An SMT mounting welding spot defect detection device

Abstract

The utility model relates to a technology field of mounting welding spot detection, especially a kind of SMT mounting welding spot defect detection device.The utility model discloses the following scheme: a kind of SMT mounting welding spot defect detection device, including support frame, drive mechanism, support mechanism, rotatable clamping mechanism and 3D line laser scanner;Two support frames are symmetrically distributed;Drive mechanism is arranged on support frame, for moving support mechanism;Support mechanism is fixedly arranged on drive mechanism, for supporting the edge of the PCB to be detected;Rotatable clamping mechanism is fixedly arranged on support frame, for clamping the middle part of the PCB to be detected;3D line laser scanner is spaced apart and arranged above the PCB to be detected, for detecting mounting welding spot.The utility model provides a kind of SMT mounting welding spot defect detection device, solves the technical problem of the technical problem that the welding spot defect detection device of existing welding spot cannot detect PCB double-sided welding spot.

Description

Technical Field

[0001] This utility model relates to the field of surface mount solder joint inspection technology, and in particular to an SMT surface mount solder joint defect inspection device. Background Technology

[0002] SMT (Surface Mount Technology) is a core process in electronics manufacturing, used to mount micro-components onto PCBs (Printed Circuit Boards).

[0003] After the PCB is mounted, solder joint defects need to be inspected to verify whether it meets the standards. A typical inspection setup involves placing the PCB on a flat surface and then using a 3D line laser scanner for inspection.

[0004] However, this inspection method can only inspect one side of the PCB board. In SMT, solder joints may be located on one or both sides of the PCB. Obviously, the above inspection method is not applicable to PCBs with solder joints on both sides. Utility Model Content

[0005] This invention provides an SMT solder joint defect detection device, which solves the technical problem that existing solder joint defect detection devices cannot detect solder joints on both sides of PCB.

[0006] To achieve this technical objective, the present invention adopts the following solution: an SMT solder joint defect detection device, comprising a support frame, a drive mechanism, a support mechanism, a rotatable clamping mechanism, and a 3D line laser scanner;

[0007] The two support frames are symmetrically distributed;

[0008] The drive mechanism is mounted on the support frame and is used to move the support mechanism.

[0009] The support mechanism is fixedly mounted on the drive mechanism to support the edge of the PCB board to be tested;

[0010] The rotatable clamping mechanism is fixedly mounted on the support frame and is used to clamp the middle part of the PCB board to be tested;

[0011] The 3D line laser scanner is positioned above the PCB board to be inspected and is used to inspect the solder joints.

[0012] Furthermore, the drive mechanism includes an upper rack, a gear, and a lower rack;

[0013] The upper rack extends along the length of the support frame and is slidably connected to the support frame. A slider is fixed on the top surface of the upper rack and is slidably disposed in a groove opened on the top surface of the support frame.

[0014] The gear is located below the upper rack, meshes with the upper rack, and is rotatably connected to the support frame;

[0015] The lower rack is located below the gear and meshes with the gear. The lower rack is slidably connected to the support frame.

[0016] Furthermore, the two sliders are connected as one unit by a connecting rod.

[0017] Furthermore, the support mechanism includes connecting plates, vertical rods, and flexible support strips;

[0018] The connecting plate is fixed to the side of the upper or lower rack;

[0019] The vertical rod is fixed to the top surface of the connecting plate;

[0020] The two ends of the flexible support strip are fixedly connected to two spaced vertical rods, and the middle of the flexible support strip hangs down naturally.

[0021] Furthermore, the rotatable clamping mechanism includes a fixed frame, a motor, and two symmetrically distributed clamps;

[0022] Two symmetrically distributed fixing frames are fixed on the top surface of the support frame;

[0023] The motor is fixed on any fixed frame;

[0024] One clamp is fixedly connected to the output shaft of the motor on the same axis, and the other clamp is rotatably connected to the fixed frame.

[0025] Furthermore, the clamp includes a vertical plate, a fixed suction cup, and a liftable suction cup;

[0026] The vertical plate is fixedly connected to the output shaft of the motor, or rotatably connected to the fixed frame;

[0027] Both the fixed suction cup and the liftable suction cup are fixed to the vertical plate, and the fixed suction cup and the liftable suction cup are arranged at intervals and opposite to each other.

[0028] Furthermore, the liftable suction cup includes a connecting block, a screw, and a suction cup body;

[0029] The connecting block is fixedly connected to the vertical plate;

[0030] The screw is threadedly connected to the connecting block;

[0031] The suction cup body is fixed to the end of the screw, and the suction cup body faces the fixed suction cup.

[0032] Furthermore, the 3D line laser scanner is fixed on a mounting frame.

