Photoresist backside residue removal apparatus
By designing a photoresist backside residue removal device, and utilizing a combination of a powered turntable and a cleaning brush, the problem of difficult removal of BL301 photoresist residue on the backside of wafers was solved, achieving efficient and safe photoresist removal.
Patent Information
- Application Number
- CN202522447705.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-19
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-11-19
AI Technical Summary
In the existing technology, it is difficult to remove the BL301 type photoresist residue on the back side of the wafer, and traditional rinsing methods are difficult to completely remove it.
A device for removing photoresist residue from the back side was designed, including a cleaning box, a power mechanism, and a removal mechanism. The device rotates the wafer via a power turntable, sprays developer solution with a spray head, and repeatedly washes the wafer with a cleaning brush. Combined with a pressure sensor, the device protects the wafer and ensures safety and accuracy.
It improves the accuracy and safety of removing photoresist residue from the back side, reduces the difficulty of cleaning, and increases the efficiency of photoresist removal.
Smart Images
Figure CN224682544U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a back-side residue removal device, specifically a photoresist back-side residue removal device, belonging to the field of photoresist technology. Background Technology
[0002] Photoresist, also known as photoresist, is a photoresist film material whose solubility changes upon exposure to ultraviolet light, electron beams, ion beams, X-rays, or other forms of radiation. It is a photosensitive liquid mixture composed of three main components: a photosensitive resin, a sensitizer, and a solvent. It is used as an anti-corrosion coating material in the photolithography process.
[0003] During chip manufacturing, photoresist needs to be coated on the wafer surface. When coating the photoresist, the wafer rotates at high speed, and some photoresist is splashed onto the back of the wafer. The traditional method is to use a back wash solution to rinse the back. However, because the BL301 photoresist is highly resistant, rinsing is not enough to completely remove the photoresist from the back, and there will still be photoresist residue. Utility Model Content
[0004] (a) Technical problems to be solved The purpose of this invention is to provide a photoresist backing residue removal device to solve the above-mentioned problems, thereby addressing the difficulty in removing photoresist residue from the BL301 type in the prior art.
[0005] (II) Technical Solution This utility model is achieved through the following technical solution: a device for removing photoresist residue on the back side.
[0006] The device includes a cleaning box containing wafers, a power mechanism, and a removal mechanism. The power mechanism includes a connecting plate and a protective plate. A power turntable and an output rod are rotatably connected inside the connecting plate. The removal mechanism includes a connecting plate, a spray head, and a cleaning brush. A delivery hose is fixedly connected to the bottom of the spray head.
[0007] Preferably, a support member is fixedly connected inside the cleaning box, a power screw is rotatably connected inside the support member, and a lifting plate one and a lifting plate two are slidably connected inside the support member. Both lifting plates one and two are threadedly connected to the power screw. The power screw is fixed through the support member, and the motor controls the rotation of the power screw, causing lifting plates one and two to move towards each other.
[0008] Preferably, one end of the connecting plate is fixedly connected to the lifting plate, and a pressure sensor is fixedly connected to the bottom of the power turntable. The bottom of the pressure sensor is fixedly connected to the protective plate. The pressure sensor detects the pressure of the protective plate pressing the wafer, avoiding excessive pressure that could damage the wafer and improving the safety of removing residual adhesive from the wafer.
[0009] Preferably, a limit rod is slidably connected to the surface of the power turntable, and the bottom end of the limit rod is fixedly connected to the protective plate. The output rod is connected to the power turntable via chain drive. The limit rod positions the protective plate, making the rotation of the protective plate driven by the power turntable more stable.
[0010] Preferably, the second connecting plate is fixedly connected to the second lifting plate, and a sliding member is slidably connected inside the second connecting plate. The sliding member is fixedly connected to the spray head, and the spray head is positioned by the sliding member to improve the stability of the lateral sliding of the spray head.
[0011] Preferably, a sliding block is fixedly connected to the middle of the sliding member, and an eccentric wheel is rotatably connected to the surface of the second connecting plate. The bottom of the eccentric wheel is slidably connected to the sliding block. By rotating the eccentric wheel, the sliding block controls the sliding member to slide horizontally repeatedly.
