wafer inspection device includes an adjustment component and a mounting frame. The optical component is mounted on the adjustment component via the mounting frame, and the adjustment component drives the optical component to move vertically.

[0011] In a preferred embodiment of the present invention, the adjustment component includes a height adjustment unit and a slider, the slider being slidably mounted on the height adjustment unit, and the mounting bracket being fixed on the slider.

[0012] In a preferred embodiment of the present invention, the adjustment component includes a first connector, a second connector, and a cable drag chain. The two ends of the cable drag chain are fixedly connected to the first connector and the second connector, respectively, and the second connector is fixedly connected to the slider.

[0013] In a preferred embodiment of the present invention, the wafer inspection device further includes a base, an air flotation component, and a support component. The air flotation component and the support component are mounted on the base, and the height adjustment unit and the first connector are fixedly mounted on the support component.

[0014] In a preferred embodiment of the present invention, the air flotation assembly includes a first air flotation guide rail, a second air flotation guide rail, and a third air flotation guide rail. The first air flotation guide rail and the second air flotation guide rail are arranged parallel to each other on the base. The third air flotation guide rail is perpendicular to the first air flotation guide rail and the second air flotation guide rail. The two ends of the third air flotation guide rail are respectively slidably mounted on the first air flotation guide rail and the second air flotation guide rail.

[0015] In a preferred embodiment of the present invention, the air flotation assembly further includes a positioning turntable and a placement platform. The positioning turntable is slidably mounted on the third air flotation guide rail, and the placement platform is mounted on the positioning turntable. The wafer to be tested is placed on the placement platform.

[0016] In a preferred embodiment of the present invention, the air flotation assembly further includes a position control unit, which is mounted on the base and used to calibrate the position of the positioning turntable.

[0017] In a preferred embodiment of the present invention, the adjustment assembly further includes a dust extraction unit and a position sensor, the dust extraction unit and the position sensor being respectively installed on both sides of the height adjustment unit, and the position sensor being used to detect the position of the slider.

[0018] The optical components provided by this invention can achieve a more precise magnification adjustment rate, making the scanned image clearer. The wafer inspection device can set up multiple sets of optical components to scan the wafer under test simultaneously. The optical components scan a portion of the image of the wafer under test, and at the same time, the scanned image is analyzed by image detection algorithm. Then, the image algorithm is used to synthesize the whole wafer scan image, which can effectively improve the inspection efficiency and shorten the cycle time.

[0019] To make the above-mentioned features and advantages of the utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the optical component structure of this utility model.

[0021] Figure 2 This is a schematic diagram of the wafer inspection device of this utility model.

[0022] Figure 3 This is a schematic diagram of the base and air flotation component of the wafer inspection device of this utility model.

[0023] Figure 4 This is a schematic diagram showing the installation of the adjustment components and optical components of the wafer inspection device of this utility model.

[0024] Figure 5 This is a schematic diagram of the adjustment component and optical component structure of this utility model.

[0025] Figure 6 for Figure 5 Another perspective illustration.

[0026] 1-Optical assembly; 11-Photographic unit; 12-Zoom tube lens; 13-Optical tube lens; 14-Objective lens unit; 141-Mounting plate; 142-Objective lens switching unit; 143-Tilt adjustment unit; 144-First objective lens; 145-Second objective lens; 146-Objective lens positioner; 15-Multi-channel light source; 16-Laser autofocus unit; 17-Photographic calibration unit; 2-Wafer under test; 3-Wafer inspection device; 31-Base; 32- Air flotation assembly; 321-First air flotation guide rail; 322-Second air flotation guide rail; 323-Third air flotation guide rail; 324-Positioning turntable; 325-Placement platform; 326-Position control unit; 33-Support assembly; 34-Adjustment assembly; 341-Height adjustment unit; 342-Slider; 343-First connector; 344-Second connector; 345-Cable drag chain; 346-Dust extraction unit; 347-Position sensor; 35-Mounting bracket.