[0033] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0034] This utility model is equipped with a rotatable clamping mechanism, which can clamp the PCB board and drive the PCB board to rotate, thereby flipping the PCB board and allowing the solder joints on both sides of the PCB board to be inspected without removing the PCB board. By setting a support mechanism to support both ends of the PCB board, the rotation or tilting of the PCB board during the inspection process is prevented from affecting the accuracy of the inspection. Attached Figure Description

[0035] Figure 1 A schematic diagram of an SMT solder joint defect detection device provided for an embodiment of this utility model;

[0036] Figure 2 for Figure 1 Enlarged view of section A in the middle;

[0037] Figure 3 for Figure 1 Enlarged view of section B in the middle.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Support frame; 11. Slide groove; 2. Clamping mechanism; 21. Fixing frame; 22. Motor; 23. Fixture; 231. Vertical plate; 232. Fixed suction cup; 233. Liftable suction cup; 2331. Connecting block; 2332. Screw; 2333. Suction cup body; 3. Drive mechanism; 31. Upper rack; 311. Slider; 32. Gear; 33. Lower rack; 4. Support mechanism; 41. Connecting plate; 42. Vertical rod; 43. Flexible support strip; 5. 3D line laser scanner; 6. Connecting rod. Detailed Implementation

[0040] To fully understand the purpose, features and effects of this utility model, the following specific embodiments will be used to describe this utility model in detail, but this utility model is not limited thereto.

[0041] like Figures 1 to 3 As shown, the present invention provides an SMT solder joint defect detection device, which includes a support frame 1, a drive mechanism 3, a support mechanism 4, a rotatable clamping mechanism 2, and a 3D line laser scanner 5.

[0042] Two support frames 1 are symmetrically distributed, and each support frame 1 is equipped with a drive mechanism 3, which is used to drive the support mechanism 4 to move.

[0043] The support mechanism 4 is fixedly mounted on the drive mechanism 3 and is used to support the edge of the PCB board to be tested.

[0044] The rotatable clamping mechanism 2 is fixedly mounted on the support frame 1 and is used to clamp the middle part of the PCB board to be tested;

[0045] The 3D line laser scanner 5 is positioned at intervals above the PCB board to be inspected, and is used to inspect the solder joints.

[0046] Furthermore, the drive mechanism 3 includes an upper rack 31, a gear 32, and a lower rack 33;

[0047] The upper rack 31 extends along the length of the support frame 1 and is slidably connected to the support frame 1. A slider 311 is fixed on the top surface of the upper rack 31 and is slidably disposed in the groove 11 opened on the top surface of the support frame 1.

[0048] Gear 32 is located below the upper rack 31, gear 32 meshes with the upper rack 31, and gear 32 is rotatably connected to the support frame 1;

[0049] The lower rack 33 is located below the gear 32 and meshes with the gear 32. The lower rack 33 is slidably connected to the support frame 1.

[0050] The sliding connection between the lower rack 33 and the support frame 1 and the upper rack 31 and the support frame 1 can be achieved by using a slider, a sliding groove, or a slide rail. This application does not impose any restrictions.

[0051] Furthermore, the two sliders 311 are connected as one unit by the connecting rod 6.

[0052] Furthermore, the support mechanism 4 includes a connecting plate 41, a vertical rod 42, and a flexible support strip 43;

[0053] The connecting plate 41 is fixed on the side of the upper rack 31 or the lower rack 33;

[0054] The vertical rod 42 is fixed to the top surface of the connecting plate 41;

[0055] The two ends of the flexible support strip 43 are fixedly connected to two spaced vertical rods 42 respectively, and the middle of the flexible support strip 43 hangs down naturally. The flexible support strip 43 can be made of silicone.

[0056] Furthermore, the rotatable clamping mechanism 2 includes a fixed frame 21, a motor 22, and two symmetrically distributed clamps 23;

[0057] Two symmetrically distributed fixing frames 21 are fixed on the top surface of the support frame 1;

[0058] The motor 22 is fixed on any of the fixed brackets 21;

[0059] One clamp 23 is coaxially and fixedly connected to the output shaft of the motor 22, and the other clamp 23 is rotatably connected to the fixed frame 21.

[0060] Furthermore, the clamp 23 includes a vertical plate 231, a fixed suction cup 232, and a liftable suction cup 233;

[0061] The vertical plate 231 is fixedly connected to the output shaft of the motor 22, or rotatably connected to the fixed frame 21;

[0062] Both the fixed suction cup 232 and the liftable suction cup 233 are fixed on the vertical plate 231, and the fixed suction cup 232 and the liftable suction cup 233 are arranged at intervals and opposite to each other.

[0063] Furthermore, the liftable suction cup 233 includes a connecting block 2331, a screw 2332, and a suction cup body 2333;

[0064] Connecting block 2331 is fixedly connected to vertical plate 231;

[0065] Screw 2332 is threadedly connected to connecting block 2331;

[0066] The suction cup body 2333 is fixed to the end of the screw 2332, and the suction cup body 2333 faces the fixed suction cup 232.

[0067] Furthermore, the 3D line laser scanner 5 is fixed on the mounting bracket 21. It should be noted that the 3D line laser scanner 5 needs to maintain an appropriate height with the PCB board, so that the PCB board can be rotated 180° while ensuring that the 3D line laser scanner 5 can complete the inspection. Therefore, any existing lifting mechanism can be used to fix the 3D line laser scanner 5 on the mounting bracket 21, and this application does not impose any restrictions.