[0012] Preferably, the surface of the spray head is fixedly connected to a locking groove for a limiting cleaning brush, and the top of the eccentric wheel is fixedly connected to a locking sleeve adapted to the output rod. The cleaning brush is limited by the locking groove and fixed to the surface of the spray head. Different specifications of cleaning brushes can be used according to the size of the wafer, thus improving the versatility of the device.
[0013] Preferably, a support tube is fixedly connected inside the cleaning box, and the support tube is located directly below the power turntable. A fixing component is assembled and connected to the middle of the wafer, and the fixing component is rotatably connected to the support tube. The fixing component is positioned by the support tube, thereby improving the stability of the wafer rotation.
[0014] This invention provides a device for removing photoresist residue from the back side, which has the following beneficial effects: 1. This photoresist backside residue removal device uses a connecting plate to position a pair of power turntables and output rods. The power turntables control the rotation of the protective plate, which in turn drives the wafer to rotate. The protective plate protects the front side of the wafer, preventing liquid from corroding the photoresist on the front side during backside residue removal, thus improving the accuracy of backside residue removal. The developing solution is delivered to the spray head through a delivery hose to rinse the backside residue of the wafer. The connecting plate drives the cleaning brush to move laterally, allowing the cleaning brush to repeatedly scrub the backside of the wafer, improving the backside residue removal effect.
[0015] 2. This photoresist backside residue removal device uses a support to fix the power screw. The motor controls the rotation of the power screw, causing lifting plate one and lifting plate two to move towards each other. Lifting plate one drives connecting plate one to move up and down, thereby controlling the protective plate to approach the wafer. A pressure sensor detects the pressure of the protective plate pressing on the wafer to avoid excessive pressure that could damage the wafer, thus improving the safety of removing photoresist residue. A limit rod positions the protective plate, making the rotation of the protective plate driven by the power turntable more stable.
[0016] 3. This photoresist backside residue removal device uses a chain to control the rotation of the output rod via a power turntable, improving the ease of rotation. A sliding component positions the spray head, enhancing its lateral sliding stability. An eccentric wheel rotates, causing a sliding block to control the sliding component's repeated lateral sliding. The output rod is inserted into a snap-fit sleeve; as the output rod rotates, the snap-fit sleeve drives the eccentric wheel to rotate synchronously. A snap-fit groove limits the cleaning brush, fixing it to the spray head surface. Different sizes of cleaning brushes can be used depending on the wafer size, improving the device's versatility. A fixing component secures the wafer, and a support tube positions the fixing component, improving wafer rotation stability. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional view of the cleaning box of this utility model; Figure 3 This is a schematic diagram of the power mechanism structure of this utility model; Figure 4 This is a schematic diagram of the removal mechanism of this utility model; Figure 5 This is a schematic diagram of the power screw structure of this utility model.
[0018] [Explanation of Key Component Symbols] 1. Cleaning box; 2. Wafer; 3. Support tube; 4. Fixtures; 5. Power mechanism; 501. Lifting plate 1; 502. Connecting plate 1; 503. Power turntable; 504. Pressure sensor; 505. Protection plate; 506. Limit rod; 507. Output rod; 6. Removal mechanism; 601. Lifting plate II; 602. Connecting plate II; 603. Sliding component; 604. Spray head; 605. Delivery hose; 606. Snap-fit groove; 607. Cleaning brush; 608. Sliding block; 609. Eccentric wheel; 610. Snap-fit sleeve; 7. Support components; 8. Power screw. Detailed Implementation
[0019] This invention provides a device for removing photoresist residue from the back side. Example 1
[0020] Please see Figure 1 , Figure 2 and Figure 5 The system includes a cleaning chamber 1, inside which a wafer 2 is installed. A support tube 3 is fixedly connected inside the cleaning chamber 1, and the support tube 3 is located directly below the power turntable 503. The support tube 3 and the power turntable 503 are located on the same central axis. A fixing member 4 is assembled and connected to the middle of the wafer 2, and the fixing member 4 is rotatably connected to the support tube 3. The wafer 2 is fixed by the fixing member 4, and the fixing member 4 is positioned by the support tube 3, thereby improving the stability of the wafer 2 rotation.