[0027] In the accompanying drawings, similar reference numerals refer to the same elements. Detailed Implementation

[0028] To make the objectives and technical solutions of the present utility model embodiments clearer, the following will be described in conjunction with the accompanying drawings of the present utility model embodiments. Figures 1-6 The technical solutions of the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0029] Optical component 1 is used to scan the surface of the wafer 2 under test and detect defects, such as Figure 1 As shown, the optical assembly 1, from top to bottom, comprises a photographic unit 11, a zoom lens tube 12, an optical tube lens 13, and an objective lens unit 14. The optical tube lens 13 has a multi-channel light source 15 and a laser autofocus unit 16 connected to its two sides, respectively. The zoom lens tube 12 changes magnification to enable the optical tube lens 13 to achieve different resolution detection capabilities, and the multi-channel light source 15 can provide different light sources for use at different resolutions.

[0030] The optical component 1 further includes a photographic calibration unit 17, which is connected to the photographic unit 11 and is used to calibrate the photographic unit 11.

[0031] The objective lens unit 14 includes a mounting plate 141, which is fixed to the lower end of the optical tube lens 174. The objective lens switching unit 142 and two pitch adjustment units 143 are respectively mounted on the lower end face of the mounting plate 141. The two pitch adjustment units 143 are mounted on the objective lens switching unit 142, and the objective lens switching unit 142 is connected to the optical tube lens 13.

[0032] The objective lens unit 14 further includes a first objective lens 144, a second objective lens 145, and an objective lens positioner 146. The first objective lens 144 and the second objective lens 145 are respectively installed in the objective lens positioner 146. Each objective lens positioner 146 is correspondingly installed on the pitch adjustment unit 143. The first objective lens 144 and the second objective lens 145 are objective lenses with different magnifications.

[0033] The objective lens switching unit 142 is used to switch between the first objective lens 144 or the second objective lens 145 with different magnifications or functions. The pitch adjustment unit 143 adjusts the pitch angle of the first objective lens 144 and the second objective lens 145 so that the optical axis of the first objective lens 144 or the second objective lens 145 is perpendicular to the plane of the wafer 2 under test. The objective lens positioner 146 is a piezoelectric objective lens positioner. The objective lens positioner 146 is connected to the laser autofocus unit 16. The laser autofocus unit 16 controls the objective lens positioner 146 to make the image of the first objective lens 144 or the second objective lens 145 clear.

[0034] The wafer inspection device 3 detects defects on the surface of the wafer 2 under test using image processing algorithms, such as... Figure 2 As shown, the wafer inspection device 3 includes one or more sets of optical components 1. The wafer inspection device 3 includes a base 31, on which the air flotation component 32 is mounted. The wafer to be inspected 2 is placed on the air flotation component 32, and the wafer to be inspected 2 is located below the optical components 1. The center position of the base 31 is set as the test point. The wafer to be inspected 2 moves to the test point under the drive of the air flotation component 32 for inspection.

[0035] like Figure 3 As shown, the air flotation assembly 32 includes a first air flotation guide rail 321, a second air flotation guide rail 322, and a third air flotation guide rail 323. The first air flotation guide rail 321 and the second air flotation guide rail 322 are arranged parallel to each other on the base 31. The third air flotation guide rail 323 is perpendicular to the first air flotation guide rail 321 and the second air flotation guide rail 322. The two ends of the third air flotation guide rail 323 are slidably mounted on the first air flotation guide rail 321 and the second air flotation guide rail 322, respectively. The third air flotation guide rail 323 moves along the first air flotation guide rail 321 and the second air flotation guide rail 322.

[0036] The air flotation assembly 32 further includes a positioning turntable 324 and a placement stage 325. The positioning turntable 324 is slidably mounted on the third air flotation guide rail 323, and the placement stage 325 is mounted on the positioning turntable 324. The wafer to be tested 2 is placed on the placement stage 325. The positioning turntable 324 can rotate on its own and can move along the third air flotation guide rail 323 to enable the wafer to be tested 2 to be completely scanned by the optical assembly 1.

[0037] The air flotation assembly 32 also includes a position control unit 326, which is disposed on the base 31 and is used to calibrate the position of the positioning turntable 324.