[0068] The following is based on Figure 1 Taking this example, the usage is as follows: First, rotate screw 2332 to increase the distance between suction cup body 2333 and fixed suction cup 232. Then, place the PCB board to be inspected between suction cup body 2333 and fixed suction cup 232. Rotate screw 2332 again to fix the PCB board between fixed suction cup 232 and liftable suction cup 233. Push connecting rod 6 to the left to move upper rack 31 to the left, simultaneously driving gear 32 to rotate counterclockwise and causing lower rack 33 to move to the right. During this process, flexible support strip 43 on the left moves to the right, and flexible support strip 43 on the right moves to the left (in this embodiment, connecting plate 41 on the left is fixed on lower rack 33, and connecting plate 41 on the right is fixed on upper rack 31). Finally, the two flexible support strips 43 respectively support the left and right sides of the PCB board to prevent it from rotating. Start the 3D line laser scanner 5 to complete the inspection of one side of the solder joints.

[0069] Pull the connecting rod 6 to the right so that the two flexible support bars 43 are away from the PCB board. Start the motor 22. The motor 22 drives the clamp 23 to rotate. The clamp 23 drives the PCB board to complete a 180° flip. Repeat the above steps to complete the inspection of the solder joints on the other side.

[0070] Finally, it should be noted that the above-listed embodiments are merely preferred embodiments of the present invention. Of course, those skilled in the art can make modifications and variations to the present invention. If such modifications and variations fall within the scope of the claims of the present invention and their equivalents, they should be considered as being within the protection scope of the present invention.

Claims

1. A device for detecting defects in SMT solder joints, characterized in that, It includes a support frame (1), a drive mechanism (3), a support mechanism (4), a rotatable clamping mechanism (2), and a 3D line laser scanner (5); The two support frames (1) are symmetrically distributed; The drive mechanism (3) is mounted on the support frame (1) and is used to drive the support mechanism (4) to move. The support mechanism (4) is fixedly mounted on the drive mechanism (3) and is used to support the edge of the PCB board to be tested; The rotatable clamping mechanism (2) is fixedly mounted on the support frame (1) and is used to clamp the middle part of the PCB board to be tested; The 3D line laser scanner (5) is spaced above the PCB board to be inspected and is used to inspect the solder joints.

2. The SMT solder joint defect detection device according to claim 1, characterized in that, The drive mechanism (3) includes an upper rack (31), a gear (32), and a lower rack (33); The upper rack (31) extends along the length of the support frame (1), and the upper rack (31) and the support frame (1) are slidably connected. A slider (311) is fixed on the top surface of the upper rack (31), and the slider (311) is slidably disposed in a groove (11) opened on the top surface of the support frame (1). The gear (32) is disposed below the upper rack (31), the gear (32) meshes with the upper rack (31), and the gear (32) is rotatably connected to the support frame (1); The lower rack (33) is disposed below the gear (32) and meshes with the gear (32). The lower rack (33) is slidably connected to the support frame (1).

3. The SMT solder joint defect detection device according to claim 2, characterized in that, The two sliders (311) are connected as one unit by a connecting rod (6).

4. The SMT solder joint defect detection device according to claim 3, characterized in that, The support mechanism (4) includes a connecting plate (41), a vertical rod (42), and a flexible support strip (43); The connecting plate (41) is fixed on the side of the upper rack (31) or the lower rack (33); The vertical rod (42) is fixed to the top surface of the connecting plate (41); The two ends of the flexible support strip (43) are fixedly connected to two spaced vertical rods (42), and the middle part of the flexible support strip (43) hangs down naturally.

5. The SMT solder joint defect detection device according to claim 4, characterized in that, The rotatable clamping mechanism (2) includes a fixed frame (21), a motor (22), and two symmetrically distributed clamps (23); The two symmetrically distributed fixing frames (21) are both fixed on the top surface of the support frame (1); The motor (22) is fixed on any of the fixed frames (21); One of the clamps (23) is coaxially fixedly connected to the output shaft of the motor (22), and the other clamp (23) is rotatably connected to the fixing frame (21).

6. The SMT solder joint defect detection device according to claim 5, characterized in that, The clamp (23) includes a vertical plate (231), a fixed suction cup (232), and a liftable suction cup (233); The vertical plate (231) is fixedly connected to the output shaft of the motor (22), or rotatably connected to the fixing frame (21); The fixed suction cup (232) and the liftable suction cup (233) are both fixed on the vertical plate (231), and the fixed suction cup (232) and the liftable suction cup (233) are arranged at intervals and opposite to each other.

7. The SMT solder joint defect detection device according to claim 6, characterized in that, The liftable suction cup (233) includes a connecting block (2331), a screw (2332), and a suction cup body (2333); The connecting block (2331) is fixedly connected to the vertical plate (231); The screw (2332) is threadedly connected to the connecting block (2331); The suction cup body (2333) is fixed to the end of the screw (2332), and the suction cup body (2333) faces the fixed suction cup (232).

8. The SMT solder joint defect detection device according to claim 7, characterized in that, The 3D line laser scanner (5) is fixed on the mounting bracket (21).

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