[0021] The cleaning box 1 is internally fixedly connected to a support member 7, and internally rotatably connected to a power screw 8. The top of the support member 7 is fixedly connected to a motor that controls the rotation of the power screw 8. The motor is a mature device, and this application can use existing equipment that meets the requirements. The support member 7 is internally slidably connected to a lifting plate 501 and a lifting plate 601, and both lifting plates 501 and 601 are threadedly connected to the power screw 8. The power screw 8 is fixed through the support member 7, and the motor controls the rotation of the power screw 8, causing the lifting plates 501 and 601 to move towards each other. Example 2
[0022] Please refer to it again. Figure 2 and Figure 3 The cleaning box 1 is equipped with a power mechanism 5 and a removal mechanism 6. The power mechanism 5 includes a connecting plate 502 and a protective plate 505. The connecting plate 502 is rotatably connected to a power turntable 503 and an output rod 507. The surface of the connecting plate 502 is fixedly connected to a motor that controls the rotation of the power turntable 503. The motor is a mature device, and this application can use existing equipment that can meet the requirements.
[0023] The power turntable 503 and output rod 507 are positioned by the connecting plate 502. The power turntable 503 controls the rotation of the protection plate 505, which in turn drives the wafer 2 to rotate. The protection plate 505 can protect the front side of the wafer 2, preventing liquid from corroding the photoresist on the front side when removing residual adhesive from the back side, thus improving the accuracy of removing residual adhesive from the back side of the wafer 2.
[0024] One end of the connecting plate 502 is fixedly connected to the lifting plate 501. A pressure sensor 504 is fixedly connected to the bottom of the power turntable 503, and the bottom of the pressure sensor 504 is fixedly connected to the protection plate 505. The lifting plate 501 drives the connecting plate 502 to move up and down, thereby controlling the protection plate 505 to approach the wafer 2. The pressure sensor 504 detects the pressure of the protection plate 505 pressing the wafer 2, so as to avoid excessive pressure causing damage to the wafer 2 and improve the safety of removing residual adhesive from the wafer 2.
[0025] A limit rod 506 is slidably connected to the surface of the power turntable 503, and the bottom end of the limit rod 506 is fixedly connected to the protective plate 505. The output rod 507 is connected to the power turntable 503 via chain drive. The limit rod 506 positions the protective plate 505, making the rotation of the protective plate 505 driven by the power turntable 503 more stable. The chain allows the power turntable 503 to control the rotation of the output rod 507, improving the ease of rotation of the output rod 507. Example 3
[0026] Please refer to it again. Figure 2 and Figure 4 The removal mechanism 6 includes a connecting plate 602, a spray head 604, and a cleaning brush 607. The bottom of the spray head 604 is fixedly connected to a delivery hose 605. The developer is delivered to the spray head 604 through the delivery hose 605 to rinse the residual adhesive on the back of the wafer 2. The connecting plate 602 drives the cleaning brush 607 to move laterally, so that the cleaning brush 607 repeatedly washes the back of the wafer 2, thereby improving the removal effect of residual adhesive on the back of the wafer 2.
[0027] The connecting plate 602 is fixedly connected to the lifting plate 601. The connecting plate 602 has a sliding component 603 inside, and the sliding component 603 is fixedly connected to the spray head 604. The spray head 604 is positioned by the sliding component 603, which improves the stability of the lateral sliding of the spray head 604.
[0028] A sliding block 608 is fixedly connected to the middle of the sliding member 603, and an eccentric wheel 609 is rotatably connected to the surface of the connecting plate 602. The bottom of the eccentric wheel 609 is slidably connected to the sliding block 608. By rotating the eccentric wheel 609, the sliding block 608 controls the sliding member 603 to slide horizontally and repeatedly.
[0029] The surface of the spray head 604 is fixedly connected to the snap-fit groove 606 for the limiting cleaning brush 607. The top of the eccentric wheel 609 is fixedly connected to the snap-fit sleeve 610 that is adapted to the output rod 507. The output rod 507 is inserted into the snap-fit sleeve 610. When the output rod 507 rotates, the snap-fit sleeve 610 drives the eccentric wheel 609 to rotate synchronously. The snap-fit groove 606 limits the cleaning brush 607 and fixes the cleaning brush 607 to the surface of the spray head 604. Different specifications of cleaning brushes 607 can be used according to the size of the wafer 2, which improves the versatility of the device.