[0038] like Figure 2 As shown, the wafer inspection device 3 also includes a support component 33, an adjustment component 34, and a mounting bracket 35. The support component 33 is fixed on the base 31, the adjustment component 34 is fixedly mounted on the support component 33, and the optical component 1 is mounted on the adjustment component 34 via the mounting bracket 35. The adjustment component 34 controls the up-and-down movement of the optical component 1 so that the optical component 1 adjusts its clarity to align with the wafer 2 under test for image scanning.

[0039] like Figure 5 As shown, the adjustment component 34 includes a height adjustment unit 341 and a slider 342. The height adjustment unit 341 is fixed to the support component 33 (e.g., ...). Figure 2 As shown, the slider 342 is slidably mounted on the height adjustment unit 341, and the slider 342 is controlled to move up and down by the height adjustment unit 341.

[0040] Specifically, the height adjustment unit 341 can be an electric slide rail device.

[0041] Specifically, one end of the mounting bracket 18 is fixedly mounted on the slider 342, and the other end is fixed to the optical component 1.

[0042] The adjustment assembly 34 includes a first connector 343, a second connector 344, and a cable drag chain 345. The first connector 343 and the second connector 344 are L-shaped structures with their two surfaces perpendicularly connected to each other. The first surface of the first connector 343 is fixed to the support assembly 33, and the first surface of the second connector 344 is fixed to the slider 342. The two ends of the cable drag chain 345 are respectively fixed to the second surfaces of the first connector 343 and the second connector 344. The second surfaces of the first connector 343 and the second connector 344 are parallel. One end of the cable drag chain 345 connected to the second connector 344 moves with the slider 342.

[0043] like Figure 5 As shown, the adjustment component 34 also includes a dust extraction unit 346, which is installed on the side of the height adjustment unit 341 and is used to clean the working environment of the wafer inspection device 3.

[0044] like Figure 6 As shown, the adjustment assembly 34 also includes a position sensor 347, which is installed on the other side of the height adjustment unit 341 and is used to detect the position of the slider 342.

[0045] When in use, the wafer inspection device 3 uses a robotic arm (not shown in the figure) to place the wafer 2 to be inspected on the stage 325. The first air flotation guide rail 321, the second air flotation guide rail 322, and the third air flotation guide rail 323 move the wafer 2 to be inspected to the inspection point (e.g., Figure 3 As shown, located below the optical component 1, the height adjustment unit 341 causes the slider 342 to move vertically, lowering the optical component 1 to a suitable detection position.

[0046] The following components are adjusted according to specific operational requirements. The order is not fixed and adjustments need to be repeated multiple times until the image of the wafer under test 2 is clear. The principle of the optical component 1 is known to those skilled in the art and will not be described in detail here. A suitable light source is selected from the multi-channel light source 15. The photographic calibration unit 17 adjusts the photographic unit 11 to image the wafer under test 2. The objective lens switching unit 142 selects either the first objective lens 144 or the second objective lens 145, and adjusts the zoom lens barrel 12 to further change the magnification and improve the resolution. A suitable light source is then selected again from the multi-channel light source 15 as needed. The pitch adjustment unit 143 is adjusted to make the selected objective lens perpendicular to the wafer under test 2. The laser autofocus unit 16 transmits a signal to the objective lens positioner 146 and controls the objective lens positioner 146 to make the image of the wafer under test 2 clear.

[0047] The air flotation component 32 causes the wafer under test 2 to move below the optical component 1 along a set trajectory. The optical component 1 performs a full scan of the wafer under test 2 and performs image detection. After the scan is completed, the robotic arm removes the wafer under test 2.

[0048] If the wafer inspection device 3 includes multiple sets of optical components 1, each set of optical components 1 simultaneously scans the wafer 2 under test. Each optical component 11 scans a portion of the image and simultaneously performs image detection algorithms to detect defects. Then, the image is synthesized using image algorithms to create an image of the entire wafer 2 under test. In this embodiment, if the image obtained by each set of optical components 1 can cover the entire wafer 2 under test during scanning, the air flotation component 32 is not required to move the wafer 2 under test.

[0049] The optical components provided by this invention can achieve more precise magnification adjustment, making the scanned images clearer. The wafer inspection device scans the wafer to be inspected simultaneously by setting up multiple sets of optical components. The optical components scan a portion of the image of the wafer to be inspected, and at the same time, the scanned images are analyzed by image detection algorithms. Then, the image algorithm is used to synthesize the whole wafer scan image, which can effectively improve the inspection efficiency and shorten the cycle time.

[0050] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An optical component, characterized in that, The device includes, from top to bottom, a photographic unit, a zoom lens tube, an optical tube, and an objective lens unit. One side of the optical tube is connected to a laser autofocus unit. The zoom lens tube changes magnification to enable the optical tube to achieve different resolution detection capabilities. The objective lens unit includes a mounting plate, an objective lens switching unit, and a pitch adjustment unit. The mounting plate is fixed to the lower end of the optical tube. The objective lens switching unit and the two pitch adjustment units are respectively mounted on the lower end face of the mounting plate, and the two pitch adjustment units are mounted on the objective lens switching unit.

2. An optical component as described in claim 1, characterized in that, The objective lens unit further includes a first objective lens, a second objective lens, and an objective lens positioner. The first objective lens and the second objective lens are respectively installed in the objective lens positioner, and each objective lens positioner is correspondingly installed on the pitch adjustment unit.

3. An optical component as described in claim 2, characterized in that, The optical assembly also includes a multi-channel light source, which is mounted on the other side of the optical tube lens and provides different light sources for use at different resolutions.

4. An optical component as described in claim 3, characterized in that, The optical components also include a photographic calibration unit, which is connected to the photographic unit.

5. A wafer inspection device, characterized in that, It includes one or more optical components as described in any one of claims 1-4, with the wafer under test located below the optical components.

6. The wafer inspection apparatus as described in claim 5, characterized in that, The wafer inspection device includes an adjustment component and a mounting bracket. The optical component is mounted on the adjustment component via the mounting bracket, and the adjustment component drives the optical component to move vertically.

7. The wafer inspection apparatus as described in claim 6, characterized in that, The adjustment assembly includes a height adjustment unit and a slider, the slider being slidably mounted on the height adjustment unit, and the mounting bracket being fixed on the slider.

8. The wafer inspection apparatus as described in claim 7, characterized in that, The adjustment assembly includes a first connector, a second connector, and a cable drag chain. The two ends of the cable drag chain are fixedly connected to the first connector and the second connector, respectively, and the second connector is fixedly connected to the slider.

9. The wafer inspection apparatus as described in claim 8, characterized in that, The wafer inspection device further includes a base, an air flotation component, and a support component. The air flotation component and the support component are mounted on the base, and the height adjustment unit and the first connector are fixedly mounted on the support component.

10. The wafer inspection apparatus as described in claim 9, characterized in that, The air flotation assembly includes a first air flotation guide rail, a second air flotation guide rail, and a third air flotation guide rail. The first air flotation guide rail and the second air flotation guide rail are arranged parallel to each other on the base. The third air flotation guide rail is perpendicular to the first air flotation guide rail and the second air flotation guide rail. The two ends of the third air flotation guide rail are slidably mounted on the first air flotation guide rail and the second air flotation guide rail, respectively.

11. The wafer inspection apparatus as described in claim 10, characterized in that, The air flotation assembly also includes a positioning turntable and a placement platform. The positioning turntable is slidably mounted on the third air flotation guide rail, and the placement platform is mounted on the positioning turntable. The wafer to be tested is placed on the placement platform.

12. The wafer inspection apparatus as described in claim 11, characterized in that, The air flotation assembly also includes a position control unit, which is mounted on the base and used to calibrate the position of the positioning turntable.

13. The wafer inspection apparatus as described in claim 7, characterized in that, The adjustment assembly also includes a dust extraction unit and a position sensor, which are respectively installed on both sides of the height adjustment unit. The position sensor is used to detect the position of the slider.

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