[0030] In use, the following steps are taken: First, the fixing member 4 is inserted into the support tube 3 to position the wafer 2. Then, the motor controls the rotation of the power screw 8, causing the lifting plate 501 and the second lifting plate 601 to move towards each other. This brings the protective plate 505 and the cleaning brush 607 closer to the wafer 2. The pressure sensor 504 detects the pressure exerted by the protective plate 505 on the wafer 2 to prevent excessive pressure from damaging it. When the protective plate 505 contacts the front side of the wafer 2, the cleaning brush 607 contacts the back side. The developing solution is then delivered to the spray head 604 through the delivery hose 605 to clean the back side of the wafer 2. The residual adhesive is rinsed off. The protective plate 505 is rotated by the power turntable 503, which in turn rotates the wafer 2. At the same time, through the chain drive, the power turntable 503 controls the output rod 507 to rotate, which in turn causes the snap-fit sleeve 610 to drive the eccentric wheel 609 to rotate synchronously. The rotation of the eccentric wheel 609 causes the sliding block 608 to control the sliding component 603 to slide repeatedly laterally, which in turn drives the cleaning brush 607 to repeatedly wash the back of the wafer 2, improving the removal effect of residual adhesive on the back of the wafer 2. Through the above device, the difficulty of cleaning the BL301 type photoresist on the back of the wafer 2 is reduced, and the removal efficiency of photoresist on the back of the wafer 2 is improved.
[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A device for removing photoresist residue from the back side, comprising a cleaning chamber (1), characterized in that: The cleaning box (1) contains a wafer (2), and the cleaning box (1) contains a power mechanism (5) and a removal mechanism (6). The power mechanism (5) includes a connecting plate (502) and a protective plate (505). The connecting plate (502) is rotatably connected to a power turntable (503) and an output rod (507). The removal mechanism (6) includes a connecting plate (602), a spray head (604), and a cleaning brush (607). The bottom of the spray head (604) is fixedly connected to a delivery hose (605).
2. The photoresist backside residue removal device according to claim 1, characterized in that: The cleaning box (1) is fixedly connected to a support member (7), and the support member (7) is rotatably connected to a power screw (8). The support member (7) is slidably connected to a lifting plate one (501) and a lifting plate two (601), and both the lifting plate one (501) and the lifting plate two (601) are threadedly connected to the power screw (8).
3. The photoresist backside residue removal device according to claim 2, characterized in that: One end of the connecting plate (502) is fixedly connected to the lifting plate (501), and a pressure sensor (504) is fixedly connected to the bottom of the power turntable (503), and the bottom of the pressure sensor (504) is fixedly connected to the protection plate (505).
4. The photoresist backside residue removal device according to claim 1, characterized in that: The power turntable (503) is slidably connected to a limit rod (506), and the bottom end of the limit rod (506) is fixedly connected to the protective plate (505). The output rod (507) is connected to the power turntable (503) via chain drive.
5. The photoresist backside residue removal device according to claim 2, characterized in that: The second connecting plate (602) is fixedly connected to the second lifting plate (601), and a sliding member (603) is slidably connected inside the second connecting plate (602), and the sliding member (603) is fixedly connected to the spray head (604).
6. The photoresist backside residue removal device according to claim 5, characterized in that: A sliding block (608) is fixedly connected to the middle of the sliding member (603), and an eccentric wheel (609) is rotatably connected to the surface of the connecting plate (602), with the bottom of the eccentric wheel (609) slidably connected to the sliding block (608).
7. The photoresist backside residue removal device according to claim 6, characterized in that: The surface of the spray head (604) is fixedly connected to the snap-fit groove (606) of the limiting cleaning brush (607), and the top end of the eccentric wheel (609) is fixedly connected to the snap-fit sleeve (610) that is adapted to the output rod (507).
8. The photoresist backside residue removal device according to claim 1, characterized in that: The cleaning box (1) is fixedly connected to a support tube (3), and the support tube (3) is located directly below the power turntable (503). The wafer (2) is assembled with a fixing member (4) in the middle, and the fixing member (4) is rotatably connected to the support tube (3).